HUE054968T2 - Eljárás és berendezés adagolóegységének automatikus szabályozására - Google Patents
Eljárás és berendezés adagolóegységének automatikus szabályozásáraInfo
- Publication number
- HUE054968T2 HUE054968T2 HUE19170774A HUE19170774A HUE054968T2 HU E054968 T2 HUE054968 T2 HU E054968T2 HU E19170774 A HUE19170774 A HU E19170774A HU E19170774 A HUE19170774 A HU E19170774A HU E054968 T2 HUE054968 T2 HU E054968T2
- Authority
- HU
- Hungary
- Prior art keywords
- dispenser
- automatically adjusting
- dispensing units
- adjusting dispensing
- units
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/041,300 US9374905B2 (en) | 2013-09-30 | 2013-09-30 | Method and apparatus for automatically adjusting dispensing units of a dispenser |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE054968T2 true HUE054968T2 (hu) | 2021-10-28 |
Family
ID=51293190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE19170774A HUE054968T2 (hu) | 2013-09-30 | 2014-07-21 | Eljárás és berendezés adagolóegységének automatikus szabályozására |
Country Status (11)
Country | Link |
---|---|
US (7) | US9374905B2 (hu) |
EP (4) | EP3053424B1 (hu) |
JP (3) | JP6346273B2 (hu) |
KR (6) | KR102108664B1 (hu) |
CN (4) | CN105766078B (hu) |
HU (1) | HUE054968T2 (hu) |
PH (1) | PH12019000165A1 (hu) |
PL (3) | PL3557968T3 (hu) |
PT (1) | PT3557968T (hu) |
TW (3) | TWI624204B (hu) |
WO (1) | WO2015047521A1 (hu) |
Families Citing this family (42)
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US9374905B2 (en) | 2013-09-30 | 2016-06-21 | Illinois Tool Works Inc. | Method and apparatus for automatically adjusting dispensing units of a dispenser |
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TWI558465B (zh) * | 2015-11-18 | 2016-11-21 | 鴻騏新技股份有限公司 | 具可調整點膠角度之點膠機構 |
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CN110602938B (zh) * | 2019-09-23 | 2020-12-29 | 中电智能卡有限责任公司 | 模块植入装置及模块植入机 |
DE102020000412A1 (de) * | 2020-01-24 | 2021-07-29 | bdtronic GmbH | Dosiervorrichtung sowie Verfahren zur dosierten Abgabe eines Mediums |
US11246249B2 (en) | 2020-04-15 | 2022-02-08 | Illinois Tool Works Inc. | Tilt and rotate dispenser having strain wave gear system |
US11389819B2 (en) | 2020-06-02 | 2022-07-19 | Illinois Tool Works Inc. | Dispensing unit mass dampener |
CN112044699B (zh) * | 2020-08-11 | 2022-01-14 | 江苏迪飞达电子有限公司 | 一种小型桌面pcb板涂胶机 |
KR20220067416A (ko) | 2020-11-17 | 2022-05-24 | 세메스 주식회사 | 주행 장치 및 이를 이용한 약액 토출 장치 |
CN113289849A (zh) * | 2021-05-18 | 2021-08-24 | 杨万涛 | 一种tft基板制造用框胶涂布装置及基板制造工艺 |
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US11904337B2 (en) | 2021-08-03 | 2024-02-20 | Illinois Tool Works Inc. | Tilt and rotate dispenser having material flow rate control |
KR102602833B1 (ko) * | 2021-09-30 | 2023-11-16 | 엔젯 주식회사 | 복수의 노즐 헤드를 구비한 프린팅 장치 및 복수의 노즐팁 정렬 방법 |
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CN114011662B (zh) * | 2021-11-12 | 2022-07-12 | 绍兴奥美电子科技有限公司 | 一种点胶机用基座正位机构及其方法 |
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CN114769067B (zh) * | 2022-04-29 | 2024-01-05 | 广东安达智能装备股份有限公司 | 一种点胶阀纠偏机构及带有点胶阀纠偏机构的点胶设备 |
US12115550B2 (en) | 2022-05-13 | 2024-10-15 | Kulicke and Soffa Hi-Tech Co., Ltd. | Dual-valve automatic calibration system and dual-valve automatic calibration method |
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CN114833035B (zh) * | 2022-05-19 | 2024-01-09 | 深圳市昌富祥智能科技有限公司 | 一种多功能点胶机构及其使用方法 |
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