KR102321552B1 - 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 - Google Patents
광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 Download PDFInfo
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- KR102321552B1 KR102321552B1 KR1020167013736A KR20167013736A KR102321552B1 KR 102321552 B1 KR102321552 B1 KR 102321552B1 KR 1020167013736 A KR1020167013736 A KR 1020167013736A KR 20167013736 A KR20167013736 A KR 20167013736A KR 102321552 B1 KR102321552 B1 KR 102321552B1
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- resin composition
- compound
- moisture
- radically polymerizable
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 42
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 19
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- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 3
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- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08G18/08—Processes
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
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| CN111868125A (zh) * | 2018-03-15 | 2020-10-30 | 3M创新有限公司 | 包含聚环氧丙烷组分的光致聚合型组合物、制品和方法 |
| CN112262164B (zh) * | 2018-05-24 | 2022-07-22 | Dic株式会社 | 湿气固化型氨基甲酸酯热熔树脂组合物及层叠体 |
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| CN101743269B (zh) * | 2008-02-27 | 2012-08-08 | Dic株式会社 | 透湿薄膜、其制造方法和使用其的层压体 |
| JP5110228B2 (ja) * | 2010-09-06 | 2012-12-26 | Ｄｉｃ株式会社 | 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン |
| US20140107295A1 (en) * | 2011-05-30 | 2014-04-17 | Mitsubishi Rayon Co., Ltd. | Epoxy resin composition, cured object and optical semiconductor sealing material |
| US20140242322A1 (en) * | 2011-07-22 | 2014-08-28 | H.B. Fuller Company | One component, dual-cure adhesive for use in electronics |
| JP5790253B2 (ja) * | 2011-07-29 | 2015-10-07 | 住友ベークライト株式会社 | 液状樹脂組成物および半導体装置 |
| JP5395968B2 (ja) * | 2012-03-06 | 2014-01-22 | 積水化学工業株式会社 | 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子 |
| JP2013191748A (ja) * | 2012-03-14 | 2013-09-26 | Mitsubishi Chemicals Corp | 半導体発光装置 |
| JP6132125B2 (ja) * | 2012-05-09 | 2017-05-24 | セメダイン株式会社 | 画像表示装置の製造方法 |
| CN103450817B (zh) * | 2012-06-01 | 2017-07-04 | 汉高股份有限公司 | 粘合剂组合物 |
| KR102199885B1 (ko) * | 2013-10-18 | 2021-01-07 | 세키스이가가쿠 고교가부시키가이샤 | 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 |
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| CN105814095B (zh) | 2019-03-22 |
| JPWO2015182697A1 (ja) | 2017-04-20 |
| TWI666285B (zh) | 2019-07-21 |
| JP2017014518A (ja) | 2017-01-19 |
| CN105814095A (zh) | 2016-07-27 |
| JP6039080B2 (ja) | 2016-12-07 |
| WO2015182697A1 (ja) | 2015-12-03 |
| KR20170013852A (ko) | 2017-02-07 |
| JP6654983B2 (ja) | 2020-02-26 |
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