JP6039080B2 - 狭額縁設計表示素子用接着剤 - Google Patents

狭額縁設計表示素子用接着剤 Download PDF

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JP6039080B2
JP6039080B2 JP2015528476A JP2015528476A JP6039080B2 JP 6039080 B2 JP6039080 B2 JP 6039080B2 JP 2015528476 A JP2015528476 A JP 2015528476A JP 2015528476 A JP2015528476 A JP 2015528476A JP 6039080 B2 JP6039080 B2 JP 6039080B2
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compound
meth
adhesive
weight
narrow frame
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JPWO2015182697A1 (ja
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高橋　徹
徹 高橋
彰 結城
彰 結城
拓身 木田
拓身 木田
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/302—Water
    • C08G18/307—Atmospheric humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
    • C08G18/3893—Low-molecular-weight compounds having heteroatoms other than oxygen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Polymerisation Methods In General (AREA)
JP2015528476A 2014-05-30 2015-05-28 狭額縁設計表示素子用接着剤 Active JP6039080B2 (ja)

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JP2014112716 2014-05-30
JP2014112716 2014-05-30
PCT/JP2015/065383 WO2015182697A1 (ja) 2014-05-30 2015-05-28 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤

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KR (1) KR102321552B1 (zh)
CN (1) CN105814095B (zh)
TW (1) TWI666285B (zh)
WO (1) WO2015182697A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074781A (ja) * 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102653979B1 (ko) * 2015-12-02 2024-04-02 세키스이가가쿠 고교가부시키가이샤 광/습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제
CN111868125A (zh) * 2018-03-15 2020-10-30 3M创新有限公司 包含聚环氧丙烷组分的光致聚合型组合物、制品和方法
CN112262164B (zh) * 2018-05-24 2022-07-22 Dic株式会社 湿气固化型氨基甲酸酯热熔树脂组合物及层叠体
KR20210104718A (ko) 2018-12-18 2021-08-25 세키스이가가쿠 고교가부시키가이샤 광습기 경화성 우레탄계 화합물, 광습기 경화성 우레탄 프리폴리머, 및 광습기 경화성 수지 조성물
KR20210114953A (ko) * 2019-01-18 2021-09-24 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 및 경화체
CN111057271B (zh) * 2019-11-26 2021-09-28 广东盈骅新材料科技有限公司 亚氧化钛复合材料及其应用
WO2023176795A1 (ja) * 2022-03-14 2023-09-21 積水化学工業株式会社 光湿気硬化性樹脂組成物、電子部品用接着剤及び表示素子用接着剤

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6424821A (en) * 1987-07-20 1989-01-26 Sunstar Engineering Inc Photo-setting polyurethane composition
JPH0222320A (ja) * 1988-07-11 1990-01-25 Toagosei Chem Ind Co Ltd 光硬化性組成物
JP2006137855A (ja) * 2004-11-12 2006-06-01 Hitachi Chem Co Ltd 光半導体封止用熱硬化性樹脂組成物、その硬化物及び光半導体
JP2006241323A (ja) * 2005-03-03 2006-09-14 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP2006313289A (ja) * 2005-05-09 2006-11-16 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
JP2009041028A (ja) * 2001-09-14 2009-02-26 Sumitomo Chemical Co Ltd 光半導体封止用樹脂組成物
WO2012165413A1 (ja) * 2011-05-30 2012-12-06 三菱レイヨン株式会社 エポキシ樹脂組成物、硬化物及び光半導体封止材料
WO2013016133A2 (en) * 2011-07-22 2013-01-31 H.B. Fuller Company A one-component, dual-cure adhesive for use on electronics
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
JP2013191748A (ja) * 2012-03-14 2013-09-26 Mitsubishi Chemicals Corp 半導体発光装置
JP2013214056A (ja) * 2012-03-06 2013-10-17 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3037579B2 (ja) * 1995-03-17 2000-04-24 サンスター技研株式会社 湿気硬化性ポリマー組成物およびその製造法
JP2001240811A (ja) * 2000-03-01 2001-09-04 Sekisui Chem Co Ltd 反応性接着剤組成物及び部材の接合方法
JP4576745B2 (ja) * 2001-04-26 2010-11-10 Ｄｉｃ株式会社 湿気硬化性ウレタン組成物
JP4392328B2 (ja) * 2004-11-08 2009-12-24 横浜ゴム株式会社 一液湿気硬化型ウレタン組成物
JP5105134B2 (ja) * 2005-05-13 2012-12-19 株式会社スリーボンド 硬化性組成物及びそれを用いた放熱部材の形成方法
JP5013585B2 (ja) 2006-09-06 2012-08-29 日立化成ポリマー株式会社 反応性ホットメルト接着剤組成物及びそれを用いた接着方法
JP2008266521A (ja) * 2007-04-24 2008-11-06 Konishi Co Ltd 湿気硬化型樹脂組成物
JP5228370B2 (ja) 2007-04-27 2013-07-03 東亞合成株式会社 一液湿気硬化型ウレタン系ホットメルト接着剤組成物及びその使用方法
CN101743269B (zh) * 2008-02-27 2012-08-08 Dic株式会社 透湿薄膜、其制造方法和使用其的层压体
JP5110228B2 (ja) * 2010-09-06 2012-12-26 Ｄｉｃ株式会社 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン
JP6132125B2 (ja) * 2012-05-09 2017-05-24 セメダイン株式会社 画像表示装置の製造方法
CN103450817B (zh) * 2012-06-01 2017-07-04 汉高股份有限公司 粘合剂组合物
KR102199885B1 (ko) * 2013-10-18 2021-01-07 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6424821A (en) * 1987-07-20 1989-01-26 Sunstar Engineering Inc Photo-setting polyurethane composition
JPH0222320A (ja) * 1988-07-11 1990-01-25 Toagosei Chem Ind Co Ltd 光硬化性組成物
JP2009041028A (ja) * 2001-09-14 2009-02-26 Sumitomo Chemical Co Ltd 光半導体封止用樹脂組成物
JP2006137855A (ja) * 2004-11-12 2006-06-01 Hitachi Chem Co Ltd 光半導体封止用熱硬化性樹脂組成物、その硬化物及び光半導体
JP2006241323A (ja) * 2005-03-03 2006-09-14 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP2006313289A (ja) * 2005-05-09 2006-11-16 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
WO2012165413A1 (ja) * 2011-05-30 2012-12-06 三菱レイヨン株式会社 エポキシ樹脂組成物、硬化物及び光半導体封止材料
WO2013016133A2 (en) * 2011-07-22 2013-01-31 H.B. Fuller Company A one-component, dual-cure adhesive for use on electronics
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
JP2013214056A (ja) * 2012-03-06 2013-10-17 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP2013191748A (ja) * 2012-03-14 2013-09-26 Mitsubishi Chemicals Corp 半導体発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074781A (ja) * 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物

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TW201606030A (zh) 2016-02-16
CN105814095B (zh) 2019-03-22
JPWO2015182697A1 (ja) 2017-04-20
TWI666285B (zh) 2019-07-21
JP2017014518A (ja) 2017-01-19
CN105814095A (zh) 2016-07-27
KR102321552B1 (ko) 2021-11-03
WO2015182697A1 (ja) 2015-12-03
KR20170013852A (ko) 2017-02-07
JP6654983B2 (ja) 2020-02-26

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