KR102305617B1 - 공극을 갖는 폴리이미드 필름 및 그 제조 방법 - Google Patents

공극을 갖는 폴리이미드 필름 및 그 제조 방법 Download PDF

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KR102305617B1
KR102305617B1 KR1020207021572A KR20207021572A KR102305617B1 KR 102305617 B1 KR102305617 B1 KR 102305617B1 KR 1020207021572 A KR1020207021572 A KR 1020207021572A KR 20207021572 A KR20207021572 A KR 20207021572A KR 102305617 B1 KR102305617 B1 KR 102305617B1
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South Korea
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polyimide film
group
film
polyimide
carbon atoms
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KR1020207021572A
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Korean (ko)
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KR20200091953A (ko
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요시키 미야모토
야스히토 이이즈카
사토시 가토
다카유키 가나다
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아사히 가세이 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
KR1020207021572A 2014-06-25 2015-06-18 공극을 갖는 폴리이미드 필름 및 그 제조 방법 KR102305617B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014130377 2014-06-25
JPJP-P-2014-130377 2014-06-25
KR1020167035080A KR102139455B1 (ko) 2014-06-25 2015-06-18 공극을 갖는 폴리이미드 필름 및 그 제조 방법
PCT/JP2015/067656 WO2015198970A1 (ja) 2014-06-25 2015-06-18 空隙を有するポリイミドフィルム及びその製造方法

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KR1020167035080A Division KR102139455B1 (ko) 2014-06-25 2015-06-18 공극을 갖는 폴리이미드 필름 및 그 제조 방법

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KR20200091953A KR20200091953A (ko) 2020-07-31
KR102305617B1 true KR102305617B1 (ko) 2021-09-27

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KR1020167035080A KR102139455B1 (ko) 2014-06-25 2015-06-18 공극을 갖는 폴리이미드 필름 및 그 제조 방법
KR1020207021572A KR102305617B1 (ko) 2014-06-25 2015-06-18 공극을 갖는 폴리이미드 필름 및 그 제조 방법

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JP (4) JP6254274B2 (ja)
KR (2) KR102139455B1 (ja)
CN (3) CN112961382A (ja)
TW (2) TWI670327B (ja)
WO (1) WO2015198970A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112961382A (zh) * 2014-06-25 2021-06-15 旭化成株式会社 具有孔隙的聚酰亚胺薄膜及其制造方法
TWI753794B (zh) * 2016-03-23 2022-01-21 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 形成含矽膜之組成物及其製法與用途
KR102358122B1 (ko) * 2016-03-31 2022-02-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 플렉시블 기판의 제조 방법
CN112051628A (zh) * 2016-05-10 2020-12-08 住友化学株式会社 光学膜和使用光学膜的光学构件
JP6966847B2 (ja) * 2016-08-10 2021-11-17 日鉄ケミカル＆マテリアル株式会社 透明ポリイミドフィルムの製造方法
KR102394341B1 (ko) * 2016-08-10 2022-05-03 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 폴리이미드 전구체 및 폴리이미드, 투명 폴리이미드 필름의 제조방법
JP6981812B2 (ja) * 2016-08-31 2021-12-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101989028B1 (ko) 2017-01-31 2019-06-14 주식회사 엘지화학 폴리이미드 및 이로부터 제조된 플렉시블 디스플레이용 폴리이미드 필름
KR102018455B1 (ko) * 2017-05-24 2019-09-04 주식회사 엘지화학 폴리이미드 적층필름 롤체 및 그 제조 방법
CN107195252A (zh) * 2017-07-13 2017-09-22 武汉天马微电子有限公司 一种柔性显示面板、显示装置及柔性显示面板的制作方法
KR101840977B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
JP7363019B2 (ja) * 2017-09-27 2023-10-18 大日本印刷株式会社 ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
KR102117151B1 (ko) * 2017-09-29 2020-05-29 주식회사 엘지화학 폴리이미드 전구체 용액 및 이를 이용하여 제조된 폴리이미드 필름
KR102281613B1 (ko) 2017-11-21 2021-07-23 주식회사 엘지화학 디스플레이 기판용 폴리이미드 필름
JP2019172970A (ja) * 2018-03-26 2019-10-10 東レ株式会社 表示デバイスまたは受光デバイスの基板用樹脂組成物、並びに、それを用いた表示デバイスまたは受光デバイスの基板、表示デバイス、受光デバイス、表示デバイスまたは受光デバイスの製造方法。
WO2019188380A1 (ja) * 2018-03-30 2019-10-03 株式会社カネカ ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法
CN108586780B (zh) * 2018-05-09 2021-05-07 无锡创彩光学材料有限公司 一种多孔性聚酰亚胺薄膜及其制备方法
CN109163442A (zh) * 2018-08-01 2019-01-08 江阴市博豪电热电器制造有限公司 一种橡胶柔性加热器及其制备方法
CN115386134A (zh) * 2018-10-31 2022-11-25 株式会社理光 多孔质层及电极
KR20210109525A (ko) * 2018-12-28 2021-09-06 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
CN113555554B (zh) * 2021-06-03 2023-04-07 浙江中科玖源新材料有限公司 一种粘结剂、硅碳负极片及其制备方法
EP4372035A1 (en) * 2021-07-13 2024-05-22 Asahi Kasei Kabushiki Kaisha Porous polyimide having highly uniform nano structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329096A (ja) 2000-03-17 2001-11-27 Toray Ind Inc 低誘電率重合体
JP2004335995A (ja) 2003-04-17 2004-11-25 Sumitomo Bakelite Co Ltd 多孔質樹脂膜ならびにその製造方法および半導体装置
JP2010202679A (ja) 2009-02-27 2010-09-16 Lintec Corp 多孔質ポリイミド形成用ブロック共重合体、多孔質ポリイミドおよび絶縁材料
JP2011132390A (ja) 2009-12-25 2011-07-07 Sumitomo Electric Ind Ltd 多孔質ポリイミド形成用樹脂組成物

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4535099A (en) * 1984-04-03 1985-08-13 Imi-Tech Corporation Polyimide foam from mixture of silicon containing diamine and different aromatic diamine
JP2531906B2 (ja) * 1991-09-13 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション 発泡重合体
JP3414479B2 (ja) * 1993-02-10 2003-06-09 ユニチカ株式会社 製膜溶液及びそれから得られる多孔質フィルム又は多孔質フィルムの被覆物
JPH1121369A (ja) * 1997-07-04 1999-01-26 Nippon Telegr & Teleph Corp <Ntt> 多孔質高分子膜の製造方法
JP2000044719A (ja) * 1998-07-22 2000-02-15 Minnesota Mining & Mfg Co <3M> 多孔質ポリイミド、その前駆体および多孔質ポリイミドの製造方法
JP2001237241A (ja) * 2000-02-24 2001-08-31 Hitachi Ltd 低誘電率膜とそれを用いた半導体装置
JP4586243B2 (ja) * 2000-06-22 2010-11-24 住友ベークライト株式会社 絶縁材の製造方法
JP4453252B2 (ja) * 2002-12-26 2010-04-21 コニカミノルタホールディングス株式会社 有機薄膜トランジスタ素子及び有機薄膜トランジスタ素子シート
US20100196683A1 (en) * 2006-10-27 2010-08-05 Konnklijke Philips Electronics N.V. Electronic device having a plastic substrate
JP4948211B2 (ja) * 2007-03-12 2012-06-06 古河電気工業株式会社 発泡体、発泡体を用いた回路基板、及びこれらの製造方法
EP2248843A4 (en) * 2008-02-25 2013-07-24 Hitachi Chem Dupont Microsys POLYIMIDE PREPARATION COMPOSITION, POLYIMIDE COATING AND TRANSPARENT FLEXIBLE COATING
JP2010202729A (ja) * 2009-03-02 2010-09-16 Hitachi Chemical Dupont Microsystems Ltd フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
KR101292886B1 (ko) 2009-09-29 2013-08-02 코오롱인더스트리 주식회사 내용제성이 개선된 무색투명한 폴리이미드 필름
JP5725017B2 (ja) * 2010-03-31 2015-05-27 Jsr株式会社 基板の製造方法およびそれに用いられる組成物
JP2012102216A (ja) * 2010-11-09 2012-05-31 Kaneka Corp ポリイミドフィルムの製造方法及びポリイミドフィルム
JP5638921B2 (ja) * 2010-11-17 2014-12-10 三井化学株式会社 誘電特性に優れた樹脂／金属積層体及び回路用基板
WO2012118020A1 (ja) 2011-02-28 2012-09-07 Jsr株式会社 樹脂組成物およびそれを用いた膜形成方法
CN103842409A (zh) * 2011-09-29 2014-06-04 Jsr株式会社 树脂组合物及使用其的膜形成方法
JP5891693B2 (ja) * 2011-10-05 2016-03-23 Jsr株式会社 基板の製造方法および基板
KR20200006626A (ko) * 2013-03-18 2020-01-20 아사히 가세이 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
CN112961382A (zh) * 2014-06-25 2021-06-15 旭化成株式会社 具有孔隙的聚酰亚胺薄膜及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329096A (ja) 2000-03-17 2001-11-27 Toray Ind Inc 低誘電率重合体
JP2004335995A (ja) 2003-04-17 2004-11-25 Sumitomo Bakelite Co Ltd 多孔質樹脂膜ならびにその製造方法および半導体装置
JP2010202679A (ja) 2009-02-27 2010-09-16 Lintec Corp 多孔質ポリイミド形成用ブロック共重合体、多孔質ポリイミドおよび絶縁材料
JP2011132390A (ja) 2009-12-25 2011-07-07 Sumitomo Electric Ind Ltd 多孔質ポリイミド形成用樹脂組成物

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CN112961382A (zh) 2021-06-15
KR102139455B1 (ko) 2020-07-30
JP6254274B2 (ja) 2017-12-27
JP6820827B2 (ja) 2021-01-27
JP2020183539A (ja) 2020-11-12
JP7037534B2 (ja) 2022-03-16
CN106414575B (zh) 2021-03-02
CN106414575A (zh) 2017-02-15
WO2015198970A1 (ja) 2015-12-30
TW201605978A (zh) 2016-02-16
JPWO2015198970A1 (ja) 2017-04-20
JP7033171B2 (ja) 2022-03-09
JP2020128522A (ja) 2020-08-27
TWI689532B (zh) 2020-04-01
JP2018048344A (ja) 2018-03-29
CN112080026A (zh) 2020-12-15
KR20200091953A (ko) 2020-07-31
TW201835165A (zh) 2018-10-01
KR20170010383A (ko) 2017-01-31
CN112080026B (zh) 2024-01-23
TWI670327B (zh) 2019-09-01

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