KR102304245B1 - 가공 장치 - Google Patents

가공 장치 Download PDF

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Publication number
KR102304245B1
KR102304245B1 KR1020150132252A KR20150132252A KR102304245B1 KR 102304245 B1 KR102304245 B1 KR 102304245B1 KR 1020150132252 A KR1020150132252 A KR 1020150132252A KR 20150132252 A KR20150132252 A KR 20150132252A KR 102304245 B1 KR102304245 B1 KR 102304245B1
Authority
KR
South Korea
Prior art keywords
wafer
robot hand
cassette
reversing
robot
Prior art date
Application number
KR1020150132252A
Other languages
English (en)
Korean (ko)
Other versions
KR20160037086A (ko
Inventor
세이지 네모토
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160037086A publication Critical patent/KR20160037086A/ko
Application granted granted Critical
Publication of KR102304245B1 publication Critical patent/KR102304245B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/08—Programme-controlled manipulators characterised by modular constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
KR1020150132252A 2014-09-26 2015-09-18 가공 장치 KR102304245B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-196304 2014-09-26
JP2014196304A JP6360762B2 (ja) 2014-09-26 2014-09-26 加工装置

Publications (2)

Publication Number Publication Date
KR20160037086A KR20160037086A (ko) 2016-04-05
KR102304245B1 true KR102304245B1 (ko) 2021-09-17

Family

ID=55597300

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150132252A KR102304245B1 (ko) 2014-09-26 2015-09-18 가공 장치

Country Status (4)

Country Link
JP (1) JP6360762B2 (zh)
KR (1) KR102304245B1 (zh)
CN (1) CN105458912B (zh)
TW (1) TWI664515B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107690377B (zh) * 2017-04-27 2021-07-09 深圳配天智能技术研究院有限公司 基于机器人系统的零件抓取方法及机器人系统、夹具
JP7191472B2 (ja) * 2019-01-25 2022-12-19 株式会社ディスコ 加工装置の使用方法
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
JP7339858B2 (ja) * 2019-11-08 2023-09-06 株式会社ディスコ 加工装置及び板状ワークの搬入出方法
JP2021132181A (ja) * 2020-02-21 2021-09-09 株式会社ディスコ 加工装置
CN113496930A (zh) * 2020-04-03 2021-10-12 重庆超硅半导体有限公司 一种集成电路用硅片无损伤转移方法
JP7509596B2 (ja) 2020-07-27 2024-07-02 株式会社ディスコ 加工装置
CN112687571B (zh) * 2020-12-31 2023-03-07 深圳中科飞测科技股份有限公司 晶圆检测方法、检测装置及计算机可读存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093893A (ja) 2003-09-19 2005-04-07 Nec Yamagata Ltd ウェハ搬送装置
JP2010201556A (ja) * 2009-03-03 2010-09-16 Kawasaki Heavy Ind Ltd ロボット及びその制御方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0533010Y2 (zh) * 1987-02-26 1993-08-23
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
JPH1022364A (ja) * 1996-07-05 1998-01-23 Metsukusu:Kk 搬送装置における吸着ハンド
JP4253365B2 (ja) * 1997-10-17 2009-04-08 オリンパス株式会社 ウェハ搬送装置
IL143467A (en) * 1998-12-02 2005-05-17 Newport Corp Specimen holding robotic arm and effector
JP2002270674A (ja) * 2001-03-14 2002-09-20 Disco Abrasive Syst Ltd 搬出装置
JP4509411B2 (ja) * 2001-03-26 2010-07-21 株式会社ディスコ 搬出入装置
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method
JP2007221031A (ja) * 2006-02-20 2007-08-30 Lintec Corp 搬送装置及び搬送方法
TWI363394B (en) * 2008-04-08 2012-05-01 Mjc Probe Inc Apparatus of fully-auto loader and method of the same
JP4705128B2 (ja) * 2008-04-15 2011-06-22 オリンパスメディカルシステムズ株式会社 マニピュレータ
JP2010238174A (ja) 2009-03-31 2010-10-21 Yamatake Corp 位置決め装置及び位置決め方法
JP5654845B2 (ja) * 2010-11-16 2015-01-14 株式会社ディスコ 研削加工装置
CN102800559B (zh) * 2011-05-24 2016-04-20 北京北方微电子基地设备工艺研究中心有限责任公司 从料盒中取晶片的装置、晶片上料设备和晶片上料系统
TWI435074B (zh) * 2011-06-29 2014-04-21 Mpi Corp 光學檢測裝置與光學檢測方法
CN103632995B (zh) * 2012-08-13 2016-06-08 上海华虹宏力半导体制造有限公司 片盒监控系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093893A (ja) 2003-09-19 2005-04-07 Nec Yamagata Ltd ウェハ搬送装置
JP2010201556A (ja) * 2009-03-03 2010-09-16 Kawasaki Heavy Ind Ltd ロボット及びその制御方法

Also Published As

Publication number Publication date
KR20160037086A (ko) 2016-04-05
TW201616259A (zh) 2016-05-01
TWI664515B (zh) 2019-07-01
JP2016068155A (ja) 2016-05-09
CN105458912A (zh) 2016-04-06
JP6360762B2 (ja) 2018-07-18
CN105458912B (zh) 2019-04-26

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