KR102282829B1 - 회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법 - Google Patents

회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법 Download PDF

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Publication number
KR102282829B1
KR102282829B1 KR1020140135546A KR20140135546A KR102282829B1 KR 102282829 B1 KR102282829 B1 KR 102282829B1 KR 1020140135546 A KR1020140135546 A KR 1020140135546A KR 20140135546 A KR20140135546 A KR 20140135546A KR 102282829 B1 KR102282829 B1 KR 102282829B1
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South Korea
Prior art keywords
circuit
connection
circuit member
connection terminal
connection material
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KR1020140135546A
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English (en)
Korean (ko)
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KR20150041748A (ko
Inventor
히로시 요코타
히로유키 이자와
모토히로 아리후쿠
스스무 가와카미
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
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Publication of KR20150041748A publication Critical patent/KR20150041748A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020140135546A 2013-10-09 2014-10-08 회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법 KR102282829B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-212121 2013-10-09
JP2013212121 2013-10-09

Publications (2)

Publication Number Publication Date
KR20150041748A KR20150041748A (ko) 2015-04-17
KR102282829B1 true KR102282829B1 (ko) 2021-07-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140135546A KR102282829B1 (ko) 2013-10-09 2014-10-08 회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법

Country Status (3)

Country Link
JP (1) JP6398570B2 (zh)
KR (1) KR102282829B1 (zh)
CN (2) CN104559902A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102608218B1 (ko) * 2015-11-04 2023-11-30 가부시끼가이샤 레조낙 접착제 조성물 및 구조체
WO2018042701A1 (ja) * 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
CN107731104B (zh) * 2017-11-27 2022-03-22 京东方科技集团股份有限公司 显示基板及制备方法、显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170910A (ja) * 2000-11-30 2002-06-14 Sony Chem Corp 接続材料
WO2010038574A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 アクリル系絶縁性接着剤
WO2012071484A2 (en) 2010-11-23 2012-05-31 Adhesives Research, Inc. Reactive conductive pressure-sensitive adhesive tape
WO2013035164A1 (ja) 2011-09-06 2013-03-14 日立化成株式会社 接着剤組成物及び接続体

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JPS503740A (zh) 1973-05-16 1975-01-16
JPS59120436A (ja) 1982-12-27 1984-07-12 Seikosha Co Ltd 異方導電性ゴムシ−トの製造方法
JPS60191228A (ja) 1984-10-29 1985-09-28 Seiko Epson Corp 表示装置の接続構造
JPS6218793A (ja) * 1985-07-18 1987-01-27 ダイソー株式会社 電気的部材の製法
JPS6262874A (ja) 1985-09-11 1987-03-19 Sony Chem Kk 導電異方性接着剤
JPH01251787A (ja) 1988-03-31 1989-10-06 Toshiba Corp 電子部品の接続装置
US5395876A (en) * 1993-04-19 1995-03-07 Acheson Industries, Inc. Surface mount conductive adhesives
JP3907217B2 (ja) 1993-07-29 2007-04-18 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JPH10251606A (ja) * 1997-03-10 1998-09-22 Asahi Chem Ind Co Ltd 導電性接着剤
JP3508558B2 (ja) 1998-07-22 2004-03-22 ソニーケミカル株式会社 異方導電性接着フィルム
JP2000169821A (ja) * 1998-09-30 2000-06-20 Three Bond Co Ltd 紫外線硬化性異方導電接着剤
JP2003306553A (ja) * 2002-04-15 2003-10-31 Kanegafuchi Chem Ind Co Ltd ポリイミド成形体
JP2005108924A (ja) * 2003-09-29 2005-04-21 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2005320455A (ja) * 2004-05-10 2005-11-17 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP4905352B2 (ja) * 2006-05-09 2012-03-28 日立化成工業株式会社 接着シート、これを用いた回路部材の接続構造及び半導体装置
JP2008195852A (ja) * 2007-02-14 2008-08-28 Hitachi Chem Co Ltd フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体
JP4941554B2 (ja) * 2007-05-09 2012-05-30 日立化成工業株式会社 フィルム状回路接続材料及び回路部材の接続構造
KR101243554B1 (ko) * 2008-04-17 2013-03-20 히타치가세이가부시끼가이샤 접착제 조성물, 회로 접속용 접착제, 접속체 및 반도체 장치
JP5176139B2 (ja) * 2008-05-12 2013-04-03 日立化成株式会社 回路接続材料及びそれを用いた回路部材の接続構造
JP5668636B2 (ja) * 2010-08-24 2015-02-12 日立化成株式会社 回路接続構造体の製造方法
JP6024261B2 (ja) * 2012-07-26 2016-11-16 日立化成株式会社 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170910A (ja) * 2000-11-30 2002-06-14 Sony Chem Corp 接続材料
WO2010038574A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 アクリル系絶縁性接着剤
WO2012071484A2 (en) 2010-11-23 2012-05-31 Adhesives Research, Inc. Reactive conductive pressure-sensitive adhesive tape
WO2013035164A1 (ja) 2011-09-06 2013-03-14 日立化成株式会社 接着剤組成物及び接続体

Also Published As

Publication number Publication date
KR20150041748A (ko) 2015-04-17
CN104559902A (zh) 2015-04-29
JP6398570B2 (ja) 2018-10-03
JP2015096603A (ja) 2015-05-21
CN114231240A (zh) 2022-03-25

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