KR102245012B1 - 묘화 장치 및 묘화 방법 - Google Patents

묘화 장치 및 묘화 방법 Download PDF

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Publication number
KR102245012B1
KR102245012B1 KR1020190060092A KR20190060092A KR102245012B1 KR 102245012 B1 KR102245012 B1 KR 102245012B1 KR 1020190060092 A KR1020190060092 A KR 1020190060092A KR 20190060092 A KR20190060092 A KR 20190060092A KR 102245012 B1 KR102245012 B1 KR 102245012B1
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KR
South Korea
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data
character
information area
pattern
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KR1020190060092A
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English (en)
Korean (ko)
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KR20200010024A (ko
Inventor
신야 나타오치
사토루 야사카
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20200010024A publication Critical patent/KR20200010024A/ko
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Publication of KR102245012B1 publication Critical patent/KR102245012B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G03F7/2055Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020190060092A 2018-07-20 2019-05-22 묘화 장치 및 묘화 방법 KR102245012B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018136414A JP7133379B2 (ja) 2018-07-20 2018-07-20 描画装置および描画方法
JPJP-P-2018-136414 2018-07-20

Publications (2)

Publication Number Publication Date
KR20200010024A KR20200010024A (ko) 2020-01-30
KR102245012B1 true KR102245012B1 (ko) 2021-04-26

Family

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Application Number Title Priority Date Filing Date
KR1020190060092A KR102245012B1 (ko) 2018-07-20 2019-05-22 묘화 장치 및 묘화 방법

Country Status (4)

Country Link
JP (1) JP7133379B2 (zh)
KR (1) KR102245012B1 (zh)
CN (1) CN110737179B (zh)
TW (1) TWI728344B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7463154B2 (ja) * 2020-03-24 2024-04-08 株式会社Screenホールディングス 描画装置、データ処理装置、描画方法、および描画データ生成方法
WO2021250891A1 (ja) * 2020-06-12 2021-12-16 株式会社アイ・セラミック・テクノロジー シート材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003099771A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd データ変換装置およびその方法、並びに当該方法を用いたプログラム
JP2006192323A (ja) 2005-01-11 2006-07-27 Seiko Epson Corp 基板、識別コード描画方法及び表示モジュール
JP2009158776A (ja) 2007-12-27 2009-07-16 Nuflare Technology Inc 描画装置及び描画方法
JP2009253124A (ja) * 2008-04-09 2009-10-29 Nuflare Technology Inc 描画装置及び描画方法

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JPS63165953A (ja) * 1986-12-27 1988-07-09 Dainippon Printing Co Ltd 雑誌編集システム
JPS6481954A (en) * 1987-09-24 1989-03-28 Graphico Corp Electronic color scanner system
JPH06110190A (ja) * 1992-09-28 1994-04-22 Toppan Printing Co Ltd 文字及び画像処理装置
JPH06266337A (ja) * 1993-03-16 1994-09-22 Pfu Ltd 文字列描画処理方法
JP4124851B2 (ja) * 1998-02-26 2008-07-23 キヤノン株式会社 情報処理装置及び情報処理方法並びに記憶媒体
JP2002367900A (ja) * 2001-06-12 2002-12-20 Yaskawa Electric Corp 露光装置および露光方法
CN1769073B (zh) * 2004-10-27 2010-05-05 中国科学院光电技术研究所 激光直写防伪标识
JP5241226B2 (ja) * 2007-12-27 2013-07-17 株式会社オーク製作所 描画装置および描画方法
JP5209544B2 (ja) 2009-03-04 2013-06-12 大日本スクリーン製造株式会社 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法
JP2011027918A (ja) * 2009-07-23 2011-02-10 Hitachi Via Mechanics Ltd 描画装置
JP5496041B2 (ja) * 2010-09-30 2014-05-21 大日本スクリーン製造株式会社 変位算出方法、描画データの補正方法、描画方法および描画装置
TW201224678A (en) * 2010-11-04 2012-06-16 Orc Mfg Co Ltd Exposure device
CN102736935A (zh) * 2012-05-31 2012-10-17 合肥芯硕半导体有限公司 无掩膜光刻机曝光中实时添加字符串的方法
US8962222B2 (en) * 2012-06-13 2015-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Photomask and method for forming the same
CN102880892B (zh) * 2012-08-30 2015-04-22 天津芯硕精密机械有限公司 无掩膜光刻机曝光中实时添加条形码的方法
JP6131916B2 (ja) * 2014-06-27 2017-05-24 大日本印刷株式会社 情報保存装置
JP2016031502A (ja) 2014-07-30 2016-03-07 株式会社Screenホールディングス 描画装置および描画方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003099771A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd データ変換装置およびその方法、並びに当該方法を用いたプログラム
JP2006192323A (ja) 2005-01-11 2006-07-27 Seiko Epson Corp 基板、識別コード描画方法及び表示モジュール
JP2009158776A (ja) 2007-12-27 2009-07-16 Nuflare Technology Inc 描画装置及び描画方法
JP2009253124A (ja) * 2008-04-09 2009-10-29 Nuflare Technology Inc 描画装置及び描画方法

Also Published As

Publication number Publication date
JP2020013042A (ja) 2020-01-23
TW202008423A (zh) 2020-02-16
TWI728344B (zh) 2021-05-21
KR20200010024A (ko) 2020-01-30
CN110737179B (zh) 2022-08-02
CN110737179A (zh) 2020-01-31
JP7133379B2 (ja) 2022-09-08

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