KR102238014B1 - 유기 전자 장치를 캡슐화하기 위한 접착 테이프 - Google Patents

유기 전자 장치를 캡슐화하기 위한 접착 테이프 Download PDF

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KR102238014B1
KR102238014B1 KR1020167031380A KR20167031380A KR102238014B1 KR 102238014 B1 KR102238014 B1 KR 102238014B1 KR 1020167031380 A KR1020167031380 A KR 1020167031380A KR 20167031380 A KR20167031380 A KR 20167031380A KR 102238014 B1 KR102238014 B1 KR 102238014B1
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adhesive
poly
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layer
weight
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KR20160143799A (ko
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클라우스 카이테-텔겐뷔셔
율리아 롬프
자니카 스톨체
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테사 소시에타스 유로파에아
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H01L21/56—
    • H01L23/293—
    • H01L23/3107—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
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    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020167031380A 2014-04-11 2015-03-17 유기 전자 장치를 캡슐화하기 위한 접착 테이프 Active KR102238014B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014207074.0A DE102014207074A1 (de) 2014-04-11 2014-04-11 Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207074.0 2014-04-11
PCT/EP2015/055480 WO2015154947A1 (de) 2014-04-11 2015-03-17 Klebeband für die kapselung einer organischen elektronischen anordnung

Publications (2)

Publication Number Publication Date
KR20160143799A KR20160143799A (ko) 2016-12-14
KR102238014B1 true KR102238014B1 (ko) 2021-04-08

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Country Link
US (1) US10011742B2 (https=)
EP (1) EP3129443B1 (https=)
JP (1) JP2017515935A (https=)
KR (1) KR102238014B1 (https=)
CN (1) CN106536656B (https=)
DE (1) DE102014207074A1 (https=)
TW (1) TWI663242B (https=)
WO (1) WO2015154947A1 (https=)

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JP6474489B2 (ja) * 2014-10-29 2019-02-27 テーザ・ソシエタス・ヨーロピア 活性化可能なゲッター材料を含む接着剤
JP6470409B2 (ja) 2014-10-29 2019-02-13 テーザ・ソシエタス・ヨーロピア シラン系水捕捉剤を含むｏｌｅｄ適合接着剤
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
JP6563796B2 (ja) * 2015-12-03 2019-08-21 双葉電子工業株式会社 封止構造、有機ｅｌ表示装置、及びセンサ
WO2017163577A1 (ja) * 2016-03-25 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 積層体の製造方法
TW201900798A (zh) * 2017-05-05 2019-01-01 美商3M新設資產公司 聚合膜及含有此膜之顯示裝置
JP7285219B2 (ja) * 2017-05-05 2023-06-01 スリーエム イノベイティブ プロパティズ カンパニー ポリマーフィルムを含むディスプレイデバイス
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
CN108878618B (zh) 2017-05-11 2020-03-24 Tcl集团股份有限公司 一种qled器件及其制备方法
CN109216486A (zh) * 2017-07-07 2019-01-15 杭州纤纳光电科技有限公司 一种薄膜光伏组件封装结构与方法
KR102733164B1 (ko) * 2017-09-27 2024-11-25 알케마 인코포레이티드 할로알킬 및 할로알케닐 에테르 (메트)아크릴레이트의 중합체
SG11202003310XA (en) 2017-10-12 2020-05-28 Avery Dennison Corp Low outgassing clean adhesive
KR102283118B1 (ko) * 2017-11-01 2021-07-28 주식회사 엘지화학 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법
JP7253542B2 (ja) * 2018-05-30 2023-04-06 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2020018410A1 (en) 2018-07-16 2020-01-23 Polyceed Inc. Polymeric compositions for use in variable transmission and electrochemical devices
WO2020017221A1 (ja) * 2018-07-18 2020-01-23 パナソニックＩｐマネジメント株式会社 ガラスパネルユニット、及びガラスパネルユニットの製造方法
JP7329615B2 (ja) * 2019-03-29 2023-08-18 ダウ グローバル テクノロジーズ エルエルシー 疎水性処理されたヒュームドシリカを含むフィルム層を有するｐｖモジュール
CN110518121B (zh) * 2019-07-19 2021-02-05 华南师范大学 一种柔性钙钛矿太阳能电池的转移方法
CN110571335A (zh) * 2019-08-08 2019-12-13 北京曜能科技有限公司 钙钛矿光伏组件、制备方法和用途
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JP2021174884A (ja) * 2020-04-24 2021-11-01 フジプレアム株式会社 ペロブスカイト型太陽電池
CN112687828A (zh) * 2020-12-28 2021-04-20 华东师范大学 一种钙钛矿太阳能电池封装方法
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CN118511671A (zh) * 2022-01-07 2024-08-16 松下控股株式会社 太阳能电池
FR3139143B1 (fr) * 2022-08-30 2024-08-30 Commissariat Energie Atomique Procede de transfert d’une couche adhesive en polymere(s) thermoplastique(s) d’un premier substrat vers un deuxieme substrat
KR20250131768A (ko) * 2022-11-04 2025-09-03 케일룩스 코포레이션 캡슐화된 페로브스카이트 모듈 및 이를 포함하는 태양 전지
CN116487276B (zh) * 2023-04-26 2024-02-23 珠海妙存科技有限公司 一种芯片及其制作方法、半导体器件
DE102023209092A1 (de) 2023-09-19 2025-03-20 Infineon Technologies Ag Verkapselungsmittel mit porösem Farbstoff für ein elektronisches Gehäuse

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