KR102234045B1 - 구리 피복 적층판, 프린트 배선판 및 그 사용 방법 - Google Patents

구리 피복 적층판, 프린트 배선판 및 그 사용 방법 Download PDF

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Publication number
KR102234045B1
KR102234045B1 KR1020140129485A KR20140129485A KR102234045B1 KR 102234045 B1 KR102234045 B1 KR 102234045B1 KR 1020140129485 A KR1020140129485 A KR 1020140129485A KR 20140129485 A KR20140129485 A KR 20140129485A KR 102234045 B1 KR102234045 B1 KR 102234045B1
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KR
South Korea
Prior art keywords
insulating layer
copper foil
polyimide
copper
less
Prior art date
Application number
KR1020140129485A
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English (en)
Korean (ko)
Other versions
KR20150037602A (ko
Inventor
아키라 모리
다케시 도쿠야마
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
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Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20150037602A publication Critical patent/KR20150037602A/ko
Application granted granted Critical
Publication of KR102234045B1 publication Critical patent/KR102234045B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020140129485A 2013-09-30 2014-09-26 구리 피복 적층판, 프린트 배선판 및 그 사용 방법 KR102234045B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013205950 2013-09-30
JPJP-P-2013-205950 2013-09-30
JPJP-P-2014-178646 2014-09-03
JP2014178646A JP6403503B2 (ja) 2013-09-30 2014-09-03 銅張積層板、プリント配線板及びその使用方法

Publications (2)

Publication Number Publication Date
KR20150037602A KR20150037602A (ko) 2015-04-08
KR102234045B1 true KR102234045B1 (ko) 2021-03-30

Family

ID=53195148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140129485A KR102234045B1 (ko) 2013-09-30 2014-09-26 구리 피복 적층판, 프린트 배선판 및 그 사용 방법

Country Status (4)

Country Link
JP (1) JP6403503B2 (ja)
KR (1) KR102234045B1 (ja)
CN (1) CN104519657B (ja)
TW (1) TWI634986B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6379071B2 (ja) * 2015-06-15 2018-08-22 Ｊｘ金属株式会社 電磁波シールド材
TWI564145B (zh) * 2015-06-17 2017-01-01 長興材料工業股份有限公司 金屬被覆積層板及其製造方法
WO2017014079A1 (ja) * 2015-07-23 2017-01-26 三井金属鉱業株式会社 樹脂付銅箔、銅張積層板及びプリント配線板
JP6825368B2 (ja) * 2016-01-05 2021-02-03 荒川化学工業株式会社 銅張積層体及びプリント配線板
KR102418502B1 (ko) * 2016-09-05 2022-07-06 아라까와 가가꾸 고교 가부시끼가이샤 플렉서블 프린트 배선판용 동피복 적층판 및 플렉서블 프린트 배선판
JP7115165B2 (ja) * 2017-09-15 2022-08-09 Jsr株式会社 高周波回路用積層体及びフレキシブルプリント基板
JP7095880B2 (ja) * 2018-10-12 2022-07-05 ユニチカ株式会社 ポリイミドフィルム
JP7503289B2 (ja) 2019-01-21 2024-06-20 ユニチカ株式会社 ポリイミド
JP7267591B2 (ja) * 2019-05-22 2023-05-02 ユニチカ株式会社 ポリエステルイミド
JP7378122B2 (ja) * 2019-10-23 2023-11-13 ユニチカ株式会社 ポリイミドフィルム
US20220204697A1 (en) * 2020-12-31 2022-06-30 Industrial Technology Research Institute Polymer and resin composition thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005080466A1 (ja) * 2004-02-25 2005-09-01 Kaneka Corporation 熱硬化性樹脂組成物およびその利用
JP2009246201A (ja) * 2008-03-31 2009-10-22 Nippon Steel Chem Co Ltd フレキシブル銅張積層板
JP2012140552A (ja) * 2011-01-05 2012-07-26 Jx Nippon Mining & Metals Corp 銅張積層板及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5031639B1 (ja) 1969-06-04 1975-10-13
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JP2003306649A (ja) * 2002-04-12 2003-10-31 Kanegafuchi Chem Ind Co Ltd 接着シート及びプリント配線板
CN1720136A (zh) * 2002-12-05 2006-01-11 株式会社钟化 叠层体、印刷电路布线板及它们的制造方法
JP2004189981A (ja) * 2002-12-13 2004-07-08 Kanegafuchi Chem Ind Co Ltd 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法
JP4872185B2 (ja) 2003-05-06 2012-02-08 三菱瓦斯化学株式会社 金属張り積層体
JP2009007551A (ja) * 2007-05-30 2009-01-15 Hitachi Chem Co Ltd 樹脂ワニス、接着層付き金属箔、金属張積層板、印刷配線板及び多層配線板
JP5636159B2 (ja) * 2007-12-28 2014-12-03 三井金属鉱業株式会社 樹脂付銅箔および樹脂付銅箔の製造方法
JP2010234638A (ja) * 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd 銅張積層板及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005080466A1 (ja) * 2004-02-25 2005-09-01 Kaneka Corporation 熱硬化性樹脂組成物およびその利用
JP2009246201A (ja) * 2008-03-31 2009-10-22 Nippon Steel Chem Co Ltd フレキシブル銅張積層板
JP2012140552A (ja) * 2011-01-05 2012-07-26 Jx Nippon Mining & Metals Corp 銅張積層板及びその製造方法

Also Published As

Publication number Publication date
JP6403503B2 (ja) 2018-10-10
KR20150037602A (ko) 2015-04-08
TWI634986B (zh) 2018-09-11
CN104519657A (zh) 2015-04-15
CN104519657B (zh) 2018-04-06
JP2015091644A (ja) 2015-05-14
TW201511941A (zh) 2015-04-01

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