KR102219604B1 - 기판 세정 장치 및 기판 처리 장치 - Google Patents

기판 세정 장치 및 기판 처리 장치 Download PDF

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Publication number
KR102219604B1
KR102219604B1 KR1020140127335A KR20140127335A KR102219604B1 KR 102219604 B1 KR102219604 B1 KR 102219604B1 KR 1020140127335 A KR1020140127335 A KR 1020140127335A KR 20140127335 A KR20140127335 A KR 20140127335A KR 102219604 B1 KR102219604 B1 KR 102219604B1
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South Korea
Prior art keywords
substrate
roll
arm
support arm
cleaning apparatus
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KR1020140127335A
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English (en)
Korean (ko)
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KR20150039681A (ko
Inventor
히데아키 다나카
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가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020140127335A 2013-10-03 2014-09-24 기판 세정 장치 및 기판 처리 장치 Active KR102219604B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-208020 2013-10-03
JP2013208020A JP6279276B2 (ja) 2013-10-03 2013-10-03 基板洗浄装置及び基板処理装置

Publications (2)

Publication Number Publication Date
KR20150039681A KR20150039681A (ko) 2015-04-13
KR102219604B1 true KR102219604B1 (ko) 2021-02-25

Family

ID=52777316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140127335A Active KR102219604B1 (ko) 2013-10-03 2014-09-24 기판 세정 장치 및 기판 처리 장치

Country Status (5)

Country Link
US (1) US9773686B2 (https=)
JP (1) JP6279276B2 (https=)
KR (1) KR102219604B1 (https=)
CN (2) CN104517808B (https=)
TW (1) TWI644738B (https=)

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JP6328577B2 (ja) * 2015-02-24 2018-05-23 株式会社荏原製作所 荷重測定装置および荷重測定方法
US10269555B2 (en) 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
CN105478428B (zh) * 2015-11-30 2017-12-12 武汉精测电子技术股份有限公司 滚筒式除尘装置
JP6661453B2 (ja) * 2016-04-20 2020-03-11 株式会社ディスコ 洗浄装置
JP6941464B2 (ja) * 2017-04-07 2021-09-29 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
CN108655040A (zh) * 2018-03-15 2018-10-16 金东纸业（江苏）股份有限公司 一种施胶辊的清洁装置及一种造纸机
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN111162201A (zh) * 2018-11-08 2020-05-15 陕西坤同半导体科技有限公司 柔性组件清洁方法及清洁设备
KR102788872B1 (ko) 2020-05-21 2025-03-31 삼성전자주식회사 틸팅 가능한 롤 브러쉬를 갖는 기판 세정 장치
GB202018030D0 (en) 2020-11-17 2020-12-30 Spts Technologies Ltd Spin rinse dryer with improved drying characteristics
CN113658886B (zh) * 2021-08-13 2023-09-26 长鑫存储技术有限公司 基板清洗装置及其基板清洗方法
CN113467199B (zh) * 2021-09-06 2021-11-12 宁波润华全芯微电子设备有限公司 一种便于拆卸的防止反溅液体污染晶圆的装置
KR20230101187A (ko) * 2021-12-29 2023-07-06 삼성전자주식회사 기판 세정 장치 및 기판 세정 방법
CN114887976B (zh) * 2022-05-25 2024-01-23 宁波芯丰精密科技有限公司 一种清洁装置
JP7843692B2 (ja) * 2022-12-23 2026-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN117443832B (zh) * 2023-11-24 2025-07-29 池州首开新材料有限公司 一种硅片清洗干燥设备及清洗干燥方法

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Also Published As

Publication number Publication date
JP2015073016A (ja) 2015-04-16
US20150099433A1 (en) 2015-04-09
KR20150039681A (ko) 2015-04-13
TW201521888A (zh) 2015-06-16
CN104517808B (zh) 2019-10-11
CN104517808A (zh) 2015-04-15
CN109037106B (zh) 2022-03-18
CN109037106A (zh) 2018-12-18
TWI644738B (zh) 2018-12-21
JP6279276B2 (ja) 2018-02-14
US9773686B2 (en) 2017-09-26

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