KR102160928B1 - 유지부 부착 유리 기판, 유리 기판의 열처리 방법, 및 유리 기판 지지 유닛 - Google Patents

유지부 부착 유리 기판, 유리 기판의 열처리 방법, 및 유리 기판 지지 유닛 Download PDF

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Publication number
KR102160928B1
KR102160928B1 KR1020157029355A KR20157029355A KR102160928B1 KR 102160928 B1 KR102160928 B1 KR 102160928B1 KR 1020157029355 A KR1020157029355 A KR 1020157029355A KR 20157029355 A KR20157029355 A KR 20157029355A KR 102160928 B1 KR102160928 B1 KR 102160928B1
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KR
South Korea
Prior art keywords
glass substrate
holding
heat treatment
glass
holding portion
Prior art date
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KR1020157029355A
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English (en)
Korean (ko)
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KR20150143492A (ko
Inventor
야스오 테라니시
히로미치 우메무라
나오토시 이나야마
Original Assignee
니폰 덴키 가라스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 니폰 덴키 가라스 가부시키가이샤 filed Critical 니폰 덴키 가라스 가부시키가이샤
Publication of KR20150143492A publication Critical patent/KR20150143492A/ko
Application granted granted Critical
Publication of KR102160928B1 publication Critical patent/KR102160928B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/04—Annealing glass products in a continuous way
    • C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
    • C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
    • C03B25/087—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets being in a vertical position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Robotics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020157029355A 2013-04-10 2014-04-08 유지부 부착 유리 기판, 유리 기판의 열처리 방법, 및 유리 기판 지지 유닛 KR102160928B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013082214A JP6065722B2 (ja) 2013-04-10 2013-04-10 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット
JPJP-P-2013-082214 2013-04-10
PCT/JP2014/060208 WO2014168149A1 (ja) 2013-04-10 2014-04-08 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット

Publications (2)

Publication Number Publication Date
KR20150143492A KR20150143492A (ko) 2015-12-23
KR102160928B1 true KR102160928B1 (ko) 2020-09-29

Family

ID=51689556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157029355A KR102160928B1 (ko) 2013-04-10 2014-04-08 유지부 부착 유리 기판, 유리 기판의 열처리 방법, 및 유리 기판 지지 유닛

Country Status (5)

Country Link
JP (1) JP6065722B2 (zh)
KR (1) KR102160928B1 (zh)
CN (1) CN105121368B (zh)
TW (1) TWI638789B (zh)
WO (1) WO2014168149A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6454188B2 (ja) * 2015-03-13 2019-01-16 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
JP6530651B2 (ja) * 2015-06-30 2019-06-12 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
JP6571413B2 (ja) * 2015-06-30 2019-09-04 ＡｖａｎＳｔｒａｔｅ株式会社 ディスプレイ用ガラス板の製造方法、及び、ガラス板製造装置
JP6571416B2 (ja) * 2015-06-30 2019-09-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法、及び、ガラス基板の製造装置
JP6587844B2 (ja) * 2015-06-30 2019-10-09 ＡｖａｎＳｔｒａｔｅ株式会社 ディスプレイ用ガラス板の製造方法、および、ディスプレイ用ガラス板製造装置
JP6571415B2 (ja) * 2015-06-30 2019-09-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
CN108698878B (zh) 2016-02-29 2021-07-02 康宁股份有限公司 用于运输玻璃基材的方法和设备
JP6642798B2 (ja) * 2016-03-14 2020-02-12 日本電気硝子株式会社 ガラス板の製造装置
JP6631838B2 (ja) * 2016-05-18 2020-01-15 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置、並びにガラス板の搬送装置
TW201822282A (zh) * 2016-09-09 2018-06-16 美商康寧公司 具有通孔的低表面粗糙度基板及其製作方法
DE102017008610A1 (de) * 2016-09-14 2018-03-15 Asahi Glass Company, Limited Verfahren zur Herstellung eines gebogenen Glasgegenstands und gebogener Glasgegenstand
JP6889866B2 (ja) * 2017-11-15 2021-06-18 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置
CN111933522B (zh) * 2020-08-17 2023-07-18 业成科技（成都）有限公司 治具和退火装置
PT3989270T (pt) 2020-10-20 2022-11-10 Semsysco Gmbh Mecanismo de retenção para fixar um substrato para um tratamento da superfície do substrato

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006029597A (ja) * 2004-07-12 2006-02-02 Koyo Thermo System Kk 焼成装置

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FR2433000A1 (fr) * 1978-08-11 1980-03-07 Saint Gobain Dispositif de transport de feuilles de verre en position verticale
JPS60163987A (ja) * 1984-02-03 1985-08-26 Nippon Sheet Glass Co Ltd 滑り止め剤
JPH062594B2 (ja) * 1987-03-26 1994-01-12 セントラル硝子株式会社 強化ガラス板の製造方法
JPH071637B2 (ja) * 1987-09-22 1995-01-11 ローム株式会社 サンプル・ホールド回路
US5752820A (en) * 1996-08-27 1998-05-19 Btu International, Inc. Panel support mechanism
CN1727294A (zh) * 2004-07-27 2006-02-01 光洋热系统株式会社 烧成装置
EP1721872A1 (en) * 2005-05-10 2006-11-15 Corning Incorporated Method of producing a glass sheet
KR101346939B1 (ko) * 2011-09-29 2014-01-03 아반스트레이트코리아 주식회사 글라스판의 제조 방법 및 글라스판 제조 장치

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2006029597A (ja) * 2004-07-12 2006-02-02 Koyo Thermo System Kk 焼成装置

Also Published As

Publication number Publication date
TWI638789B (zh) 2018-10-21
WO2014168149A1 (ja) 2014-10-16
KR20150143492A (ko) 2015-12-23
CN105121368B (zh) 2018-03-30
JP2014205579A (ja) 2014-10-30
TW201512115A (zh) 2015-04-01
JP6065722B2 (ja) 2017-01-25
CN105121368A (zh) 2015-12-02

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