WO2014168149A1 - 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット - Google Patents

保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット Download PDF

Info

Publication number
WO2014168149A1
WO2014168149A1 PCT/JP2014/060208 JP2014060208W WO2014168149A1 WO 2014168149 A1 WO2014168149 A1 WO 2014168149A1 JP 2014060208 W JP2014060208 W JP 2014060208W WO 2014168149 A1 WO2014168149 A1 WO 2014168149A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
holding
glass
heat treatment
substrate
Prior art date
Application number
PCT/JP2014/060208
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
妥夫 寺西
博通 梅村
尚利 稲山
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to KR1020157029355A priority Critical patent/KR102160928B1/ko
Priority to CN201480020611.0A priority patent/CN105121368B/zh
Publication of WO2014168149A1 publication Critical patent/WO2014168149A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/04—Annealing glass products in a continuous way
    • C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
    • C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
    • C03B25/087—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets being in a vertical position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a glass substrate with a holding portion having a holding portion, a heat treatment method for a glass substrate when heat-treating the glass substrate, and a technology of a glass substrate support unit including a glass substrate and a support means for supporting the glass substrate. .
  • the “Patent Document 1” describes a narrow width that can be rotated in two orthogonal directions when a glass panel (glass substrate) is heat-treated (fired) in the manufacture of a glass display panel.
  • a flat and robust support plate (setter) is supported from below by a plurality of support members, and a glass panel is placed on the support plate in a horizontal posture, and the glass panel is supported entirely by the support plate.
  • a support assembly and a panel support assembly in which a glass panel is directly placed in a horizontal posture on the plurality of narrow support members without using a support plate, and the glass panels are locally supported by the plurality of support members. It is disclosed.
  • Patent Document 2 in the firing furnace (heat treatment furnace), the lower edge portion of the glass substrate is supported by the groove portion of the roller, and the upper edge portion is sandwiched between a pair of guide rollers and conveyed in a vertical posture.
  • Conveying means means for supporting both the upper and lower edges of the glass substrate by the groove of the roller and conveying them in a vertical position, and the lower edge portion while supporting the upper edge portion of the glass substrate by a hanging bracket.
  • a transporting means for transporting the paper while being sandwiched between a pair of guide rollers is disclosed.
  • Patent Document 1 when a heat treatment is performed on the glass substrate, the glass substrate can be supported without applying extra stress, It seems that it is possible to effectively prevent the occurrence of distortion and scratches.
  • the horizontal glass panel (glass substrate) is simply supported while being placed on the support plate (setter). Further, scratches were generated by sliding or the like on the contact surface between the glass panel and the support plate, and there was a risk of degrading the quality of the glass panel or generating defective products.
  • a horizontal glass panel is directly placed on a plurality of narrow support members, and the glass panel and each support member are locally in contact with each other.
  • the transport means disclosed in the above-mentioned “Patent Document 2” is configured to transport the glass substrate in a vertical posture.
  • the ultrathin glass substrate described above is sufficiently deformed (warped).
  • the glass substrate cannot be supported because the vertical posture cannot be maintained by buckling in the first place.
  • the glass substrate is vertically supported by suspending and supporting the upper edge portion of the glass substrate with the hanging metal fittings and sandwiching the lower end portion with the pair of guide rollers.
  • the strength of the ultra-thin glass substrate mentioned above is not high, so cracks etc. occur at the sandwiched portion by the hanging bracket, and the glass substrate breaks during heat treatment There was a possibility.
  • the present invention has been made in view of the above-mentioned current problems, and when a heat treatment is performed on a rectangular flat glass substrate, the glass substrate can be supported without adding extra stress, It is an object of the present invention to provide a glass substrate with a holding portion, a heat treatment method for a glass substrate, and a glass substrate support unit capable of effectively preventing the glass substrate from being deformed, distorted or scratched.
  • the glass substrate heat treatment method of the present invention is a glass substrate heat treatment method when heat treatment is performed on a rectangular flat plate-shaped glass substrate, and the thickness of the glass substrate is compared with other regions at the edge portion. A thick holding portion is formed, and the glass substrate is heat-treated while holding the glass substrate through the holding portion, and after the heat treatment is finished, a predetermined region including the holding portion is removed from the glass substrate. It is characterized by lacking.
  • the holding portion is formed by sticking a band-shaped plate glass to the glass substrate, and the glass substrate and the plate glass are in direct surface contact.
  • the holding portion is formed so as to protrude from the glass substrate.
  • the glass substrate is held by sandwiching the holding portion.
  • the glass substrate is preferably held by hooking the holding portion.
  • the glass substrate is preferably held in a suspended state.
  • a plurality of the glass substrates are provided and arranged in a straight line along a direction orthogonal to the plate surface of the glass substrate.
  • the vicinity of the lower end of the glass substrate is preferably disposed in a gap between a pair of guide members arranged side by side along a direction orthogonal to the plate surface of the glass substrate.
  • the glass substrate of the present invention is a glass substrate with a holding portion, and is formed in a rectangular flat plate-like glass substrate and a peripheral portion of the glass substrate with a thickness greater than that of other regions, and the glass substrate And a holding part that is held during the heat treatment.
  • the holding portion is formed by sticking a band-shaped plate glass to the glass substrate, and the glass substrate and the plate glass are in direct surface contact.
  • the holding portion is formed on an edge portion of one side of the glass substrate.
  • the holding portion is formed so as to protrude from the glass substrate.
  • the glass substrate and the plate glass are formed of the same material.
  • a glass substrate support unit of the present invention comprises the glass substrate according to any one of claims 9 to 13 and a clamp mechanism, and the holding mechanism is sandwiched by the clamp mechanism, or And a holding jig for holding the glass substrate by hooking the holding portion on the clamp mechanism portion.
  • the holding portion is formed on two opposite edge portions or all four edge portions in the glass substrate, and the glass substrate is in a vertical posture via the holding portion. Or it is preferable to hold
  • the following effects can be obtained. That is, according to the heat treatment method for a glass substrate according to claim 1, when the heat treatment is performed on the rectangular flat glass substrate, the glass substrate can be supported without applying extra stress, and the glass substrate can be deformed or strained. It is possible to effectively prevent the occurrence of scratches and scratches. Therefore, it is possible to improve the quality of the glass substrate and reduce defective products.
  • the glass substrate and the plate glass can be easily bonded at room temperature without using an adhesive or the like, and the holding portion can be formed.
  • the heat treatment method for a glass substrate in claim 3 it is possible to hold the glass substrate by the holding jig through the protruding portion of the holding portion, and the flat portion of the glass substrate interferes with the holding jig. The possibility that the glass substrate will be scratched or damaged can be reduced.
  • the glass substrate is held by sandwiching a holding portion having a plate thickness that is thicker than that of the other plane portion in the rectangular flat glass substrate.
  • a crack or the like is generated at the sandwiched portion, and the possibility that the glass substrate is damaged during the heat treatment can be reduced.
  • the glass substrate heat treatment method of claim 5 when holding the glass substrate by the holding jig, since the holding portion is not sandwiched, the position of the glass substrate with respect to the holding jig is fixed very firmly. Without fear, it is possible to reduce the possibility that the glass substrate will be scratched or damaged by an unexpected external force.
  • the heat treatment method for a glass substrate in claim 6 since the glass substrate is suspended through the holding portion and held in a vertical position, even if it is an ultra-thin glass substrate, deformation (warping) ) Can be sufficiently suppressed.
  • a plurality of glass substrates can be accommodated in a compact and efficient manner, for example, in a heat treatment furnace.
  • the adjacent glass substrates are brought into contact with each other by the air flow in the heat treatment furnace, and the situation in which the scratches are attached. It can be effectively prevented.
  • the glass substrate with a holding portion in claim 9 when the heat treatment is performed on the rectangular flat plate-shaped glass substrate, the glass substrate can be supported without applying extra stress, and the glass substrate can be deformed or distorted. It is possible to effectively prevent the occurrence of scratches and scratches. Therefore, it is possible to improve the quality of the glass substrate and reduce defective products.
  • the holding portion can be formed by easily bonding the glass substrate and the plate glass at room temperature without using an adhesive or the like.
  • the glass substrate with a holding part in claim 11 since the position where the holding part is formed is the edge part of the glass substrate, the area (holding part) to be removed after the heat treatment is made as small as possible, and the yield is increased. Can be improved.
  • the glass substrate with a holding part in claim 12 it becomes possible to hold by the holding jig through the protruding portion of the holding part, and the flat part of the glass substrate and the holding jig interfere with each other. The possibility that the glass substrate will be scratched or damaged can be reduced.
  • the thermal expansion coefficients of the glass substrate and the plate glass are substantially equal, it is caused by a difference in thermal expansion even when heated in a heat treatment furnace, for example. Further, it is possible to effectively prevent a situation in which the glass plate peels off from the glass substrate or the glass substrate or the glass plate is damaged due to warpage or distortion of the glass substrate and the glass plate.
  • the glass substrate support unit of claim 14 when heat-treating the rectangular flat plate-shaped glass substrate, the glass substrate can be supported without adding extra stress, and the glass substrate can be deformed or distorted. It is possible to effectively prevent the occurrence of scratches. Therefore, it is possible to improve the quality of the glass substrate and reduce defective products.
  • the glass substrate is placed in a vertical posture (vertical posture) or a flat posture (horizontal posture) while applying tension from the edge of the glass substrate by the holding jig. Therefore, even an ultra-thin glass substrate can be reliably held without being bent.
  • the perspective view which showed the whole structure of the glass substrate support unit which concerns on 1st embodiment of this invention The cross-sectional front view which showed the heat processing furnace in which the glass substrate support unit which concerns on 1st embodiment was installed. Similarly, the cross-sectional side view which showed the heat processing furnace.
  • the enlarged side view which showed the vicinity of the holding part of a glass substrate In the glass substrate support unit which concerns on 3rd embodiment, the enlarged side view which showed the vicinity of the holding part of a glass substrate. Similarly, it is the figure which showed the glass substrate support unit which concerns on 3rd embodiment, Comprising: The perspective view which showed the whole structure of the glass substrate support unit which provided the holding jig
  • or FIG. the vertical direction in FIGS. 1 to 3 is described as the vertical direction of the glass substrate 1 (or the heat treatment furnace 50).
  • the direction of the arrow A is defined as the forward direction.
  • the glass substrate 1 in this embodiment is used for a flat panel display represented by a liquid crystal display, a plasma display, an organic EL, etc., a solar panel, etc., for example.
  • the glass substrate 1 is a glass substrate with a holding unit, and includes a substrate body 10 as shown in FIG. 1, and a holding unit 11 is formed on the substrate body 10.
  • the substrate body 10 is formed of a rectangular flat plate glass plate having a thickness of 0.7 [mm] or less (more specifically, 10 [ ⁇ m] to 700 [ ⁇ m]).
  • the substrate body 10 is suspended by holding a holding portion 11 with a holding jig 2 described later when annealing treatment (heat treatment) is performed on the glass substrate 1, and the front-rear direction (a direction parallel to the arrow A). ) While maintaining the vertical orientation (vertical orientation) extending in the vertical direction (in the side view, the direction orthogonal to the arrow A).
  • Band-shaped plate glasses 11a and 11a are respectively bonded (adhered) to the upper side edge portions (hereinafter referred to as “upper side edge portions”) 10a and 10a at room temperature along the upper side.
  • the holding part 11 is comprised by the plate glass 11a * 11a each provided in the upper side edge part 10a * 10a of the surface of the board
  • maintenance part 11 it is not limited to using the plate glass 11a as shown by this embodiment. That is, for example, in the manufacturing process of a glass substrate, a glass ribbon (strip-shaped thin glass) is cooled by a cooling roller, a top roll or the like in any of the “overflow downdraw method” and the “float method”. Molded while being stretched in the width direction. At this time, the thickness of the side end portion of the glass ribbon is increased as compared with other regions, and such a side end portion can be used as the holding portion 11.
  • the adhesive force that is developed with the surface contact between the members 10 and 11 a is used.
  • the adhesive force generated in such a surface contact portion is considered to be derived from hydrogen bonding between the surfaces of both members 10 and 11a or van der Waals force, and contact between both members 10 and 11a. It is known that it is expressed when the surface roughness (Ra) of the surface is 2.0 [nm] or less (preferably 0.5 [nm] or less, more preferably 0.2 [nm]). Yes.
  • substrate main body 10 it is not limited to the aspect using the adhesive force expressed with such a surface contact, You may use the existing adhesive agent.
  • the material of the substrate body 10 and the plate glass 11a is not limited to the same material. However, as will be described later, if heat treatment is performed in a heat treatment furnace 50 (see FIG. 2), it is preferable to use the same material because the expansion coefficients are not substantially different and the difference in thermal expansion during each temperature increase or decrease is not likely to occur.
  • a plurality (two in the present embodiment) of holding jigs 2 and 2 serve as support means for supporting the glass substrate 1 along the upper side of the substrate body 10.
  • the holding jig 2 is provided with a clamp mechanism 21, and the glass substrate 1 is held by the holding jig 2 by sandwiching the holding part 11 of the substrate body 10 from both sides in the front-rear direction. Suspended by.
  • the glass substrate support unit 100 is configured by the glass substrate 1 and the holding jig 2 having the above-described configuration.
  • the number of holding jigs 2 may be one, or may be three or more.
  • the holding portion 11 held by the holding jig 2 is configured by the plate glass 11a bonded to the substrate body 10 at the normal temperature.
  • the surface contact portions of the substrate body 10 and the plate glass 11a are heated to 300 [° C.] or higher through an annealing process. If the heating temperature is lower than the lower one of the strain points of the substrate body 10 and the plate glass 11a, the bonding state between them is “unbonded state” although not fused. If the heating temperature is equal to or higher than the lower strain point and lower than the lower softening point of the substrate body 10 and the plate glass 11a, the adhesion state between them is “peeling”. Impossible and stronger adhesion state ”.
  • the adhesive state between them is “a non-peelable adhesive state” or “a non-peelable and stronger bond”. Since the holding portion 11 cannot be peeled and removed when the state becomes ⁇ state '', by cutting the substrate body 10 along the planned cutting line 10b located below the upper edge portion 10a of the substrate body 10, A predetermined area including the holding unit 11 is removed (deleted).
  • the holding jig 2 suspends a weight (not shown) made of, for example, a glass block in the lower edge portion (hereinafter referred to as “lower edge portion”) 10 c on the lower side of the substrate body 10. It is more preferable for maintaining the suspended posture of the glass substrate 1 that is suspended.
  • the surface roughness (Ra) of a predetermined region of the glass block that is the weight is set to 2.0 [nm] (preferably 0.5 [nm].
  • the portion where the weight is directly attached is set as an ineffective area of the substrate body 10, and the ineffective area is cut after the annealing process along a planned cutting line (not shown). Is preferred.
  • a guide pin 3 is attached to the lower portion of the glass substrate 1 as a guide member for restricting the positional displacement of the glass substrate 1 in the front-rear direction.
  • a pair of guide pins 3 and 3 are provided on both sides in the left and right direction (in the direction orthogonal to the arrow A in a plan view) in the vicinity of the lower end (ineffective area) of the substrate body 10.
  • the pair of guide pins 3 and 3 have a gap in the direction perpendicular to the plate surface of the substrate body 10 on the front surface side and the back surface side near the lower end of the substrate body 10. It is fixedly installed in a state, and is effectively used, for example, when performing heat treatment to be described later.
  • the glass substrate support unit 100 having the above configuration is, for example, put into a heat treatment furnace 50 and subjected to heat treatment. More specifically, the plurality of glass substrate support units 100, 100,... Put into the heat treatment furnace 50 are accommodated in a state where the glass substrates 1, 1,. That is, the plurality of glass substrates 1, 1... Are arranged in a straight line along a direction orthogonal to the plate surface.
  • each holding jig 2 can be attached to and detached from the lower surface of the base member 51 installed on the furnace ceiling portion with a magnet or the like, with the clamp mechanism portion 21 facing downward. It is suspended. And by holding
  • a pair of guide pins 3, 3 are respectively fitted in the lower part of the furnace wall on both sides in the left-right direction so as to be able to move out and withdraw from the internal space of the heat treatment furnace 50.
  • the glass substrate 1 (more specifically, the substrate body 10) is held by the pair of guide pins 3 and 3 at both ends in the left-right direction near the lower end.
  • the jig 2 is held in a suspended state.
  • the undue swinging of the glass substrate 1 is limited, and damage due to contact between the glass substrates 1 and 1 adjacent to each other is effectively prevented.
  • wear and damage due to sliding associated with the swinging of the glass substrate 1, and consequently breakage, etc. are effectively suppressed at the location held by the holding jig 2 in the holding portion 11 of the substrate body 10.
  • the downward tensile force by the weight acts on the glass substrate 1.
  • the unjustified swinging is further limited.
  • substrate body 10 and the plate glass 11a are formed with the alkali free glass of the same material. Therefore, the thermal expansion coefficients of both the members 10 and 11a are substantially equal, and even when heated in the heat treatment furnace 50, warpage or distortion occurs due to the difference in thermal expansion between them, and the plate glass 11a peels from the substrate body 10. Or the substrate body 10 or the plate glass 11a is hardly damaged.
  • the substrate body 10 and the plate glass 11a are heated.
  • the surface contact portion becomes inseparable after heat treatment. This is because when the temperature of the glass exceeds 250 ° C. to 300 ° C., the dehydration reaction proceeds at the hydrogen bonding portion at the surface contact portion between the substrate body 10 and the plate glass 11a, and the bonding at the surface contact portion is stronger. This is thought to be due to a change to a covalent bond that generates force.
  • the substrate main body 10 and the plate glass 11a cannot be peeled off.
  • the substrate main body 10 is cut by folding after the scribe formation, laser cleaving, cleaving with bending stress, or the like.
  • a high-quality glass substrate 1 having no scratches or distortions is manufactured.
  • the glass substrate 1 is suspended in a vertical posture (vertical posture) by the holding jig 2 suspended from the lower surface of the base member 51 of the furnace ceiling portion.
  • a heat treatment or other processing may be performed while the glass substrate 1 is being transported while being suspended by a transport means (not shown). Good.
  • FIGS. 4 and 5 the vertical direction in FIGS. 4 and 5 is described as the vertical direction of the glass substrate 201. 4 and 5, the direction of the arrow A is defined as the front direction.
  • the glass substrate 201 in the second embodiment has substantially the same configuration as the glass substrate 1 in the first embodiment described above, but differs from the glass substrate 1 in the configuration of the holding portion 211 formed in the substrate body 210. To do. Therefore, in the following description, differences from the glass substrate 1 (first embodiment) are mainly described, and descriptions of equivalent configurations to the glass substrate 1 are omitted.
  • upper edge portions (hereinafter referred to as “upper edge portions”) 210 a and 210 a that are edge portions of one side of the substrate body 210. are bonded (adhered) to the strip-shaped plate glasses 211a and 211a at room temperature along the upper side.
  • each plate glass 211 a is set sufficiently longer than the dimension of the upper side of the substrate body 210.
  • the plate glass 211a is along the upper side in the upper side edge portion 210a of the substrate body 210, and both side ends in the longitudinal direction are in the left-right direction of the substrate body 210 (in a direction orthogonal to the arrow A in plan view). It arrange
  • the holding part 211 is comprised by the plate glass 211a * 211a provided in the upper side edge part 210a * 210a of the surface of the board
  • holding jigs 203 and 203 composed of a plurality of (two in this embodiment) beams are provided, and the holding jigs 203 and 203 provide both sides of the holding portion 211 in the left-right direction.
  • the glass substrate 201 is held in a suspended state by hooking each of the extending portions.
  • the holding jig 203 if a rectangular groove 203a is formed on the upper surface in advance, the glass substrate 201 with respect to the holding jig 203 is hooked by holding the holding part 211 through the groove 203a. This is more preferable because it is possible to regulate the positional deviation.
  • the portion held by the holding jig 203 is the extending portion of the holding portion 211 that is separated from the substrate main body 210.
  • the holding jig 202 interferes with an effective area of the main body 210 (a part below the planned cutting line 210b), and the substrate main body 210 is not damaged or damaged.
  • the glass substrate 201 in this embodiment is good also as a structure hold
  • a plurality of (two in the present embodiment) holding jigs 202 and 202 are used to sandwich the extending portions on both sides in the left-right direction of the holding portion 211, and the glass substrate 201. Will be held in a suspended state.
  • the glass substrate support unit 200 is configured by the glass substrate 201 and the holding jig 202 (or 203) having the above-described configuration.
  • the number of holding jigs 202 (or 203) may be three (or three) or more.
  • FIGS. 6 to 8 the vertical direction of FIGS. 6 to 8 is described as the vertical direction of the glass substrate 301 for convenience. 6 to 8, the direction of the arrow A is defined as the front.
  • the glass substrate 301 in the third embodiment has substantially the same configuration as the glass substrate 1 in the first embodiment described above, but differs from the glass substrate 1 in the configuration of the holding portion 311 formed in the substrate body 310. To do. Therefore, in the following description, differences from the glass substrate 1 (first embodiment) are mainly described, and descriptions of equivalent configurations to the glass substrate 1 are omitted.
  • upper edge portions (hereinafter referred to as “upper edge portions”) 310 a and 310 a that are edge portions of one side of the substrate body 310.
  • a plurality of strip-shaped plate glasses 311a, 311a are laminated in the thickness direction, along the upper side. Arranged.
  • maintenance part 311 is comprised by several plate glass 311a * 311a ... provided in the upper side edge part 310a * 310a of such the surface of the board
  • the holding portion 311 having a thicker plate thickness than other regions is formed.
  • the holding portion 311 is formed on the front surface side and the back surface side of the substrate main body 310 so as to have a sufficient thickness dimension that can be hooked to another member.
  • holding jigs 303 and 303 which are usually composed of a plurality of (two in the present embodiment) beams, are provided along the holding portion 311.
  • the glass substrate 301 is held in a suspended state by hooking the holding unit 311.
  • the holding jigs 303 and 303 made of a beam having a rectangular shape in cross section are provided below the holding unit 311 and the holding unit 311. It is arranged along. Further, the holding portion 311 is hooked on the upper surface of each holding jig 303 via the lower surface.
  • the glass substrate 301 is hold
  • support members 52 and 52 having a concave shape in cross section are provided so as to protrude by the support members 52 and 52.
  • a method for hooking both ends of the holding jig 303 is conceivable.
  • the holding portion 311 is not sandwiched, so the position of the glass substrate 301 with respect to the holding jig 303 is The glass substrate 301 is not fixed so firmly, and there is no possibility that the glass substrate 301 is damaged or damaged by an unexpected external force.
  • the holding portion 311 is configured by the plate glass 311a having a longitudinal dimension substantially the same as the upper side of the substrate body 310, but is not limited thereto. That is, similarly to the glass substrate 201 in the second embodiment described above, the holding portion 311 may be configured by a plate glass having a longitudinal dimension sufficiently longer than the upper side of the substrate body 310. In this case, the holding portion 311 is formed so as to protrude to both sides of the substrate body 310 in the left-right direction. Therefore, the glass substrate 301 is held in a suspended state while being hooked by the distal end portion of the clamp mechanism 321 of the holding jig 302 at both ends of the holding portion 311 extending in the left-right direction from the substrate body 310. Can be done. Therefore, there is no possibility that the holding jig 302 interferes with the effective area of the substrate body 310 and the substrate body 310 is damaged or damaged.
  • the glass substrate 301 in this embodiment is good also as a structure hold
  • the holding portion 311 is hooked by the tip portion of the clamp mechanism 321 of the holding jig 302, and the glass substrate 301 is held in a suspended state.
  • the glass substrate support unit 300 is configured by the glass substrate 301 and the holding jig 302 (or 303) configured as described above.
  • the number of holding jigs 302 (or 303) may be one (or one), or may be three (or three) or more. .
  • FIG. 9 the vertical direction in FIG. 9 is defined as the vertical direction of the glass substrate 401 for the following description.
  • the direction of the arrow A is defined as the forward direction.
  • the glass substrate 401 in the fourth embodiment has substantially the same configuration as the glass substrate 1 in the first embodiment described above, but differs from the glass substrate 1 in the configuration of the holding portion 411 formed in the substrate body 410. To do. Therefore, in the following description, differences from the glass substrate 1 (first embodiment) are mainly described, and descriptions of equivalent configurations to the glass substrate 1 are omitted.
  • the upper side edge (hereinafter referred to as “upper side edge”) 410a and the lower side edge.
  • An edge (hereinafter referred to as “lower edge”) 410c and two opposite edges on the back surface of the substrate body 410, that is, an upper edge 410a and a lower edge 410c,
  • the strip-shaped plate glasses 411a, 411a,... Are bonded (adhered) at room temperature along the upper and lower sides.
  • the holding portions 411 and 411 are configured by 411a and 411a. In other words, holding portions 411 and 411 having thicker plates than the other regions are formed near the upper end (upper side edge portion 410a) and near the lower end (lower side edge portion 410c) of the substrate body 410, respectively. .
  • the glass substrate 401 in the fourth embodiment using the clamp mechanism portions 421, 421,... Of the plurality of holding jigs 402, 402,. It is possible to hold the holding portions 411 and 411 on both sides at the same time and hold the glass substrate 401 in a suspended state. That is, the glass substrate 401 can be supported by the holding jig 402 via the holding portions 411 and 411 on both sides of the substrate body 410 in the vertical direction. For example, the glass substrate 401 has a large size that extends in the vertical direction. Even if it is this glass substrate, it becomes possible to hold
  • the glass substrate 401 is held in a vertical posture, but is not limited to this.
  • the glass substrate 401 is held in a horizontal posture. Also good.
  • the glass substrate 401 can be reliably supported without being bent.
  • the glass substrate support unit 400 is configured by the glass substrate 401 and the holding jig 402 configured as described above.
  • the number of holding jigs 402 that support the holding portions 411 of the substrate body 410 may be three or less, or may be five or more.
  • FIG. 10 the vertical direction in FIG. 10 is described as the vertical direction of the glass substrate 501.
  • the direction of the arrow A is defined as the forward direction.
  • the glass substrate 501 in the fifth embodiment has substantially the same configuration as the glass substrate 1 in the first embodiment described above, but differs from the glass substrate 1 in the configuration of the holding portion 511 formed in the substrate body 510. To do. Therefore, in the following description, differences from the glass substrate 1 (first embodiment) are mainly described, and descriptions of equivalent configurations to the glass substrate 1 are omitted.
  • two opposite side edges on the surface of the substrate body 510 that is, a right side edge (hereinafter referred to as “right side edge”) 510d and a left side edge.
  • An edge (hereinafter referred to as a “left edge”) 510e and two opposite edges on the back surface of the substrate body 510, that is, the right edge 510d and the left edge 510e are strip-shaped.
  • the plate glasses 511a, 511a,... Are bonded (adhered) at room temperature along the right and left sides.
  • a plurality of plate glasses 511a provided on the right side edge portion 510d and the left side edge portion 510e on the surface of the substrate body 510 and on the right side edge portion 510d and the left side edge portion 510e on the back surface of the substrate body 510, respectively.
  • the holding portions 511 and 511 are configured by 511a. In other words, holding portions 511 and 511 having thicker plates than the other regions are formed near the right end (right side edge portion 510d) and near the left end (left side edge portion 510e) of the substrate body 510, respectively.
  • the holding portions 511 and 511 on both sides of the glass substrate 501 can be held simultaneously by holding the holding portions 511 and 511 on both sides at the same time. That is, the glass substrate 501 can be supported by the holding jig 502 via the holding portions 511 and 511 on both sides of the substrate main body 510 in the left-right direction.
  • the glass substrate 501 extends in the left-right direction. Even with this glass substrate, the posture of the glass substrate 501 can be held more firmly, and the glass substrate 501 can be reliably prevented from swinging.
  • the glass substrate 501 is held in a vertical posture, but is not limited to this.
  • the glass substrate 501 is held in a horizontal posture. Also good. In this case, regardless of whether the glass substrate 501 is held in a vertical posture or a horizontal posture, the glass substrate 501 is not bent by applying a tension in the left-right direction with the holding jig 502. Can be securely held.
  • the glass substrate support unit 500 is configured by the glass substrate 501 and the holding jig 502 configured as described above.
  • the number of holding jigs 502 that support the holding portions 511 of the substrate body 510 may be three or less, or may be five or more.
  • Glass substrate 601 (sixth embodiment)
  • the structure of the glass substrate 601 which embodies this invention which concerns on 6th embodiment is demonstrated using FIG.
  • the vertical direction in FIG. 9 is described as the vertical direction of the glass substrate 601.
  • the direction of the arrow A is defined as the forward direction.
  • the glass substrate 601 in the sixth embodiment has substantially the same configuration as the glass substrate 1 in the first embodiment described above, but differs from the glass substrate 1 in the configuration of the holding portion 611 formed in the substrate body 610. To do. Therefore, in the following description, differences from the glass substrate 1 (first embodiment) are mainly described, and descriptions of equivalent configurations to the glass substrate 1 are omitted.
  • the edge of all four sides on the surface of the substrate body 610 that is, the edge of the upper side of the substrate body 610 (hereinafter referred to as “upper edge”) 610a and the lower side Side edge (hereinafter referred to as “lower edge”) 610c, right edge (hereinafter referred to as “right edge”) 610d and left edge (hereinafter referred to as “right edge”)
  • the strip-shaped glass sheets 611a, 611a,... are attached (adhered) to the 610e at room temperature along the upper and lower sides and the right and left sides.
  • edge portions of all four sides on the back surface of the substrate body 610 that is, the edge portion on the upper side of the substrate body 610 (hereinafter referred to as “upper edge portion”) 610a and the edge portion on the lower side (hereinafter referred to as “below”).
  • 610c, right side edge (hereinafter referred to as “right side edge”) 610d and left side edge (hereinafter referred to as "left side edge”) ) 610e is bonded (adhered) to the strip-shaped plate glass 611a, 611a,... At room temperature along the upper and lower sides and the right and left sides.
  • the holding portions 611, 611,... are configured by a plurality of glass sheets 611a, 611a,... Provided respectively on the lower side edge 610c, the right side edge 610d, and the left side edge 610e.
  • the thicker holding portions 611, 611... are formed in comparison with other regions.
  • the clamp mechanism portions 621, 621,... Of the plurality of holding jigs 602, 602, It is possible to hold the posture of the glass substrate 601 by simultaneously holding the holding portions 611, 611... On both sides and in the left-right direction (in the direction orthogonal to the arrow A in plan view). It becomes.
  • the glass substrate 601 can be supported by the holding jig 602 via the holding portions 611, 611,... Positioned around the substrate body 610.
  • the glass substrate 601 can be any large glass. Even if it is a board
  • the glass substrate 601 is held in a vertical posture, but is not limited to this.
  • the glass substrate 601 is held in a horizontal posture. Also good.
  • the holding jig 602 applies tension in the front-rear direction (parallel to the arrow A) and in the left-right direction. As a result, the glass substrate 601 can be reliably held without causing bending.
  • the glass substrate support unit 600 is configured by the glass substrate 601 and the holding jig 602 configured as described above.
  • the number of holding jigs 602 that support the holding portions 611 of the substrate body 610 may be seven or less, or nine or more.
  • maintenance part 611 is not formed on the extension line of the cutting projected line 610b.
  • the present inventors prepared glass substrates of Examples 1, 2, 3, and 4 as samples of the embodiment of the present invention. Moreover, the glass substrate which is Comparative Example 1, 2, 3, 4, 5 was prepared as a comparison object of these samples.
  • non-alkali glass manufactured by Nippon Electric Glass Co., Ltd .: OA-11
  • examples for the glass substrates of No. 2 and Comparative Example 5 non-alkali glass (manufactured by Nippon Electric Glass Co., Ltd .: OA-10G) was used.
  • the size of the glass substrate at this time in Examples 1, 2, 3, 4 and Comparative Examples 4 and 5, the width was 730 [mm] and the length was 1020 [mm]. 2 and 3, horizontal: 730 [mm], vertical 920 [mm].
  • the size of the glass substrate is different because the method of supporting the glass substrate is different. In the case of suspension support, it is necessary to cut the holding portion after the heat treatment, so the vertical dimension is set to be large. It was decided.
  • the thickness of the glass substrate at this time is 0.5 [mm] in Examples 1, 3, 4 and Comparative Examples 1, 2, and 4, while Example 2 and Comparative Examples 3, 5 In this case, the thickness was set to 0.3 [mm].
  • the holding portion is formed by sticking a band-shaped plate glass in the vicinity of the upper end of the substrate body by using the adhesive force that is developed with the surface contact described above.
  • the glass substrate is suspended and supported while the holding portion is held (or hooked) by a plurality of holding jigs.
  • a strip-shaped plate glass having a width of 70 [mm] with respect to the upper side edge portions of the front and back surfaces of the substrate body (manufactured by Nippon Electric Glass Co., Ltd .: OA). -10G and thickness 0.5 [mm]) were attached to form the holding portion.
  • a clamp mechanism having a square shape with a side of 50 mm is adopted as the tip surface of the clamp mechanism portion that contacts the holding portion. .
  • Example 3 a strip-shaped plate glass having a width of 70 [mm] with respect to the upper side edge portions of the front and back surfaces of the substrate body (manufactured by Nippon Electric Glass Co., Ltd .: OA-10G,
  • the holding portion was formed by laminating each of 0.5 [mm]) as a set while laminating them as a set.
  • the holding portion is hooked by the tip portion of the clamp mechanism portion using a step between the holding portion and the substrate body.
  • Example 4 a strip-shaped plate glass having a width of 50 [mm] with respect to the upper side edge portions of the front and back surfaces of the substrate body (manufactured by Nippon Electric Glass Co., Ltd .: OA-10G,
  • the holding portion was formed by pasting the thickness 0.5 [mm]) so as to extend 50 [mm] each on both sides in the width direction of the substrate body. Further, as a support method using the holding jig, the extended portion of the holding portion is hooked on the holding jig.
  • Comparative Example 1 a support plate (setter) made of crystallized glass having a size 10 [mm] larger than the surrounding dimensions (vertical dimension and lateral dimension) of the glass substrate is prepared.
  • the glass substrate was supported in a horizontal posture by placing it on the support plate.
  • Comparative Examples 2 and 3 a support member made of crystallized glass was prepared, and the glass substrate was supported in a vertical posture by leaning against the support member.
  • Comparative Examples 4 and 5 the glass substrate was suspended and supported while directly holding the upper edge portion of the substrate body by a plurality of holding jigs.
  • the shape of the front end surface of the clamp mechanism part of the holding jig in Comparative Examples 4 and 5 was the same as that of the holding jig employed in Examples 1 and 2 described above.
  • the heating rate was 10 [° C./min] and the heat treatment temperature was 540 [ Heat treatment was performed under the condition of [° C.]. Further, after the heat treatment, the temperature was lowered to room temperature in three stages. In addition, about Example 2 and Comparative Example 5, compared with the other Examples and Comparative Examples, the temperature was lowered while taking sufficient time.
  • Example 1, 2, 3, 4 and Comparative Examples 4 and 5 after reducing temperature to room temperature, the upper side edge part currently supported by the holding jig is cut off by laser cleaving. Thus, a glass substrate having a predetermined size (width: 730 [mm], length 920 [mm]) was obtained.
  • the glass substrate with a holding part, the heat treatment method for a glass substrate, and the glass substrate support unit of the present invention are used for, for example, a flat panel display typified by a liquid crystal display, a plasma display, and an organic EL, a solar panel, and the like. It can be used for heat treatment of a rectangular flat glass substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Robotics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2014/060208 2013-04-10 2014-04-08 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット WO2014168149A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020157029355A KR102160928B1 (ko) 2013-04-10 2014-04-08 유지부 부착 유리 기판, 유리 기판의 열처리 방법, 및 유리 기판 지지 유닛
CN201480020611.0A CN105121368B (zh) 2013-04-10 2014-04-08 带保持部的玻璃基板、玻璃基板的热处理方法、以及玻璃基板支承单元

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013082214A JP6065722B2 (ja) 2013-04-10 2013-04-10 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット
JP2013-082214 2013-04-10

Publications (1)

Publication Number Publication Date
WO2014168149A1 true WO2014168149A1 (ja) 2014-10-16

Family

ID=51689556

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/060208 WO2014168149A1 (ja) 2013-04-10 2014-04-08 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット

Country Status (5)

Country Link
JP (1) JP6065722B2 (zh)
KR (1) KR102160928B1 (zh)
CN (1) CN105121368B (zh)
TW (1) TWI638789B (zh)
WO (1) WO2014168149A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3989270A1 (en) * 2020-10-20 2022-04-27 Semsysco GmbH Clipping mechanism for fastening a substrate for a surface treatment of the substrate
JP7114475B2 (ja) 2016-02-29 2022-08-08 コーニング インコーポレイテッド ガラス基板の輸送のための方法および機器

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6454188B2 (ja) * 2015-03-13 2019-01-16 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
JP6571413B2 (ja) * 2015-06-30 2019-09-04 ＡｖａｎＳｔｒａｔｅ株式会社 ディスプレイ用ガラス板の製造方法、及び、ガラス板製造装置
JP6587844B2 (ja) * 2015-06-30 2019-10-09 ＡｖａｎＳｔｒａｔｅ株式会社 ディスプレイ用ガラス板の製造方法、および、ディスプレイ用ガラス板製造装置
JP6571416B2 (ja) * 2015-06-30 2019-09-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法、及び、ガラス基板の製造装置
JP6571415B2 (ja) * 2015-06-30 2019-09-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
JP6530651B2 (ja) * 2015-06-30 2019-06-12 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
JP6642798B2 (ja) * 2016-03-14 2020-02-12 日本電気硝子株式会社 ガラス板の製造装置
JP6631838B2 (ja) * 2016-05-18 2020-01-15 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置、並びにガラス板の搬送装置
TW201822282A (zh) * 2016-09-09 2018-06-16 美商康寧公司 具有通孔的低表面粗糙度基板及其製作方法
US10766803B2 (en) * 2016-09-14 2020-09-08 AGC Inc. Method for producing bent glass article, and bent glass article
JP6889866B2 (ja) * 2017-11-15 2021-06-18 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置
CN111933522B (zh) * 2020-08-17 2023-07-18 业成科技（成都）有限公司 治具和退火装置
CN118066874B (zh) * 2024-04-19 2024-06-21 赛德半导体有限公司 一种柔性超薄玻璃强化设备的送料装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526198A (en) * 1978-08-11 1980-02-25 Saint Gobain Plate glass carrying device
JPS60163987A (ja) * 1984-02-03 1985-08-26 Nippon Sheet Glass Co Ltd 滑り止め剤
JPH071637B2 (ja) * 1987-09-22 1995-01-11 ローム株式会社 サンプル・ホールド回路
JP2000501373A (ja) * 1996-08-27 2000-02-08 ビーティーユー インターナショナル インコーポレイテッド パネル支持メカニズム
JP2006029597A (ja) * 2004-07-12 2006-02-02 Koyo Thermo System Kk 焼成装置
WO2013046683A1 (ja) * 2011-09-29 2013-04-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス板の製造方法及びガラス板製造装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062594B2 (ja) * 1987-03-26 1994-01-12 セントラル硝子株式会社 強化ガラス板の製造方法
CN1727294A (zh) * 2004-07-27 2006-02-01 光洋热系统株式会社 烧成装置
EP1721872A1 (en) * 2005-05-10 2006-11-15 Corning Incorporated Method of producing a glass sheet

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526198A (en) * 1978-08-11 1980-02-25 Saint Gobain Plate glass carrying device
JPS60163987A (ja) * 1984-02-03 1985-08-26 Nippon Sheet Glass Co Ltd 滑り止め剤
JPH071637B2 (ja) * 1987-09-22 1995-01-11 ローム株式会社 サンプル・ホールド回路
JP2000501373A (ja) * 1996-08-27 2000-02-08 ビーティーユー インターナショナル インコーポレイテッド パネル支持メカニズム
JP2006029597A (ja) * 2004-07-12 2006-02-02 Koyo Thermo System Kk 焼成装置
WO2013046683A1 (ja) * 2011-09-29 2013-04-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス板の製造方法及びガラス板製造装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7114475B2 (ja) 2016-02-29 2022-08-08 コーニング インコーポレイテッド ガラス基板の輸送のための方法および機器
EP3989270A1 (en) * 2020-10-20 2022-04-27 Semsysco GmbH Clipping mechanism for fastening a substrate for a surface treatment of the substrate
EP3989271A1 (en) * 2020-10-20 2022-04-27 Semsysco GmbH Clipping mechanism for fastening a substrate for a surface treatment of the substrate
WO2022084109A1 (en) * 2020-10-20 2022-04-28 Semsysco Gmbh Clipping mechanism for fastening a substrate for a surface treatment of the substrate
US11942356B2 (en) 2020-10-20 2024-03-26 Semsysco Gmbh Clipping mechanism for fastening a substrate for a surface treatment of the substrate

Also Published As

Publication number Publication date
KR102160928B1 (ko) 2020-09-29
JP2014205579A (ja) 2014-10-30
JP6065722B2 (ja) 2017-01-25
CN105121368B (zh) 2018-03-30
TWI638789B (zh) 2018-10-21
TW201512115A (zh) 2015-04-01
CN105121368A (zh) 2015-12-02
KR20150143492A (ko) 2015-12-23

Similar Documents

Publication Publication Date Title
JP6065722B2 (ja) 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット
US20130280495A1 (en) Glass film cutting method and glass film laminate
JP2014125376A (ja) ガラス基板支持ユニット、ガラス基板支持方法、及びガラス基板熱処理方法
US8312741B2 (en) Cleaving method for a glass film
US9458047B2 (en) Method for cutting plate-like glass, and cutting device therefor
US9212080B2 (en) Glass film cleaving method and glass film laminate
EP3245674A1 (en) Glass substrate and display device comprising the same
JP6054396B2 (ja) ガラスシートの周縁領域を切除するための方法及び装置
US10766804B2 (en) Glass film production method
KR20160086855A (ko) 유리 필름 적층체 및 액정 패널의 제조 방법
JP5241223B2 (ja) ガラス板の製造方法及び製造設備
JP2019137587A (ja) ガラス基板群及びその製造方法
JP6388210B2 (ja) ガラスリボンの製造装置及びガラスリボンの製造方法
TWI649279B (zh) 脆性材料基板之刻劃裝置
WO2016011114A1 (en) Methods and apparatus for controlled laser cutting of flexible glass
US10301211B2 (en) Mechanically forming crack initiation defects in thin glass substrates using an abrasive surface
JP6379678B2 (ja) ガラス基板の製造方法
TW201718427A (zh) 玻璃薄膜的製造方法、及包含玻璃薄膜的電子裝置的製造方法
JP5434977B2 (ja) ディスプレイ用のガラス基板の製造方法およびフラットパネルディスプレイの製造方法
TWI679174B (zh) 玻璃基板的熱處理方法以及玻璃基板的製造方法
US20240228371A9 (en) Glass sheet for chemical strengthening, manufacturing method of strengthened glass sheet, and glass sheet
WO2018193583A1 (ja) スクライブ装置及びスクライブ方法
JP2012167014A (ja) ガラス板の製造方法及び製造設備
JP2017165469A (ja) ガラス板物品保持具及びガラス板物品保持方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14782554

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20157029355

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 14782554

Country of ref document: EP

Kind code of ref document: A1