KR102122749B1 - 기재막 및 소결 방법 - Google Patents

기재막 및 소결 방법 Download PDF

Info

Publication number
KR102122749B1
KR102122749B1 KR1020197017474A KR20197017474A KR102122749B1 KR 102122749 B1 KR102122749 B1 KR 102122749B1 KR 1020197017474 A KR1020197017474 A KR 1020197017474A KR 20197017474 A KR20197017474 A KR 20197017474A KR 102122749 B1 KR102122749 B1 KR 102122749B1
Authority
KR
South Korea
Prior art keywords
film
coating layer
oxide
base film
light irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197017474A
Other languages
English (en)
Korean (ko)
Other versions
KR20190075151A (ko
Inventor
쿠르트 에이. 슈로더
히로시 우치다
켄지 시노자키
Original Assignee
쇼와 덴코 가부시키가이샤
엔씨씨 나노, 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와 덴코 가부시키가이샤, 엔씨씨 나노, 엘엘씨 filed Critical 쇼와 덴코 가부시키가이샤
Publication of KR20190075151A publication Critical patent/KR20190075151A/ko
Application granted granted Critical
Publication of KR102122749B1 publication Critical patent/KR102122749B1/ko
Assigned to 가부시끼가이샤 레조낙 reassignment 가부시끼가이샤 레조낙 권리지분의 전부이전등록 Assignors: 가부시키가이샤 레조낙 홀딩스
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G13/00—Electrographic processes using a charge pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
KR1020197017474A 2012-06-05 2013-05-31 기재막 및 소결 방법 Active KR102122749B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261655644P 2012-06-05 2012-06-05
US61/655,644 2012-06-05
PCT/IB2013/001254 WO2013182896A1 (en) 2012-06-05 2013-05-31 Substrate film and sintering method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177004747A Division KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Publications (2)

Publication Number Publication Date
KR20190075151A KR20190075151A (ko) 2019-06-28
KR102122749B1 true KR102122749B1 (ko) 2020-06-15

Family

ID=49711481

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020197017474A Active KR102122749B1 (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020147034282A Ceased KR20150016552A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법
KR1020177004747A Ceased KR20170023202A (ko) 2012-06-05 2013-05-31 기재막 및 소결 방법

Country Status (6)

Country Link
US (1) US9631283B2 (https=)
EP (1) EP2855148B1 (https=)
JP (1) JP6258303B2 (https=)
KR (3) KR102122749B1 (https=)
CN (1) CN104797419B (https=)
WO (1) WO2013182896A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10000411B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductivity and low emissivity coating technology
US10000965B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductive coating technology
US10060180B2 (en) 2010-01-16 2018-08-28 Cardinal Cg Company Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology
JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
JP6441212B2 (ja) * 2013-03-29 2018-12-19 太陽ホールディングス株式会社 光焼成用熱可塑性樹脂フィルム基材、これを用いた導電回路基板およびその製造方法
EP3122542B1 (en) * 2014-03-28 2019-06-05 Ez Print, LLC 3d print bed having permanent coating
WO2017073967A1 (ko) * 2015-10-26 2017-05-04 한국기계연구원 광소결을 이용한 패턴 형성 장치 및 이를 이용한 패턴 형성 방법
CN209440968U (zh) * 2015-12-24 2019-09-27 株式会社村田制作所 树脂片
JP2017216303A (ja) * 2016-05-30 2017-12-07 株式会社リコー 回路部材用基材、回路部材、回路部材用基材の製造方法、及び回路部材の製造方法
EP3543214A4 (en) * 2016-11-17 2019-11-27 Nippon Chemical Industrial Co., Ltd. COPPER OXIDE PARTICLES, PRODUCTION METHOD THEREFOR, PHOTOSINTERA COMPOSITION, METHOD FOR PRODUCING A CONDUCTIVE FILM THEREFOR AND COPPER OXIDE PARTICLE PASTE
CN109426397B (zh) * 2017-08-22 2020-08-04 京东方科技集团股份有限公司 触控结构的制备方法、触控结构
US11028012B2 (en) 2018-10-31 2021-06-08 Cardinal Cg Company Low solar heat gain coatings, laminated glass assemblies, and methods of producing same
US11267763B2 (en) 2019-05-17 2022-03-08 Raytheon Technologies Corporation Rapid processing of laminar composite components
DE102019114806A1 (de) * 2019-06-03 2020-12-03 Value & Intellectual Properties Management Gmbh Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger
JP7344297B2 (ja) * 2019-07-31 2023-09-13 株式会社Fuji ３次元積層造形による回路配線の製造方法
WO2021044986A1 (ja) * 2019-09-05 2021-03-11 株式会社Adeka 重合性組成物、被覆構造体の製造方法、被覆構造体及び被覆材
CN110577771A (zh) * 2019-09-17 2019-12-17 宁波石墨烯创新中心有限公司 一种导电油墨、rfid天线和电子标签及制备方法
US11996384B2 (en) 2020-12-15 2024-05-28 Pulseforge, Inc. Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
JP2023017150A (ja) * 2021-07-26 2023-02-07 株式会社リコー 導体の製造方法、導体の製造装置、及び構造体
EP4274391A1 (en) 2022-05-06 2023-11-08 Ecole Polytechnique Federale De Lausanne (Epfl) Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices
JP2024001439A (ja) * 2022-06-22 2024-01-10 石原ケミカル株式会社 回路基板、ｒｆタグ、及び回路基板作製方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011000892A (ja) * 2003-09-10 2011-01-06 Nippon Zeon Co Ltd 樹脂複合フィルム

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4147639B2 (ja) 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
JP2005203396A (ja) 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
US7820097B2 (en) 2004-11-24 2010-10-26 Ncc Nano, Llc Electrical, plating and catalytic uses of metal nanomaterial compositions
US8945686B2 (en) 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
CN101605658B (zh) * 2007-02-14 2012-10-03 东丽株式会社 易粘合性叠层热塑性树脂膜
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
EP2172337A4 (en) * 2007-07-31 2012-04-25 Techno Polymer Co Ltd LAYER PRODUCT
US7833683B2 (en) 2007-08-14 2010-11-16 Xerox Corporation Photosensitive member having an overcoat
US8410712B2 (en) * 2008-07-09 2013-04-02 Ncc Nano, Llc Method and apparatus for curing thin films on low-temperature substrates at high speeds
KR100999506B1 (ko) * 2008-09-09 2010-12-09 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR100999921B1 (ko) 2008-09-26 2010-12-13 삼성전기주식회사 기판의 이중 표면 처리 방법 및 상기 방법에 의해 표면 처리된 기판
CA2740618C (en) * 2008-10-17 2016-01-12 Ncc Nano, Llc Method for reducing thin films on low temperature substrates
WO2012011491A1 (ja) * 2010-07-22 2012-01-26 パナソニック電工株式会社 導電性フィルム
JP5608491B2 (ja) * 2010-09-13 2014-10-15 東芝テック株式会社 導電パターンの形成方法および印刷物
JP5880100B2 (ja) * 2012-02-10 2016-03-08 コニカミノルタ株式会社 透明電極の製造方法
JP5849834B2 (ja) * 2012-04-09 2016-02-03 コニカミノルタ株式会社 透明電極、透明電極の製造方法、及び該透明電極を用いた有機電子素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011000892A (ja) * 2003-09-10 2011-01-06 Nippon Zeon Co Ltd 樹脂複合フィルム

Also Published As

Publication number Publication date
JP6258303B2 (ja) 2018-01-10
US20150225857A1 (en) 2015-08-13
EP2855148A1 (en) 2015-04-08
CN104797419A (zh) 2015-07-22
KR20170023202A (ko) 2017-03-02
EP2855148B1 (en) 2019-04-10
KR20190075151A (ko) 2019-06-28
CN104797419B (zh) 2018-02-23
WO2013182896A1 (en) 2013-12-12
KR20150016552A (ko) 2015-02-12
JP2015528753A (ja) 2015-10-01
US9631283B2 (en) 2017-04-25
EP2855148A4 (en) 2016-01-20

Similar Documents

Publication Publication Date Title
KR102122749B1 (ko) 기재막 및 소결 방법
KR101586619B1 (ko) 충전제 재료를 포함하는 투명한 전도성 코팅
CN104620168B (zh) 带有融合金属纳米线的透明导电电极、它们的结构设计及其制造方法
KR101811068B1 (ko) 도전 적층체 및 그것을 이용하여 이루어지는 터치 패널
CN107000409B (zh) 透明导电性膜层叠体及其用途
US9854670B2 (en) Transparent electrode and method for producing same
EP3028126B1 (en) Bonding electronic components to patterned nanowire transparent conductors
US20150103269A1 (en) Transparent conductive substrate production method, transparent conductive substrate, and electrostatic capacitance touch panel
EP2876468A1 (en) Conductive optical element, input element and display element
TW201505037A (zh) 導電圖型之製造方法及導電圖型形成基板
TWI757255B (zh) 透明導電層層合用薄膜、該製造方法及透明導電性薄膜
WO2014010270A1 (ja) 導電積層体、パターン化導電積層体、その製造方法、および、それらを用いてなるタッチパネル
KR101959594B1 (ko) 도전 적층체 및 이를 이용하여 이루어지는 표시체
EP2695215A1 (en) Apparatus and method for providing an embedded structure and for providing an electro-optical device including the same
CN109074919B (zh) 透明导电图案的形成方法
TW201324546A (zh) 附透明導電層之基體及其製造方法
KR102088100B1 (ko) 광소결 나노잉크, 광소결 방법 그리고 전도성 나노 구조체
CN113632183A (zh) 加热器
JP6323741B2 (ja) 導電積層体及びそれを用いてなる表示体
KR20100116398A (ko) 탄소나노튜브 박막 후처리 공정
KR20140074072A (ko) 투명 전도성 필름 및 이의 제조방법
JP2012142539A (ja) 薄膜太陽電池向け裏面電極テープ、及びこれを用いる薄膜太陽電池の製造方法
JP2014099294A (ja) 基材の製造方法、基材、および基材を用いた成形体
JP2012212784A (ja) 導電性パターン部材形成方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20190618

Application number text: 1020177004747

Filing date: 20170220

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190827

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20200219

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20190827

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20200219

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20191025

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20200324

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20200319

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20200219

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20191025

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200609

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200610

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20240530

Start annual number: 5

End annual number: 5