KR102117726B1 - 압착 장치 및 압착 방법 - Google Patents

압착 장치 및 압착 방법 Download PDF

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KR102117726B1
KR102117726B1 KR1020157002389A KR20157002389A KR102117726B1 KR 102117726 B1 KR102117726 B1 KR 102117726B1 KR 1020157002389 A KR1020157002389 A KR 1020157002389A KR 20157002389 A KR20157002389 A KR 20157002389A KR 102117726 B1 KR102117726 B1 KR 102117726B1
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South Korea
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sheet
elastic sheet
chip
substrate
substrate stage
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KR1020157002389A
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Korean (ko)
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KR20150036254A (ko
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가츠미 데라다
사토루 나라바
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토레이 엔지니어링 컴퍼니, 리미티드
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Publication of KR20150036254A publication Critical patent/KR20150036254A/ko
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    • H—ELECTRICITY
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1020157002389A 2012-06-29 2013-06-27 압착 장치 및 압착 방법 KR102117726B1 (ko)

Applications Claiming Priority (3)

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JP2012146895 2012-06-29
JPJP-P-2012-146895 2012-06-29
PCT/JP2013/067624 WO2014003107A1 (fr) 2012-06-29 2013-06-27 Dispositif d'ondulation et procédé d'ondulation

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KR20150036254A KR20150036254A (ko) 2015-04-07
KR102117726B1 true KR102117726B1 (ko) 2020-06-01

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KR (1) KR102117726B1 (fr)
WO (1) WO2014003107A1 (fr)

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DE102014114093B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern
DE102014114096A1 (de) 2014-09-29 2016-03-31 Danfoss Silicon Power Gmbh Sinterwerkzeug für den Unterstempel einer Sintervorrichtung
DE102014114095B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Sintervorrichtung
DE102014114097B4 (de) * 2014-09-29 2017-06-01 Danfoss Silicon Power Gmbh Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe
JP6411316B2 (ja) * 2015-12-08 2018-10-24 株式会社新川 電子部品実装装置
TWI671827B (zh) * 2017-03-30 2019-09-11 日商新川股份有限公司 接合裝置以及接合方法
JP7182036B2 (ja) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法
JP7268929B2 (ja) * 2020-08-05 2023-05-08 株式会社新川 実装装置及び実装方法
KR102233338B1 (ko) * 2020-10-12 2021-03-29 주식회사 저스템 플립칩 본딩 산화 방지 장치
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法

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JP2001053092A (ja) * 1999-08-13 2001-02-23 Japan Radio Co Ltd パッケージ、デバイス及びその製造方法
JP2004296746A (ja) * 2003-03-26 2004-10-21 Nikkiso Co Ltd 加圧装置および回路素子の実装方法
JP2012004603A (ja) * 2004-09-15 2012-01-05 Seiko Epson Corp 半導体装置の実装構造、半導体装置の実装方法及び基板

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