KR102104407B1 - 표면 실장기의 부품 유지 헤드 - Google Patents

표면 실장기의 부품 유지 헤드 Download PDF

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Publication number
KR102104407B1
KR102104407B1 KR1020130146415A KR20130146415A KR102104407B1 KR 102104407 B1 KR102104407 B1 KR 102104407B1 KR 1020130146415 A KR1020130146415 A KR 1020130146415A KR 20130146415 A KR20130146415 A KR 20130146415A KR 102104407 B1 KR102104407 B1 KR 102104407B1
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KR
South Korea
Prior art keywords
spindle
holding
light
nozzle
pressing portion
Prior art date
Application number
KR1020130146415A
Other languages
English (en)
Korean (ko)
Other versions
KR20150041728A (ko
Inventor
타니자키 마사히로
마사키 노리유키
테츠오 후지하라
Original Assignee
한화정밀기계 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한화정밀기계 주식회사 filed Critical 한화정밀기계 주식회사
Priority to CN201410089054.XA priority Critical patent/CN104582463B/zh
Publication of KR20150041728A publication Critical patent/KR20150041728A/ko
Application granted granted Critical
Publication of KR102104407B1 publication Critical patent/KR102104407B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020130146415A 2013-10-09 2013-11-28 표면 실장기의 부품 유지 헤드 KR102104407B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410089054.XA CN104582463B (zh) 2013-10-09 2014-03-12 表面贴装机的组件保持头

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-212220 2013-10-09
JP2013212220A JP6178693B2 (ja) 2013-10-09 2013-10-09 表面実装機の部品保持ヘッド

Publications (2)

Publication Number Publication Date
KR20150041728A KR20150041728A (ko) 2015-04-17
KR102104407B1 true KR102104407B1 (ko) 2020-04-24

Family

ID=53001150

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130146415A KR102104407B1 (ko) 2013-10-09 2013-11-28 표면 실장기의 부품 유지 헤드

Country Status (3)

Country Link
JP (1) JP6178693B2 (ja)
KR (1) KR102104407B1 (ja)
CN (1) CN104582463B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6514871B2 (ja) * 2014-09-30 2019-05-15 ハンファエアロスペース株式会社Ｈａｎｗｈａ Ａｅｒｏｓｐａｃｅ Ｃｏ．，Ｌｔｄ． 表面実装機の部品保持ヘッド、この部品保持ヘッドにおけるセンサの位置決め方法、及びセンサ位置決め治具
JP6429582B2 (ja) * 2014-10-09 2018-11-28 ハンファエアロスペース株式会社Ｈａｎｗｈａ Ａｅｒｏｓｐａｃｅ Ｃｏ．，Ｌｔｄ． 表面実装機の部品保持ヘッド
KR102199474B1 (ko) * 2015-11-18 2021-01-06 한화정밀기계 주식회사 표면 실장기의 부품 유지 헤드
EP3522693B1 (en) * 2016-09-29 2023-12-13 Fuji Corporation Component mounting apparatus
US11439051B2 (en) 2018-01-10 2022-09-06 Fuji Corporation Grounding detection device and electronic component mounter
WO2020208798A1 (ja) * 2019-04-11 2020-10-15 株式会社Ｆｕｊｉ 部品装着機および部品装着方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026591A (ja) 2000-07-12 2002-01-25 Matsushita Electric Ind Co Ltd 部品実装方法及び該方法を実施する部品実装装置
JP2006100594A (ja) 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 部品実装方法及び部品実装装置
JP2006196618A (ja) 2005-01-12 2006-07-27 Fuji Mach Mfg Co Ltd 電子部品装着装置
JP2007019296A (ja) 2005-07-08 2007-01-25 Matsushita Electric Ind Co Ltd 電子部品の実装装置
JP2007059776A (ja) 2005-08-26 2007-03-08 Matsushita Electric Ind Co Ltd 電子部品実装装置、電子部品実装方法およびノズル高さ検出方法
JP2009246303A (ja) 2008-03-31 2009-10-22 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2009272652A (ja) 2009-08-18 2009-11-19 Panasonic Corp ロータリー型部品実装装置
JP2013191771A (ja) 2012-03-14 2013-09-26 Fuji Mach Mfg Co Ltd 部品装着装置
JP2014063837A (ja) 2012-09-20 2014-04-10 Samsung Techwin Co Ltd 表面実装機の部品保持ヘッド
WO2014147806A1 (ja) 2013-03-22 2014-09-25 富士機械製造株式会社 部品実装機

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148790A (ja) * 1995-11-21 1997-06-06 Sanyo Electric Co Ltd 電子部品装着装置
JP3543044B2 (ja) * 1996-03-15 2004-07-14 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
US6605500B2 (en) * 2000-03-10 2003-08-12 Infotech Ag Assembly process
JP4729645B1 (ja) * 2010-09-01 2011-07-20 ヤマハ発動機株式会社 部品実装装置
JP4756109B1 (ja) * 2010-09-10 2011-08-24 ヤマハ発動機株式会社 部品実装装置
JP5721222B2 (ja) * 2011-05-31 2015-05-20 三星テクウィン株式会社Ｓａｍｓｕｎｇ Ｔｅｃｈｗｉｎ Ｃｏ．， Ｌｔｄ 電子部品実装装置
JP5812456B2 (ja) * 2012-02-28 2015-11-11 富士機械製造株式会社 部品実装機

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026591A (ja) 2000-07-12 2002-01-25 Matsushita Electric Ind Co Ltd 部品実装方法及び該方法を実施する部品実装装置
JP2006100594A (ja) 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 部品実装方法及び部品実装装置
JP2006196618A (ja) 2005-01-12 2006-07-27 Fuji Mach Mfg Co Ltd 電子部品装着装置
JP2007019296A (ja) 2005-07-08 2007-01-25 Matsushita Electric Ind Co Ltd 電子部品の実装装置
JP2007059776A (ja) 2005-08-26 2007-03-08 Matsushita Electric Ind Co Ltd 電子部品実装装置、電子部品実装方法およびノズル高さ検出方法
JP2009246303A (ja) 2008-03-31 2009-10-22 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2009272652A (ja) 2009-08-18 2009-11-19 Panasonic Corp ロータリー型部品実装装置
JP2013191771A (ja) 2012-03-14 2013-09-26 Fuji Mach Mfg Co Ltd 部品装着装置
JP2014063837A (ja) 2012-09-20 2014-04-10 Samsung Techwin Co Ltd 表面実装機の部品保持ヘッド
WO2014147806A1 (ja) 2013-03-22 2014-09-25 富士機械製造株式会社 部品実装機

Also Published As

Publication number Publication date
KR20150041728A (ko) 2015-04-17
JP2015076529A (ja) 2015-04-20
JP6178693B2 (ja) 2017-08-09
CN104582463A (zh) 2015-04-29
CN104582463B (zh) 2019-05-17

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