CN104582463B - 表面贴装机的组件保持头 - Google Patents

表面贴装机的组件保持头 Download PDF

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Publication number
CN104582463B
CN104582463B CN201410089054.XA CN201410089054A CN104582463B CN 104582463 B CN104582463 B CN 104582463B CN 201410089054 A CN201410089054 A CN 201410089054A CN 104582463 B CN104582463 B CN 104582463B
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CN
China
Prior art keywords
unit
main shaft
component
head
retaining head
Prior art date
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Application number
CN201410089054.XA
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English (en)
Chinese (zh)
Other versions
CN104582463A (zh
Inventor
谷崎昌裕
则行正贵
藤原哲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Precision Machinery Co Ltd
Original Assignee
Hanwha Precision Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hanwha Precision Machinery Co Ltd filed Critical Hanwha Precision Machinery Co Ltd
Publication of CN104582463A publication Critical patent/CN104582463A/zh
Application granted granted Critical
Publication of CN104582463B publication Critical patent/CN104582463B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201410089054.XA 2013-10-09 2014-03-12 表面贴装机的组件保持头 Active CN104582463B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013212220A JP6178693B2 (ja) 2013-10-09 2013-10-09 表面実装機の部品保持ヘッド
JP2013-212220 2013-10-09
KR1020130146415A KR102104407B1 (ko) 2013-10-09 2013-11-28 표면 실장기의 부품 유지 헤드
KR10-2013-0146415 2013-11-28

Publications (2)

Publication Number Publication Date
CN104582463A CN104582463A (zh) 2015-04-29
CN104582463B true CN104582463B (zh) 2019-05-17

Family

ID=53001150

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410089054.XA Active CN104582463B (zh) 2013-10-09 2014-03-12 表面贴装机的组件保持头

Country Status (3)

Country Link
JP (1) JP6178693B2 (ja)
KR (1) KR102104407B1 (ja)
CN (1) CN104582463B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6514871B2 (ja) * 2014-09-30 2019-05-15 ハンファエアロスペース株式会社Ｈａｎｗｈａ Ａｅｒｏｓｐａｃｅ Ｃｏ．，Ｌｔｄ． 表面実装機の部品保持ヘッド、この部品保持ヘッドにおけるセンサの位置決め方法、及びセンサ位置決め治具
JP6429582B2 (ja) * 2014-10-09 2018-11-28 ハンファエアロスペース株式会社Ｈａｎｗｈａ Ａｅｒｏｓｐａｃｅ Ｃｏ．，Ｌｔｄ． 表面実装機の部品保持ヘッド
KR102199474B1 (ko) * 2015-11-18 2021-01-06 한화정밀기계 주식회사 표면 실장기의 부품 유지 헤드
EP3522693B1 (en) * 2016-09-29 2023-12-13 Fuji Corporation Component mounting apparatus
US11439051B2 (en) 2018-01-10 2022-09-06 Fuji Corporation Grounding detection device and electronic component mounter
WO2020208798A1 (ja) * 2019-04-11 2020-10-15 株式会社Ｆｕｊｉ 部品装着機および部品装着方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252197A (ja) * 1996-03-15 1997-09-22 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
WO2001067492A2 (en) * 2000-03-10 2001-09-13 Infotech, Ag Method and apparatus for soldering surface mounted components onto printed circuit boards
CN102387698A (zh) * 2010-09-01 2012-03-21 雅马哈发动机株式会社 元件安装装置
CN102404984A (zh) * 2010-09-10 2012-04-04 雅马哈发动机株式会社 元件安装装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148790A (ja) * 1995-11-21 1997-06-06 Sanyo Electric Co Ltd 電子部品装着装置
JP4394260B2 (ja) 2000-07-12 2010-01-06 パナソニック株式会社 部品実装方法
JP2006100594A (ja) 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 部品実装方法及び部品実装装置
JP4478583B2 (ja) * 2005-01-12 2010-06-09 富士機械製造株式会社 電子部品装着装置
JP4561506B2 (ja) 2005-07-08 2010-10-13 パナソニック株式会社 電子部品の実装装置
JP4569419B2 (ja) 2005-08-26 2010-10-27 パナソニック株式会社 電子部品実装装置、電子部品実装方法およびノズル高さ検出方法
JP5154999B2 (ja) 2008-03-31 2013-02-27 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4503686B2 (ja) 2009-08-18 2010-07-14 パナソニック株式会社 ロータリー型部品実装装置
JP5721222B2 (ja) * 2011-05-31 2015-05-20 三星テクウィン株式会社Ｓａｍｓｕｎｇ Ｔｅｃｈｗｉｎ Ｃｏ．， Ｌｔｄ 電子部品実装装置
JP5812456B2 (ja) * 2012-02-28 2015-11-11 富士機械製造株式会社 部品実装機
JP5971992B2 (ja) 2012-03-14 2016-08-17 富士機械製造株式会社 部品装着装置
JP5974368B2 (ja) 2012-09-20 2016-08-23 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． 表面実装機の部品保持ヘッド
JP6057360B2 (ja) 2013-03-22 2017-01-11 富士機械製造株式会社 部品実装機

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252197A (ja) * 1996-03-15 1997-09-22 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
WO2001067492A2 (en) * 2000-03-10 2001-09-13 Infotech, Ag Method and apparatus for soldering surface mounted components onto printed circuit boards
CN102387698A (zh) * 2010-09-01 2012-03-21 雅马哈发动机株式会社 元件安装装置
CN102404984A (zh) * 2010-09-10 2012-04-04 雅马哈发动机株式会社 元件安装装置

Also Published As

Publication number Publication date
KR20150041728A (ko) 2015-04-17
JP2015076529A (ja) 2015-04-20
JP6178693B2 (ja) 2017-08-09
CN104582463A (zh) 2015-04-29
KR102104407B1 (ko) 2020-04-24

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C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Gyeongnam Changwon City, South Korea

Applicant after: HANWHA TECHWIN Co.,Ltd.

Address before: Gyeongnam Changwon City, South Korea

Applicant before: Samsung Techwin Co.,Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: SAMSUNG TAI KEWEI CO., LTD. TO: HANWHA TECHWIN CO., LTD.

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CB02 Change of applicant information

Address after: Gyeongnam Changwon City, South Korea

Applicant after: HANWHA AEROSPACE Co.,Ltd.

Address before: Gyeongnam Changwon City, South Korea

Applicant before: HANWHA TECHWIN Co.,Ltd.

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Effective date of registration: 20190419

Address after: Gyeongnam Changwon City, South Korea

Applicant after: Hanwha Precision Machinery Co.,Ltd.

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Applicant before: HANWHA AEROSPACE Co.,Ltd.

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