CN104582463B - Component holding head of surface mounting machine - Google Patents

Component holding head of surface mounting machine Download PDF

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Publication number
CN104582463B
CN104582463B CN201410089054.XA CN201410089054A CN104582463B CN 104582463 B CN104582463 B CN 104582463B CN 201410089054 A CN201410089054 A CN 201410089054A CN 104582463 B CN104582463 B CN 104582463B
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China
Prior art keywords
unit
main shaft
component
head
retaining head
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Active
Application number
CN201410089054.XA
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Chinese (zh)
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CN104582463A (en
Inventor
谷崎昌裕
则行正贵
藤原哲夫
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Hanwha Precision Machinery Co Ltd
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Hanwha Precision Machinery Co Ltd
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Publication of CN104582463A publication Critical patent/CN104582463A/en
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Publication of CN104582463B publication Critical patent/CN104582463B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

According to an aspect of an exemplary embodiment, there is provided a component holding head of a surface mounter, the component holding head including: a plurality of spindles; a pressure unit for lowering the main shaft in an axial direction of the main shaft; a holding unit provided at a bottom of each of the plurality of spindles, the holding unit for holding a component; an elastic member provided between the main shaft and the holding unit; a non-contact sensor provided integrally with the pressure unit, the non-contact sensor generating a drop detection signal by detecting a relative position change of the holding unit with respect to the main shaft in a non-contact manner as the elastic member is compressed when the holding unit drops according to a descent of the main shaft.

Description

The component retaining head of surface stick-mounting machine
This application claims on October 9th, 2013 in the 2013-212220 Japan Patent Shen that Japanese Patent Office submits Please with the power for the 10-2013-0146415 South Korea patent application submitted on November 28th, 2013 in Korean Intellectual Property Office The disclosure of benefit, described two applications is all incorporated herein by reference.
Technical field
Exemplary embodiment is related to a kind of component (electronic component, for example, integrated chip (IC)) being mounted in substrate The component retaining head of surface stick-mounting machine, wherein the component retaining head includes the holding unit for keeping component.
Background technique
In general, surface stick-mounting machine is configured to move component retaining head on component supply unit, keep component The ozzle as holding unit of head is gone up and down to adsorb and pick up component, is moved to component retaining head on substrate, is then existed Decline ozzle on substrate, component is mounted on the preset coordinates position of substrate.
As described above, when by making ozzle lifting to pick up component, if the descending stroke of ozzle is too long, with The top surface of the lower part of ozzle forcefully press component, component are very likely damaged, and if ozzle descending stroke It is too short, it would be possible that preventing ozzle from picking up component since ozzle cannot be fallen on the top surface of component.
Identical principle is applied to when component is mounted in substrate.In other words, if the descending stroke of ozzle It is too long, then component is very likely damaged as the component for being adsorbed onto ozzle lower part forcefully presses substrate, and if Descending stroke is too short, it would be possible that preventing component from being mounted in substrate since component is not fallen on the top surface of substrate.
No. 3543044 Japanese Registered Patent discloses a kind of method of whereabouts that ozzle is detected using detection unit, Method of this method as the descending stroke for suitably controlling ozzle.However, falling in JP3543044 for detecting ozzle Detection unit setting be used for each ozzle.In other words, according to JP3543044, in the component retaining head including multiple ozzles In, it is used to detect multiple detection units of ozzle whereabouts corresponding to multiple nozzle sets.In this case, installation space may It is insufficient and additionally increase cost.
Summary of the invention
It includes component for keeping multiple holding units of component that one or more exemplary embodiments, which provide a kind of, Holding head, wherein holding unit is dropped through a detection unit to detect.
One side accoding to exemplary embodiment, provides a kind of component retaining head of surface stick-mounting machine, and the component is kept Head includes: multiple main shafts;Pressure unit, for declining main shaft along the axial direction of the main shaft;Holding unit is arranged described The bottom of each main shaft in multiple main shafts, the holding unit is for keeping component;Elastic component, setting in the main shaft and Between the holding unit;Noncontacting proximity sensor is integrally provided with the pressure unit, when the holding unit is according to master The decline of axis and when falling, as the elastic component is compressed, the holding unit changes relative to the relative position of main shaft, The noncontacting proximity sensor generates whereabouts detection and changing to the relative position and detecting according to cordless Signal.
The main shaft that will decline can be selected and making main shaft carry out relative motion relative to the pressure unit, and selected The main shaft selected can be declined and declining the pressure unit.
The component retaining head may also include that decline unit, for declining the pressure unit;Control unit is used for Control the decline unit, wherein described control unit falls based on the received to be detected signal and stop the decline unit.
Described control unit can control the decline unit so that the holding unit from the first height and position fall one Until reaching the second height and position, decrease speed is gradually decreased, and when the holding unit reaches the second height and position When, decrease speed is at the uniform velocity.
The noncontacting proximity sensor can include: luminescence unit, for towards anti-on the outer surface of the holding unit Reflective surface radiant light;Light receiving unit, for receiving the reflected light reflected from reflecting surface;Sensor unit connects for measuring The light quantity of the reflected light of receipts and the generation whereabouts detection signal when the received light quantity of measurement reduces specific quantity.
The light quantity of the sustainable received reflected light of measurement of sensor unit, obtains the change according to time received light quantity Rate, and when the absolute value that received light quantity is less than or equal to first threshold and the change rate is equal to or more than the second threshold When value, the sensor unit can produce whereabouts detection signal.
The direction of the light radiated by the luminescence unit can tilt down.
The noncontacting proximity sensor can be the fibre optical sensor including optical fiber.
The component retaining head may also include a main body and the swivel head for being rotatably arranged the head main body, wherein The multiple main shaft is arranged in the head main body along the circumferential directions and the pressure unit of the swivel head.
Detailed description of the invention
Exemplary embodiment is described in detail by referring to accompanying drawing, will become more clear in terms of above and other Chu, in which:
Fig. 1 is the perspective view of component retaining head accoding to exemplary embodiment;
Fig. 2 is the view for describing the mechanism for declining the main shaft of the component retaining head in Fig. 1 along the Z direction;
Fig. 3 is the view for describing the structure near the pressure unit of the mechanism in Fig. 2;
Fig. 4 A is view when main shaft in Fig. 2 is in initial position;
Fig. 4 B is view when main shaft in Fig. 2 is in decline state;
Fig. 5 is accoding to exemplary embodiment, in the sectional perspective view of the ozzle of the bottom of main shaft;
Fig. 6 is that accoding to exemplary embodiment, when ozzle falls, fibre optical sensor is according to the curve of time received light quantity Figure;
Fig. 7 is the exemplary view for describing to control Z servo motor by using control unit accoding to exemplary embodiment Figure.
Specific embodiment
Exemplary embodiment is described more fully with reference to the accompanying drawings.Identical label instruction in the description and the appended drawings is identical Element, therefore by omission it is repeatedly described.
Fig. 1 is the perspective view of component retaining head 10 accoding to exemplary embodiment.
As shown in Figure 1, component retaining head 10 is rotation head dummy component retaining head, wherein swivel head 30 is arranged in head main body On 20, rotated along the direction R around vertical axes, multiple main shafts 31 along swivel head 30 circumferencial direction cloth at regular intervals The bottom of main shaft 31 is arranged in the ozzle 32 set, and be used as the holding unit for absorbent module.
Swivel head 30 can be rotated according to the operation for the R servo motor 21 being arranged in head main body 20 along the direction R.In addition, Each main shaft 31 can be revolved around the axis of main shaft 31 along the direction T according to the operation for the T servo motor 22 being arranged in head main body 20 Turn.
In addition, for the main shaft 31a Z servo motor 23 that (that is, axial) declines along the Z direction in specific position to be arranged In head main body 20.Due to the mechanism for rotating swivel head 30 along the direction R according to the operation of R servo motor 21 and make main shaft 31 according to the operation of T servo motor 22 be well known along the mechanism that the direction T rotates, so will omit its details herein.Now, It will be described in detail the mechanism for declining main shaft 31a according to the operation of Z servo motor 23.
Fig. 2 is for describing the mechanism for declining the main shaft 31a of the component retaining head 10 in Fig. 1 along the Z direction View.The motor shaft for the Z servo motor 23 being arranged in head main body 20 is connected to the screw shaft 24a of ball screw framework 24, In, nut 24b is mounted on screw shaft 24a.In addition, pressure unit 25 is connected to nut 24b.Therefore, pressure unit 25 is according to Z The operation of servo motor 23 moves along the Z direction together with nut 24b.
One pressure unit 25 is only set in head main body 20.When main shaft 31 will be made to decline, by making 31 phase of main shaft Relative motion is carried out for pressure unit 25 and selects the main shaft 31(that will decline in the main shaft of specific position from main shaft 31 31a), and decline pressure unit 25 so that main shaft 31a declines.
In other words, according to the present embodiment, swivel head 30 is rotated along the direction R, so that main shaft 31 is relative to pressure unit 25 carry out relative motion, to make the main shaft 31a to be declined setting to (as shown in Figure 3) under pressure unit 25.Then, it gives Pressure unit 25 presses so that the main shaft 31a below pressure unit 25 declines.Here, the main shaft 31a in specific position is selected And the structure for declining the main shaft is not limited to above description.For example, selecting the master that will decline in addition to making the movement of main shaft 31 Axis 31a can also select the main shaft 31a that will decline by making the movement of pressure unit 25.
As shown in Fig. 2, connecting rod 26, which is connected to nut 24b(nut 24b, is connected to pressure unit 25), splined nut 28 connects It is connected to connecting rod 26, and fibre optical sensor 40 is arranged on splined nut 28.In addition, splined shaft 27 is fixedly disposed and leads to the end On body 20, and splined nut 28 is slidably disposed on splined shaft 27.In other words, fibre optical sensor 40 and pressure unit 25 are integrally provided.Therefore, as shown in Figure 4 A and 4 B shown in FIG., when pressure unit 25 according to the operation of Z servo motor 23 along the Z direction When movement, fibre optical sensor 40 correspondingly moves along the Z direction.
Fig. 4 A is view when main shaft 31a in Fig. 2 is in initial position, and Fig. 4 B is to make figure by pressure unit 25 Main shaft 31a in 2 is in view when decline state.Here, main shaft 31 all the time by Fig. 2 the bullet including two helical springs Property device 33 and be elastically supported towards initial position.
Meanwhile fibre optical sensor 40 includes luminescence unit, light receiving unit and optical fiber, and since fibre optical sensor 40 is It is well known, therefore its details is not discussed herein.
In the present embodiment, as shown in Fig. 2, fibre optical sensor 40 is set along relative to 32 upwardly inclined direction of ozzle It sets.In addition, the luminescence unit of fibre optical sensor 40 is pushed up along downwardly-inclined direction towards the external of ozzle 32 shown in Fig. 5 The reflecting surface 32a on surface emits light P.The light P of transmitting reflects on reflecting surface 32a, and passes through fibre optical sensor 40 Light receiving unit receives the light of reflection.
Here, the lower part of main shaft 31 is arranged in ozzle 32.Helical spring 34 is arranged as elastic component in main shaft 31 and pipe Between mouth 32.Therefore, if ozzle 32 falls while main shaft 31 declines, helical spring 34 is compressed, therefore ozzle 32 change in the up-down direction relative to the relative position of main shaft 31.In detail, ozzle 32 is carried out towards the bottom of main shaft 31 Relative motion.Here, the statement of ozzle 32 " under fall within ... on ", substantially means the bottom applied force from ozzle 32, and Including during component pick-up operation, fall within component under the lower part of ozzle 32 while ozzle 32 moves downward top surface on The case where, and during component mounting operation, be adsorbed under the component of the lower part of ozzle 32 and fall on the top surface of substrate Situation.
Meanwhile under the original state that ozzle 32 does not fall, the light P radiated from the luminescence unit of fibre optical sensor 40 passes through Lens 40a is focused on reflecting surface 32a.Therefore, it falls when with ozzle 32 so that position of the ozzle 32 relative to main shaft 31 When changing in the up-down direction, reduced by the amount of the reflecting surface 32a reflected light reflected, therefore the light of fibre optical sensor 40 connects Receiving the received light quantity of unit reduces.In the present embodiment, the reduction of received light quantity passes through the sensor list of fibre optical sensor 40 First 40b detection.
When received light quantity reduces predetermined amount, sensor unit 40b determines that ozzle 32 falls, and generates whereabouts detection letter Number.In the present embodiment, when the following condition is satisfied, determine that received light quantity reduces predetermined amount, to generate whereabouts detection Signal.
In other words, as shown in fig. 6, received light quantity is unstable and changes according to the time, and work as ozzle When 32 whereabouts, received light quantity is reduced rapidly.Therefore, in the present embodiment, sensor unit 40b constantly measures received anti- Penetrate the light quantity f (t) of light.And when received light quantity f (t) is less than or equal to first threshold, and work as received light quantity f (t) Change rate df (t)/dt absolute value be equal to or more than second threshold when, sensor unit 40b generate fall detection signal.Cause This, prevents the whereabouts detection signal that mistake is generated caused by due to unstable received light quantity.Here, first threshold and Two threshold values by designer based on the received the unstable degree of reality of light quantity and suitably determine.In the present embodiment, received Light quantity is stably kept and executing satin face processing (satin process) on the reflecting surface 32a in ozzle 32.
In addition, in the present embodiment, the direction of the light P radiated from the luminescence unit of fibre optical sensor 40 is set as dipping down Oblique 45 °.Since the direction of light P is downward, so fibre optical sensor 40 may be provided on ozzle 32.Therefore, fibre optical sensor 40 The falling operation of ozzle 32 will not be adversely affected.
According to including the surface stick-mounting machine with the component retaining head 10 of above structure, by the bottom for being mounted on main shaft 31 Ozzle 32 from component supply unit pick up component, component is transmitted to printed circuit board, then by component be mounted on printing electricity On the specific position of road plate.
When picking up and mounting assembly, as above with reference to described in Fig. 2, the top of main shaft 31a passes through pressure unit 25 It is pressed, so that main shaft 31a declines along the Z direction.Then, when the whereabouts of ozzle 32 in the end of main shaft 31a, helical spring 34 are compressed (as described above) and ozzle 32 changes in the up-down direction relative to the relative position of main shaft 31a, therefore, optical fiber The received light quantity of the light receiving unit of sensor 40 reduces.Then, the sensor unit 40b of fibre optical sensor 40 generates inspection of falling Survey signal.The detection signal that falls is transmitted to control unit 50 shown in Figure 2.Fall detection signal based on the received, and control is single Member 50 is stopped using the Z servo motor 23 for acting on the decline unit for declining pressure unit 25.Therefore, the decline row of ozzle 32 Journey is properly controlled, so that ozzle 32 accurately falls.
Fig. 7 is the example for describing to control Z servo motor 23 by using control unit 50 accoding to exemplary embodiment View.It is shown in FIG. 7, according to the operation of Z servo motor 23, according to the time, the descending stroke of ozzle 32 and lower reduction of speed Degree.The design value of descending stroke is 8mm.
As shown in fig. 7, control unit 50 controls Z servo motor 23, so that decrease speed is higher during initial decline, when Stroke is the first height and position of 3mm() when, decrease speed gradually decreases, then when stroke is the second height and position of 6.7mm() when, Decrease speed is at the uniform velocity.Then, as ozzle 32 falls, signal, control are detected according to from the received whereabouts of fibre optical sensor 40 Unit 50 stops Z servo motor 23.
Be shown in FIG. 7, when descending stroke be 8mm(that is, the design value for making ozzle 32 fall always) when, when decline go Three models when journey (that is, 9mm) is greater than design value and when descending stroke (that is, 7mm) is less than design value.In any mould In formula, descending stroke is properly controlled, therefore ozzle 32 accurately falls.
In addition, in one or more embodiments, the sensor unit 40b of fibre optical sensor 40 is set single with control Member 50 is independent, but the function of sensor unit 40b can be executed by control unit 50.In addition, according to one or more Embodiment, fibre optical sensor 40 use noncontacting proximity sensor as the detection unit of the whereabouts for detecting ozzle 32, still Another noncontacting proximity sensor (for example, magnetic sensor) can be used.
In addition, component retaining head 10 can be another type rather than rotate head dummy.
As described above, accoding to exemplary embodiment, a pressure unit 25 is used for multiple main shafts 31, by making multiple main shafts 31 carry out relative motion relative to pressure unit 25 to select the main shaft 31a that will decline, and then decline pressure unit 25, from And decline the main shaft 31a of selection.Then, the detection of fibre optical sensor 40 being integrally provided with pressure unit 25 is arranged in main shaft The whereabouts of the ozzle 32 of the bottom of 31a, therefore a fibre optical sensor (noncontacting proximity sensor) 40 is able to detect each ozzle 32 whereabouts.
As described above, accoding to exemplary embodiment, component retaining head includes multiple holding units for keeping component, but It is that each holding unit is dropped through a detection unit to detect.Therefore, the descending stroke of holding unit can be controlled suitably It makes the size without increase component retaining head and increases the cost for manufacturing component retaining head.
Although one or more embodiments are described with reference to the accompanying drawings, those skilled in the art will Understand, it in the case where not departing from the spirit and scope for the present inventive concept being defined by the claims, can be in form and thin Section aspect makes various changes to it.

Claims (8)

1. a kind of component retaining head of surface stick-mounting machine, the component retaining head include:
Multiple main shafts;
Pressure unit, for declining the main shaft selected from the multiple main shaft along the axial direction of the main shaft;
The bottom of each main shaft in the multiple main shaft is arranged in holding unit, and the holding unit is for keeping component;
Elastic component is arranged between the main shaft and the holding unit;
Noncontacting proximity sensor is integrally provided with the pressure unit, when the holding unit is according to the decline of the main shaft And when falling, as the elastic component is compressed, the holding unit changes relative to the relative position of the main shaft, described Noncontacting proximity sensor generates whereabouts detection signal and detection by changing according to cordless to the relative position,
Wherein, the main shaft that will decline is selected and making the main shaft carry out relative motion relative to the pressure unit, and And the main shaft of selection is declined and declining the pressure unit.
2. component retaining head as described in claim 1, the component retaining head further include:
Decline unit, for declining the pressure unit;
Control unit, for controlling the decline unit,
Wherein, described control unit falls based on the received detects signal and stops the decline unit.
3. component retaining head as claimed in claim 2, wherein described control unit controls the decline unit, so that in institute Holding unit to be stated to fall until reaching the second height and position from the first height and position, decrease speed gradually decreases, and When the holding unit reaches the second height and position, decrease speed is at the uniform velocity.
4. component retaining head as described in claim 1, wherein the noncontacting proximity sensor includes:
Luminescence unit, for towards the reflecting surface radiant light on the outer surface of the holding unit;
Light receiving unit, for receiving the reflected light reflected from the reflecting surface;
Sensor unit, the light quantity for measuring received reflected light and the production when the received light quantity of measurement reduces specific quantity It gives birth to and falls detection signal.
5. component retaining head as claimed in claim 4, wherein the light of the received reflected light of sensor unit test constantly Amount, obtains received light quantity according to the change rate of time, and when received light quantity is less than or equal to first threshold and described When the absolute value of change rate is equal to or more than second threshold, the sensor unit generates the detection signal that falls.
6. component retaining head as claimed in claim 4, wherein the direction of the light radiated by the luminescence unit dips down Tiltedly.
7. component retaining head as claimed in claim 4, wherein the noncontacting proximity sensor is the Fibre Optical Sensor for including optical fiber Device.
8. component retaining head as described in claim 1, the component retaining head further includes a main body and is rotatably arranged The swivel head of the head main body,
Wherein, the multiple main shaft is arranged along the circumferential directions and the pressure unit of the swivel head in the head In main body.
CN201410089054.XA 2013-10-09 2014-03-12 Component holding head of surface mounting machine Active CN104582463B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013212220A JP6178693B2 (en) 2013-10-09 2013-10-09 Component mounting head for surface mounter
JP2013-212220 2013-10-09
KR10-2013-0146415 2013-11-28
KR1020130146415A KR102104407B1 (en) 2013-10-09 2013-11-28 A component keeping head for surface mounter

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CN104582463A CN104582463A (en) 2015-04-29
CN104582463B true CN104582463B (en) 2019-05-17

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KR (1) KR102104407B1 (en)
CN (1) CN104582463B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6514871B2 (en) * 2014-09-30 2019-05-15 ハンファエアロスペース株式会社Hanwha Aerospace Co.,Ltd. Part holding head of surface mounter, positioning method of sensor in this part holding head, and sensor positioning jig
JP6429582B2 (en) * 2014-10-09 2018-11-28 ハンファエアロスペース株式会社Hanwha Aerospace Co.,Ltd. Component mounting head for surface mounter
KR102199474B1 (en) * 2015-11-18 2021-01-06 한화정밀기계 주식회사 A component keeping head for surface mounter
WO2018061151A1 (en) * 2016-09-29 2018-04-05 富士機械製造株式会社 Component mounting apparatus
CN111406449B (en) * 2018-01-10 2022-02-11 株式会社富士 Grounding detection device and electronic component mounting machine
WO2020208798A1 (en) * 2019-04-11 2020-10-15 株式会社Fuji Component mounter and component mounting method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252197A (en) * 1996-03-15 1997-09-22 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component
WO2001067492A2 (en) * 2000-03-10 2001-09-13 Infotech, Ag Method and apparatus for soldering surface mounted components onto printed circuit boards
CN102387698A (en) * 2010-09-01 2012-03-21 雅马哈发动机株式会社 Element mounting device
CN102404984A (en) * 2010-09-10 2012-04-04 雅马哈发动机株式会社 Element installing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148790A (en) * 1995-11-21 1997-06-06 Sanyo Electric Co Ltd Electronic device mounter
JP4394260B2 (en) * 2000-07-12 2010-01-06 パナソニック株式会社 Component mounting method
JP2006100594A (en) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd Component mounting method and component mounting apparatus
JP4478583B2 (en) * 2005-01-12 2010-06-09 富士機械製造株式会社 Electronic component mounting device
JP4561506B2 (en) * 2005-07-08 2010-10-13 パナソニック株式会社 Electronic component mounting equipment
JP4569419B2 (en) * 2005-08-26 2010-10-27 パナソニック株式会社 Electronic component mounting apparatus, electronic component mounting method, and nozzle height detection method
JP5154999B2 (en) * 2008-03-31 2013-02-27 株式会社日立ハイテクインスツルメンツ Electronic component mounting device
JP4503686B2 (en) * 2009-08-18 2010-07-14 パナソニック株式会社 Rotary type component mounting equipment
JP5721222B2 (en) * 2011-05-31 2015-05-20 三星テクウィン株式会社Samsung Techwin Co., Ltd Electronic component mounting equipment
JP5812456B2 (en) * 2012-02-28 2015-11-11 富士機械製造株式会社 Component mounter
JP5971992B2 (en) * 2012-03-14 2016-08-17 富士機械製造株式会社 Component mounting device
JP5974368B2 (en) * 2012-09-20 2016-08-23 ハンファテクウィン株式会社Hanwha Techwin Co.,Ltd. Component mounting head for surface mounter
WO2014147806A1 (en) * 2013-03-22 2014-09-25 富士機械製造株式会社 Component mounter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252197A (en) * 1996-03-15 1997-09-22 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component
WO2001067492A2 (en) * 2000-03-10 2001-09-13 Infotech, Ag Method and apparatus for soldering surface mounted components onto printed circuit boards
CN102387698A (en) * 2010-09-01 2012-03-21 雅马哈发动机株式会社 Element mounting device
CN102404984A (en) * 2010-09-10 2012-04-04 雅马哈发动机株式会社 Element installing device

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CN104582463A (en) 2015-04-29
KR20150041728A (en) 2015-04-17
JP6178693B2 (en) 2017-08-09
KR102104407B1 (en) 2020-04-24
JP2015076529A (en) 2015-04-20

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