CN104582463A - Surface mount components installed retaining head - Google Patents

Surface mount components installed retaining head Download PDF

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Publication number
CN104582463A
CN104582463A CN201410089054.XA CN201410089054A CN104582463A CN 104582463 A CN104582463 A CN 104582463A CN 201410089054 A CN201410089054 A CN 201410089054A CN 104582463 A CN104582463 A CN 104582463A
Authority
CN
China
Prior art keywords
unit
main shaft
head
retaining head
component retaining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410089054.XA
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Chinese (zh)
Other versions
CN104582463B (en
Inventor
谷崎昌裕
则行正贵
藤原哲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Precision Machinery Co Ltd
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of CN104582463A publication Critical patent/CN104582463A/en
Application granted granted Critical
Publication of CN104582463B publication Critical patent/CN104582463B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

According to an aspect of an exemplary embodiment, there is provided a holding surface mounter head assembly, said assembly holding head comprising: a plurality of spindles; pressure means for causing a decline in the axial direction of the main shaft of the main shaft; holding means , provided at the bottom of each of said plurality of spindle axis, said holding means for holding a component; an elastic member disposed between said shaft and said holding means; non-contact sensor, and the pressure means integrally provided, when the holding unit according to the spindle and falling drops, as the resilient member is compressed, the holding means for changing the relative position of the spindle, through the non-contact sensor in accordance with the non- contact manner to detect the relative position of the whereabouts of the detection signal is generated.

Description

The component retaining head of surface stick-mounting machine
The rights and interests of the 10-2013-0146415 korean patent application that this application claims the 2013-212220 Japanese patent application submitted in Japan Office on October 9th, 2013 and submit on November 28th, 2013 in Korean Intellectual Property Office, the disclosures of described two applications are all contained in this by reference.
Technical field
Exemplary embodiment relates to a kind of component retaining head assembly (electronic component, such as, integrated chip (IC)) being arranged on suprabasil surface stick-mounting machine, and wherein, this component retaining head comprises the holding unit for keeping assembly.
Background technology
Usually, surface stick-mounting machine is constructed to component retaining head is moved on assembly feeding unit, make the ozzle lifting being used as holding unit of component retaining head with absorption and picking up assembly, component retaining head is made to move on substrate, then on substrate, ozzle is made to decline, to be arranged on the preset coordinates position of substrate by assembly.
As mentioned above, when by making ozzle be elevated picking up assembly, if the descending stroke of ozzle is long, so along with the top surface of the bottom press component forcefully of ozzle, assembly is very likely damaged, and if the descending stroke of ozzle is too short, the top surface that so may can not drop on assembly due to ozzle make ozzle can not picking up assembly.
Identical principle was applied to when assembly is arranged on suprabasil time.In other words, if the descending stroke of ozzle is long, so along with the assembly being adsorbed onto ozzle bottom presses substrate forcefully, assembly is very likely damaged, and if descending stroke is too short, the top surface so may not dropping on substrate due to assembly make assembly can not be arranged in substrate.
No. 3543044 Japanese Registered Patent discloses a kind of detecting unit that uses to detect the method for the whereabouts of ozzle, and the method is as the method for descending stroke suitably controlling ozzle.But in JP3543044, the detecting unit fallen for detecting ozzle is arranged for each ozzle.In other words, according to JP3543044, in the component retaining head comprising multiple ozzle, corresponding to multiple detecting units that multiple nozzle set falls for detecting ozzle.In this case, installing space may be not enough and additionally increase cost.
Summary of the invention
One or more exemplary embodiment provides a kind of component retaining head comprising multiple holding units for keeping assembly, and wherein, the detecting unit that is dropped through of holding unit detects.
According to the one side of exemplary embodiment, provide a kind of component retaining head of surface stick-mounting machine, described component retaining head comprises: multiple main shaft; Pressure unit, declines along the axis of described main shaft for making main shaft; Holding unit, be arranged on the bottom of each main shaft in described multiple main shaft, described holding unit is for keeping assembly; Elastic component, is arranged between described main shaft and described holding unit; Noncontacting proximity sensor, arrange integratedly with described pressure unit, when described holding unit falls according to the decline of main shaft, along with described elastic component is compressed, described holding unit changes relative to the relative position of main shaft, and described noncontacting proximity sensor produces whereabouts detection signal by detecting described relative position change according to cordless.
Select the main shaft that will decline by making main shaft carry out relative motion relative to described pressure unit, and the main shaft selected declines by making described pressure unit decline.
Described component retaining head also can comprise: decline unit, declines for making described pressure unit; Control unit, for controlling described decline unit, wherein, described control unit makes described decline unit stop according to the whereabouts detection signal received.
Described control unit can control described decline unit, make to fall until before arriving the second height and position at described holding unit from the first height and position, decrease speed reduces gradually, and when described holding unit arrives the second height and position, decrease speed is at the uniform velocity.
Described noncontacting proximity sensor can comprise: luminescence unit, the reflecting surface radiant light on the outer surface towards described holding unit; Light receiving unit, for receiving the reverberation from reflective surface reflects; Sensor unit, for measuring the light quantity of the reverberation of reception and producing whereabouts detection signal when the light quantity of the reception of measuring reduces specified quantitative.
The sustainable light quantity measuring the reverberation received of described sensor unit, obtain the rate of change of the light quantity received according to the time, and when the absolute value that the light quantity received is less than or equal to first threshold and described rate of change is equal to or greater than Second Threshold, described sensor unit can produce whereabouts detection signal.
Can be downward-sloping by the direction of the light of described luminescence unit radiation.
Described noncontacting proximity sensor can be the Fibre Optical Sensor comprising optical fiber.
Described component retaining head also can comprise head main body and rotatably be set to the swivel head of described head main body, wherein, described multiple main shaft along the circumferential directions of described swivel head and described pressure unit be arranged on described head main body.
Accompanying drawing explanation
Be described in detail exemplary embodiment by referring to accompanying drawing, above and other aspect will become clearer, wherein:
Fig. 1 is the perspective view of the component retaining head according to exemplary embodiment;
Fig. 2 is the view for describing for the mechanism making the main shaft of the component retaining head in Fig. 1 decline along the Z direction;
Fig. 3 is the view of the structure near the pressure unit for describing the mechanism in Fig. 2;
Fig. 4 A is main shaft in Fig. 2 view when being in initial position;
Fig. 4 B is main shaft in Fig. 2 view when being in decline state;
Fig. 5 is according to exemplary embodiment, at the sectional perspective view of the ozzle of the bottom of main shaft;
Fig. 6 is according to exemplary embodiment, when ozzle falls, and the curve chart of the light quantity that Fibre Optical Sensor received according to the time;
Fig. 7 is according to exemplary embodiment, for being described through the view of the example using control unit control Z servomotor.
Embodiment
More fully exemplary embodiment is described with reference to the accompanying drawings.Specification indicates identical element with the identical label in accompanying drawing, therefore omission is repeatedly described it.
Fig. 1 is the perspective view of the component retaining head 10 according to exemplary embodiment.
As shown in Figure 1, component retaining head 10 rotates head dummy component retaining head, wherein, swivel head 30 is arranged on head main body 20, to rotate around vertical axes along R direction, multiple main shaft 31 is arranged at regular intervals along the circumferencial direction of swivel head 30, and the ozzle 32 being used as the holding unit of absorbent module is arranged on the bottom of main shaft 31.
Swivel head 30 can rotate along R direction according to the operation of the R servomotor 21 be arranged on head main body 20.In addition, each main shaft 31 can rotate along T direction according to the axle of the operation of the T servomotor 22 be arranged on head main body 20 around main shaft 31.
In addition, head main body 20 is arranged on for making at the main shaft 31a Z servomotor 23 that (that is, axial) declines along the Z direction of ad-hoc location.The mechanism rotated along R direction according to the operation of R servomotor 21 owing to making swivel head 30 and make main shaft 31 be known according to the operation of T servomotor 22 along the mechanism that T direction rotates, so its details will be omitted at this.Now, the mechanism that main shaft 31a is declined according to the operation of Z servomotor 23 will be described in detail.
Fig. 2 is the view for describing for the mechanism making the main shaft 31a of the component retaining head 10 in Fig. 1 decline along the Z direction.The motor shaft being arranged on the Z servomotor 23 on head main body 20 is connected to the screw shaft 24a of ball screw framework 24, and wherein, nut 24b is arranged on screw shaft 24a.In addition, pressure unit 25 is connected to nut 24b.Therefore, pressure unit 25 moves together with nut 24b along the Z direction according to the operation of Z servomotor 23.
Head main body 20 only arranges a pressure unit 25.When main shaft 31 will be made to decline, the main shaft 31(that selection will decline from main shaft 31 by making main shaft 31 carry out relative motion relative to pressure unit 25 will be at the main shaft 31a of ad-hoc location), and make pressure unit 25 decline main shaft 31a is declined.
In other words, according to the present embodiment, swivel head 30 rotates along R direction, to make main shaft 31 carry out relative motion relative to pressure unit 25, thus makes the main shaft 31a that will decline be set to (as shown in Figure 3) under pressure unit 25.Then, exert pressure the main shaft 31a below pressure unit 25 is declined to pressure unit 25.Here, select the main shaft 31a at ad-hoc location and the structure that this main shaft is declined be not limited to above description.Such as, except making main shaft 31 motion select the main shaft 31a that will decline, the main shaft 31a that will decline can also be selected by making pressure unit 25 motion.
As shown in Figure 2, connecting rod 26 is connected to nut 24b(nut 24b and is connected to pressure unit 25), splined nut 28 is connected to connecting rod 26, and Fibre Optical Sensor 40 is arranged on splined nut 28.In addition, splined shaft 27 is set on head main body 20 regularly, and splined nut 28 is slidably disposed on splined shaft 27.In other words, Fibre Optical Sensor 40 and pressure unit 25 are arranged integratedly.Therefore, as shown in Figure 4 A and 4 B shown in FIG., when pressure unit 25 moves along the Z direction according to the operation of Z servomotor 23, Fibre Optical Sensor 40 correspondingly moves along the Z direction.
Fig. 4 A is main shaft 31a in Fig. 2 view when being in initial position, and Fig. 4 B is view when making the main shaft 31a in Fig. 2 be in decline state by pressure unit 25.Here, main shaft 31 1 was elastically supported towards initial position straight through the comprising two helical spring elastic devices 33 of Fig. 2.
Meanwhile, Fibre Optical Sensor 40 comprises luminescence unit, light receiving unit and optical fiber, and due to Fibre Optical Sensor 40 be known, therefore its details is no longer described here.
In the present embodiment, as shown in Figure 2, Fibre Optical Sensor 40 is arranged along relative to the acclivitous direction of ozzle 32.In addition, the luminescence unit of Fibre Optical Sensor 40 is along downward-sloping direction towards the reflecting surface 32a utilizing emitted light P of the external top surface of the ozzle 32 shown in Fig. 5.The light P launched reflects on reflecting surface 32a, and receives the light of reflection by the light receiving unit of Fibre Optical Sensor 40.
Here, ozzle 32 is arranged on the bottom of main shaft 31.Helical spring 34 is arranged between main shaft 31 and ozzle 32 as elastic component.Therefore, if ozzle 32 falls while main shaft 31 declines, so helical spring 34 is compressed, and therefore ozzle 32 changes in the vertical direction relative to the relative position of main shaft 31.In detail, ozzle 32 carries out relative motion towards the bottom of main shaft 31.Here, ozzle 32 " under fall within ... on " statement, it is roughly meant to apply power from the bottom of ozzle 32, and during being included in assembly pick-up operation, while ozzle 32 moves downward ozzle 32 bottom under fall within situation on the top surface of assembly, and during component mounting operation, under being adsorbed onto the assembly of the bottom of ozzle 32, fall within the situation on the top surface of substrate.
Meanwhile, under the initial condition that ozzle 32 does not fall, focus on reflecting surface 32a from the light P scioptics 40a of the luminescence unit radiation of Fibre Optical Sensor 40.Therefore, when falling to making ozzle 32 change in the vertical direction relative to the position of main shaft 31 along with ozzle 32, the amount of the reverberation reflected by reflecting surface 32a is reduced, and the light quantity that therefore light receiving unit of Fibre Optical Sensor 40 receives reduces.In the present embodiment, the sensor unit 40b being decreased through Fibre Optical Sensor 40 of the light quantity of reception detects.
When the light quantity received reduces scheduled volume, sensor unit 40b determines that ozzle 32 falls, and produces whereabouts detection signal.In the present embodiment, when condition below meeting, determine that the light quantity received reduces scheduled volume, thus produce whereabouts detection signal.
In other words, as shown in Figure 6, the light quantity of reception is unstable and changes according to the time, and when ozzle 32 falls, the light quantity of reception reduces rapidly.Therefore, in the present embodiment, sensor unit 40b measures the light quantity f (t) of the reverberation of reception constantly.And when the light quantity f (t) received is less than or equal to first threshold, and when the absolute value of rate of change df (the t)/dt of the light quantity f (t) received is equal to or greater than Second Threshold, sensor unit 40b produces whereabouts detection signal.Therefore, the whereabouts detection signal of the generation mistake caused due to the light quantity of the reception of instability is prevented.Here, first threshold and Second Threshold are suitably determined according to the actual unstable degree of the light quantity received by designer.In the present embodiment, the light quantity of reception by performing satin face process (satin process) and stably keeping on the reflecting surface 32a of ozzle 32.
In addition, in the present embodiment, downward-sloping 45 ° are set to from the direction of the light P of the luminescence unit radiation of Fibre Optical Sensor 40.Because the direction of light P is downward, so Fibre Optical Sensor 40 can be arranged on ozzle 32.Therefore, Fibre Optical Sensor 40 can not cause adverse influence for the falling operation of ozzle 32.
According to the surface stick-mounting machine comprising the component retaining head 10 with said structure, by being arranged on the ozzle 32 of the bottom of main shaft 31 from assembly feeding unit picking up assembly, assembly is sent to printed circuit board (PCB), then assembly is arranged on the ad-hoc location of printed circuit board (PCB).
Pick up and installation component time, as above with reference to described by Fig. 2, the top of main shaft 31a is pressed by pressure unit 25, declines along the Z direction to make main shaft 31a.Then, when the ozzle 32 of the end at main shaft 31a falls, helical spring 34 is compressed (as mentioned above) and ozzle 32 changes in the vertical direction relative to the relative position of main shaft 31a, and therefore, the light quantity that the light receiving unit of Fibre Optical Sensor 40 receives reduces.Then, the sensor unit 40b of Fibre Optical Sensor 40 produces whereabouts detection signal.Whereabouts detection signal is sent to the control unit 50 shown in Fig. 2.According to the whereabouts detection signal received, the Z servomotor 23 that control unit 50 makes to be used as the decline unit that pressure unit 25 is declined stops.Therefore, the descending stroke of ozzle 32 is properly controlled, thus ozzle 32 is accurately fallen.
Fig. 7 is according to exemplary embodiment, for being described through the view of the example using control unit 50 control Z servomotor 23.Figure 7 illustrates, according to the operation of Z servomotor 23, according to the time, the descending stroke of ozzle 32 and decrease speed.The design load of descending stroke is 8mm.
As shown in Figure 7, control unit 50 control Z servomotor 23, makes decrease speed higher between initial decrement phase, when stroke is 3mm(first height and position) time, decrease speed reduces gradually, then when stroke is 6.7mm(second height and position) time, decrease speed is at the uniform velocity.Then, along with ozzle 32 falls, according to the whereabouts detection signal received from Fibre Optical Sensor 40, control unit 50 makes Z servomotor 23 stop.
Figure 7 illustrates, when descending stroke be 8mm(namely, make the design load that ozzle 32 falls always) time, Three models when descending stroke (that is, 9mm) is greater than design load and when descending stroke (that is, 7mm) is less than design load.In any pattern, descending stroke is properly controlled, and therefore ozzle 32 accurately falls.
In addition, in one or more embodiment, the sensor unit 40b of Fibre Optical Sensor 40 is set up with control unit 50 independent, but the function of sensor unit 40b performs by control unit 50.In addition, according to one or more embodiment, Fibre Optical Sensor 40 uses noncontacting proximity sensor as the detecting unit of the whereabouts for detecting ozzle 32, but can use another noncontacting proximity sensor (such as, magnetic sensor).
In addition, component retaining head 10 can be another type instead of rotate head dummy.
As mentioned above, according to exemplary embodiment, a pressure unit 25, for multiple main shaft 31, carries out relative motion to select the main shaft 31a that will decline relative to pressure unit 25 by making multiple main shaft 31, then make pressure unit 25 decline, thus the main shaft 31a of selection is declined.Then, the Fibre Optical Sensor 40 arranged integratedly with pressure unit 25 detects the whereabouts of the ozzle 32 of the bottom being arranged on main shaft 31a, and therefore Fibre Optical Sensor (noncontacting proximity sensor) 40 can detect the whereabouts of each ozzle 32.
As mentioned above, according to exemplary embodiment, component retaining head comprises the multiple holding units for keeping assembly, but the detecting unit that is dropped through of each holding unit detects.Therefore, the descending stroke of holding unit suitably can control and need not increase the size of component retaining head and the cost increased for the manufacture of component retaining head.
Although described one or more embodiment with reference to the accompanying drawings, but those of ordinary skill in the art will be appreciated that, when not departing from the spirit and scope of the present invention's design be defined by the claims, in form and details, various change can be made to it.

Claims (9)

1. a component retaining head for surface stick-mounting machine, described component retaining head comprises:
Multiple main shaft;
Pressure unit, declines along the axis of described main shaft for making main shaft;
Holding unit, be arranged on the bottom of each main shaft in described multiple main shaft, described holding unit is for keeping assembly;
Elastic component, is arranged between described main shaft and described holding unit;
Noncontacting proximity sensor, arrange integratedly with described pressure unit, when described holding unit falls according to the decline of main shaft, along with described elastic component is compressed, described holding unit changes relative to the relative position of main shaft, and described noncontacting proximity sensor produces whereabouts detection signal by detecting described relative position change according to cordless.
2. component retaining head as claimed in claim 1, wherein, selects the main shaft that will decline by making main shaft carry out relative motion relative to described pressure unit, and the main shaft selected declines by making described pressure unit decline.
3. component retaining head as claimed in claim 2, described component retaining head also comprises:
Decline unit, declines for making described pressure unit;
Control unit, for controlling described decline unit,
Wherein, described control unit makes described decline unit stop according to the whereabouts detection signal received.
4. component retaining head as claimed in claim 3, wherein, described control unit controls described decline unit, make to fall until before arriving the second height and position at described holding unit from the first height and position, decrease speed reduces gradually, and when described holding unit arrives the second height and position, decrease speed is at the uniform velocity.
5. component retaining head as claimed in claim 1, wherein, described noncontacting proximity sensor comprises:
Luminescence unit, the reflecting surface radiant light on the outer surface towards described holding unit;
Light receiving unit, for receiving the reverberation from described reflective surface reflects;
Sensor unit, for measuring the light quantity of the reverberation of reception and producing whereabouts detection signal when the light quantity of the reception of measuring reduces specified quantitative.
6. component retaining head as claimed in claim 5, wherein, the light quantity of the reverberation that described sensor unit test constantly receives, obtain the light quantity of reception according to the rate of change of time, and when the absolute value that the light quantity received is less than or equal to first threshold and described rate of change is equal to or greater than Second Threshold, described sensor unit produces whereabouts detection signal.
7. component retaining head as claimed in claim 5, wherein, downward-sloping by the direction of the light of described luminescence unit radiation.
8. component retaining head as claimed in claim 5, wherein, described noncontacting proximity sensor is the Fibre Optical Sensor comprising optical fiber.
9. component retaining head as claimed in claim 1, described component retaining head also comprises head main body and is rotatably set to the swivel head of described head main body,
Wherein, described multiple main shaft along the circumferential directions of described swivel head and described pressure unit be arranged on described head main body.
CN201410089054.XA 2013-10-09 2014-03-12 Component holding head of surface mounting machine Active CN104582463B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013212220A JP6178693B2 (en) 2013-10-09 2013-10-09 Component mounting head for surface mounter
JP2013-212220 2013-10-09
KR10-2013-0146415 2013-11-28
KR1020130146415A KR102104407B1 (en) 2013-10-09 2013-11-28 A component keeping head for surface mounter

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Publication Number Publication Date
CN104582463A true CN104582463A (en) 2015-04-29
CN104582463B CN104582463B (en) 2019-05-17

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CN201410089054.XA Active CN104582463B (en) 2013-10-09 2014-03-12 Component holding head of surface mounting machine

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JP (1) JP6178693B2 (en)
KR (1) KR102104407B1 (en)
CN (1) CN104582463B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714542A (en) * 2015-11-18 2017-05-24 韩华泰科株式会社 A part holding head for surface mounter
CN111406449A (en) * 2018-01-10 2020-07-10 株式会社富士 Grounding detection device and electronic component mounting machine

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6514871B2 (en) * 2014-09-30 2019-05-15 ハンファエアロスペース株式会社Hanwha Aerospace Co.,Ltd. Part holding head of surface mounter, positioning method of sensor in this part holding head, and sensor positioning jig
JP6429582B2 (en) * 2014-10-09 2018-11-28 ハンファエアロスペース株式会社Hanwha Aerospace Co.,Ltd. Component mounting head for surface mounter
WO2018061151A1 (en) * 2016-09-29 2018-04-05 富士機械製造株式会社 Component mounting apparatus
WO2020208798A1 (en) * 2019-04-11 2020-10-15 株式会社Fuji Component mounter and component mounting method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252197A (en) * 1996-03-15 1997-09-22 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component
WO2001067492A2 (en) * 2000-03-10 2001-09-13 Infotech, Ag Method and apparatus for soldering surface mounted components onto printed circuit boards
CN102387698A (en) * 2010-09-01 2012-03-21 雅马哈发动机株式会社 Element mounting device
CN102404984A (en) * 2010-09-10 2012-04-04 雅马哈发动机株式会社 Element installing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148790A (en) * 1995-11-21 1997-06-06 Sanyo Electric Co Ltd Electronic device mounter
JP4394260B2 (en) * 2000-07-12 2010-01-06 パナソニック株式会社 Component mounting method
JP2006100594A (en) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd Component mounting method and component mounting apparatus
JP4478583B2 (en) * 2005-01-12 2010-06-09 富士機械製造株式会社 Electronic component mounting device
JP4561506B2 (en) * 2005-07-08 2010-10-13 パナソニック株式会社 Electronic component mounting equipment
JP4569419B2 (en) * 2005-08-26 2010-10-27 パナソニック株式会社 Electronic component mounting apparatus, electronic component mounting method, and nozzle height detection method
JP5154999B2 (en) * 2008-03-31 2013-02-27 株式会社日立ハイテクインスツルメンツ Electronic component mounting device
JP4503686B2 (en) * 2009-08-18 2010-07-14 パナソニック株式会社 Rotary type component mounting equipment
JP5721222B2 (en) * 2011-05-31 2015-05-20 三星テクウィン株式会社Samsung Techwin Co., Ltd Electronic component mounting equipment
JP5812456B2 (en) * 2012-02-28 2015-11-11 富士機械製造株式会社 Component mounter
JP5971992B2 (en) * 2012-03-14 2016-08-17 富士機械製造株式会社 Component mounting device
JP5974368B2 (en) * 2012-09-20 2016-08-23 ハンファテクウィン株式会社Hanwha Techwin Co.,Ltd. Component mounting head for surface mounter
WO2014147806A1 (en) * 2013-03-22 2014-09-25 富士機械製造株式会社 Component mounter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252197A (en) * 1996-03-15 1997-09-22 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component
WO2001067492A2 (en) * 2000-03-10 2001-09-13 Infotech, Ag Method and apparatus for soldering surface mounted components onto printed circuit boards
CN102387698A (en) * 2010-09-01 2012-03-21 雅马哈发动机株式会社 Element mounting device
CN102404984A (en) * 2010-09-10 2012-04-04 雅马哈发动机株式会社 Element installing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714542A (en) * 2015-11-18 2017-05-24 韩华泰科株式会社 A part holding head for surface mounter
CN106714542B (en) * 2015-11-18 2020-06-09 韩华精密机械株式会社 Component holding head of surface mounting machine
CN111406449A (en) * 2018-01-10 2020-07-10 株式会社富士 Grounding detection device and electronic component mounting machine

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Publication number Publication date
CN104582463B (en) 2019-05-17
KR20150041728A (en) 2015-04-17
JP6178693B2 (en) 2017-08-09
KR102104407B1 (en) 2020-04-24
JP2015076529A (en) 2015-04-20

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