KR102094728B1 - 묘화 장치, 노광 묘화 장치, 묘화 방법 및 프로그램을 기억한 기록 매체 - Google Patents

묘화 장치, 노광 묘화 장치, 묘화 방법 및 프로그램을 기억한 기록 매체 Download PDF

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KR102094728B1
KR102094728B1 KR1020157003800A KR20157003800A KR102094728B1 KR 102094728 B1 KR102094728 B1 KR 102094728B1 KR 1020157003800 A KR1020157003800 A KR 1020157003800A KR 20157003800 A KR20157003800 A KR 20157003800A KR 102094728 B1 KR102094728 B1 KR 102094728B1
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KR
South Korea
Prior art keywords
substrate
exposed
amount
coordinate data
deformation
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KR1020157003800A
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English (en)
Korean (ko)
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KR20150043329A (ko
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히로아키 키쿠치
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가부시키가이샤 아도테크 엔지니어링
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Publication of KR20150043329A publication Critical patent/KR20150043329A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
KR1020157003800A 2012-08-14 2013-04-25 묘화 장치, 노광 묘화 장치, 묘화 방법 및 프로그램을 기억한 기록 매체 KR102094728B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012179935A JP6085433B2 (ja) 2012-08-14 2012-08-14 描画装置、露光描画装置、プログラム及び描画方法
JPJP-P-2012-179935 2012-08-14
PCT/JP2013/062291 WO2014027483A1 (ja) 2012-08-14 2013-04-25 描画装置、露光描画装置、描画方法、及び、プログラムを記憶した記録媒体

Publications (2)

Publication Number Publication Date
KR20150043329A KR20150043329A (ko) 2015-04-22
KR102094728B1 true KR102094728B1 (ko) 2020-03-30

Family

ID=50286371

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157003800A KR102094728B1 (ko) 2012-08-14 2013-04-25 묘화 장치, 노광 묘화 장치, 묘화 방법 및 프로그램을 기억한 기록 매체

Country Status (5)

Country Link
JP (1) JP6085433B2 (ja)
KR (1) KR102094728B1 (ja)
CN (1) CN104583873B (ja)
TW (1) TWI620999B (ja)
WO (1) WO2014027483A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10133193B2 (en) * 2016-07-19 2018-11-20 Applied Materials, Inc. Piecewise alignment modeling method
JP6326170B2 (ja) * 2017-06-14 2018-05-16 株式会社アドテックエンジニアリング 描画装置、露光描画装置、プログラム及び描画方法

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JP2005157326A (ja) * 2003-10-29 2005-06-16 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP2009290119A (ja) 2008-05-30 2009-12-10 Orc Mfg Co Ltd 描画データを補正可能な露光装置
JP2011039264A (ja) * 2009-08-11 2011-02-24 Sony Chemical & Information Device Corp 積層基板の製造方法
JP2012053296A (ja) 2010-09-01 2012-03-15 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法

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JP3087899B2 (ja) * 1989-06-16 2000-09-11 株式会社日立製作所 厚膜薄膜混成多層配線基板の製造方法
JPH1048835A (ja) * 1996-08-06 1998-02-20 Ibiden Co Ltd プリント配線板の製造装置及び製造方法
JP2002184684A (ja) * 2000-12-19 2002-06-28 Fujitsu Ltd 縮小投影露光装置の位置合わせ方法
JP2002190655A (ja) * 2000-12-21 2002-07-05 Hitachi Ltd プリント配線板の製造方法と露光方法
JP2003008238A (ja) * 2001-06-21 2003-01-10 Toppan Printing Co Ltd 多層プリント板用穴明け加工機及びそれを用いた製造方法。
KR100519252B1 (ko) * 2003-11-24 2005-10-06 삼성전자주식회사 오버레이 마크, 오버레이 마크 형성방법 및 오버레이측정방법
JP4273030B2 (ja) * 2004-03-29 2009-06-03 富士フイルム株式会社 露光装置の校正方法及び露光装置
CN1766738A (zh) * 2004-09-30 2006-05-03 富士胶片株式会社 描绘方法及装置
JP2006251160A (ja) * 2005-03-09 2006-09-21 Fuji Photo Film Co Ltd 描画方法および装置
JP2008058797A (ja) * 2006-09-01 2008-03-13 Fujifilm Corp 描画装置及び描画方法
JP2008078464A (ja) * 2006-09-22 2008-04-03 Nec Toppan Circuit Solutions Inc 印刷配線板の製造方法および穴明け装置
JP2008251797A (ja) * 2007-03-30 2008-10-16 Fujifilm Corp 基準位置計測装置及び方法、並びに描画装置
JP2009223262A (ja) * 2008-03-19 2009-10-01 Orc Mfg Co Ltd 露光システムおよび露光方法
WO2010125813A1 (ja) * 2009-04-30 2010-11-04 株式会社ニコン 露光方法及びデバイス製造方法、並びに重ね合わせ誤差計測方法
JP2011022329A (ja) * 2009-07-15 2011-02-03 Fujifilm Corp 描画装置、プログラム及び描画方法
US8271919B2 (en) * 2009-10-30 2012-09-18 Ibiden Co., Ltd. Method for correcting image rendering data, method for rendering image, method for manufacturing wiring board, and image rendering system
JP5441633B2 (ja) * 2009-11-16 2014-03-12 富士フイルム株式会社 マーク認識装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005157326A (ja) * 2003-10-29 2005-06-16 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP2009290119A (ja) 2008-05-30 2009-12-10 Orc Mfg Co Ltd 描画データを補正可能な露光装置
JP2011039264A (ja) * 2009-08-11 2011-02-24 Sony Chemical & Information Device Corp 積層基板の製造方法
JP2012053296A (ja) 2010-09-01 2012-03-15 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法

Also Published As

Publication number Publication date
TWI620999B (zh) 2018-04-11
TW201407294A (zh) 2014-02-16
CN104583873A (zh) 2015-04-29
JP6085433B2 (ja) 2017-02-22
JP2014038175A (ja) 2014-02-27
WO2014027483A1 (ja) 2014-02-20
CN104583873B (zh) 2017-05-10
KR20150043329A (ko) 2015-04-22

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