CN104583873B - 描绘装置、曝光描绘装置、描绘方法及存储有程序的记录介质 - Google Patents

描绘装置、曝光描绘装置、描绘方法及存储有程序的记录介质 Download PDF

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Publication number
CN104583873B
CN104583873B CN201380042910.XA CN201380042910A CN104583873B CN 104583873 B CN104583873 B CN 104583873B CN 201380042910 A CN201380042910 A CN 201380042910A CN 104583873 B CN104583873 B CN 104583873B
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CN
China
Prior art keywords
exposed
substrate
component
correcting value
strain
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CN201380042910.XA
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English (en)
Chinese (zh)
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CN104583873A (zh
Inventor
菊池浩明
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ADITECH ENGINEERING Co Ltd
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ADITECH ENGINEERING Co Ltd
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Publication of CN104583873A publication Critical patent/CN104583873A/zh
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201380042910.XA 2012-08-14 2013-04-25 描绘装置、曝光描绘装置、描绘方法及存储有程序的记录介质 Active CN104583873B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012179935A JP6085433B2 (ja) 2012-08-14 2012-08-14 描画装置、露光描画装置、プログラム及び描画方法
JP2012-179935 2012-08-14
PCT/JP2013/062291 WO2014027483A1 (ja) 2012-08-14 2013-04-25 描画装置、露光描画装置、描画方法、及び、プログラムを記憶した記録媒体

Publications (2)

Publication Number Publication Date
CN104583873A CN104583873A (zh) 2015-04-29
CN104583873B true CN104583873B (zh) 2017-05-10

Family

ID=50286371

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380042910.XA Active CN104583873B (zh) 2012-08-14 2013-04-25 描绘装置、曝光描绘装置、描绘方法及存储有程序的记录介质

Country Status (5)

Country Link
JP (1) JP6085433B2 (ja)
KR (1) KR102094728B1 (ja)
CN (1) CN104583873B (ja)
TW (1) TWI620999B (ja)
WO (1) WO2014027483A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102318906B1 (ko) * 2016-07-19 2021-10-27 어플라이드 머티어리얼스, 인코포레이티드 구분적 정렬 모델링 방법
JP6326170B2 (ja) * 2017-06-14 2018-05-16 株式会社アドテックエンジニアリング 描画装置、露光描画装置、プログラム及び描画方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3087899B2 (ja) * 1989-06-16 2000-09-11 株式会社日立製作所 厚膜薄膜混成多層配線基板の製造方法
JPH1048835A (ja) * 1996-08-06 1998-02-20 Ibiden Co Ltd プリント配線板の製造装置及び製造方法
JP2002184684A (ja) * 2000-12-19 2002-06-28 Fujitsu Ltd 縮小投影露光装置の位置合わせ方法
JP2002190655A (ja) * 2000-12-21 2002-07-05 Hitachi Ltd プリント配線板の製造方法と露光方法
JP2003008238A (ja) * 2001-06-21 2003-01-10 Toppan Printing Co Ltd 多層プリント板用穴明け加工機及びそれを用いた製造方法。
JP2005157326A (ja) * 2003-10-29 2005-06-16 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
KR100519252B1 (ko) * 2003-11-24 2005-10-06 삼성전자주식회사 오버레이 마크, 오버레이 마크 형성방법 및 오버레이측정방법
JP4273030B2 (ja) * 2004-03-29 2009-06-03 富士フイルム株式会社 露光装置の校正方法及び露光装置
CN1766738A (zh) * 2004-09-30 2006-05-03 富士胶片株式会社 描绘方法及装置
JP2006251160A (ja) * 2005-03-09 2006-09-21 Fuji Photo Film Co Ltd 描画方法および装置
JP2008058797A (ja) * 2006-09-01 2008-03-13 Fujifilm Corp 描画装置及び描画方法
JP2008078464A (ja) * 2006-09-22 2008-04-03 Nec Toppan Circuit Solutions Inc 印刷配線板の製造方法および穴明け装置
JP2008251797A (ja) * 2007-03-30 2008-10-16 Fujifilm Corp 基準位置計測装置及び方法、並びに描画装置
JP2009223262A (ja) * 2008-03-19 2009-10-01 Orc Mfg Co Ltd 露光システムおよび露光方法
JP5449702B2 (ja) * 2008-05-30 2014-03-19 株式会社オーク製作所 描画データを補正可能な露光装置
US20100296074A1 (en) * 2009-04-30 2010-11-25 Nikon Corporation Exposure method, and device manufacturing method
JP2011022329A (ja) * 2009-07-15 2011-02-03 Fujifilm Corp 描画装置、プログラム及び描画方法
JP2011039264A (ja) * 2009-08-11 2011-02-24 Sony Chemical & Information Device Corp 積層基板の製造方法
US8271919B2 (en) * 2009-10-30 2012-09-18 Ibiden Co., Ltd. Method for correcting image rendering data, method for rendering image, method for manufacturing wiring board, and image rendering system
JP5441633B2 (ja) * 2009-11-16 2014-03-12 富士フイルム株式会社 マーク認識装置
JP5467975B2 (ja) * 2010-09-01 2014-04-09 株式会社日立ハイテクノロジーズ 露光装置、露光方法、及び表示用パネル基板の製造方法

Also Published As

Publication number Publication date
KR20150043329A (ko) 2015-04-22
JP6085433B2 (ja) 2017-02-22
CN104583873A (zh) 2015-04-29
TWI620999B (zh) 2018-04-11
TW201407294A (zh) 2014-02-16
JP2014038175A (ja) 2014-02-27
KR102094728B1 (ko) 2020-03-30
WO2014027483A1 (ja) 2014-02-20

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