KR102094728B1 - Drawing device, exposure drawing device, drawing method, and recording medium whereon program is stored - Google Patents

Abstract

The coordinate data indicating the first position in the design of the plurality of reference marks formed on the substrate to be exposed, the coordinate data indicating the drawing pattern to be drawn on the substrate to be determined based on the first position, and the actuality of each of the plurality of reference marks Coordinate data indicating the second position of the data is obtained, and a shift correction amount for correcting the shift between the first position and the second position is derived for each of the plurality of reference marks, and each of the derived shift correction amounts is reduced to a predetermined ratio. When the drawing pattern is drawn on the substrate to be exposed on the basis of the coordinate data indicating the drawing pattern based on the coordinate data indicating the second position, coordinate data representing the drawing pattern is corrected based on the reduced misalignment correction amount.

Description

A writing medium, an exposure drawing device, a recording medium storing a drawing method and a program {DRAWING DEVICE, EXPOSURE DRAWING DEVICE, DRAWING METHOD, AND RECORDING MEDIUM WHEREON PROGRAM IS STORED}

The present invention relates to a drawing device, an exposure drawing device, a recording medium storing a drawing method and a program, and in particular, a drawing device for drawing a drawing pattern on a substrate, and an exposure drawing device for drawing a drawing pattern on a substrate by exposure, The present invention relates to a drawing method for drawing a drawing pattern on a substrate and a recording medium storing a program executed by the drawing device.

Conventionally, a multi-layer wiring board having a multi-layer wiring structure in which a prepreg dried by impregnating a glass fabric and dried or a metal plate having excellent stiffness functions is used as a core substrate, and a multilayer wiring structure in which a resin layer and a wiring layer are laminated in multiple layers on these core substrates is known. have. In addition, a thin multilayer wiring board having no core layer has been proposed in view of the recent need for thinning and space saving for this multilayer wiring board.

In these multi-layered wiring boards, the alignment of the circuit patterns (wiring patterns) interposed between the layers may be difficult because the substrates are bent by chemical treatment or the substrates are deformed due to insufficient strength. Nevertheless, since the land diameter and the hole diameter in the circuit pattern are miniaturized by the high density of the circuit pattern, high-precision interlayer alignment is required.

In order to satisfy this demand, a technique of drawing on a substrate after deforming the circuit pattern according to the deformation of the substrate caused by the bending and deformation of the substrate has been proposed. According to this technique, the precision of interlayer alignment is improved, but since the deformation accumulates each time the layers are stacked, the shape of the circuit pattern drawn on the upper layer is deviated from the shape of the circuit pattern in the design, so that the mounting of electronic components on the substrate is prevented. I am concerned that it will be difficult.

In addition, a technique for dividing an image representing a circuit pattern into a plurality of regions and rotating the image in accordance with the deformation of the substrate for each division region has been proposed. According to this technique, the amount of misalignment between the shape of the circuit pattern in the design and the shape of the circuit pattern actually drawn in each divided region is reduced. However, in this technique, there has been a problem that image processing is complicated in order to divide an image into a plurality of regions, and a mechanism that a positioning hole for connecting circuit patterns between layers is formed for each divided region.

As a technique for solving these problems, Japanese Patent Application Publication No. 2005-157326 and Japanese Patent Application Publication No. 2011-95742 can suppress deviations from the circuit patterns in the design of circuit patterns drawn without complicated image processing. A drawing device is disclosed.

That is, the drawing device of Japanese Patent Laid-Open No. 2005-157326 obtains the deformation information of the substrate in advance, and based on the deformation information, the circuit pattern recorded on the substrate after deformation is the same as the circuit pattern indicated by raster data. The raster data is converted into a shape. Then, based on the converted raster data, a circuit pattern is recorded on the substrate before deformation.

In addition, the drawing device of Japanese Patent Laid-Open No. 2011-95742 discloses displacement of the positional coordinates of the substrate by using the positional coordinates that define the target area to be imaged and the drawing data having the position of the reference point formed in the target area. Correct the position of the reference point based on the shape. Then, based on the position of the corrected reference point, each coordinate in the target area is corrected while maintaining the shape of the target area.

Here, when drawing a circuit pattern on each layer of a multilayer wiring board, a layer of a circuit pattern may be formed on the upper side and the lower side of the layer to be drawn, respectively. In this case, if the circuit pattern is deformed according to the deformation of the substrate, the pitch of the mounting pad on the upper side or the lower side deviates from the pitch of the electrode of the electronic component, and finally it becomes difficult to mount the electronic component on the substrate. There was a problem that there was a possibility. In addition, when drawing a solder resist pattern for protecting a circuit on a circuit pattern drawn on a substrate, a similar problem occurs when the solder resist pattern is deformed according to the deformation of the substrate.

However, in the technique disclosed in Japanese Patent Laid-Open No. 2005-157326, the circuit pattern is deformed based on the deformation state previously recognized, so that if the circuit pattern is already formed on the lower layer, the interlayer wiring on the lower side The precision of the positioning for connecting the deteriorates. In this case, there is a possibility that mounting of the electronic component on the substrate becomes difficult.

In addition, in the technique disclosed in Japanese Patent Application Laid-Open No. 2011-95742, as the size of each target region changes from the size of the target region before correction, there is a possibility that the pitch of the mounting pad is greatly changed from the set value. Even in this case, it becomes difficult to mount the electronic component on the substrate.

The present invention has been made in view of the above-mentioned problems, and even when the drawing pattern is modified in accordance with the deformation of the substrate, a recording device, an exposure drawing device, a drawing method, and a program capable of mounting electronic components on a substrate with high precision are stored. The purpose is to provide a medium.

In order to achieve the above object, the drawing apparatus according to the present invention is coordinate data indicating a first position that is a design position of a plurality of reference marks formed on a substrate to be exposed, and is drawn on the substrate to be exposed based on the first position. Acquisition means for acquiring coordinate data indicating a drawing pattern to be performed and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks, and the first position and the second position for each of the plurality of reference marks Derivation means for deriving the misalignment correction amount for correcting the misalignment of the, Reduction means for reducing each of the misalignment correction amounts derived from the derivation means at a predetermined ratio, and the pinot on the basis of the coordinate data indicating the second position In the case of drawing the drawing pattern on the optical substrate, the deviation reduced by the reducing means is corrected. Correction means is provided for correcting coordinate data representing the drawing pattern based on the amount.

According to the drawing apparatus according to the present invention, coordinate data indicating a first position that is a design position of a plurality of reference marks formed on a substrate to be exposed by an acquisition means, and to be drawn on the substrate to be exposed based on the first position Coordinate data indicating a drawing pattern and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks are obtained, and the first position and the second position for each of the plurality of reference marks are derived by derivation means The amount of misalignment correction for correcting the misalignment of is derived.

Here, in the drawing apparatus according to the present invention, each of the offset correction amounts derived by the derivation means by the reduction means is reduced by a predetermined ratio.

In the drawing apparatus according to the present invention, when drawing the drawing pattern on the substrate to be exposed on the basis of coordinate data indicating the second position by the correction means, based on the amount of misalignment correction reduced by the reduction means. Coordinate data representing the drawing pattern is corrected.

That is, in the case of correcting the coordinate data representing the drawing pattern to be drawn according to the deformation of the substrate to be exposed, the drawing apparatus according to the present invention reduces the displacement correction amount due to deformation of the substrate to be exposed and then draws the drawing pattern based on the deviation correction amount. Correct the coordinate data representing. The drawing apparatus according to the present invention thus reduces the degree of alignment (deformation) with respect to the displacement of the reference mark due to deformation of the substrate to be exposed.

As described above, according to the drawing device according to the present invention, since the degree of alignment with respect to the displacement of the reference mark due to deformation of the substrate to be exposed is improved to improve the shape, the substrate is deformed compared to the case where the present invention is not applied. Accordingly, even when the drawing pattern is modified, the electronic component can be mounted on the substrate with high precision. In addition, by applying the present invention to the formation of a drawing pattern on a multi-layered wiring board, each time the layers are nested, the pattern is gradually corrected to a drawing pattern whose shape is maintained, and finally, a more accurate component mounting can be realized.

Further, in the drawing apparatus according to the present invention, at least one of the reduction means multiplying the misalignment correction amount by a value less than 1, dividing the misalignment correction amount by a value exceeding 1, and subtracting a predetermined amount from the misalignment correction amount By performing one, each of the derived offset correction amounts may be reduced to a predetermined ratio. As a result, the degree of alignment is deteriorated, but pattern deformation can be reduced.

In addition, in the drawing apparatus according to the present invention, the drawing pattern is a circuit pattern indicating electronic wiring, and the ratio may be set to a ratio determined so that conductive vias enter the land in the drawing pattern. These can prevent land defects (protrusion of the conductive vias out of the land) that cause product defects.

In addition, in the drawing apparatus according to the present invention, the drawing pattern is a solder resist pattern indicating an opening hole for mounting a component of the solder resist layer, and the ratio is such that the opening hole is set inside the conductor pad for joining the component. You may be able to do this. Thereby, the shift | offset | difference of the conductor pad and opening hole which becomes a product defect can be prevented.

In addition, in the drawing apparatus according to the present invention, the deviation correcting amount may be derived from the amount of deviation obtained by subtracting at least one of the deviation caused by parallel movement of the substrate to be exposed, the displacement caused by rotation, and the displacement caused by stretching. Thereby, the amount of displacement due to deformation of the substrate to be exposed can be more accurately derived.

Further, in the drawing apparatus according to the present invention, the drawing pattern is drawn on each of the plurality of regions on the substrate to be exposed, and the reference mark is formed on each of the plurality of regions on which the drawing pattern is drawn, and the The reduction means may reduce each of the misalignment correction amounts for each of the plurality of regions. This increases the complexity as a function, but it is strong against deformation, so that electronic components can be mounted on the substrate with higher accuracy.

In addition, the drawing apparatus according to the present invention further includes receiving means for accepting input of an adjustment parameter for reducing each of the deviation correction amounts derived from the derivation means, and the reduction means receives the adjustment parameters received by the acceptance means. You may make it calculate based on the said ratio. Thereby, the convenience by a user can be improved more.

In addition, in the drawing apparatus according to the present invention, when the drawing means draws by stacking a plurality of drawing patterns on the substrate to be exposed, and when drawing a drawing pattern on the uppermost layer of the substrate to be exposed, the deviation correction amount is adjusted. It may be set to 0. Thereby, an electronic component can be mounted more reliably on a board | substrate.

On the other hand, in order to achieve the above object, the exposure drawing apparatus according to the present invention exposes the drawing pattern to the substrate to be exposed based on the drawing apparatus according to the present invention and coordinate data corrected by the correction means of the drawing apparatus. It is provided with exposure means for drawing.

Therefore, according to the exposure drawing apparatus according to the present invention, since it functions like the drawing apparatus according to the present invention, the electronic components can be mounted on the substrate with high precision even when the drawing pattern is modified according to the deformation of the substrate as in the drawing apparatus. .

In addition, in order to achieve the above object, the program according to the present invention uses a computer to coordinate data indicating a first position in the design of a plurality of reference marks formed on a substrate to be exposed, and to the substrate to be exposed based on the first position. Acquisition means for acquiring coordinate data indicating a drawing pattern to be drawn, and coordinate data indicating actual second positions of the plurality of reference marks, and the first position and the second position for each of the plurality of reference marks Derivation means for deriving the misalignment correction amount for correcting the misalignment of the unit; Reduction means for reducing each of the misalignment correction amounts derived by the derivation means at a predetermined ratio; and the coordinate data indicating the second position. When the drawing pattern is drawn on the substrate to be exposed, the shift reduced by the reduction means On the basis of the amount thereby functions as a correction means for correcting the coordinate data representing the imaged pattern.

Therefore, according to the program according to the present invention, the computer can be operated similarly to the drawing device according to the present invention. Thus, even in the case where the drawing pattern is modified according to the deformation of the substrate as in the drawing device, the electronic components can be mounted on the substrate with high precision. You can.

In addition, in order to achieve the above object, the drawing method according to the present invention is coordinate data indicating the first position in the design of a plurality of reference marks formed on the substrate to be exposed, and is drawn on the substrate to be exposed based on the first position. An acquisition step of acquiring coordinate data indicating a drawing pattern to be performed, and coordinate data indicating an actual second position of each of the plurality of reference marks, and of the first position and the second position for each of the plurality of reference marks Derivation step for deriving the amount of misalignment correction for correcting the misalignment, Reduction step for reducing each of the misalignment correction amounts derived in the derivation step at a predetermined ratio, and the exposed subject based on coordinate data indicating the second position. When drawing the drawing pattern on the substrate, based on the amount of misalignment correction reduced in the reduction step. W and a correction step for correcting the coordinate data representing the imaged pattern.

Therefore, according to the drawing method according to the present invention, since it acts like the drawing device according to the present invention, the electronic components can be mounted on the substrate with high precision even when the drawing pattern is modified in accordance with the deformation of the substrate as in the drawing device.

(Effects of the Invention)

According to the present invention, even when the drawing pattern is deformed in accordance with the deformation of the substrate, the effect that the electronic component can be mounted on the substrate with high precision is exhibited.

1 is a perspective view showing the appearance of an exposure drawing apparatus according to an embodiment.
It is a perspective view which shows the structure of the main part of the exposure drawing apparatus by embodiment.
It is a perspective view which shows the structure of the exposure head of the exposure drawing apparatus by embodiment.
4 is a plan view showing an exposed area formed on a substrate to be exposed in the exposure drawing apparatus according to the embodiment.
5 is a block diagram showing the configuration of the electric system of the exposure drawing apparatus according to the embodiment.
6A is a plan view for explaining the principle of exposure control processing in the exposure drawing apparatus according to the embodiment.
6B is a plan view for explaining the principle of exposure control processing in the exposure drawing apparatus according to the embodiment.
It is a top view which shows the area | region which is the object of coordinate conversion according to the deformation | transformation of the to-be-exposed board | substrate in the exposure drawing apparatus by 1st Embodiment and 2nd Embodiment.
It is a top view which shows the area | region which is the object of coordinate conversion according to the deformation | transformation of the to-be-exposed substrate in the exposure drawing apparatus by 1st Embodiment and 2nd Embodiment.
8 is a flow chart showing the flow of processing of the exposure control processing program according to the first embodiment.
9 is a plan view showing a position of a mark in a design and a position of a measured mark in the exposure control process according to the first embodiment.
10 is a plan view for explaining a method of coordinate conversion according to deformation of a substrate to be exposed in the exposure control process according to the first embodiment.
11A is a plan view showing an example of an image after coordinate conversion by the exposure drawing apparatus according to the first embodiment, and shows a case where coordinate conversion according to deformation of the substrate to be exposed is not performed.
Fig. 11B is a plan view showing an example of an image after coordinate conversion by the exposure drawing apparatus according to the first embodiment, and shows a case where the coordinate correction according to the deformation of the substrate to be exposed is performed by reducing the distortion correction amount.
11C is a plan view showing an example of an image after coordinate conversion by the exposure drawing apparatus according to the first embodiment, and shows a case where coordinate conversion according to deformation of a substrate to be exposed is performed without reducing a deformation correction amount.
12 is a cross-sectional view showing an example of a substrate to be exposed when a circuit pattern is drawn in multiple layers on the substrate to be exposed in the exposure drawing apparatus according to the first embodiment.
13 is a plan view showing an example of an image drawn on each layer when a circuit pattern is drawn in multiple layers on an exposed substrate in the exposure drawing apparatus according to the first embodiment.
14 is a plan view provided for explanation of the annular ring.
15 is a flow chart showing the flow of processing in the exposure control processing program according to the second embodiment.
16A is a plan view showing an example of an image after coordinate conversion by the exposure drawing apparatus according to the second embodiment, and shows a case where coordinate conversion according to deformation of the substrate to be exposed is not performed.
16B is a plan view showing an example of an image after coordinate conversion by the exposure drawing apparatus according to the second embodiment, and shows a case in which coordinate conversion according to deformation of an exposed substrate is performed by setting a limit based on an annealing. .
16C is a plan view showing an example of an image after coordinate conversion by the exposure drawing apparatus according to the second embodiment, and shows a case where coordinate conversion according to deformation of an exposed substrate is performed without setting the above limitation.
17 is a plan view for explaining a method of coordinate conversion according to deformation of a substrate to be exposed in the exposure control process according to the second embodiment.
18 is a flow chart showing the flow of processing of the exposure control processing program according to the third embodiment.
19A is a plan view showing an area to be subjected to coordinate transformation according to deformation of a substrate to be exposed in the exposure drawing apparatus according to the fourth embodiment.
19B is a plan view showing an area to be subjected to coordinate transformation according to deformation of a substrate to be exposed in the exposure drawing apparatus according to the fourth embodiment.
19C is a plan view showing an area to be subjected to coordinate transformation according to deformation of a substrate to be exposed in the exposure drawing apparatus according to the fourth embodiment.
20A is a plan view showing an area to be subjected to coordinate transformation according to deformation of a substrate to be exposed in the exposure drawing apparatus according to the fourth embodiment.
20B is a plan view showing an area to be subjected to coordinate transformation according to deformation of a substrate to be exposed in the exposure drawing apparatus according to the fourth embodiment.
20C is a plan view showing an area to be subjected to coordinate transformation according to deformation of a substrate to be exposed in the exposure drawing apparatus according to the fourth embodiment.
21 is a flow chart showing the flow of processing in the exposure control processing program according to the fourth embodiment.

[First Embodiment]

Hereinafter, the exposure drawing apparatus according to the embodiment will be described in detail with reference to the accompanying drawings. In addition, in the present embodiment, the present invention is drawn by exposing a light beam to a substrate to be exposed (the substrate to be exposed (C) to be described later) to draw a drawing pattern such as a circuit pattern, a solder resist pattern showing opening holes for mounting components in the solder resist layer A case in which it is applied to an exposure drawing apparatus to be described will be described as an example. Further, the substrate to be exposed C is a flat substrate such as a printed wiring board or a glass substrate for a flat panel display.

As shown in FIG. 1 and FIG. 2, the exposure drawing apparatus 10 by this embodiment is equipped with the stage 12 of plate shape for fixing the to-be-exposed board | substrate C. As shown in FIG. A plurality of suction holes for sucking air are formed on the upper surface of the stage 12. Thereby, when the substrate to be exposed C is mounted on the upper surface of the stage 12, air between the substrate to be exposed C and the stage 12 is sucked, so that the substrate to be exposed C is vacuum adsorbed to the stage 12 do.

In addition, hereinafter, the direction in which the stage 12 moves is determined as the Y direction, a direction orthogonal to the Y direction in the horizontal plane is determined as the X direction, and a direction orthogonal to the Y plane in the vertical plane is determined as the Z direction.

In addition, the stage 12 is supported by a flat plate-shaped base 16 movably installed on a table-shaped base 14. That is, one or a plurality (two in this embodiment) of guide rails 18 are provided on the upper surface of the base 14. The base 16 is supported so as to be freely movable in the Y direction along the guide rail 18, and is driven and moved by a drive mechanism (stage drive section 42 to be described later) composed of a motor or the like. The stage 12 moves in the Y direction along the guide rail 18 in connection with the movement of the base 16.

On the upper surface of the base 14, a gate 20 is installed to stand on two guide rails 18. The substrate C to be mounted on the stage 12 moves by opening and closing the opening of the gate 20 along the guide rail 18. An exposure unit 22 exposing the light beam toward the opening is attached to an upper portion of the opening of the gate 20. When the stage 12 is moved along the guide rail 18 by the exposure unit 22 and is positioned in the opening, the light beam is exposed on the upper surface of the substrate C to be mounted on the stage 12.

The exposure section 22 according to the present embodiment includes a plurality of exposure heads 22a (10 in this embodiment). Further, the optical fiber 26 drawn out from the light source unit 24 described later and the signal cable 30 drawn out from the image processing unit 28 described below are connected to the exposure unit 22, respectively.

Each of the exposure heads 22a has a digital micromirror device (DMD) as a reflective spatial light modulation element. The exposure head 22a modulates the light beam from the light source unit 24 by controlling the DMD based on image information input from the image processing unit 28. The exposure drawing apparatus 10 exposes the substrate to be exposed C by irradiating the modulated light beam to the substrate C to be exposed. Further, the spatial light modulation element is not limited to a reflection type, and may be a transmissive spatial light modulation element such as liquid crystal.

On the upper surface of the base 14, a gate 32 installed vertically across the two guide rails 18 is further installed. The substrate C to be mounted on the stage 12 moves by opening and closing the opening of the gate 32 along the guide rail 18.

On the upper portion of the opening portion of the gate 32, one or a plurality of photographing portions 34 for photographing the opening portions (34 in this embodiment) are attached. The photographing unit 34 is a CCD camera or the like incorporating a strobe with extremely short light emission time per time. In addition, a rail 34a is installed on the upper portion of the opening of the gate 32 in a horizontal plane along a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 12, and the photographing unit 34 is provided. Each is guided by a rail 34a and is formed to be movable. When the stage 12 is moved along the guide rail 18 by the photographing unit 34 and positioned in the opening, the top surface of the substrate C to be mounted on the stage 12 is photographed.

Next, exposure processing by the exposure head 22a according to the present embodiment will be described.

As shown in Fig. 3, the image area P1, which is the area exposed by the exposure head 22a, has a rectangular shape inclined at a predetermined inclination angle with respect to the movement direction (Y direction) of one of the shift stages 12. In addition, when the light beam is exposed by the exposure head 22a while the stage 12 is moving the opening of the gate 20, the exposure head 22a is exposed to the substrate C to be exposed along the movement of the stage 12. The exposed area P2 of the object is formed.

Further, as shown in Fig. 4, each of the exposure heads 22a arranged in a matrix shape is arranged to be shifted by a distance that is a natural number multiple (1 time in this embodiment) of the long side of the image area P1 in the X direction. have. Then, each of the exposed areas P2 is formed to partially overlap with the adjacent exposed areas P2.

Next, the configuration of the electric system of the exposure drawing apparatus 10 according to the present embodiment will be described.

As shown in FIG. 5, the system controller 40 which is electrically connected to each part of the apparatus is formed in the exposure drawing apparatus 10, and each addition of the exposure drawing apparatus 10 is performed by this system control part 40. It is comprehensively controlled. In addition, the exposure drawing apparatus 10 has a stage driver 42, an operation device 44, a photographing driver 46, and an external input / output unit 48.

The system controller 40 has a central processing unit (CPU), random access memory (RAM), read only memory (ROM), and a hard disk drive (HDD). In addition, the system control unit 40 outputs light beams from the light source unit 24 by the CPU and outputs corresponding image information by the image processing unit 28 at a timing according to the movement of the stage 12. The exposure of the light beam to the optical substrate C is controlled.

The stage drive unit 42 has a drive mechanism composed of a motor, a hydraulic pump, or the like, and drives the stage 12 under control of the system control unit 40.

The operation device 44 has a display unit for displaying various information under the control of the system control unit 40, and an input unit for inputting various information by user manipulation.

The photographing driving unit 46 has a driving mechanism composed of a motor or a hydraulic pump or the like, and drives the photographing unit 34 under the control of the system control unit 40.

The external input / output unit 48 performs input / output of various types of information between an information processing device such as a personal computer connected to the exposure drawing device 10.

Here, the exposure drawing apparatus 10 according to the present embodiment draws an image such as a drawing pattern represented by image information on the substrate C to be exposed as described above. On the other hand, as shown in Fig. 2, an alignment mark (hereinafter referred to as "reference mark") M, which is a reference for positioning when an image is drawn, is formed on the substrate C to be exposed. The exposure drawing apparatus 10 photographs the reference mark M by the photographing unit 34 before exposing the light beam to the substrate C to be exposed, and measures the position of the reference mark M from the captured image. . And the exposure drawing apparatus 10 determines the area | region which draws an image according to the measured position.

That is, as shown in Fig. 6A, the four reference marks M1 to M4 (hereinafter, referred to as reference marks M in all four) are formed on the substrate C to be exposed according to the present embodiment. . Further, an image 62 is drawn on the substrate C to be exposed at a predetermined relative position relative to the reference marks M1 to M4. 6A and 6B, the reference mark M1 at the upper left position, the reference mark M2 at the upper right position, and the reference mark M3 and the lower right position at the upper left position. Reference marks M4 are formed at positions. The exposure drawing apparatus 10 estimates the deformation of the substrate C to be exposed based on the amount of displacement from the position of the reference marks M1 to M4 in the design of each position of the measured reference marks M1 to M4. . And the exposure drawing apparatus 10 deforms the image 62 as shown in FIG. 6B as an example according to the assumed deformation of the exposed substrate C, and the deformed image 62 is the exposed substrate C To draw on.

In addition, in the exposure drawing apparatus 10 according to the present embodiment, as an example when deforming an image in accordance with the deformation of the substrate C to be exposed, as shown in Fig. 7A, the entire area to be drawn is a target of coordinate transformation. The area (area indicated by dots in FIGS. 7A and 7B) 64 may be used. However, the target area 64 is not limited to this, and may be formed in any size and shape as long as the relative positions with respect to the reference marks M1 to M4 are known in advance. For example, as shown in Fig. 7B, a rectangular area surrounded by four reference marks M1 to M4 may be used as the target area 64.

In addition, when an image other than a circuit pattern such as an identification number of the substrate C is drawn at the end of the substrate C, the coordinates are not converted to the drawing area of the image, and only the drawing area of the circuit pattern is drawn. It is good to perform coordinate conversion. This is because, for example, when an image representing the identification number of the substrate C to be exposed is exposed, etc., it is easy to confirm the contents of the drawing when the image is not deformed according to the deformation of the substrate C to be exposed.

Next, the operation of the exposure drawing apparatus 10 according to this embodiment will be described with reference to FIG. 8. 8 is a flow chart showing the flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 when an execution instruction is input through the operation device 44. The program is stored in advance in a predetermined area of the ROM installed in the system control unit 40.

First, in step S101, image information that is coordinate data (vector data in the present embodiment) representing the image to be drawn on the substrate C to be exposed (in this embodiment, an image in which the outer shape is a rectangular drawing pattern) is acquired. do. At this time, the system control unit 40 acquires image information by reading the image information stored in the HDD or by inputting the image information from the outside through the external input / output unit 48. In this embodiment, the outer shape of the image represented by the image information is rectangular, but is not limited to this, and may be any shape. Further, in the present embodiment, the image information is vector data indicating a drawing pattern or the like, but is not limited thereto, and may be raster data.

In the next step S103, position information indicating the positions (first positions) of the design reference marks M1 to M4 on the substrate C is acquired as coordinate data. At this time, the system control unit 40 acquires the location information by reading the location information stored in advance in the HDD or by inputting the location information from the outside through the external input / output unit 48.

Alternatively, the correspondence table in which the identification information of the substrate C to be exposed and the positional information indicating the position of the design reference marks M1 to M4 are stored in advance in the HDD, and the design reference marks M1 to M4 based on the correspondence table ) May be derived. More specifically, the substrate to be exposed C is identified according to the positions of the reference marks M1 to M4 obtained by recording measurement in step S107, which will be described later, and the identification information of the substrate to be exposed C obtained by identification is also described. Corresponding location information may be acquired.

In the next step S105, the stage 12 is moved until the substrate to be exposed C is positioned at a position where each of the reference marks M1 to M4 is included in the imaging area of the imaging unit 34.

In the next step S107, the positions (second positions) of the actual reference marks M1 to M4 are measured. At this time, the system control unit 40 extracts regions corresponding to the reference marks M1 to M4 from the image photographed by the imaging unit 34, and derives the position coordinates of the reference mark M. In the present embodiment, the coordinates of the center of the area of the reference mark M in the photographed image are used as the position coordinates of the reference marks M1 to M4. Further, in the present embodiment, the positional coordinates of the reference mark M are derived from the captured image, but the present invention is not limited to this, and information indicating the positional coordinates of the reference mark M obtained by measurement may be input from the outside.

As an example, as shown in FIG. 9, the measured positions of the reference marks M1 to M4 may deviate from the positions of the reference marks M1 to M4 in the design, respectively. 9, the measured positions of the reference marks M1 to M4 are indicated by solid lines, and the positions of the reference marks M1 to M4 on the design are indicated by dotted lines. In addition, hereinafter, as shown in Fig. 9, the left and right directions of the substrate to be exposed C are set in the x direction, and the up and down directions in the front view are described in the y direction.

In the next step S109, the amount of rotation and offset of the substrate C to be exposed from the amount of displacement between the position of the design reference marks M1 to M4 obtained in step S103 and the position of the reference marks M1 to M4 measured in step S107. We derive at least one of the quantity and the stretching ratio. In addition, the said rotation amount here refers to the position of the corresponding reference mark M from the position of the design reference mark M in a predetermined orthogonal coordinate system (xy coordinate system shown in FIG. 9 as an example in this embodiment as an example). The angle of rotation to reach. In addition, the said offset amount here is the amount of parallel movement from the position of the design reference mark M in the Cartesian coordinate system to the position of the corresponding real reference mark M. In addition, the expansion / contraction magnification referred to herein is an enlargement or reduction magnification from the position of the design reference mark M in the Cartesian coordinate system to the position of the corresponding actual reference mark M. In this embodiment, both the rotation amount, the offset amount, and the stretching ratio of the substrate C to be exposed are derived. At this time, the amount of offset in the x direction (ofsx), the amount of offset in the y direction (ofsy), and the x direction with respect to the substrate C to be exposed by the least square method using the respective coordinates of the four reference marks M1 to M4 The respective parameters of the stretching ratio (kx), the stretching ratio (ky) in the y direction, and the rotation amount (θ) are derived.

That is, when deriving each of the above parameters, the position of the reference marks M1 to M4 in the design and the positions of the reference marks M1 to M4 measured in the processing in step S107 are uniquely related to each parameter including the above parameters. It is said to be. In this case, each of the above parameters is determined so that the average deviation of each of the above parameters is minimal (see Japanese Patent Laid-Open No. 61-44429, etc.). Since the method for determining each of the above parameters is a known method used in affine transformation or the like, the description herein above is omitted.

In the next step S111, deformation correction amounts dx and dy for correcting the deformation of the substrate C to be exposed are derived. The amount of deformation of the substrate C to be exposed is represented by the amount of displacement of each of the four reference marks M1 to M4. Therefore, the amount of deformation correction for correcting the deformation of the substrate C is represented by (dx0, dy0) to (dx3, dy3) for each of the reference marks M1 to M4. In this embodiment, the displacement correction amount of each of the reference marks M1 to M4 is measured and the position of the reference marks M1 to M4 in the design after the correction based on the offset amount, the stretching ratio and the rotation amount derived in step S109. Let the residual (displacement amount) of the position of the reference marks M1-M4 be.

In the next step S113, adjustment parameters (Mx, My) (0 <Mx <1, 0 <My <1) when correcting each coordinate in the image information according to the amount of deformation correction of the substrate C to be exposed are The indicated information is read from the HDD. Further, Mx is an adjustment parameter in the x direction, and My is an adjustment parameter in the y direction. The degree of alignment with respect to the displacement of the reference marks M1 to M4 due to deformation of the substrate to be exposed C is determined by the adjustment parameters Mx and My in this embodiment. In the present embodiment, the adjustment parameter is defined as a rate at which the deformation correction amount is reduced (hereinafter, also referred to as "the correction rate"). That is, when adjustment parameters (Mx, My) = (0, 0), correction is not performed according to deformation of the substrate to be exposed C. When adjustment parameters are (Mx, My) = (1, 1), pinot Correction according to deformation of the optical substrate C is performed without reducing the correction amount. In addition, when the adjustment parameter is larger than 0 and smaller than 1, correction according to the deformation of the substrate C to be exposed is performed while reducing the amount of deformation correction according to the adjustment parameter.

In the present embodiment, information indicating this adjustment parameter is previously inputted by the user through the operating device 44 and stored in the HDD. In addition, in step S113, input of information indicating an adjustment parameter through the operating device 44 may be accepted. In addition, in this embodiment, 0 <Mx <1 and 0 <My <1. However, the present invention is not limited to this, and 0≤Mx≤1 and 0≤My≤1 may be used, including the case where the correction according to the deformation of the substrate C is not performed and the compensation is performed without reducing the correction amount.

In the next step S115, the deformation correction amounts dx and dy of the substrate C to be exposed are reduced based on the adjustment parameters Mx and My read in step S113. Further, in the present embodiment, the deformation correction amounts dx 'and dy' in which the deformation correction amounts dx and dy are reduced by the following equation (1) are calculated.

In the following step S117, the deformation (dx ', dy') obtained by the processing in step S115 is used to deform the coordinates (xl, yl) to be coordinated in the image information to be the substrate to be exposed (C). According to this, it is converted into the corrected coordinates (xm, ym).

At this time, in this embodiment, as shown in Fig. 10 as an example by the system control unit 40, a plurality of images represented by the image information based on coordinates to be subjected to coordinate conversion (four in this embodiment) It is divided into the areas of, and the areas SA0 to SA3 of each divided area are derived. Here, when performing the division, as shown in Fig. 10, in the image represented by the image information, the four regions are drawn by drawing a straight line parallel to each side of the image and passing through the coordinates to be converted. Divide by. In this embodiment, the area of the upper left area is SA0, the area of the upper right area is SA1, the area of the lower left area is SA2, and the area of the lower right area is SA3 for each divided area. Respectively.

In addition, the system control unit 40 substitutes the area (SA0 to SA3) of the divided regions thus obtained and the deformation correction amounts (dx ', dy') obtained by the processing in step S115 into the following equation (2). The value obtained by this is the deformation correction amount (ddx, ddy) of each coordinate (xl, yl) that is the object of coordinate transformation in the image information.

For example, as shown in FIG. 10, dx0 '= 1, dx1' = 2, dx2 '= 5, dx3' = 10, SA0 = 1, SA1 = 3, SA2 = 3, SA3 = 9, SS = 16 In this case, ddx = (10 × 9 + 5 × 3 + 2 × 3 + 1 × 1) / 16 = 7.

In addition, the method for deriving the deformation correction amounts ddx and ddy is not limited to this. That is, when the position coordinate in the coordinate data of the image to be imaged is P (x, y), the endocrine for each side of the reference rectangle is required. The position P 'according to the endocrine may be determined for the image after correction, and the amount of misalignment between the position P and the position P' may be determined as the deformation correction amount ddx, ddy.

In addition, the system control unit 40 includes a deformation correction amount (ddx, ddy) of each coordinate in the image information, an offset amount (ofsx) in the x direction, an offset amount (ofsy) in the y direction, and an expansion / contraction ratio in the x direction ( kx), the expansion and contraction ratio (ky) in the y direction and the rotation amount (θ) are substituted into the following equation (3). The value thus obtained becomes the coordinates (xm, ym) in which the respective coordinates (xl, yl) are corrected based on the deformation correction amount of the substrate C to be exposed.

In the next step S119, the stage driver 42 is controlled to move the stage 12 to a position where the top surface of the substrate C is exposed by the light beam emitted from the exposure unit 22.

In the next step S121, the light source unit 24 and the image processing unit so as to draw an image represented by the image information on the substrate C to be exposed using coordinates (xm, ym) obtained by the processing in step S117. The exposure head 22a is controlled through (28). At this time, the system controller 40 controls the stage driver 42 to move the stage 12 at a predetermined speed, thereby drawing the image on the substrate C while moving the substrate C to be exposed. To control the exposure head 22a.

In the next step S123, the stage 12 is moved to a position where the substrate C is to be separated from the stage 12, and the execution of the exposure control processing program is ended.

For example, when the adjustment parameter read in step S113 of the exposure control processing program is 0% (Mx = 0, My = 0), that is, when correction due to deformation of the substrate C is not performed, Fig. 11A As shown in the figure, a rectangular drawing pattern is drawn irrespective of the deformation of the substrate C to be exposed.

In addition, when the adjustment parameter is 50% (half), as an example, as shown in Fig. 11B, after the deformation correction amount of the reference mark M is set to 50%, the drawing pattern is deformed based on the deformation correction amount to be drawn.

In addition, when the adjustment parameter is 100% (Mx = 1, My = 1), as an example, as shown in Fig. 11C, the image is deformed using the distortion correction amount itself of the reference mark M and is drawn. In this case, since the image is deformed according to the positions of the reference marks M1 to M4, the drawing pattern is deformed in a shape according to the deformation of the substrate C to be exposed and is drawn.

Further, for example, as shown in Fig. 12, when the circuit patterns 62A to 62D of a plurality of layers (for example, four layers) are stacked sequentially from the lower side on the substrate C to be exposed, each drawing is performed. Chemical treatment such as development, etching, and peeling is performed each time the drawing in the layer is completed. In addition, lamination of the prepreg layer, processing of conductive vias, field via plating, roughening, lamination of DFR (Dry Film photoResist), etc. are performed to overlap the layers. Therefore, as shown in FIG. 13, each time a layer is nested with the circuit pattern 62A of the first layer, the circuit pattern 62B of the second layer, the circuit pattern 62C of the third layer, and the circuit pattern 62D of the fourth layer It is assumed that the deformation of the substrate C to be exposed increases.

11A to 11C, the land 66 is positioned at the position of the reference mark M of the layer to be drawn so that the positional relationship between the land 66 and the conducting via 68 is easily understood in the circuit pattern to be drawn. Is installed, and the conductive via 68 is installed at the position of the reference mark M on the other layer. In this embodiment, when drawing a circuit pattern, the correction amount of correction according to the deformation of the substrate C to be exposed for each layer is such that conductive vias 68 enter into the land 66 of the substrate C to be exposed. Reduce it. Thereby, even when the circuit pattern is deformed according to the deformation of the substrate C to be exposed, the electronic components can be mounted on the substrate with high precision.

Further, in the present embodiment, the deformation correction amount of each reference mark M1 to M4 is multiplied by a value smaller than 1 (adjustment parameters Mx, My), but the deformation correction amount is not limited to this. That is, the deformation correction amount may be reduced by dividing the deformation correction amount by a value exceeding 1, or by subtracting a predetermined amount from the deformation correction amount. Alternatively, the distortion correction amount may be reduced by combining a plurality of the multiplication, division, and subtraction.

Also, when a plurality of circuit patterns are stacked on the substrate C to be exposed and drawn, and when a circuit pattern is drawn on the top layer of the substrate C, the deformation correction amounts dx 'and dy' are ( 0, 0) may be used to calculate the formula (2) above. That is, when an electronic component having a predetermined shape (for example, a rectangular shape) is placed on the uppermost layer of the multilayer wiring board, if the amount of correction correction of the circuit pattern to be drawn on the top is large, the drawn circuit pattern is greatly deformed and the electronic There is a possibility that parts cannot be mounted. However, by not correcting the strain in the uppermost layer, deformation of the circuit pattern in the uppermost layer is avoided, and the electronic component can be reliably mounted on the substrate to be exposed C.

In the present embodiment, the case where the present invention is applied to the exposure drawing apparatus 10 for drawing a circuit pattern by exposing a light beam to the substrate C to be exposed, but is not limited thereto. That is, the present invention can be applied to any drawing apparatus that draws an image to be imaged based on the position of the reference mark formed on the object to be imaged. Moreover, you may apply this invention to the laser processing apparatus and drill processing apparatus which form the conductive via etc. which electrically connect the interlayer of each layer which draws a circuit pattern. Moreover, you may apply to the exposure apparatus and the processing apparatus for forming the component mounting hole in the solder resist layer for protecting the circuit pattern of a board | substrate. Thereby, an electronic component can be mounted more reliably on a board | substrate.

[Second Embodiment]

Hereinafter, the exposure drawing apparatus 10 according to the second embodiment of the present invention will be described.

The exposure drawing apparatus 10 according to the second embodiment has a configuration shown in FIGS. 1 to 6B, similarly to the exposure drawing apparatus 10 according to the first embodiment.

The exposure drawing apparatus 10 according to the second embodiment sets a limit to the amount of distortion correction (dx, dy) in accordance with the value of the annular ring when performing correction in accordance with the deformation of the substrate C to be exposed. As shown in Fig. 14, the annular ring is an annular region surrounding the entire circumference of the conducting via 68 when the conducting via 68 is empty inside the land 66, and the land diameter is D and the hole diameter. When d is d, the width L of the annular ring, which is the width of the annular region, is represented by L = (Dd) / 2.

Next, the operation of the exposure drawing apparatus 10 according to this embodiment will be described with reference to FIG. 15. 15 shows the flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 according to the second embodiment when an execution instruction is input through the operation device 44. It is a flow chart. The program is stored in advance in a predetermined area of the ROM of the system control unit 40. Incidentally, in the step of performing the same processing as in Fig. 8 in Fig. 15, the same step number as in Fig. 8 is assigned, and the description thereof is omitted in principle.

First, in steps S101 to S111, processing similar to steps S101 to S111 of the first embodiment is performed, respectively.

In the following step S201, the width L of the annular ring is derived. In the present embodiment, the information indicating the land diameter (D) of the land 66 and the hole diameter (d) of the conduction via 68 is acquired, and the land diameter (D) and the hole diameter (d) are (4) Substituting into the equation, the width (L) of the annular ring is obtained.

Further, the land diameter D and the hole diameter d may be input by the user through the operation device 44 based on the design values of the circuit pattern. The method for deriving the width L of the annular ring is not limited to this, and may be input through an external input / output unit 48 from an information processing device connected to the outside, for example, to a storage means such as RAM or HDD. You may remember it in advance. In addition, in consideration of the imaging error, the width L of the annular ring may be set to be smaller than it is, and a margin may be provided so that the conductive via 68 does not protrude from the land 66.

In the following step S203, the deviation amount dE of any one of the reference marks M1 to M4 due to deformation of the substrate C to be expressed by the following equation (5) is the width L of the annular ring It is determined whether it is larger.

When it is determined in step S203 that the displacement amount dE of the reference marks M1 to M4 is larger than the width L of the annular ring, the flow proceeds to step S205, and the conduction via 68 enters the land 66. The deformation correction amount (dx, dy) is limited to be the deformation correction amount (dx, dy) that maintains one shape. This is a process for maintaining shape as much as possible while avoiding the displacement of the positions of the lands 66 and conducting vias 68 between the layers when the circuit pattern is drawn in multiple layers on the substrate C to be exposed. In the present embodiment, the displacement correction amount (dx, derived by the processing in step S111) is substituted by substituting the deviation amount (dE), the width (L) of the annular ring, and the deformation correction amount (dx, dy) into the following equation (6). dy) is corrected by the amount of deformation correction (dx ', dy'). Thereby, the deformation correction amounts dx and dy are corrected to the maximum deformation correction amounts dx 'and dy' within the range in which the conductive vias 68 enter the interior of the land 66. In addition, when drawing a solder resist pattern indicating an opening hole for mounting a component of a solder resist layer as a drawing pattern, it is sufficient to limit the deformation correction amount (dx, dy) so that the opening hole enters the inside of the conductor pad for joining the component. .

On the other hand, when it is determined in step S203 that the displacement amount dE of the reference marks M1 to M4 is equal to or less than the width L of the annular ring, the flow advances to step S207, and the deformation correction amount used for correction (dx, dy) It is assumed that no limit is set. That is, the deformation correction amounts dx and dy derived in step S111 are replaced with the deformation correction amounts dx 'and dy' using the following equation (7).

In the following steps S117 to S123, processing similar to steps S117 to S123 of the first embodiment is performed, respectively, and the execution of this exposure control processing program ends.

For example, when correction is not performed due to deformation of the substrate C, a rectangular image is drawn regardless of the deformation of the substrate C, as shown in Fig. 16A. In this case, even if the substrate to be exposed C is deformed, the image to be drawn is not deformed, so it is not always possible that the conductive via 68 can be placed inside the land 66. Also in FIG. 16A to FIG. 16C, as in FIGS. 11A to 11C, the reference mark (M) of the layer to be drawn is easy to understand the positional relationship between the land 66 and the conductive via 68 in the circuit pattern to be drawn. ), The land 66 is installed, and the conductive via 68 is installed at the position of the reference mark M of the other layer.

In addition, when the width L of the annular ring derived in step S207 is a predetermined value (for example, 20 µm), and the amount of displacement is larger than the width L of the annular ring, as an example, shown in Fig. 16B. As described above, after the deformation correction amount of the reference mark M is reduced, an image is deformed and drawn based on the deformation correction amount. At this time, as shown in Fig. 17, after the correction amount for the deformation correction amount dx, dy is limited so that the conductive via 68 enters inside the land 66, the image is deformed according to the deformation of the substrate C to be exposed. do. Thereby, the conductive via 68 can be placed inside the land 66, and the electronic component can be reliably mounted on the substrate to be exposed C.

In addition, when the width L of the annular ring is a predetermined value (for example, 20 µm), and the deviation amount is equal to or less than the width L of the annular ring, as an example, a reference mark ( The image is deformed and drawn using the distortion correction amount itself of M). In this case, since the image to be drawn is deformed in accordance with the deformation of the substrate C to be exposed, the conductive via 68 can be reliably placed inside the land 66. This deformation does not necessarily mean that the electronic component can be mounted on the substrate to be exposed (C).

[Third Embodiment]

Hereinafter, the exposure drawing apparatus 10 according to the third embodiment of the present invention will be described.

The exposure drawing apparatus 10 according to the third embodiment has a configuration shown in FIGS. 1 to 6B, similarly to the exposure drawing apparatus 10 according to the first and second embodiments.

The exposure drawing apparatus 10 according to the third embodiment reduces the amount of distortion correction (dx, dy) in accordance with the adjustment parameters (Mx, My) when performing correction in accordance with the deformation of the substrate C to be exposed, and is also annular A limit is set to the deformation correction amounts dx and dy according to the width L of the ring.

Next, the operation of the exposure drawing apparatus 10 according to this embodiment will be described with reference to FIG. 18. 18 is a flow chart showing the flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 when an execution instruction is input through the operation device 44. The program is stored in advance in a predetermined area of the ROM of the system control unit 40.

In addition, the step which performs the same process as FIG. 8 or 15 in FIG. 18 is given the same step number as FIG. 8 or FIG. 15, and the description is omitted in principle.

First, in steps S101 to S113, the same processing as steps S101 to S113 of the first embodiment is performed, respectively. In the following steps S201 and S203, the same processing as steps S201 and S203 of the second embodiment is performed.

When it is determined in step S203 that the displacement amount dE of the reference marks M1 to M4 is larger than the width L of the annular ring, the flow proceeds to step S301, and the conduction via 68 enters the land 66. The deformation correction amount (dx, dy) is limited to be the deformation correction amount (dx, dy) that maintains one shape. In this embodiment, by substituting the deformation correction amount (dx, dy), the displacement amount (dE), the width (L) of the annular ring, and the adjustment parameters (Mx, My) read in step S113 into the following equation (8): The deformation correction amounts dx and dy derived in step S111 are corrected to the deformation correction amounts dx 'and dy'. As a result, the deformation correction amounts dx and dy enter the inside of the lands 66 of the conducting vias 68, and are further corrected by the deformation correction amounts dx 'and dy' whose shape is adjusted.

On the other hand, when it is determined in step S203 that the displacement amount dE of the reference marks M1 to M4 is equal to or less than the width L of the annular ring, the flow advances to step S303, and the deformation correction amount used for correction (dx, dy) It is assumed that no limit is set. That is, the distortion correction amounts dx and dy derived in step S111 are corrected to the deformation correction amounts dx 'and dy' by substituting the adjustment parameters Mx and My read in step S113 into the following equation (9).

In the following steps S117 to S123, processing similar to steps S117 to S123 of the first embodiment is performed, respectively, and the execution of this exposure control processing program ends.

[Fourth Embodiment]

Hereinafter, the exposure drawing apparatus 10 according to the fourth embodiment of the present invention will be described.

The exposure drawing apparatus 10 according to the fourth embodiment has a configuration shown in Figs. 1 to 6B, similarly to the exposure drawing apparatus 10 according to the first to third embodiments.

The exposure drawing apparatus 10 according to the first to third embodiments is coordinates according to the deformation of the substrate C to be exposed based on the four reference marks M1 to M4 in one target area 64. Convert it. On the other hand, the exposure drawing apparatus 10 according to the fourth embodiment performs coordinate conversion according to the deformation of the substrate C to be exposed on the basis of the separate reference marks M for the plurality of target regions 64, respectively.

For example, as shown in Fig. 19A, the plurality of target regions 64 may be each region divided by a plurality of (for example, four) regions represented by image information. Further, when dividing the image, four reference marks M arranged in two rows and two columns among the reference marks M formed to be arranged in a lattice form are divided so as to be included in each divided region.

Alternatively, as shown in Fig. 19B, after the outer circumference of the image is the non-target region, the region excluding the non-target region from the image is divided into a plurality (for example, four) regions as the target region 64. You may do it. Further, when dividing the image, the areas surrounded by four reference marks M arranged in two rows and two columns among the reference marks M formed to be arranged in a matrix shape are divided into respective divided areas.

Alternatively, as shown in Fig. 19C, a plurality of (for example, four) regions of a part of the image may be extracted, and each of the extracted regions may be the target region 64. In addition, each of the portions of the partial regions such that corner portions of each target region 64 are respectively located in the vicinity of each of the four reference marks M arranged in two rows and two columns among the reference marks M formed to be arranged in a matrix shape. It is good to be extracted.

Alternatively, as shown in Fig. 20A, the plurality of target regions 64 may be each region divided by a plurality of (for example, four) regions represented by image information. In addition, each of the plurality of target areas 64 is divided to include four reference marks M arranged in two rows and two columns.

Alternatively, as shown in Fig. 20B, after the outer circumference of the image is the non-target region, the region excluding the non-target region from the image is divided into a plurality (for example, four) regions of the target region 64. May be In addition, each of the plurality of target areas 64 is divided to include four reference marks M arranged in two rows and two columns.

Alternatively, as shown in Fig. 20C, a plurality of (for example, four) regions of a part of the image may be extracted, and each extracted region may be the target region 64. In addition, four reference marks M arranged in two rows and two columns are formed in the inner periphery of each target region 64 or around the outer periphery of each target region 64 according to the shape or size of each target region 64. .

Next, the operation of the exposure drawing apparatus 10 according to this embodiment will be described with reference to FIG. 21. 21 is a flow chart showing the flow of processing of the exposure control process program executed by the system control unit 40 of the exposure drawing apparatus 10 when an execution instruction is input through the operation device 44. The program is stored in advance in a predetermined area of the ROM of the system control unit 40.

In addition, the step which performs the process similar to FIG. 8 in FIG. 21 is given the same step number as FIG. 8, and the description is omitted in principle.

First, in steps S101 to S107, the same processing as steps S101 to S107 of the first embodiment is performed, respectively.

In the following step S401, for the reference mark M corresponding to one target area 64 among the plurality of target areas 64, the rotation amount and the offset amount of the substrate C to be exposed are the same as in step S109. Derive the stretch magnification.

In the following steps S111 to S117, processing similar to steps S111 to S117 of the first embodiment is performed, respectively.

In the next step S403, it is determined whether coordinate conversion in step S117 has been performed for the reference mark M corresponding to all the target areas 64 of the plurality of target areas 64. If it was negative determination in step S117, the process returns to step S401.

On the other hand, when it is affirmative determination in step S403, it transfers to step S119. In steps S119 to S123, the same processing as steps S119 to S123 of the first embodiment is performed, respectively, and the execution of the exposure control processing program is ended.

In addition, when the circuit pattern to be drawn in each of the plurality of areas on the substrate C is deformed, the drawing area of the circuit pattern is shifted in parallel or rotation to prevent overlapping circuit patterns drawn between adjacent areas. You may adjust by.

In addition, in the fourth embodiment, a circuit pattern is drawn on each of the plurality of areas on the substrate C to be exposed, and a configuration for reducing the amount of distortion correction for each of the plurality of areas is applied to the first embodiment. Although it is a form, embodiment which applies the said structure is not limited to this. That is, the configuration of the fourth embodiment may be applied to the second embodiment or the third embodiment.

As for the indication of the Japan patent application 2012-1779935, the whole is taken in into this specification by reference.

All documents, patent applications and technical specifications described in this specification are incorporated by reference in the present specification to the same extent that individual documents, patent applications and technical specifications are incorporated by reference, and to the same extent as if recorded individually.

Claims (11)

Coordinate data indicating a first position, which is a design position of a plurality of reference marks formed on four corners of a target area of the target substrate, and coordinate data indicating a drawing pattern to be drawn on the target substrate which is defined based on the first position And acquisition means for acquiring coordinate data indicating a second position which is an actual position of each of the plurality of reference marks,
A shift correction amount for correcting the drawing pattern according to the deformation of the substrate to be exposed by using the offset amount, the stretching ratio, and the rotation amount based on the shift of the first position and the second position for each of the plurality of reference marks Derivation means for deriving,
Reduction means for reducing each of the offset correction amounts derived by the derivation means at a predetermined ratio,
Correction means for correcting coordinate data indicating the drawing pattern based on the amount of misalignment correction reduced by the reduction means when drawing the drawing pattern on the substrate to be exposed based on the coordinate data indicating the second position. A drawing device characterized in that it is provided. According to claim 1,
The reduction means is derived by performing at least one of multiplying the misalignment correction amount by a value less than 1, dividing the misalignment correction amount by a value exceeding 1, and subtracting a predetermined amount from the misalignment correction amount. A drawing device characterized in that each of the correction amounts is reduced to a predetermined ratio. The method of claim 1 or 2,
The drawing pattern is a circuit pattern representing electronic wiring,
The ratio is the ratio of the drawing pattern, characterized in that the ratio is set so that conductive vias enter the interior of the land. The method of claim 1 or 2,
The drawing pattern is a solder resist pattern showing opening holes for mounting parts of the solder resist layer,
The ratio is a drawing device characterized in that the opening hole is set to enter the inside of the conductor pad for joining the part. The method of claim 1 or 2,
And the derivation means derives the offset correction amount from the amount of offset obtained by subtracting at least one of a shift due to parallel movement of the substrate to be exposed, a shift caused by rotation, and a shift caused by stretching. The method of claim 1 or 2,
The drawing pattern is drawn on each of a plurality of regions in the substrate to be exposed,
The reference mark is formed for each of the plurality of areas where the drawing pattern is drawn,
The reducing device reduces the amount of the shift correction amount for each of the plurality of regions. The method of claim 1 or 2,
And receiving means for accepting an input of an adjustment parameter for reducing each of the deviation correction amounts derived by the derivation means,
The reduction means calculates the ratio based on the adjustment parameter received by the reception means. The method of claim 1 or 2,
The drawing means is characterized in that the deviation correction amount is set to 0 when drawing by stacking a plurality of drawing patterns on the substrate to be exposed, and when drawing a drawing pattern on the uppermost layer of the substrate to be exposed. . The drawing device according to claim 1 or 2,
And exposure means for exposing and drawing the drawing pattern on the substrate to be exposed on the basis of coordinate data corrected by the correction means of the drawing device. (a) Coordinate data indicating the first position in the design of a plurality of reference marks formed on four corners of the target area of the target substrate, coordinates indicating a drawing pattern to be drawn on the target substrate which is defined based on the first position Data and coordinate data indicating actual second positions of the plurality of reference marks,
(b) correcting the drawing pattern according to the deformation of the substrate to be exposed by using the offset amount, the stretching ratio, and the rotation amount based on the displacement of the first position and the second position for each of the plurality of reference marks Derive the amount of deviation correction for
(c) each of the offset correction amounts derived in (b) is reduced to a predetermined ratio,
(d) When drawing the drawing pattern on the substrate to be exposed on the basis of the coordinate data indicating the second position, correcting the coordinate data representing the drawing pattern based on the amount of misalignment correction reduced in (c). Drawing method comprising the one. A computer-readable recording medium storing a program for executing a drawing process on a computer,
The drawing process,
(a) Coordinate data indicating the first position in the design of a plurality of reference marks formed on four corners of the target area of the target substrate, coordinates indicating a drawing pattern to be drawn on the target substrate which is defined based on the first position Data and coordinate data indicating actual second positions of the plurality of reference marks,
(b) correcting the drawing pattern according to the deformation of the substrate to be exposed by using the offset amount, the stretching ratio, and the rotation amount based on the displacement of the first position and the second position for each of the plurality of reference marks Derive the amount of deviation correction for
(c) each of the offset correction amounts derived in (b) is reduced to a predetermined ratio,
(d) When drawing the drawing pattern on the substrate to be exposed on the basis of the coordinate data indicating the second position, correcting the coordinate data representing the drawing pattern based on the amount of misalignment correction reduced in (c). And a computer readable recording medium.

Images