KR20150043329A - Drawing device, exposure drawing device, drawing method, and recording medium whereon program is stored - Google Patents

Abstract

Coordinate data indicating a first position on the design of a plurality of reference marks formed on the substrate to be exposed, coordinate data indicating a drawing pattern to be drawn on the substrate to be formed determined based on the first position, And derives a discrepancy correction amount for correcting the discrepancy between the first position and the second position for each of the plurality of reference marks, and reduces each of the derived discrepancy correction amounts at a predetermined ratio And coordinate data indicating the drawing pattern is corrected on the basis of the reduced displacement correction amount when the drawing pattern is drawn on the substrate to be exposed based on the coordinate data indicating the drawing pattern based on the coordinate data indicating the second position.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a drawing apparatus, an exposure apparatus, an image drawing method, and a recording medium storing a program (DRAWING DEVICE, EXPOSURE DRAWING DEVICE, DRAWING METHOD, AND RECORDING MEDIUM WHEREON PROGRAM IS STORED)

The present invention relates to a drawing apparatus, an exposure apparatus, a drawing method, and a recording medium storing a program, and more particularly to a drawing apparatus for drawing a drawing pattern on a substrate, an exposure apparatus for drawing a drawing pattern on a substrate by exposure, A drawing method of drawing a drawing pattern on a substrate, and a recording medium storing a program to be executed by the drawing apparatus.

A multilayer wiring board having a multilayer wiring structure in which a glass substrate is impregnated with a glass cloth and dried, and a metal plate or the like having excellent rigidity is used as a core substrate and a resin layer and a wiring layer are stacked on the core substrate in multilayers is known have. In recent years, a thin multilayer wiring board having no core layer has been proposed in view of the demand for thinning of this multilayer wiring board and space saving.

In these multilayer wiring boards, the substrate may be warped by chemical treatment or the substrate may be deformed due to insufficient strength, which may make it difficult to align the circuit patterns (wiring patterns) to be formed on the respective layers with each other. Nevertheless, due to the increase in the density of the circuit pattern, the land diameter and the hole diameter in the circuit pattern are reduced, so that highly precise interlayer alignment is required.

In order to satisfy this requirement, a technique has been proposed in which a circuit pattern is deformed in accordance with the deformation of the substrate caused by warping and deformation of the substrate, and then drawn on the substrate. According to this technique, the accuracy of the interlayer alignment is improved. However, since the deformation is accumulated every time the layer is piled up, the shape of the circuit pattern drawn on the upper layer is different from the shape of the circuit pattern on the design, It becomes worrisome.

There is also proposed a technique of dividing an image representing a circuit pattern into a plurality of regions and rotating the image in accordance with deformation of the substrate for each of the divided regions. According to this technique, the deviation of the shape of the circuit pattern in design and the shape of the circuit pattern actually drawn in each divided area is reduced. However, this technique has a problem that image processing becomes complicated in order to divide an image into a plurality of regions, and a mechanism for forming a positioning hole for connecting a circuit pattern from one layer to another is required.

As a technique for solving these problems, Japanese Unexamined Patent Application Publication Nos. 2005-157326 and 2011-95742 disclose a technique capable of suppressing deviation of a circuit pattern drawn from a circuit pattern to be imaged without complicating image processing A drawing apparatus is disclosed.

That is, in the drawing apparatus of Japanese Patent Application Laid-Open No. 2005-157326, the deformation information of the substrate is acquired in advance and the circuit pattern recorded on the post-deformation board based on the deformation information is the same as the circuit pattern represented by the raster data The raster data is transformed so as to have a shape. Then, based on the converted raster data, a circuit pattern is recorded on the substrate before the deformation.

Further, the drawing apparatus disclosed in Japanese Patent Application Laid-Open No. 11-95742 discloses displacement of the position coordinates of the substrate by using the drawing data having the position coordinates defining the object area to be drawn and the position of the reference point formed in the object area The position of the reference point is corrected based on the shape. Then, each coordinate in the target area is corrected while maintaining the shape of the target area based on the position of the corrected reference point.

Here, when a circuit pattern is drawn on each layer of the multilayer wiring substrate, a layer of a circuit pattern may be formed on the upper side and the lower side of the layer to be rendered. In this case, when the circuit pattern is deformed in accordance with the deformation of the substrate, the pitch of the mounting pads is shifted from the pitch of the electrodes of the electronic component on the upper side or the lower side and finally the mounting of the electronic component on the substrate becomes difficult There was a problem that there was a possibility. Further, when drawing a solder resist pattern for protecting the circuit on the circuit pattern drawn on the substrate, the same problem arises if the solder resist pattern is deformed in accordance with the deformation of the substrate.

However, in the technique disclosed in Japanese Patent Application Laid-Open No. 2005-157326, since the circuit pattern is deformed based on the previously detected deformation state, when the circuit pattern is already formed on the lower layer, The precision of the alignment for connecting the electrodes is deteriorated. In this case, there is a possibility that the mounting of the electronic component on the substrate becomes difficult.

Further, in the technique disclosed in Japanese Patent Application Laid-Open No. 11-95742, there is a possibility that the pitch of the mounting pads largely changes from the set value as the size of each target area changes from the size of the object area before correction. Even in this case, it is difficult to mount the electronic component on the substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a drawing apparatus, an exposure apparatus, a drawing method, and a program storing a program capable of mounting an electronic component on a substrate with high precision even when the drawing pattern is deformed according to the deformation of the substrate And a medium.

In order to achieve the above object, an image drawing apparatus according to the present invention includes coordinate data indicating a first position which is a design position of a plurality of reference marks formed on a substrate to be exposed, For each of the plurality of reference marks, coordinate data indicating a rendering pattern of the plurality of reference marks, and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks; A reduction means for reducing each of the shift correction amounts derived from the derivation means to a predetermined ratio; and a subtraction means for subtracting, from the coordinate data indicating the second position, When the imaging pattern is drawn on the optical substrate, the displacement correction And correction means for correcting the coordinate data indicating the drawing pattern on the basis of the amount of movement.

According to the drawing apparatus of the present invention, coordinate data representing a first position, which is a design position of a plurality of reference marks formed on a substrate to be exposed by the obtaining means, is plotted on the substrate to be determined based on the first position Coordinate data indicating a rendering pattern and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks are acquired and the derivation means acquires coordinate data indicating the first position and the second position A deviation correction amount for correcting the deviation of the optical disc 1 is derived.

Here, in the drawing apparatus according to the present invention, each of the deviation correction amounts derived by the deriving means is reduced by a reduction means at a predetermined ratio.

Further, in the imaging apparatus according to the present invention, when the imaging pattern is drawn on the substrate to be imaged based on the coordinate data indicating the second position by the correction means, based on the amount of misalignment correction reduced by the abatement means The coordinate data indicating the drawing pattern is corrected.

That is, in the case where the coordinate data indicating the imaging pattern to be imaged is corrected in accordance with the deformation of the substrate to be imaged, the imaging apparatus according to the present invention reduces the shift correction amount due to the deformation of the substrate to be imaged, Is corrected. The imaging apparatus according to the present invention reduces the degree of alignment (deformation) of the reference mark due to deformation of the substrate to be imaged.

As described above, according to the drawing apparatus of the present invention, since the degree of alignment with respect to the deviation of the reference mark due to the deformation of the substrate to be exposed is reduced to improve the formability, The electronic parts can be mounted on the substrate with high accuracy even when the drawing pattern is modified in accordance with the pattern. Further, by applying the present invention to the formation of the patterning pattern on the multilayer wiring board, the pattern is gradually corrected every time the layer is filled, thereby realizing component mounting with higher precision.

The drawing apparatus according to the present invention is characterized in that the reduction means multiplies the discrepancy correction amount by a value less than 1, divides the discrepancy correction amount by a value exceeding 1, and subtracts a predetermined amount from the discrepancy correction amount It is also possible to reduce each of the derived deviation correction amounts by a predetermined ratio. As a result, the degree of alignment is deteriorated, but pattern deformation can be reduced.

In the drawing apparatus according to the present invention, the drawing pattern may be a circuit pattern representing an electronic wiring, and the ratio may be a predetermined ratio such that the conductive via is inserted into the land in the drawing pattern. As a result, it is possible to prevent a land defect (protruding of the conductive via from outside the land) which causes a product defect.

The drawing apparatus according to the present invention is characterized in that the drawing pattern is a solder resist pattern showing an opening hole for mounting a component of a solder resist layer and the ratio is set so that the ratio is set so that the opening hole enters the inside of the conductive pad . As a result, it is possible to prevent the conductor pads from being defective from being displaced from the opening holes.

In the drawing apparatus according to the present invention, the deriving means may derive the discrepancy correction amount from a shift amount obtained by subtracting at least one of shift caused by parallel movement, rotation caused by rotation, and shift caused by expansion and contraction of the substrate. This makes it possible to more precisely derive the shift amount due to the deformation of the substrate to be exposed.

Further, the drawing apparatus according to the present invention is characterized in that the drawing pattern is drawn in each of a plurality of regions in the substrate, the reference mark is formed in each of the plurality of regions in which the drawing pattern is drawn, And the abatement means may reduce each of the discrepancy correction amounts for each of the plurality of regions. As a result, although the complexity as a function increases, the electronic part becomes strong against deformation and can be mounted on the substrate with higher precision.

Further, the drawing apparatus according to the present invention further includes a reception means for receiving an input of an adjustment parameter for reducing each of the deviation correction amounts derived from the deriving means, wherein the reduction means receives the adjustment parameters received by the reception means The above ratio may be calculated on the basis. As a result, the convenience of the user can be further improved.

Further, in the drawing apparatus according to the present invention, when the drawing means draws a plurality of drawing patterns on the substrate and draws the drawing pattern on the uppermost layer of the substrate, 0 ". As a result, the electronic component can be mounted on the substrate more reliably.

In order to achieve the above object, according to the present invention, there is provided an exposure apparatus, comprising: an imaging apparatus according to the present invention; and a control unit configured to expose the imaging pattern on the substrate based on coordinate data corrected by the correction means of the imaging apparatus And an exposure means for imaging the image.

Therefore, according to the exposure apparatus according to the present invention, since the electronic apparatus operates similarly to the drawing apparatus according to the present invention, the electronic components can be mounted on the substrate with high precision even when the drawing pattern is deformed according to the deformation of the substrate .

According to another aspect of the present invention, there is provided a computer program for causing a computer to function as: An acquisition unit configured to acquire coordinate data indicating a rendering pattern to be rendered and coordinate data indicating an actual second position of each of the plurality of reference marks; A reduction means for reducing each of the discrepancy correction amounts derived by the derivation means to a predetermined ratio; and a subtraction means for subtracting, from the coordinate data indicating the second position, When the drawing pattern is drawn on the substrate to be exposed, On the basis of the amount thereby functions as a correction means for correcting the coordinate data representing the imaged pattern.

Therefore, according to the program of the present invention, a computer can be operated in the same manner as the drawing apparatus according to the present invention, so that even when the drawing pattern is deformed in accordance with the deformation of the substrate as in the drawing apparatus, the electronic parts are mounted on the substrate with high accuracy .

In order to achieve the above object, a drawing method according to the present invention is a drawing method comprising: coordinate data indicating a first position in design of a plurality of reference marks formed on a substrate to be projected; The coordinate data indicating the imaging pattern of the plurality of reference marks and the coordinate data indicating the actual second position of each of the plurality of reference marks; A deriving step of deriving a discrepancy correction amount for correcting the discrepancy; a reducing step of reducing each of the discrepancy correction amounts derived in the deriving step to a predetermined ratio; When drawing the above described imaging pattern on a substrate, based on the amount of misalignment correction reduced in the abatement step W and a correction step for correcting the coordinate data representing the imaged pattern.

Therefore, according to the drawing method of the present invention, since the drawing apparatus according to the present invention operates similarly to the drawing apparatus according to the present invention, the electronic components can be mounted on the substrate with high precision even when the drawing pattern is deformed according to the deformation of the substrate.

(Effects of the Invention)

According to the present invention, even when the drawing pattern is deformed according to the deformation of the substrate, the electronic part can be mounted on the substrate with high accuracy.

1 is a perspective view showing an appearance of an exposure apparatus according to an embodiment.
2 is a perspective view showing a configuration of a main part of an exposure apparatus according to the embodiment.
3 is a perspective view showing a configuration of an exposure head of the exposure apparatus according to the embodiment.
4 is a plan view showing an exposed area formed on a substrate to be exposed in the exposure apparatus according to the embodiment.
Fig. 5 is a block diagram showing the configuration of an electric machine of the exposure apparatus according to the embodiment. Fig.
6A is a plan view provided for explaining the principle of the exposure control processing in the exposure apparatus according to the embodiment.
Fig. 6B is a plan view provided for explaining the principle of exposure control processing in the exposure apparatus according to the embodiment; Fig.
7A is a plan view showing an area to be subjected to coordinate conversion according to deformation of the substrate to be exposed in the exposure apparatus according to the first embodiment and the second embodiment.
Fig. 7B is a plan view showing an area to be subjected to coordinate transformation according to deformation of the substrate to be exposed in the exposure apparatus according to the first embodiment and the second embodiment; Fig.
8 is a flowchart showing the flow of processing of the exposure control processing program according to the first embodiment.
Fig. 9 is a plan view showing positions of marks on the design and positions of marks measured in the exposure control process according to the first embodiment. Fig.
10 is a plan view provided for explaining a method of coordinate conversion according to deformation of the substrate to be exposed in the exposure control processing according to the first embodiment.
FIG. 11A is a plan view showing an example of an image after coordinate conversion by the exposure apparatus according to the first embodiment, and shows a case where coordinate conversion is not performed according to deformation of the substrate to be exposed.
Fig. 11B is a plan view showing an example of an image after coordinate conversion by the exposure apparatus according to the first embodiment, and shows a case where the coordinate transformation according to the deformation of the substrate to be subjected to the deformation correction is reduced.
Fig. 11C is a plan view showing an example of an image after coordinate conversion by the exposure apparatus according to the first embodiment, and shows a case where coordinate conversion according to deformation of the substrate to be imaged is performed without reducing deformation correction amount.
12 is a cross-sectional view showing an example of a substrate to be exposed when a circuit pattern is drawn in multiple layers on a substrate to be exposed in the exposure apparatus according to the first embodiment.
13 is a plan view showing an example of an image to be drawn in each layer when a circuit pattern is drawn in multiple layers on a substrate to be exposed in the exposure apparatus according to the first embodiment.
14 is a plan view providing an explanation of an annular ring.
15 is a flowchart showing the flow of processing of the exposure control processing program according to the second embodiment.
16A is a plan view showing an example of an image after coordinate conversion by the exposure apparatus according to the second embodiment, and shows a case where coordinate conversion is not performed according to the deformation of the substrate to be exposed.
16B is a plan view showing an example of an image after coordinate conversion by the exposure apparatus according to the second embodiment and shows a case where coordinate conversion according to deformation of the substrate to be exposed is performed by setting a limit based on an annular ring .
FIG. 16C is a plan view showing an example of an image after coordinate conversion by the exposure apparatus according to the second embodiment, and shows a case where the coordinate conversion according to the deformation of the substrate to be exposed is performed without setting the above limitations.
17 is a plan view provided for explaining a method of coordinate conversion according to the deformation of the substrate to be exposed in the exposure control processing according to the second embodiment.
18 is a flowchart showing the flow of processing of the exposure control processing program according to the third embodiment.
Fig. 19A is a plan view showing a region to be subjected to coordinate conversion according to the deformation of the substrate to be exposed in the exposure apparatus according to the fourth embodiment. Fig.
Fig. 19B is a plan view showing an area to be subjected to coordinate conversion in accordance with deformation of the substrate to be exposed in the exposure apparatus according to the fourth embodiment. Fig.
Fig. 19C is a plan view showing an area to be subjected to coordinate conversion according to the deformation of the substrate to be exposed in the exposure apparatus according to the fourth embodiment. Fig.
20A is a plan view showing a region to be subjected to coordinate conversion according to the deformation of the substrate to be exposed in the exposure apparatus according to the fourth embodiment.
20B is a plan view showing a region to be subjected to coordinate conversion according to the deformation of the substrate to be exposed in the exposure apparatus according to the fourth embodiment.
20C is a plan view showing a region to be subjected to coordinate conversion according to the deformation of the substrate to be exposed in the exposure apparatus according to the fourth embodiment.
21 is a flowchart showing the flow of processing of the exposure control processing program according to the fourth embodiment.

[First Embodiment]

Hereinafter, an exposure apparatus according to an embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is applied to a substrate (a substrate (C) to be described later) by exposing a light beam to draw a drawing pattern such as a circuit pattern, a solder resist pattern representing an opening hole for component mounting of a solder resist layer A description will be given of an example in which the present invention is applied to an exposure apparatus. The substrate C is a flat board such as a printed wiring board or a glass substrate for a flat panel display.

As shown in Figs. 1 and 2, the exposure apparatus 10 according to the present embodiment is provided with a stage 12 in the form of a flat plate for fixing the substrate C to be exposed. On the upper surface of the stage 12, a plurality of suction holes for sucking air are formed. As a result, air is sucked between the substrate 12 and the substrate 12 when the substrate 12 is mounted on the upper surface of the stage 12, whereby the substrate 12 is vacuum- do.

In the following description, the direction in which the stage 12 moves is defined as the Y direction, the direction perpendicular to the Y direction is defined as the X direction, and the direction orthogonal to the Y direction within the vertical direction is defined as the Z direction.

Further, the stage 12 is supported by a flat plate-shaped base 16 provided movably on the top surface of the base 14 in the form of a table. That is, one or a plurality (two in this embodiment) of the guide rails 18 are provided on the upper surface of the base 14. The base 16 is supported so as to freely move in the Y direction along the guide rails 18 and is driven and driven by a driving mechanism (a stage driving section 42 described later) constituted by a motor or the like. The stage 12 moves in the Y direction along the guide rail 18 in association with the movement of the base 16.

On the upper surface of the base body 14, a gate 20 provided so as to extend over two guide rails 18 is provided. The substrate (C) mounted on the stage (12) moves with the opening of the gate (20) in and out along the guide rail (18). An upper portion of the opening portion of the gate 20 is provided with an exposure portion 22 for exposing a light beam toward the opening portion. The light beam is exposed on the upper surface of the substrate C mounted on the stage 12 when the stage 12 moves along the guide rail 18 and is located at the opening by the exposure section 22. [

The exposure section 22 according to the present embodiment includes a plurality (ten in this embodiment) of exposure heads 22a. An optical fiber 26 drawn out from a light source unit 24 to be described later and a signal cable 30 drawn out from an image processing unit 28 to be described later are connected to the exposure section 22, respectively.

Each of the exposure heads 22a has a digital micromirror device (DMD) as a reflection type spatial light modulating device. The exposure head 22a modulates the light beam from the light source unit 24 by controlling the DMD based on the image information input from the image processing unit 28. [ The exposure apparatus 10 exposes the substrate C by irradiating the substrate C with the modulated light beam. The spatial light modulation element is not limited to a reflection type, and may be a transmission type spatial light modulation element such as a liquid crystal.

On the upper surface of the base body 14, there is further provided a gate 32 provided so as to extend over two guide rails 18. The substrate (C) mounted on the stage (12) moves the opening of the gate (32) along the guide rail (18).

One or a plurality of (two in this embodiment) photographing portions 34 for photographing the opening portion are attached to the upper portion of the opening portion of the gate 32. The photographing unit 34 is a CCD camera or the like having a built-in strobe with extremely short light emission time. A rail 34a is provided at an upper portion of the opening of the gate 32 along a direction (X direction) perpendicular to the movement direction (Y direction) of the stage 12 in a horizontal plane, Each of which is guided by the rail 34a to be movable. The upper surface of the substrate C mounted on the stage 12 is photographed when the stage 12 moves along the guide rail 18 and is located in the opening by the photographing unit 34. [

Next, exposure processing by the exposure head 22a according to the present embodiment will be described.

As shown in Fig. 3, the image area P1, which is an area exposed by the exposure head 22a, has a rectangular shape in which one side is inclined at a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 12. When the light beam is exposed by the exposure head 22a while the stage 12 is moving through the opening of the gate 20 and the stage 12 is moved along the movement of the stage 12, An exposed region P2 of the object is formed.

Each of the exposure heads 22a arranged in a matrix as shown in Fig. 4 is arranged so that the length of the long side of the image area P1 in the X direction is shifted by a distance obtained by multiplying it by a natural number (one time in this embodiment) have. Each of the exposed regions P2 is formed by partially overlapping the adjacent exposed regions P2.

Next, the configuration of the electric machine of the exposure apparatus 10 according to the present embodiment will be described.

5, a system control unit 40 electrically connected to each unit of the apparatus is formed in the exposure apparatus 10, and the system control unit 40 controls each unit of the exposure apparatus 10 And is controlled in a general manner. The exposure apparatus 10 also has a stage driving section 42, an operation device 44, a photographing driving section 46, and an external input / output section 48.

The system control unit 40 has a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), and a hard disk drive (HDD). The system control unit 40 outputs the light beam from the light source unit 24 by the CPU and outputs the image information corresponding to the movement of the stage 12 by the image processing unit 28, And controls the exposure of the light beam to the optical substrate (C).

The stage driving section 42 has a driving mechanism constituted by a motor or a hydraulic pump and drives the stage 12 under the control of the system control section 40. [

The operation device 44 has a display section for displaying various information under the control of the system control section 40 and an input section for inputting various information by user operation.

The photographing drive section 46 has a drive mechanism constituted by a motor or a hydraulic pump and drives the photographing section 34 under the control of the system control section 40. [

The external input / output section 48 performs input / output of various information with an information processing apparatus such as a personal computer connected to the exposure apparatus 10.

Here, the exposure apparatus 10 according to the present embodiment draws an image such as a drawing pattern represented by image information on the substrate C as described above. On the other hand, as shown in Fig. 2, an alignment mark (hereinafter, referred to as a "reference mark") M serving as a reference for positioning when an image is drawn is formed on the substrate to be subjected to the exposure. The exposure apparatus 10 captures the reference mark M by the photographing section 34 before exposing the light source to the substrate C and measures the position of the reference mark M from the photographed image . Then, the exposure apparatus 10 determines an area for drawing an image according to the measured position.

That is, as shown in Fig. 6A, the above-described four reference marks M1 to M4 (hereinafter, also referred to as a reference mark M as a whole) are formed on the substrate C according to this embodiment . Further, an image 62 is usually drawn on the substrate C at a predetermined relative position with respect to the reference marks M1 to M4. 6A and 6B, the reference mark M1 is positioned at the upper left position, the reference mark M2 is positioned at the upper right position, the reference mark M3 is positioned at the lower left position, And a reference mark M4 is formed at the position. The exposure apparatus 10 assumes deformation of the substrate C based on the amount of displacement from the positions of the reference marks M1 to M4 in the design of the positions of the measured reference marks M1 to M4 . Then, the exposure apparatus 10 deforms the image 62 as shown in Fig. 6B and deforms the deformed image 62 on the substrate C in accordance with the deformation of the inferred substrate C, .

In the exposure apparatus 10 according to the present embodiment, when the image is deformed in accordance with the deformation of the substrate C as an example, as shown in Fig. 7A, the entire region to be rendered is referred to as a target (An area indicated by dots in Fig. 7A and Fig. 7B) 64 may be used. However, the target area 64 is not limited to this, and may be formed in any size and shape as long as the relative positions of the reference marks M1 to M4 are known in advance. For example, as shown in Fig. 7B, a rectangular area surrounded by the four reference marks M1 to M4 may be used as the target area 64. Fig.

When an image other than the circuit pattern such as the identification number of the substrate C is to be drawn on the end portion of the substrate C, the coordinate conversion is not performed on the drawing region of the image and only the drawing region of the circuit pattern Coordinate conversion may be performed. This is because, for example, when the image representing the identification number of the substrate to be exposed C is to be exposed, it is easy to confirm the drawing contents by not deforming the image according to the deformation of the substrate C.

Next, the operation of the exposure apparatus 10 according to the present embodiment will be described with reference to FIG. 8 is a flowchart showing the flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure apparatus 10 when the execution instruction is input via the operation device 44. [ The program is stored in advance in a predetermined area of the ROM provided in the system control unit 40. [

First, in step S101, image information which is coordinate data (vector data in this embodiment) representing an image to be imaged on the substrate C (in this embodiment, an image representing an imaging pattern whose outer shape is rectangular) is acquired do. At this time, the system control unit 40 reads the image information stored in the HDD or inputs the image information from the outside via the external input / output unit 48 to acquire the image information. In the present embodiment, the outer shape of the image represented by the image information is a rectangular shape, but it is not limited to this, and any shape may be used. In the present embodiment, the image information is vector data indicating a drawing pattern or the like, but the present invention is not limited to this and may be raster data.

In the next step S103, position information indicating the position (first position) of the reference marks M1 to M4 in the design on the substrate C is obtained as coordinate data. At this time, the system control unit 40 reads the positional information stored in advance in the HDD or inputs the positional information from the outside through the external input / output unit 48 to acquire the positional information.

Or the position information indicating the position of the reference marks (M1 to M4) on the design in correspondence with the identification information of the substrate (C) or the substrate to be projected in advance in the HDD. Based on the correspondence table, the reference marks (M1 to M4 May be derived. More specifically, the substrate C is identified based on the positions of the reference marks M1 to M4 obtained by the recording measurement in step S107 described later, and the identification information of the substrate C to be obtained The corresponding positional information may be acquired.

In the next step S105, the stage 12 is moved until each of the reference marks M1 to M4 is positioned at the position where the each of the reference marks M1 to M4 is included in the photographing area of the photographing section 34. [

In the next step S107, the position (second position) of the actual reference marks M1 to M4 is measured. At this time, the system control unit 40 extracts an area corresponding to the reference marks M1 to M4 from the image photographed by the photographing unit 34, and derives the positional coordinates of the reference mark M. [ In the present embodiment, the coordinates of the center of the area of the reference mark M in the photographed image are the position coordinates of the reference marks M1 to M4. In the present embodiment, the position coordinates of the reference mark M are derived from the photographed image. However, the present invention is not limited to this, and information indicating the position coordinates of the reference mark M obtained by measurement may be inputted from the outside.

As an example, as shown in Fig. 9, the positions of the measured reference marks M1 to M4 may deviate from the positions of the reference marks M1 to M4 in design. In Fig. 9, the positions of the measured reference marks M1 to M4 are indicated by solid lines, and the positions of the reference marks M1 to M4 in the design are indicated by dotted lines. 9, the lateral direction of the front surface of the substrate C is defined as the x direction, and the vertical direction of the front substrate is defined as the y direction.

In the next step S109, the amount of rotation of the substrate C, the offset of the position of the reference mark (M1 to M4) measured in step S107, Amount of stretching, stretching ratio. The above-mentioned amount of rotation is calculated from the position of the reference mark M on the design in a predetermined orthogonal coordinate system (xy coordinate system shown in Fig. 9 as an example in this embodiment) to the position of the corresponding actual reference mark M This is the rotation angle. The offset amount referred to herein is a parallel movement amount from the position of the reference mark M on the design to the position of the corresponding actual reference mark M in the orthogonal coordinate system. The stretching magnification mentioned here is an enlargement or reduction magnification from the position of the reference mark M on the design to the position of the corresponding actual reference mark M in the orthogonal coordinate system. In the present embodiment, both the amount of rotation, the amount of offset, and the expansion / contraction ratio of the substrate C are derived. At this time, the offset amount ofsx in the x direction, the offset amount ofsy in the y direction, and the offset amount ofsy in the x direction (the direction of the x direction) with respect to the substrate C are obtained by the least squares method using the respective coordinates of the four reference marks M1 to M4 The expansion / contraction ratio kx in the y direction, and the rotation amount? Are derived.

That is, when deriving each of the parameters, the position of the reference marks (M1 to M4) in design and the positions of the reference marks (M1 to M4) measured in the process of step S107 include an arbitrary relationship . In this case, the respective parameters are determined such that the average deviation of the parameters becomes minimum (see, for example, Japanese Patent Application Laid-Open No. 61-44429). Since the method of determining each of the above parameters is a known method used in affine transformation and the like, the description thereof is omitted here.

In the next step S111, a deformation correction amount dx, dy for correcting the deformation of the substrate C is derived. Further, the deformation amount of the substrate C is indicated by the amount of shift of each of the four reference marks M1 to M4. Therefore, the deformation correction amount for correcting the deformation of the substrate C is indicated by (dx0, dy0) to (dx3, dy3) for the reference marks M1 to M4, respectively. In the present embodiment, the deformation correction amounts of the reference marks M1 to M4 are measured with the positions of the reference marks M1 to M4 in the design after the correction based on the offset amount, the expansion / contraction ratio and the rotation amount derived in step S109 (Displacement) of the positions of the reference marks M1 to M4.

In the next step S113, the adjustment parameters (Mx, My) (0 <Mx <1, 0 <My <1) for correcting each coordinate in the image information according to the deformation correction amount of the substrate C From the HDD. Mx is an adjustment parameter in the x direction, and My is an adjustment parameter in the y direction. The degree of alignment with respect to the deviation of the reference marks M1 to M4 due to the deformation of the substrate to be imaged C is determined by the adjustment parameters Mx and My in this embodiment. In the present embodiment, the adjustment parameter is set as a ratio for reducing the deformation correction amount (hereinafter also referred to as &quot; correction ratio &quot;). That is, when the adjustment parameter (Mx, My) = (0, 0), correction according to the deformation of the substrate C is not performed, The correction according to the deformation of the optical substrate C is performed without reducing the correction amount. When the adjustment parameter is larger than 0 and smaller than 1, correction according to the deformation of the substrate C is performed while reducing the deformation correction amount in accordance with the adjustment parameter.

In this embodiment, the information indicating the adjustment parameter is input by the user in advance through the operating device 44 and is stored in the HDD. In step S113, input of information indicating an adjustment parameter via the operation device 44 may be accepted. In the present embodiment, 0 <Mx <1, 0 <My <1. However, the present invention is not limited to this, and may be 0? Mx? 1, 0? My? 1 including cases where correction is not performed in accordance with deformation of the substrate C and correction is performed without reducing the correction amount.

In the next step S115, the deformation correction amount dx, dy of the substrate C is reduced based on the adjustment parameters Mx, My read in step S113. In the present embodiment, the deformation correction amounts dx 'and dy' obtained by reducing the deformation correction amounts dx and dy are calculated by the following equation (1).

In the next step S117, the coordinates (xl, yl) to be subjected to coordinate conversion in the image information are converted into the deformations (xx, yy) of the substrate C using the deformation correction amounts dx ', dy' (Xm, ym) corrected in accordance with the coordinates (xm, ym).

At this time, in the present embodiment, as shown in Fig. 10 as an example, the system controller 40 controls a plurality of (four in this embodiment) images represented by the image information on the basis of coordinates to be subjected to coordinate conversion, , And derives the areas SA0 to SA3 of the respective divided areas. Here, when the division is performed, as shown in Fig. 10, a straight line passing through the coordinates to be converted is parallel to each side of the image in the image represented by the image information, . In this embodiment, SA0 is the area of the upper left area in FIG. 10, SA1 is the area of the upper right area, SA2 is the area of the lower left area, and SA3 is the area of the lower right area Respectively.

The system control unit 40 substitutes the areas SA0 to SA3 of the divided areas thus obtained and the deformation correction amounts dx 'and dy' obtained by the processing of step S115 into the following equation (2). The value thus obtained is the deformation correction amount (ddx, ddy) of each coordinate (xl, yl) to be subjected to coordinate transformation in the image information.

For example, as shown in Fig. 10, dx0 '= 1, dx1' = 2, dx2 '= 5, dx3' = 10, SA0 = 1, SA1 = 3, SA2 = 3, SA3 = 9, Ddx = (10 x 9 + 5 x 3 + 2 x 3 + 1 x 1) / 16 = 7.

The method of deriving the deformation correction amounts ddx and ddy is not limited to this. That is, if the position coordinate in the coordinate data of the image to be rendered is P (x, y), the end divisions for the sides of the reference rectangle are required. The position P 'in accordance with the endocrine disposition may be determined for the corrected image and the amount of displacement between the position P and the position P' may be determined as the deformation correction amounts ddx and ddy.

The system control unit 40 corrects the deformation correction amount ddx and ddy of each coordinate in the image information and the offset amount ofsx in the x direction, the offset amount ofsy in the y direction, kx), the expansion / contraction ratio ky in the y direction, and the rotation amount? are substituted into the following equation (3). (Xm, ym) obtained by correcting the coordinates (xl, yl) on the basis of the deformation correction amount of the substrate (C).

In the next step S119, the stage driving unit 42 is controlled so as to move the stage 12 to a position where the top surface of the substrate C is exposed by the light beam emitted from the exposure unit 22. [

In the next step S121, the light source unit 24 and the image processing unit (not shown) are used to draw an image represented by the image information on the substrate C using the coordinates (xm, ym) And controls the exposure head 22a through the exposure head 28 as shown in Fig. At this time, the system control unit 40 controls the stage driving unit 42 to move the stage 12 at a predetermined speed, thereby drawing the image on the substrate C while moving the substrate C And controls the exposure head 22a.

In the next step S123, the stage 12 is moved to a position where the substrate 12 is separated from the stage 12, and the execution of the present exposure control processing program is terminated.

For example, when the adjustment parameter read in step S113 of the exposure control processing program is 0% (Mx = 0, My = 0), that is, when correction according to the deformation of the substrate C is not performed, A rectangular imaging pattern is drawn irrespective of the deformation of the substrate C as shown in Fig.

When the adjustment parameter is 50% (half), the drawing pattern is deformed and drawn on the basis of the deformation correction amount after the deformation correction amount of the reference mark M is set to 50%, for example, as shown in Fig. 11B.

If the adjustment parameter is 100% (Mx = 1, My = 1), the image is deformed and drawn using the deformation correction amount itself of the reference mark M as shown in Fig. 11C as an example. In this case, since the image is deformed in accordance with the positions of the reference marks M1 to M4, the imaging pattern is deformed in the shape corresponding to the deformation of the substrate C to be imaged.

12, for example, when circuit patterns 62A to 62D of a plurality of layers (for example, four layers) are sequentially stacked from the lower side and are drawn on the substrate C, Chemical treatment such as development, etching, peeling, etc. is performed every time the drawing in the layer is completed. Further, in order to overlap the layers, lamination of prepreg layers, processing of conductive vias, field via plating, coarsening, lamination of DFR (dry film photo resist) are performed. Therefore, as shown in Fig. 13, every time the layer is covered with the first circuit pattern 62A, the second layer circuit pattern 62B, the third layer circuit pattern 62C, and the fourth layer circuit pattern 62D, It is assumed that the deformation of the substrate to be exposed C becomes larger.

11A to 11C, the land 66 is provided at the position of the reference mark M of the layer to be rendered so that the positional relationship between the land 66 and the conductive via 68 can be easily recognized in the circuit pattern to be drawn. And a conductive via 68 is provided at the position of the reference mark M in the other layer. In this embodiment, when drawing a circuit pattern, the correction amount of the correction according to the deformation of the substrate C for each layer is set such that the conductive via 68 is inserted into the land 66 in the substrate C . As a result, even when the circuit pattern is deformed in accordance with the deformation of the substrate C, the electronic components can be mounted on the substrate with high accuracy.

In the present embodiment, the deformation correction amount is reduced by multiplying the deformation correction amount of each of the reference marks M1 to M4 by a value (adjustment parameter (Mx, My)) smaller than 1, but is not limited thereto. That is, the deformation correction amount may be reduced by dividing the deformation correction amount by a value exceeding 1 or subtracting a predetermined amount from the deformation correction amount. Alternatively, a plurality of the multiplication, division, and subtraction may be combined to reduce the deformation correction amount.

In addition, when drawing a plurality of circuit patterns on the substrate C to be imaged and drawing a circuit pattern on the uppermost layer of the substrate C, the deformation correction amounts dx 'and dy' 0, 0), the above equation (2) may be calculated. That is, when an electronic component of a predetermined shape (for example, rectangular shape) is loaded on the uppermost layer of the multilayer wiring board, if the deformation correction amount of the circuit pattern to be drawn at the uppermost position is large, the drawn circuit pattern is largely deformed, There is a possibility that the component can not be mounted. However, by not correcting the deformation in the uppermost layer, deformation of the circuit pattern in the uppermost layer is avoided, and the electronic component can be reliably mounted on the substrate to be exposed.

In the present embodiment, the present invention is applied to the exposure apparatus 10 for exposing a light beam onto a substrate C to draw a circuit pattern. However, the present invention is not limited to this. That is, the present invention can be applied to any drawing apparatus that draws an image to be drawn on the basis of the position of the reference mark formed on the drawing body. Further, the present invention may be applied to a laser machining apparatus and a drill machining apparatus for forming conductive vias or the like for electrically connecting layers between layers for drawing a circuit pattern. The present invention may be applied to an exposure apparatus and a processing apparatus for forming a hole for mounting a component in a solder resist layer for protecting a circuit pattern of a substrate. As a result, the electronic component can be mounted on the substrate more reliably.

[Second Embodiment]

Hereinafter, the exposure apparatus 10 according to the second embodiment of the present invention will be described.

The exposure apparatus 10 according to the second embodiment has a configuration shown in Figs. 1 to 6B, similar to the exposure apparatus 10 according to the first embodiment.

The exposure apparatus 10 according to the second embodiment sets a limit to the deformation correction amounts dx and dy according to the value of the annuling when the correction is performed in accordance with the deformation of the substrate C to be exposed. As shown in Fig. 14, the annular ring is an annular region surrounding the entire circumference of the conductive via 68 when the conductive via 68 is empty in the interior of the land 66, and the land diameter is D, The width L of the annular ring, which is the width of the annular region when d is taken as d, is expressed as L = (Dd) / 2.

Next, the operation of the exposure apparatus 10 according to the present embodiment will be described with reference to Fig. 15 shows a flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure apparatus 10 according to the second embodiment when an execution instruction is input via the operation device 44 Flow chart. The program is stored in a predetermined area of the ROM of the system control unit 40 in advance. In the step of performing the same processing as that of Fig. 8 in Fig. 15, the same step numbers as those in Fig. 8 are added, and the explanation thereof is omitted in principle.

First, in steps S101 to S111, the same processing as steps S101 to S111 in the first embodiment is performed.

In the next step S201, the width L of the annular ring is derived. The land diameter D of the lands 66 and the hole diameter d of the conductive vias 68 are obtained and the land diameter D and the hole diameter d are obtained by the following equation (4) To obtain the width L of the annular ring.

The land diameter D and the hole diameter d may be input by the user through the operation device 44 based on the design value of the circuit pattern. The method of deriving the width L of the annular ring is not limited to this. For example, it may be input from the information processing apparatus connected to the outside via the external input / output unit 48, It is good to remember it in advance. In addition, the width L of the annular ring may be set smaller than the actual width in consideration of drawing errors so that the conductive vias 68 do not protrude from the lands 66.

In the next step S203, the shift amount dE of any of the reference marks M1 to M4 due to the deformation of the substrate to be subjected to the exposure is expressed by the following formula (5) Is greater than a predetermined value.

If it is determined in step S203 that the shift amount dE of the reference marks M1 to M4 is larger than the width L of the anuning ring, the process proceeds to step S205, The deformation correcting amounts dx and dy are limited such that the deformation correcting amounts dx and dy that maintain a shape are satisfied. This is a process for maintaining the shape as much as possible while avoiding displacement of the positions of the lands 66 and the conductive vias 68 between the layers when the circuit pattern is drawn on the substrate C in a plurality of layers. In the present embodiment, the deformation correction amounts dx, dx derived by the processing of step S111 are substituted into the following equation (6) by substituting the shift amount dE, the width L of the anuning ring, and the deformation correction amounts dx, dy is corrected to the deformation correction amounts dx 'and dy'. The deformation correction amounts dx and dy are corrected to the maximum deformation correction amounts dx 'and dy' within the range where the conductive vias 68 enter the land 66. [ Further, when drawing a solder resist pattern representing an opening for a component mounting of a solder resist layer as a drawing pattern, the deformation correction amount dx, dy may be limited such that the opening hole enters the inside of a conductor pad for bonding with the component .

On the other hand, if it is determined in step S203 that the shift amount dE of the reference marks M1 to M4 is equal to or smaller than the width L of the anuning ring, the process proceeds to step S207 to determine whether the deformation correction amount dx, It is assumed that no limit is set. That is, the deformation correction amount dx, dy derived in the step S111 is directly replaced with the deformation correction amount dx ', dy' by using the following expression (7).

In the following steps S117 to S123, the same processing as in steps S117 to S123 of the first embodiment is performed, and the execution of the present exposure control processing program is terminated.

For example, when correction is not performed in accordance with the deformation of the substrate C, a rectangular image is drawn irrespective of the deformation of the substrate C as shown in Fig. 16A. In this case, since the image to be drawn is not deformed even if the substrate C is deformed, it is not always possible to insert the conductive via 68 into the land 66. [ 16A to 16C, the reference mark M of the layer to be imaged so that the positional relationship between the lands 66 and the conductive vias 68 can be easily recognized in the circuit pattern to be imaged, as in Figs. 11A to 11C And the conductive vias 68 are provided at the positions of the reference marks M of the other layers.

When the width L of the annular ring derived in step S207 is a predetermined value (for example, 20 占 퐉) and the amount of shift is larger than the width L of the annular ring, The image is deformed and drawn on the basis of the deformation correction amount after the deformation correction amount of the reference mark M is reduced. 17, after the amount of correction for the deformation correction amounts dx and dy is limited so that the conductive vias 68 are inserted into the land 66, the image is deformed in accordance with the deformation of the substrate C do. As a result, the conductive via 68 can be placed inside the land 66, and the electronic component can be reliably mounted on the substrate C to be exposed.

When the width L of the annular ring is a predetermined value (for example, 20 mu m) and the amount of displacement is equal to or smaller than the width L of the annular ring, as shown in Fig. 16C, M), the image is deformed and drawn. In this case, since the image to be drawn is deformed in accordance with the deformation of the substrate C, the conductive via 68 can be securely inserted into the land 66. However, when the deformation is large, The electronic component can not always be mounted on the substrate C as shown in Fig.

[Third embodiment]

Hereinafter, the exposure apparatus 10 according to the third embodiment of the present invention will be described.

The exposure apparatus 10 according to the third embodiment has the configuration shown in Figs. 1 to 6B, similar to the exposure apparatus 10 according to the first embodiment and the second embodiment.

The exposure apparatus 10 according to the third embodiment reduces the deformation correction amounts dx and dy in accordance with the adjustment parameters Mx and My when the correction is performed in accordance with the deformation of the substrate C, Limitations are set for the deformation correction amounts dx and dy in accordance with the width L of the ring.

Next, the operation of the exposure apparatus 10 according to the present embodiment will be described with reference to Fig. 18 is a flowchart showing the flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure apparatus 10 when an execution instruction is input via the operation device 44. [ The program is stored in a predetermined area of the ROM of the system control unit 40 in advance.

8 or 15 in Fig. 18 is given the same step numbers as those in Fig. 8 or Fig. 15, and a description thereof will be omitted in principle.

First, in steps S101 to S113, the same processing as steps S101 to S113 of the first embodiment is performed. In the following steps S201 and S203, processing similar to that of steps S201 and S203 of the second embodiment is performed.

If it is determined in step S203 that the shift amount dE of the reference marks M1 to M4 is larger than the width L of the anuning ring, the process proceeds to step S301, where the conductive vias 68 enter the land 66 The deformation correcting amounts dx and dy are limited such that the deformation correcting amounts dx and dy that maintain a shape are satisfied. In the present embodiment, by substituting the deformation correction amounts dx and dy, the shift amount dE, the width of the annular ring L, and the adjustment parameters Mx and My read in step S113 into the following equation (8) The deformation correction amounts dx and dy derived in step S111 are corrected to the deformation correction amounts dx 'and dy'. The deformation correction amounts dx and dy are thereby corrected to the deformation correction amounts dx 'and dy' where the conductive vias 68 enter the land 66 and the shape is adjusted.

On the other hand, if it is determined in step S203 that the shift amount dE of the reference marks M1 to M4 is smaller than or equal to the width L of the anuning ring, the process proceeds to step S303, It is assumed that no limit is set. That is, the adjustment parameters (Mx, My) read in step S113 are substituted into the following equation (9), and the deformation correction amounts dx and dy derived in step S111 are corrected to the deformation correction amounts dx 'and dy'.

In the following steps S117 to S123, the same processing as in steps S117 to S123 of the first embodiment is performed, and the execution of the present exposure control processing program is terminated.

[Fourth Embodiment]

Hereinafter, an exposure apparatus 10 according to a fourth embodiment of the present invention will be described.

The exposure apparatus 10 according to the fourth embodiment has a configuration shown in Figs. 1 to 6B, similar to the exposure apparatus 10 according to the first to third embodiments.

The exposure apparatus 10 according to the first embodiment through the third embodiment is configured such that the coordinates of the coordinates of the target substrate 64 in accordance with the deformation of the substrate C based on the four reference marks M1- Conversion is performed. On the other hand, the exposure apparatus 10 according to the fourth embodiment performs coordinate conversion according to the deformation of the substrate C on the basis of the respective reference marks M with respect to the plurality of object regions 64.

For example, as shown in Fig. 19A, the plurality of object areas 64 may be divided into a plurality of (for example, four) areas represented by image information. Further, when dividing the image, four reference marks M arranged in two rows and two columns out of the reference marks M formed so as to be arranged in a lattice form are divided so as to be included in each divided region.

As shown in Fig. 19B, an area obtained by dividing the area excluding the non-object area from the image into a plurality of (for example, four) areas is set as the object area 64 Maybe. Further, when dividing the image, an area surrounded by the four reference marks M arranged in two rows and two columns of the reference marks M formed so as to be arranged in a matrix shape is divided so as to form each divided area.

Alternatively, as shown in FIG. 19C, a plurality of (for example, four) partial regions of the image may be extracted and the extracted regions may be used as the target regions 64. In addition, in the vicinity of each of the four reference marks M arranged in two rows and two columns of the reference marks M arranged to be arranged in a matrix, If extracted, it is good.

Alternatively, as shown in FIG. 20A, the plurality of object areas 64 may be divided into a plurality of (for example, four) areas represented by image information. In addition, each of the plurality of object areas 64 is divided so that four reference marks M arranged in two rows and two columns are included.

20B, an area obtained by dividing an area excluding the non-object area from the image into a plurality of (for example, four) areas is set as the object area 64 after the outer peripheral part of the image is set as the non- . In addition, each of the plurality of object areas 64 is divided so that four reference marks M arranged in two rows and two columns are included.

Alternatively, as shown in FIG. 20C, a plurality of (for example, four) partial regions of the image may be extracted and the extracted regions may be used as the target regions 64. [ Further, four reference marks M arranged in two rows and two columns are formed in each of the object regions 64 or in the vicinity of the periphery of each of the object regions 64 in accordance with the shape or size of each of the object regions 64 .

Next, the operation of the exposure apparatus 10 according to the present embodiment will be described with reference to Fig. 21 is a flowchart showing the flow of processing of the exposure control processing program executed by the system control unit 40 of the exposure apparatus 10 when the execution instruction is input through the operation device 44. [ The program is stored in a predetermined area of the ROM of the system control unit 40 in advance.

In the step of performing the same processing as that of Fig. 8 in Fig. 21, the same step numbers as those in Fig. 8 are added, and the description thereof is omitted in principle.

First, in steps S101 to S107, the same processing as steps S101 to S107 in the first embodiment is performed.

In the next step S401, the rotation amount, the offset amount, the rotation amount, and the like of the substrate C are determined for the reference mark M corresponding to one target area 64 of the plurality of target areas 64, Extraction / expansion ratio is derived.

In the following steps S111 to S117, the same processes as those in steps S111 to S117 of the first embodiment are performed.

In the next step S403, it is determined whether the coordinate conversion in step S117 has been performed on the reference mark M corresponding to all the object areas 64 among the plurality of object areas 64. [ If the determination is negative in step S117, the process returns to step S401.

On the other hand, if the determination in step S403 is affirmative, the process proceeds to step S119. Steps S119 to S123 are similar to steps S119 to S123 of the first embodiment, and the execution of the present exposure control processing program is terminated.

Further, when the circuit pattern to be imaged is changed in each of the plurality of regions on the substrate C, the area of the circuit pattern to be imaged is moved in parallel or in the rotational direction so that the circuit patterns to be imaged do not overlap each other .

The fourth embodiment is a structure in which a circuit pattern is drawn in each of a plurality of areas on the substrate C and a configuration for reducing the deformation correction amount for each of a plurality of areas is applied to the first embodiment However, the embodiment to which the above configuration is applied is not limited to this. That is, the configuration of the fourth embodiment may be applied to the second embodiment or the third embodiment.

The disclosure of Japanese Patent Application No. 2012-1779935 is incorporated herein by reference in its entirety.

All publications, patent applications, and technical specifications described in this specification are herein incorporated by reference to the same extent as if each individual document, patent application, and technical specification were specifically and individually stated to be incorporated by reference.

Claims (11)

Coordinate data indicating a first position that is a design position of a plurality of reference marks formed on a substrate to be exposed, coordinate data indicating a drawing pattern to be drawn on the substrate determined based on the first position, An obtaining means for obtaining coordinate data indicating a second position which is an actual position of each of the marks,
Deriving means for deriving a discrepancy correction amount for correcting the discrepancy between the first position and the second position for each of the plurality of reference marks;
Reduction means for reducing each of the shift correction amounts derived by the derivation means to a predetermined ratio;
Correction means for correcting the coordinate data indicating the drawing pattern on the basis of the misalignment correction amount reduced by the abatement means when the drawing pattern is drawn on the substrate with reference to the coordinate data indicating the second position And a display unit for displaying the image. The method according to claim 1,
The abatement means may perform at least one of multiplying the discrepancy correction amount by a value less than 1, dividing the discrepancy correction amount by a value exceeding 1, and subtracting a predetermined amount from the discrepancy correction amount, And the amount of correction is reduced to a predetermined ratio. 3. The method according to claim 1 or 2,
The drawing pattern is a circuit pattern representing an electronic wiring,
Wherein the ratio is a ratio determined so that the conductive via enters into the land in the drawing pattern. 3. The method according to claim 1 or 2,
Wherein the drawing pattern is a solder resist pattern showing an opening hole for component mounting of a solder resist layer,
Wherein the ratio is a ratio determined so that the opening hole enters the inside of the conductive pad for bonding with the component. 3. The method according to claim 1 or 2,
Wherein said deriving means derives the discrepancy correction amount from a shift amount obtained by subtracting at least one of shift caused by parallel movement of the substrate, rotation caused by rotation, and shift caused by expansion and contraction. 3. The method according to claim 1 or 2,
Wherein the imaging pattern is imaged on each of a plurality of regions of the substrate,
Wherein the reference mark is formed for each of the plurality of areas in which the drawing pattern is drawn,
Wherein said abatement means reduces each of said misalignment correction amounts for each of said plurality of regions. 3. The method according to claim 1 or 2,
Further comprising accepting means for accepting an input of an adjustment parameter for reducing each of the deviation correction amounts derived by the deriving means,
Wherein said abatement means calculates said ratio based on an adjustment parameter received by said acceptance means. 3. The method according to claim 1 or 2,
Characterized in that the derivation means sets the shift correction amount to 0 when drawing a plurality of imaging patterns on the substrate to be imaged and drawing the imaging pattern on the uppermost layer of the substrate to be imaged, . An image forming apparatus comprising: the drawing apparatus according to claim 1 or 2;
And an exposure means for exposing and drawing the imaging pattern on the substrate based on the coordinate data corrected by the correction means of the imaging apparatus. (a) coordinate data indicating a first position on a design of a plurality of reference marks formed on a substrate to be subjected to exposure, coordinate data indicating a drawing pattern to be drawn on the substrate to be determined determined based on the first position, Acquiring coordinate data indicating an actual second position of each of the reference marks,
(b) deriving a discrepancy correction amount for correcting the discrepancy between the first position and the second position for each of the plurality of reference marks,
(c) each of the deviation correction amounts derived in (b) is reduced to a predetermined ratio,
(d) correcting the coordinate data indicating the drawing pattern based on the amount of misalignment correction reduced in the abatement step, when drawing the drawing pattern on the substrate with reference to the coordinate data indicating the second position And wherein the rendering method comprises the steps of: A computer-readable recording medium storing a program for causing a computer to execute a rendering process,
The drawing process includes:
(a) coordinate data indicating a first position on a design of a plurality of reference marks formed on a substrate to be subjected to exposure, coordinate data indicating a drawing pattern to be drawn on the substrate to be determined determined based on the first position, Acquiring coordinate data indicating an actual second position of each of the reference marks,
(b) deriving a discrepancy correction amount for correcting the discrepancy between the first position and the second position for each of the plurality of reference marks,
(c) each of the deviation correction amounts derived in (b) is reduced to a predetermined ratio,
(d) correcting the coordinate data indicating the drawing pattern on the basis of the misalignment correction amount reduced by the abatement means when the drawing pattern is drawn on the substrate with reference to the coordinate data indicating the second position And a recording medium.

Images