JP6637120B2 - Drawing apparatus, exposure drawing apparatus, program and drawing method - Google Patents

Description

  The present invention relates to a drawing apparatus, an exposure drawing apparatus, a program, and a drawing method, and in particular, to a drawing apparatus for drawing a drawing pattern on a substrate, an exposure drawing apparatus for drawing a drawing pattern on a substrate by exposure, and the above-described drawing apparatus. And a drawing method for drawing a drawing pattern on a substrate.

  Conventionally, a multilayer wiring structure in which a prepreg obtained by impregnating and drying a glass cloth or a metal plate having excellent rigidity function is used as a core substrate, and a resin layer and a wiring layer are stacked in multiple layers on these core substrates. Is known. Further, in recent years, a demand has been made for a reduction in the thickness and space of the multilayer wiring board. Therefore, a thin multilayer wiring board having no core layer has been proposed.

  In these multilayer wiring boards, it is difficult to align the drawing patterns (wiring patterns) drawn on each layer between the layers due to warpage of the substrate due to chemical treatment or deformation of the substrate due to insufficient strength. May be. Nevertheless, since the land diameter and the hole diameter in the drawing pattern are becoming finer due to the higher density of the drawing pattern, high-precision interlayer alignment is required.

  In order to satisfy this requirement, there has been proposed a technique of drawing a pattern on a substrate after deforming a drawing pattern in accordance with substrate distortion caused by warpage and deformation of the substrate. According to this technology, the accuracy of alignment between layers is improved, but distortion is accumulated each time the layers are stacked, so that the shape of the drawing pattern drawn on the upper layer deviates from the shape of the designed drawing pattern, and There is a concern that mounting electronic components on top of the electronic components will be difficult.

  Further, a technique has been proposed in which an image indicating a drawing pattern is divided into a plurality of regions, and the image is rotated and moved for each divided region according to distortion of a substrate. According to this technique, in each divided region, the amount of deviation between the shape of the designed drawing pattern and the shape of the actually drawn drawing pattern is reduced. However, this technique has a problem that image processing becomes complicated and a problem that a mechanism for forming a positioning hole for connecting a drawing pattern between layers in each divided region is required.

  As techniques for solving these problems, Patent Literature 1 and Patent Literature 2 can suppress a deviation of a drawn pattern from a designed drawing pattern without complicating image processing. A drawing device is disclosed.

  That is, the drawing apparatus of Patent Document 1 acquires deformation information of a substrate in advance, and based on the deformation information, the drawing pattern recorded on the deformed substrate has the same shape as the drawing pattern indicated by the raster data. The raster data is converted so that Then, a drawing pattern is recorded on the substrate before deformation based on the converted raster data.

  Further, the drawing apparatus of Patent Document 2 described above uses a drawing data having a position coordinate defining a region to be drawn and a position of a reference point provided in the region to change the position coordinate of the substrate. The position of the reference point is corrected based on the position. Then, based on the corrected position of the reference point, each coordinate in the area is corrected while maintaining the shape of the area.

JP 2005-157326 A JP 2011-95742 A

  In the technique disclosed in Patent Document 1, since the drawing pattern is largely deformed based on the acquired deformation information, the mounting of the electronic component on the finally obtained substrate is improved. There is a problem that the accuracy of the method may be deteriorated.

  Also, in the technique disclosed in Patent Document 2, as the size of the region to be drawn changes from the size of the region before correction, the mounting pad and the electrode of the electronic component are finally connected. May occur, which may make it difficult to mount electronic components on a substrate.

  The present invention has been made in view of the above problems, and has a drawing device and an exposure drawing device capable of realizing highly accurate alignment between layers while suppressing a pitch shift between a mounting pad and an electrode of an electronic component. , A program, and a drawing method.

  In order to achieve the above object, a drawing apparatus according to the present invention includes: coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on a substrate to be exposed; An acquisition unit configured to acquire coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed, defined as, and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks; A physical quantity indicating the magnitude of distortion of the substrate to be exposed based on the position and the second position, and for each of the plurality of reference marks, the physical amount of the first position and the second position A deriving unit that derives a correction amount for the deviation; a reducing unit that reduces an amount that is larger as the physical quantity increases from each of the correction amounts derived by the deriving unit; and the substrate to be exposed with reference to the second position. Above drawing pattern When drawing the emissions, and a, a correction unit for correcting the coordinate data representing the drawing pattern based on the correction amount is reduced by the reduction unit.

  According to the drawing apparatus of the present invention, the acquisition unit sets the coordinate data indicating the first position, which is the designed position of the plurality of reference marks provided on the substrate to be exposed, based on the first position. The obtained coordinate data indicating the drawing pattern to be drawn on the substrate to be exposed and the coordinate data indicating the second position, which is the actual position of each of the plurality of reference marks, are obtained. In addition, the deriving unit derives a physical quantity indicating the magnitude of the distortion of the substrate to be exposed based on the first position and the second position, and, for each of the plurality of reference marks, the first amount. And a correction amount for the deviation between the second position and the second position.

  Here, in the drawing apparatus according to the present invention, the reduction unit reduces, from each of the correction amounts derived by the derivation unit, a larger amount as the physical quantity increases.

  Further, in the drawing apparatus according to the present invention, when the correction unit draws the drawing pattern on the substrate to be exposed based on the second position, the drawing pattern is based on the correction amount reduced by the reduction unit. Is corrected.

  That is, the drawing apparatus according to the present invention reduces the larger amount as the physical amount increases from each of the correction amounts derived from the deviation amount between the designed position of the reference mark and the actual position, and reduces the reduced correction amount. Is used to correct the coordinate data indicating the drawing pattern.

  As described above, according to the drawing apparatus of the present invention, as the magnitude of the distortion of the substrate to be exposed increases, the correction amount decreases.As a result, the shape of the drawing pattern after correction approaches the shape of the distortion of the substrate to be exposed, High-precision interlayer alignment can be realized while suppressing a pitch shift between the mounting pad and the electrode of the electronic component.

  In the drawing apparatus according to the present invention, the deriving unit may determine, as the physical quantity, a maximum value of a shift amount between the first position and the second position for each of the plurality of reference marks, At least one of each of the average values and the integrated value of each of the shift amounts may be derived. Further, in the drawing apparatus according to the present invention, the deriving unit may determine the physical quantity based on a distance between the plurality of reference marks obtained based on the first position and a corresponding second position. At least one of a maximum value of a difference from the distance between the plurality of reference marks, an average value of each of the differences, and an integrated value of each of the differences may be derived. By deriving the maximum value of the shift amount for each of the reference marks as the physical quantity, the correction can be performed more reliably. In addition, by deriving the average value of the deviation amount for each of the reference marks, it is possible to suppress occurrence of erroneous correction due to the peculiar deviation. Further, by deriving the integrated value of the shift amount for each of the reference marks, it is possible to perform the correction reflecting all the shift amounts.

  Note that in the drawing apparatus according to the present invention, the reducing unit multiplies each of the correction amounts derived by the deriving unit by a positive value smaller than 1 as the physical quantity increases, and increases the physical quantity as the physical quantity increases. By performing at least one of dividing by a value larger than 1 and subtracting a positive value that is larger as the physical quantity becomes larger and smaller than the correction quantity, each of the correction quantities derived by the derivation unit is obtained. Therefore, a larger amount may be reduced as the physical amount increases. Thus, the correction amount can be reduced by a simple calculation.

  Note that in the drawing apparatus according to the present invention, the drawing pattern is a circuit pattern indicating an electronic wiring, and the correction unit sets the correction amount reduced by the reduction unit to a conductive via inside a land in the drawing pattern. May be corrected based on the first correction amount, the coordinate data indicating the drawing pattern may be corrected. This can prevent chipping of the land (protrusion of the conductive via out of the land) which causes a defect of the substrate to be exposed.

  Note that, in the drawing apparatus according to the present invention, the drawing pattern is a solder resist pattern indicating an opening for component mounting of the solder resist layer, and the correction unit reduces the correction amount reduced by the reduction unit. When the opening is larger than a second correction amount determined to fit inside the conductor pad for joining with the component, the coordinate data indicating the drawing pattern is corrected based on the second correction amount. May be. Thus, it is possible to prevent a displacement between the conductive pad and the opening hole, which causes a defect of the substrate to be exposed.

  In the drawing apparatus according to the present invention, the deriving unit may determine whether the displacement due to the parallel movement, the displacement due to the rotation, and the displacement due to expansion and contraction of the substrate to be exposed are based on the displacement between the first position and the second position. The correction amount may be derived based on a deviation amount obtained by subtracting at least one. This makes it possible to more reliably suppress the pitch deviation between the mounting pad and the electrode of the electronic component.

  In addition, the drawing apparatus according to the present invention further includes a receiving unit that receives an input of reduction information in which the reduction rate of the physical quantity and the reduction rate of the correction amount are associated with each other, wherein the reduction unit receives the reduction received by the reception unit. The correction amount derived by the deriving unit may be reduced by using a reduction rate associated with the physical quantity derived by the deriving unit in the information. As a result, the degree of reduction of the correction amount can be easily set, so that convenience for the user can be improved.

  On the other hand, in order to achieve the above object, an exposure / drawing apparatus according to the present invention includes a drawing apparatus according to the present invention and the drawing / drawing apparatus on the substrate to be exposed based on coordinate data corrected by the correction unit of the drawing apparatus. Exposure means for exposing and drawing the pattern.

  Therefore, according to the exposure and drawing apparatus according to the present invention, since it operates in the same manner as the drawing apparatus according to the present invention, similarly to the drawing apparatus, while suppressing the pitch shift between the mounting pad and the electrode of the electronic component, Highly accurate alignment between layers can be realized.

  The exposure / drawing apparatus according to the present invention is configured such that, when a drawing pattern of a plurality of layers is stacked and drawn on the substrate to be exposed, the acquisition unit, the derivation unit, the reduction unit, the correction unit, and the exposure unit A control unit that controls a unit and performs, for each of the plurality of layers, acquisition by the acquisition unit, derivation by the derivation unit, reduction by the reduction unit, correction by the correction unit, and exposure by the exposure unit. May be further provided. Accordingly, even when a plurality of drawing patterns are stacked and drawn, it is possible to realize high-precision interlayer alignment while suppressing a pitch shift between the mounting pad and the electrode of the electronic component.

  The exposure / drawing apparatus according to the present invention further includes a storage unit for storing permissible amount information indicating a maximum permissible amount of the physical amount, which is an upper limit permissible as the magnitude of the distortion of the substrate to be exposed, and the control unit However, when the physical quantity derived by the derivation unit is larger than the maximum allowable amount indicated by the allowable amount information, the exposure of the substrate to be exposed by the exposure unit may be prohibited. Thus, useless exposure can be avoided.

  In order to achieve the above object, a program according to the present invention includes: a computer which stores coordinate data indicating a first position which is a design position of a plurality of reference marks provided on a substrate to be exposed; An acquisition unit that acquires coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed determined based on the position of the reference mark, and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks. Deriving a physical quantity indicating the magnitude of the distortion of the substrate to be exposed based on the first position and the second position, and for each of the plurality of reference marks, the first position and the second position. A deriving unit that derives a correction amount for the displacement of the second position, a reducing unit that reduces, from each of the correction amounts derived by the deriving unit, a larger amount as the physical quantity increases, and a second position based on the second position. the above When drawing the drawing pattern on the exposed substrate, and a correcting unit for correcting the coordinate data representing the drawing pattern based on the correction amount is reduced by the reduction unit, to function as a.

  Therefore, according to the program according to the present invention, the computer can be operated in the same manner as the drawing apparatus according to the present invention, and thus, similarly to the drawing apparatus, the pitch deviation between the mounting pad and the electrode of the electronic component is suppressed. In addition, highly accurate alignment between layers can be realized.

  Further, in order to achieve the above object, the drawing method according to the present invention comprises: a coordinate data indicating a first position which is a design position of a plurality of fiducial marks provided on the substrate to be exposed; An acquisition step of acquiring coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed determined with reference to the reference position, and acquiring coordinate data indicating a second position that is an actual position of each of the plurality of reference marks; A physical quantity indicating the magnitude of the distortion of the substrate to be exposed is derived based on the first position and the second position, and the first position and the second position are determined for each of the plurality of reference marks. A deriving step of deriving a correction amount for the position shift; a reducing step of reducing the larger amount from the correction amounts derived in the deriving step as the physical quantity increases; and When drawing the drawing pattern on the substrate to be exposed Te, and a, a correction step of correcting the coordinate data representing the drawing pattern based on the correction amount is reduced by the reduction step.

  Therefore, according to the drawing method according to the present invention, since it operates in the same manner as the drawing apparatus according to the present invention, similarly to the drawing apparatus, it is possible to suppress a pitch shift between the mounting pad and the electrode of the electronic component while maintaining a high pitch. Accurate alignment between layers can be realized.

  ADVANTAGE OF THE INVENTION According to this invention, it is effective in realizing highly accurate alignment between layers, suppressing the pitch shift between the mounting pad and the electrode of the electronic component.

FIG. 1 is a perspective view illustrating an appearance of an exposure / drawing apparatus according to an embodiment. FIG. 1 is a perspective view illustrating a configuration of a main part of an exposure / drawing apparatus according to an embodiment. FIG. 2 is a perspective view illustrating a configuration of an exposure head of the exposure / drawing apparatus according to the embodiment. FIG. 3 is a plan view showing an exposed area formed on the substrate to be exposed in the exposure / drawing apparatus according to the embodiment. FIG. 2 is a block diagram illustrating a configuration of an electric system of the exposure / drawing apparatus according to the embodiment. FIG. 3 is a plan view showing an example of a substrate to be exposed where no distortion has occurred. It is a top view showing an example of a to-be-exposed substrate in which distortion has occurred. FIG. 9 is a plan view for describing a method for deriving a distortion amount in exposure control processing according to the embodiment. FIG. 11 is a plan view for explaining another example of a method for deriving a distortion amount in the exposure control processing according to the embodiment. It is a mimetic diagram showing an example of reduction information concerning an embodiment. 6 is a graph illustrating an example of a relationship between a physical quantity indicating a magnitude of distortion of a substrate to be exposed and a reduction rate in an exposure control process according to the embodiment. FIG. 3 is a plan view showing an example of an area to be subjected to coordinate conversion according to distortion of a substrate to be exposed in the exposure and drawing apparatus according to the embodiment. FIG. 6 is a plan view illustrating another example of an area to be subjected to coordinate conversion according to distortion of a substrate to be exposed in the exposure / drawing apparatus according to the embodiment. FIG. 6 is a plan view illustrating another example of an area to be subjected to coordinate conversion according to distortion of a substrate to be exposed in the exposure / drawing apparatus according to the embodiment. 5 is a flowchart illustrating a flow of processing of an exposure control processing program according to the first embodiment. FIG. 6 is a plan view for describing a method of coordinate conversion according to distortion of a substrate to be exposed in an exposure control process according to the embodiment. FIG. 2 is a plan view illustrating an example of a target image when coordinate conversion according to distortion of a substrate to be exposed is not performed in the exposure and drawing apparatus according to the first embodiment. FIG. 3 is a plan view illustrating an example of the target image after the coordinate conversion when the coordinate conversion according to the distortion of the substrate to be exposed is performed while reducing the correction amount in the exposure and drawing apparatus according to the first embodiment. FIG. 2 is a cross-sectional view illustrating an example of a substrate to be exposed when a multilayer pattern is drawn on the substrate to be exposed in the exposure and drawing apparatus according to the first embodiment. FIG. 3 is a plan view illustrating an example of target images drawn on each layer when a drawing pattern is drawn on a substrate to be exposed in multiple layers in the exposure / drawing apparatus according to the first embodiment. It is a top view for explanation of an annular ring. It is a flow chart which shows a flow of processing of an exposure control processing program concerning a 2nd embodiment. FIG. 11 is an enlarged plan view illustrating an example of a target image after coordinate conversion when coordinate conversion according to distortion of a substrate to be exposed is performed while reducing the amount of correction in the exposure and drawing apparatus according to the second embodiment. In the exposure / drawing apparatus according to the second embodiment, an example of the target image after the coordinate conversion when the coordinate conversion according to the distortion of the substrate to be exposed is performed without limiting the reduction correction amount (left diagram), and the reduction. It is a top view showing an example (right figure) of a target picture after coordinate conversion when it is performed, limiting the amount of correction.

[First Embodiment]
Hereinafter, an exposure drawing apparatus according to an embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is applied to a method in which a substrate to be exposed (substrate C to be described later) is exposed to a light beam to form a drawing pattern such as a circuit pattern or a solder resist pattern indicating an opening for mounting a component in a solder resist layer. A case where the present invention is applied to an exposure drawing apparatus for drawing will be described as an example. As the substrate to be exposed, a flat board such as a printed wiring board or a glass substrate for a flat panel display is exemplified. In the exposure and drawing apparatus according to the present embodiment, the substrate to be exposed and drawn has a rectangular shape.

  As shown in FIGS. 1 and 2, the exposure / drawing apparatus 10 according to the present embodiment includes a flat stage 12 for fixing a substrate C to be exposed. A plurality of suction holes (not shown) for sucking air are provided on the upper surface of the stage 12. Thus, when the substrate C to be exposed is placed on the upper surface of the stage 12, the air between the substrate C to be exposed and the stage 12 is sucked, so that the substrate C to be exposed is vacuum-adsorbed to the stage 12.

  The stage 12 according to the present embodiment is supported on a flat base 16 movably provided on the upper surface of a table-like base 14. That is, one or more (two in this embodiment) guide rails 18 are provided on the upper surface of the base 14. The base 16 is supported by the guide rail 18 so as to be freely movable along the guide rail 18, and is driven and moved by a driving mechanism (a stage driving unit 42 described later) including a motor, a hydraulic pump, and the like. I do. Therefore, the stage 12 moves along the guide rail 18 in conjunction with the movement of the base 16.

  In addition, as shown in FIG. 2, hereinafter, the direction in which the stage 12 moves is defined as a Y direction, a direction orthogonal to the Y direction in a horizontal plane is defined as an X direction, and the direction orthogonal to the Y direction in a vertical plane is defined. Is defined as the Z direction.

  On the upper surface of the base 14, a gate-shaped gate 20 erected so as to straddle the two guide rails 18 is provided. The substrate C to be exposed placed on the stage 12 moves so as to enter and exit the opening of the gate 20 along the guide rail 18. An exposure unit 22 for exposing a light beam toward the opening is attached above the opening of the gate 20. When the stage 12 moves along the guide rail 18 and is positioned at the opening, the exposure unit 22 exposes the upper surface of the substrate C to be exposed placed on the stage 12 with a light beam.

  The exposure unit 22 according to the present embodiment includes a plurality of (ten in the present embodiment) exposure heads 22a. Further, an optical fiber 26 drawn from a light source unit 24 described later and a signal cable 30 drawn from an image processing unit 28 described later are connected to the exposure unit 22, respectively.

  Each of the exposure heads 22a has a digital micromirror device (DMD) as a reflective spatial light modulator. On the other hand, the exposure drawing apparatus 10 includes a light source unit 24 that emits a light beam to the exposure head 22a, and an image processing unit 28 that outputs image information to the exposure head 22a. The exposure head 22a modulates the light beam from the light source unit 24 by controlling the DMD based on the image information input from the image processing unit 28. The exposure drawing apparatus 10 exposes the substrate C by irradiating the substrate C with the modulated light beam. The spatial light modulator is not limited to the reflection type, but may be a transmission type spatial light modulator such as a liquid crystal.

  On the upper surface of the base 14, there is further provided a gate-shaped gate 32 erected so as to straddle the two guide rails 18. The substrate C to be exposed placed on the stage 12 moves so as to enter and exit the opening of the gate 32 along the guide rail 18.

  Above the opening of the gate 32, one or more (two in the present embodiment) photographing units 34 for photographing the opening are attached. The photographing unit 34 is a CCD camera or the like having a built-in strobe with a very short light emission time. A rail 34a is provided above the opening of the gate 32 along a direction (X direction) perpendicular to the horizontal direction of the movement of the stage 12 (Y direction). It is provided movably guided by 34a. When the stage 12 moves along the guide rail 18 and is positioned at the opening, the photographing section 34 photographs the upper surface of the substrate C to be exposed placed on the stage 12.

  Next, an exposure process by the exposure head 22a according to the present embodiment will be described.

  As shown in FIG. 3, an image area 22b which is an area exposed by the exposure head 22a according to the present embodiment has one side having a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 12. It is a rectangular shape inclined at. When the stage 12 is moving through the opening of the gate 20 and the light beam is exposed by the exposure head 22a, the substrate C to be exposed is strip-shaped exposed for each exposure head 22a as the stage 12 moves. A region 22c is formed.

  Also, as shown in FIGS. 2 and 3, each of the exposure heads 22a is arranged in a matrix in the exposure unit 22, and as shown in FIG. They are shifted by a distance that is a natural number times (in this embodiment, 1). Each of the exposed areas 22c is formed so as to partially overlap with the adjacent exposed area 22c.

  Next, a configuration of an electric system of the exposure / drawing apparatus 10 according to the present embodiment will be described.

  As shown in FIG. 5, the exposure / drawing apparatus 10 is provided with a system control unit 40 which is electrically connected to each unit of the apparatus. The system control unit 40 controls each unit of the exposure / drawing apparatus 10 in an integrated manner. Controlled. Further, the exposure / drawing apparatus 10 includes a stage drive unit 42, an operation device 44, a photographing drive unit 46, and an external input / output unit 48.

  The system control unit 40 has a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a HDD (Hard Disk Drive) 40A. The system control unit 40 causes the CPU to emit a light beam from the light source unit 24 and cause the image processing unit 28 to output corresponding image information at a timing corresponding to the movement of the stage 12, thereby allowing the substrate to be exposed to light. The exposure of the light beam to C is controlled.

  The stage drive unit 42 has a drive mechanism including a motor, a hydraulic pump, and the like, as described above, and moves the stage 12 under the control of the system control unit 40.

  The operation device 44 has a display unit that displays various information under the control of the system control unit 40, and an input unit that inputs various information by a user operation.

  The imaging driving unit 46 has a driving mechanism including a motor, a hydraulic pump, and the like, and moves the imaging unit 34 under the control of the system control unit 40.

  The external input / output unit 48 inputs and outputs various information to and from an information processing apparatus such as a personal computer connected to the exposure / drawing apparatus 10.

  By the way, as shown in FIG. 2, a plurality of (four in the present embodiment) alignment marks (hereinafter, referred to as a reference) for positioning when an image is drawn are formed on a substrate C to be exposed according to the present embodiment. M is provided. As an example, as shown in FIG. 6A, in the exposure / drawing apparatus 10 according to the present embodiment, reference marks M1 to M4 (hereinafter, four are collectively referred to as “reference marks M”) are provided at each corner of the substrate C to be exposed. .) Is provided. Specifically, the reference mark M1 is located at the upper left position in the front view of FIG. 6A of the exposed substrate C, the reference mark M2 is located at the upper right position, the reference mark M3 is located at the lower left position, and the reference mark M4 is located at the lower right position. Is provided.

  The exposure / drawing apparatus 10 according to the present embodiment includes an image of a drawing pattern or the like (hereinafter, referred to as a “target image”) indicated by image information at a predetermined relative position with respect to each of the reference marks M on a substrate C to be exposed. .) 62 is drawn. In the exposure drawing apparatus 10 according to the present embodiment, the outer shape of the target image 62 is rectangular, but is not limited thereto, and may be any shape such as an elliptical shape or a star shape.

  When drawing the target image 62, the exposure / drawing apparatus 10 captures each of the reference marks M by the capturing unit 34 before exposing the exposure target substrate C to the light beam. Measure the position of. Then, the exposure drawing apparatus 10 determines an area in which the target image 62 is drawn based on the measured positions of the reference marks M, and draws the target image 62 in the determined area.

  As an example, as shown in FIG. 6B, the conventional exposure and drawing apparatus 10 calculates the amount of distortion of the substrate C from each position of the reference mark M before drawing the target image 62 on the substrate C. There was something to derive. Then, in the conventional exposure and drawing apparatus 10, the shape of the target image 62 is corrected according to the magnitude of the derived distortion.

  At this time, the exposure / drawing apparatus 10 according to the present embodiment prevents the accuracy of the mounting of the electronic component from being degraded due to the difference between the design shape of the target image 62 and the shape of the target image 62 to be drawn. Therefore, the correction amount for the distortion of the substrate C to be exposed of the target image 62 is reduced. At this time, the exposure / drawing apparatus 10 according to the present embodiment calculates the magnitude of the distortion of the substrate C to be exposed from the correction amount corresponding to each shift amount of the reference mark M (hereinafter, referred to as “pure correction amount”). The larger the physical quantity shown, the more the quantity is reduced. Thereby, the deformation of the target image 62 from the designed shape is suppressed. Then, the exposure / drawing apparatus 10 according to the present embodiment deforms the target image 62 according to each of the reduced correction amounts of the reference mark M (hereinafter, referred to as “reduction correction amount”).

  As an example, as shown in FIG. 7, the exposure / drawing apparatus 10 according to the present embodiment includes, as the physical quantity, a design position for each of the reference marks M and a position obtained by measurement (actual position). The maximum value of the deviation amount de is used. In FIG. 7, the positions of the reference marks M in design are connected by solid lines, and the positions of the reference marks M obtained by measurement are connected by dotted lines. Further, assuming that the horizontal direction in front view in FIG. 7 is the x direction, the vertical direction in front view is the y direction, the shift amount in the x direction is the shift amount dx, and the shift amount in the y direction is the shift amount dy, the shift amount de is as follows. (1)

As described above, in the exposure and drawing apparatus 10 according to the present embodiment, the maximum value of the shift amount is used as the physical quantity, but is not limited thereto, and the average value of the shift amounts or the respective values of the shift amounts are used. The integrated value may be used as the physical quantity. Further, a plurality of combinations of the maximum value, the average value, and the integrated value may be used as the physical quantity.

  Alternatively, as shown in FIG. 8 as an example, the maximum value of the difference between the corresponding distances between the design distances Pa1 to Pa6 between the reference marks M1 to M4 and the distances Pb1 to Pb6 obtained by the measurement is calculated as described above. It may be used as a physical quantity. In FIG. 8, similarly to FIG. 7, each position of the design reference mark M is shown by connecting with a solid line, and each position of the reference mark M obtained by measurement is shown by connecting with a dotted line. I have. The average value of each of the differences or the integrated value of each of the differences may be used as the physical quantity. Further, a plurality of combinations of the maximum value, the average value, and the integrated value may be used as the physical quantity.

  On the other hand, in order to derive the reduction correction amount, the exposure / drawing apparatus 10 according to the present embodiment uses the position information in which each position of the design reference mark M is represented by coordinate data and the reduction information 50 as a system. It is stored in a predetermined area of the HDD 40A of the control unit 40 in advance.

  As an example, as illustrated in FIG. 9, the reduction information 50 according to the present embodiment includes physical quantity information indicating the physical quantity, reduction rate information indicating a reduction rate when the pure correction amount is reduced, and processing for the exposed substrate C. The processing content information indicating the content is information associated with each other. As shown in the figure, when the reduction rate is indicated in a range in the reduction rate information, it indicates that the reduction rate increases linearly or in a curve within the range.

  Further, in the reduction information 50 according to the present embodiment, as the processing content information, an exposure drawing process of drawing the target image 62 on the substrate C to be exposed, and a substrate to be exposed without drawing the target image 62 on the substrate C to be exposed. Any one of error processing for discharging C is stored. If the processing content indicated by the processing content information associated with the physical quantity in the reduction information 50 is the exposure writing processing, the exposure / drawing apparatus 10 uses the reduction rate indicated by the reduction rate information associated with the physical quantity. After reducing the net correction amount, the exposure drawing process is executed. On the other hand, when the processing content indicated by the processing content information associated with the physical quantity in the reduction information 50 is an error process, the exposure / drawing apparatus 10 removes the exposure target drawing C without performing the exposure / drawing process. Discharge from 10 However, the processing content of the error processing is not limited to this. After the exposure / drawing processing is performed with the reduction rate for the exposed substrate C being a fixed value, information indicating that an error has occurred is drawn on the exposed substrate C. You may. Note that, in the exposure drawing apparatus 10 according to the present embodiment, as shown in FIG. 9, in the reduction information 50, the processing content when the physical quantity is 100 μm or more is an error processing.

  Here, as shown in FIGS. 9 and 10 as an example, in the exposure / drawing apparatus 10 according to the present embodiment, in the reduction information 50, as the physical quantity increases, the reduction rate increases. This means that as the physical quantity increases, the amount of reduction with respect to the net correction amount increases, that is, the amount of reduction correction decreases. In this case, the target image 62 is deformed to a shape closer to the shape of the distortion of the substrate C to be exposed than the designed shape of the target image 62, as compared with the case where the reduction correction amount is not used. Thereby, the displacement between the mounting pad and the electrode of the electronic component is suppressed.

  In the exposure drawing apparatus 10 according to the present embodiment, as shown in FIG. 10, as the physical quantity increases, the reduction rate increases stepwise, but the method of increasing the reduction rate is not limited to this. . For example, the reduction rate may be increased linearly as the physical quantity increases. Further, the amount of increase in the reduction rate may increase as the physical quantity increases, or the amount of increase in the reduction rate may decrease as the physical quantity increases.

  The exposure drawing apparatus 10 according to the present embodiment determines the reduction rate using the physical quantity and the reduction information 50, and derives the reduction correction amount from the pure correction amount and the reduction rate. Then, the exposure / drawing apparatus 10 corrects each position of the reference mark M according to the derived reduction correction amount, deforms the target image 62 based on each position of the corrected reference mark M, and The image 62 is drawn on the substrate C to be exposed.

  In the exposure / drawing apparatus 10 according to the present embodiment, the input of the reduction information 50 is received by the user via the input unit of the operation device 44, and the received reduction information 50 is stored in the HDD 40A of the system control unit 40. However, the present invention is not limited to this. For example, each information in the reduction information 50 may be stored in the HDD 40A of the system control unit 40 as a fixed value in advance.

  Further, in the exposure drawing apparatus 10 according to the present embodiment, when deforming the target image 62, as shown in FIG. 11A as an example, the entire area of the target image 62 is converted into a target area (FIG. 11B (area indicated by a dot pattern in FIG. 11B). However, the target area 64 is not limited to this. For example, as shown in FIG. 11B, a rectangular area having the positions of the centers of gravity of the four reference marks M1 to M4 as corner points may be set as the target area 64. Alternatively, as shown in FIG. 11C, for example, the entire surface to be exposed of the substrate C to be exposed may be the target region 64, or a partial region of the target image 62 may be the target region 64.

Further, an image other than the circuit pattern such as the identification number of the substrate C to be exposed may be drawn on an end portion of the substrate C to be exposed, etc. In this case, coordinate conversion is performed for the drawing region of the image. Instead, the coordinate conversion may be performed only in the drawing area of the circuit pattern. This is because the image showing the character string such as the identification number of the substrate C to be exposed is easy to confirm the drawing content without being deformed regardless of the state of the distortion of the substrate C to be exposed. The operation of the exposure drawing apparatus 10 according to the present embodiment will be described with reference to FIG. FIG. 12 is a flowchart illustrating a process flow of an exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 when an execution instruction is input via the input unit of the operation device 44. The program is stored in a predetermined area of the ROM in the system control unit 40 in advance.

  Also, in order to avoid confusion, an example will be described in which image information that is coordinate data (in the present embodiment, vector data) indicating the target image 62 is stored in the HDD 40A of the system control unit 40. . In the exposure / drawing apparatus 10 according to the present embodiment, the image information is vector data indicating a drawing pattern, but is not limited thereto, and may be raster data.

  First, in step S101, image information that is coordinate data indicating the target image 62 to be drawn is obtained by reading from the HDD 40A. However, the system control unit 40 may acquire image information by inputting image information from outside via the external input / output unit 48.

  In the next step S103, the above-described position information in which each position of the design reference mark M is represented by coordinate data is obtained by reading from the HDD 40A.

  As described above, in the exposure / drawing apparatus 10 according to the present embodiment, the system control unit 40 acquires the position information by reading it from the HDD 40A. However, the acquisition method is not limited to this, and the acquisition method is not limited to this. Alternatively, a method of inputting position information from outside may be used.

  In the next step S105, the stage 12 is moved so that the exposure target substrate C passes through the position where each of the reference marks M is included in the imaging region of the imaging unit 34.

  In the next step S107, the actual position of each reference mark M is measured. At this time, the system control unit 40 extracts an area corresponding to each of the reference marks M from the image captured by the imaging unit 34, and derives the barycentric coordinates of the extracted area as the position coordinates of each of the reference marks M. As described above, in the exposure / drawing apparatus 10 according to the present embodiment, each position of the reference mark M is measured using the photographed image. However, the present invention is not limited to this. The indicated information may be input from outside via the external input / output unit 48.

  In the next step S109, the rotation of the substrate C to be exposed is determined from the amount of deviation between each position of the design reference mark M obtained in the processing of step S103 and each position of the reference mark M measured in the processing of step S107. The amount, offset amount, and expansion / contraction ratio are derived. Note that the rotation amount mentioned here is based on the position of the design reference mark M in the predetermined orthogonal coordinate system (in the present embodiment, as an example, the xy coordinate system shown in FIG. 9). This is the rotation angle that reaches the position of the reference mark M. Further, the offset amount here is a parallel movement amount from the position of the design reference mark M in the orthogonal coordinate system to the corresponding position of the actual reference mark M. Further, the expansion / contraction magnification here is an enlargement / reduction magnification from the position of the design reference mark M in the orthogonal coordinate system to the position of the corresponding actual reference mark M.

  The system control unit 40 calculates the offset amount ofsx in the x direction, the offset amount ofsy in the y direction, the expansion and contraction magnification kx in the x direction, the expansion and contraction magnification ky in the y direction, by the least square method using the position coordinates of each reference mark M. And the parameters of the rotation amount θ are derived for each of the exposed substrates C.

  That is, when deriving the above parameters, the positions of the design reference marks M and the positions of the measured reference marks M include the above parameters without considering the distortion of the substrate C to be exposed. Assume a unique relationship. Then, the parameters are determined so that the average deviation of the parameters is minimized (see, for example, JP-A-61-44429). Since the method of determining each of the above parameters is a known method used in affine transformation and the like, further description is omitted here.

  In the next step S111, the position coordinates of each of the reference marks M measured in the processing in step S107 are converted based on the rotation amount, the offset amount, and the expansion / contraction magnification derived in the processing in step S109. Thereby, the amount of displacement of each position of the reference mark M due to the displacement of the arrangement position when the substrate C to be exposed is arranged on the stage 12 is canceled.

  As described above, in the exposure drawing apparatus 10 according to the present embodiment, the position coordinates of each of the reference marks M measured in the process of step S107 are determined based on each of the rotation amount, the offset amount, and the expansion / contraction magnification of the substrate C to be exposed. , But is not limited to this. For example, the conversion may be performed based on any one of the rotation amount, the offset amount, and the expansion / contraction magnification of the exposure target substrate C, or may be performed based on a plurality of combinations.

  In the next step S113, a net correction amount is derived on the basis of the position coordinates of each of the reference marks M subjected to the coordinate conversion in the process of step S111. Hereinafter, the pure correction amounts of the reference marks M1, M2, M3, and M4 are represented as (dx0, dy0), (dx1, dy1), (dx2, dy2), and (dx3, dy3), respectively.

  In the next step S114, based on the position information acquired in the step S103 and the position coordinates of each of the reference marks M subjected to the coordinate conversion in the processing in the step S111, the physical quantity (in the present embodiment, the reference mark M (The maximum value of each shift amount).

  In the next step S115, the reduction information 50 is read from the HDD 40A of the system control unit 40.

  In the next step S117, in the read reduction information 50, it is determined whether or not the processing content indicated by the processing content information associated with the physical quantity information indicating the physical quantity derived in the processing in step S114 is the exposure drawing processing. judge.

  When an affirmative determination is made in step S117, the process proceeds to step S119. On the other hand, when a negative determination is made in step S117, the process proceeds to step S135, and as an error process, the stage 12 is moved to a position where the substrate C to be exposed is removed from the stage 12, and the execution of the main exposure control processing program ends. I do. In this case, the substrate to be exposed C is removed from the stage 12 without performing the exposure / drawing processing, and is discharged to the outside of the exposure / drawing apparatus 10.

  On the other hand, in step S119, in the read-out reduction information 50, the net correction amount is reduced by using the reduction rate N indicated by the reduction rate information associated with the physical quantity information indicating the physical quantity derived in step S114. Derives a reduction correction amount. Hereinafter, the reduction correction amounts of the reference marks M1, M2, M3, and M4 are respectively (dx0 ', dy0'), (dx1 ', dy1'), (dx2 ', dy2'), (dx3 ', dy3'). It expresses.

  In the exposure / drawing apparatus 10 according to the present embodiment, the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) are reduced by a reduction rate with respect to the pure correction amounts (dx0, dy0) to (dx3, dy3). It is obtained by multiplying N and is represented by the following equation (2).

  In the next step S127, coordinate conversion of each coordinate in the target area 64 of the target image 62 is performed using the reduction correction amount (dx ', dy') obtained by the processing in step S119.

  Here, a method of coordinate conversion of each coordinate in the target area 64 of the target image 62 in the exposure drawing apparatus 10 according to the present embodiment will be described. First, as shown in FIG. 13 as an example, the system control unit 40 divides the target image 62 into a plurality of (four in the present embodiment) regions based on the coordinates to be subjected to the coordinate conversion. The areas SA0 to SA3 of the divided areas are derived. At this time, as shown in the drawing, the target image 62 is divided into four regions by drawing a straight line inside the target image 62 that is parallel to each side and passes through the coordinates to be converted.

  Note that, for each of the divided regions, the area of the lower right region in front view in FIG. 10 which is the region facing the reference mark M1 (that is, the region including the reference mark M4) is represented as SA0. Further, the area of the lower left area which is the area opposed to the reference mark M2 (that is, the area including the reference mark M3) is represented as SA1. Further, the area of the upper right area which is the area opposed to the reference mark M3 (that is, the area including the reference mark M2) is represented as SA2. Further, the area of the upper left area which is an area opposed to the reference mark M4 (that is, an area including the reference mark M1) is represented as SA3.

  The system control unit 40 also determines the areas of the divided areas SA0 to SA3 obtained in this way and the reduced correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) obtained by the processing in step S115. Are substituted into the following equation (3). The value obtained as a result is the correction amount (ddx, ddy) of the coordinates to be subjected to the coordinate conversion with respect to the distortion of the substrate C to be exposed.

  For example, as shown in the figure, dx0 ′ = 1, dx1 ′ = 2, dx2 ′ = 5, dx3 ′ = 10, SA0 = 3, SA1 = 9, SA2 = 3, SA3 = 1, and SS = 16. In this case, ddx = (3 × 1 + 9 × 2 + 3 × 5 + 1 × 10) /16≒2.9.

  The method for deriving the correction amount (ddx, ddy) for the distortion of the substrate C to be exposed is not limited to this. That is, each side of the target image 62 is internally divided by drawing a perpendicular to each side of the target image 62 from a predetermined position A (x, y) of the target image 62 before the coordinate conversion. Thus, the internal division ratio of each side of the target image 62 with respect to the position A is obtained. In the target image 62 after the coordinate conversion, a position B corresponding to the internal division ratio may be determined, and a shift amount between the position A and the position B may be determined as a correction amount (ddx, ddy).

  Further, the system control unit 40 calculates the correction amount (ddx, ddy) of each coordinate in the target image 62, the offset amount ofx in the x direction, the offset amount ofsy in the y direction, the expansion and contraction magnification kx in the x direction, and the expansion and contraction magnification in the y direction. ky and the rotation amount θ are substituted into the following equation (4). The coordinates (xm, ym) of the coordinates (xl, yl) to be subjected to the coordinate conversion after the coordinate conversion are obtained by the equation (4).

  In the next step S129, the stage driving unit 42 is controlled to move the stage 12 to a position where the upper surface of the substrate C to be exposed is exposed by the light beam emitted from the exposure unit 22.

  In the next step S131, the exposure head 22a is controlled via the light source unit 24 and the image processing unit 28 to draw the target image 62 on the substrate C to be exposed using the coordinates (xm, ym) after the coordinate conversion. At this time, the system control unit 40 draws the target image 62 on the exposure target substrate C while moving the exposure target substrate C by controlling the stage driving unit 42 so as to move the stage 12 at a predetermined speed. The exposure head 22a is controlled so as to cause the exposure.

  In the next step S133, the stage 12 is moved to a position where the substrate C to be exposed is removed from the stage 12, and the execution of the exposure control processing program is terminated.

  As described above, in the exposure drawing apparatus 10 according to the present embodiment, as shown in FIG. 14A as an example, when the reduction rate is 0% (N = 0), the system control unit 40 The target image 62 is drawn without reducing the correction amount for the distortion.

  On the other hand, as shown in FIG. 14B as an example, when the reduction rate is greater than 0% (N> 0), the system control unit 40 reduces the correction amount for the distortion of the substrate C to be exposed according to the reduction rate. Above, the target image 62 is transformed and drawn. In FIGS. 14A and 14B, the land 66 is provided at the position of the reference mark M of the layer to be drawn so that the positional relationship between the land 66 and the conductive via 68 can be easily understood in the drawing pattern to be drawn. The conductive via 68 is provided at the position of the reference mark M in another layer.

  In a general exposure and drawing apparatus, for example, as shown in FIG. 15, when drawing patterns 62A to 62D of a plurality of layers (for example, four layers) are sequentially stacked on a substrate C to be exposed from the lower side, and drawing is performed. Each time drawing is completed, chemical processing such as development, etching, and peeling is performed. Further, in a general exposure and drawing apparatus, in order to further overlap layers, lamination of a prepreg layer, processing of a conductive via, filling via plating, roughening, lamination of DFR (Dry Film photoResist), and the like are performed. Therefore, as shown in FIG. 16, each time the first layer drawing pattern 62A, the second layer drawing pattern 62B, the third layer drawing pattern 62C, the fourth layer drawing pattern 62D and the layer It is assumed that the distortion of C increases.

  However, in the exposure / drawing apparatus 10 according to the present embodiment, when drawing a drawing pattern, the correction amount for the distortion of the substrate C to be exposed is reduced while increasing the reduction amount as the physical amount increases for each layer. Let it. Thereby, the electronic component can be mounted on the substrate with high accuracy.

  Further, in the exposure / drawing apparatus 10 according to the present embodiment, the net correction amount is reduced by multiplying each correction amount of the reference mark M by a positive value (reduction rate) smaller than 1. Not limited. That is, the net correction amount may be reduced by dividing the net correction amount by a value exceeding 1, or by subtracting a positive value from the net correction amount. Alternatively, the net correction amount may be reduced by combining a plurality of the above multiplications, divisions, and subtractions.

  Further, in the case where a plurality of drawing patterns are laminated on the substrate to be exposed C and the drawing is performed on the lowest layer of the substrate to be exposed C, the distortion of the substrate to be exposed C is not corrected. good.

  In the exposure / drawing apparatus 10 according to the present embodiment, a case has been described where the present invention is applied to the exposure / drawing apparatus 10 that exposes a substrate C to be exposed with a light beam to draw a drawing pattern. However, the present invention is not limited to this. . That is, the present invention can be applied to any drawing apparatus that draws an image to be drawn based on the position of the reference mark M provided on the drawing object. Further, the present invention may be applied to a laser processing apparatus and a drill processing apparatus that form a conductive via or the like that electrically connects layers of each layer for drawing a drawing pattern. Further, the present invention may be applied to an exposure drawing apparatus and a processing apparatus for forming a component mounting hole in a solder resist layer for protecting a drawing pattern on a substrate. Thereby, the electronic component can be mounted on the board with high accuracy.

[Second embodiment]
Hereinafter, an exposure drawing apparatus 10 according to a second embodiment of the present invention will be described.

  The exposure and drawing apparatus 10 according to the second embodiment has the same configuration as the exposure and drawing apparatus 10 according to the first embodiment, and a description of each configuration will be omitted.

  When performing the correction according to the distortion of the substrate C to be exposed, the exposure drawing apparatus 10 according to the second embodiment limits the reduction correction amount (dx ′, dy ′) according to the value of the annular ring. . As shown in FIG. 17, the annular ring is an annular region surrounding the entire periphery of the conductive via 68 when the conductive via 68 is opened inside the land 66, and the land diameter is D and the hole diameter is d. The width L of the annular ring, which is the width of the annular region in the case, is represented by L = (D−d) / 2.

  In the exposure drawing apparatus 10 according to the present embodiment, information indicating the land diameter D of the land 66 and the hole diameter d of the conductive via 68 is stored in the HDD 40A of the system control unit 40 in advance.

  Next, the operation of the exposure and drawing apparatus 10 according to the present embodiment will be described with reference to FIG. FIG. 18 is a flowchart illustrating a flow of an exposure control processing program executed by the system control unit 40 of the exposure / drawing apparatus 10 according to the second embodiment when an execution instruction is input via the operation device 44. It is. The program is stored in a predetermined area of the ROM of the system control unit 40 in advance. Steps in FIG. 18 that perform the same processing as in FIG. 12 are assigned the same step numbers as in FIG. 12, and descriptions thereof are omitted as much as possible.

  In the exposure / drawing apparatus 10 according to the second embodiment, the process proceeds to step S121 after performing the processing in step S119.

  In step S121, information indicating the width L of the annular ring is obtained. In the exposure drawing apparatus 10 according to the present embodiment, information indicating the land diameter D of the land 66 and the hole diameter d of the conductive via 68 is read from the HDD 40A of the system control unit 40, and the values of the land diameter D and the hole diameter d are calculated as follows. The width L of the annular ring is derived by substituting into the equation (5).

  The land diameter D and the hole diameter d may be input by the user via the operation device 44 based on the type of the substrate C to be exposed and the design value of the drawing pattern.

  The method of obtaining the width L of the annular ring is not limited to this. The acquisition method may be, for example, a method of inputting from an externally connected information processing device via the external input / output unit 48. In addition, the acquisition method may be a method in which information indicating the width L of the annular ring (for example, 30 μm) is stored in advance in a storage unit such as the RAM or the HDD 40A of the system control unit 40 and read out from the storage unit. . In addition, by taking into account errors in the mounting position of the substrate C to be exposed, errors in the drawing position, and the like, the value of the width L of the annular ring is made smaller than the actual one so that the conductive via 68 does not protrude from the land 66. May be given a margin.

  In the next step S123, a value obtained by subtracting the reduced correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) from the net correction amounts (dx0, dy0) to (dx3, dy3) is the width L of the annular ring. It is determined whether it is greater than. At this time, a determination is made for each of the reference marks M, and an affirmative determination is made when at least one of the reference marks M satisfies this condition. If a negative determination is made in step S123, the process proceeds to step S127, whereas if an affirmative determination is made, the process proceeds to step S126.

  In step S126, the amount of reduction correction (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) is set in order to prevent the displacement of the land 66 and the conductive via 68 from occurring due to the correction for the distortion of the substrate C to be exposed. ). At this time, the values obtained by substituting the net correction amounts (dx0, dy0) to (dx3, dy3) and the width L of the annular ring into the following equation (6) are used as the reduction correction amounts (dx0 ′, dy0 ′). To (dx3 ′, dy3 ′).

  In the above equation (6), the shift amount obtained by limiting the reduction correction amounts (dx0 ', dy0') to (dx3 ', dy3') as described above is referred to as a shift amount de '.

  As a result, as shown in FIG. 19, the amount of correction for the distortion of the substrate to be exposed C is reduced such that the conductive via 68 is accommodated inside the land 66 while the minimum amount of correction for the substrate to be exposed C is secured. Then, the image is deformed. As a result, the conductive via 68 fits inside the land 66, and the electronic component can be mounted on the substrate C with high accuracy.

  As an example, as shown in the left diagram of FIG. 20, when the reduction rate N is 40%, the reduction correction amount is derived, and the target image 62 is deformed, the position of the land 66 and the conduction via 68 is shifted. I do. In this case, as shown in the right diagram of FIG. 20, by limiting the amount of reduction correction based on the width L of the annular ring, the conductive via 68 can be accommodated inside the land 66. In FIG. 20, the land 66 is provided at the position of the reference mark M of the layer to be drawn so that the positional relationship between the land 66 and the conductive via 68 can be easily understood in the drawing pattern to be drawn. The conductive via 68 is provided at the position of the reference mark M.

  Various processes for realizing the exposure control process by the exposure drawing apparatus 10 configured as described above may be realized by a software configuration using a computer by executing a program. However, it is needless to say that the present invention is not limited to the realization by the software configuration, but may be realized by a hardware configuration or a combination of the hardware configuration and the software configuration.

DESCRIPTION OF SYMBOLS 10 Exposure drawing apparatus 12 Stage 22 Exposure part 22a Exposure head 34 Imaging part 40 System control part 40A HDD
62 Target image C Exposure substrate M, M1 to M4 Reference mark

Claims (11)

Coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on the multilayer wiring board, and a solder resist layer for drawing on the multilayer wiring board defined based on the first position . An acquisition unit that acquires coordinate data indicating a drawing pattern that is a solder resist pattern indicating an opening for component mounting , and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
A physical quantity indicating the magnitude of the distortion of the multilayer wiring board is derived based on the first position and the second position, and the first position and the second position are determined for each of the plurality of reference marks. Derivation unit for deriving a correction amount for correcting the drawing pattern according to the distortion of the multilayer wiring board for the displacement of the position,
A reduction unit configured to reduce a larger amount as the physical amount increases from each of the correction amounts derived by the derivation unit , wherein the opening hole is reduced so as to fit inside a conductor pad for joining with a component. Department and
When drawing the drawing pattern on the multilayer wiring board based on the second position, a correction unit that corrects coordinate data indicating the drawing pattern based on the correction amount reduced by the reduction unit;
Drawing device provided with. The deriving unit may determine, as the physical quantity, a maximum value of a shift amount of the first position and the second position for each of the plurality of reference marks, an average value of the shift amounts, and a value of the shift amount. The drawing apparatus according to claim 1, wherein at least one of the integrated values is derived. The deriving unit determines, as the physical quantity, a distance between the plurality of reference marks obtained based on the first position and a mutual distance between the plurality of reference marks obtained based on the corresponding second position. The drawing apparatus according to claim 1, wherein at least one of a maximum value of a difference between the distance and an average value of each of the differences and an integrated value of each of the differences is derived. The reduction unit multiplies each of the correction amounts derived by the derivation unit by a positive value that is smaller than 1 as the physical quantity increases, and divides by a value that exceeds 1 that increases as the physical quantity increases. And performing at least one of subtracting a positive value that is larger as the physical quantity becomes larger and smaller than the correction quantity, thereby increasing the larger quantity as the physical quantity becomes larger from each of the correction quantities derived by the derivation unit. The drawing apparatus according to any one of claims 1 to 3, wherein the writing apparatus is reduced. The deriving unit converts the coordinate data indicating the second position based on at least one of a displacement due to parallel movement, a displacement due to rotation, and a displacement due to expansion and contraction of the multilayer wiring board, and converts the multilayer wiring board. The drawing apparatus according to any one of claims 1 to 4, wherein the correction amount is derived based on coordinate data in which each position shift of the reference mark due to a shift in the arrangement position at the time of arrangement on the drawing stage is canceled. A receiving unit that receives an input of reduction information in which the reduction rates of the physical quantity and the correction amount are respectively associated with each other;
The reduction unit reduces a correction amount derived by the derivation unit using a reduction rate associated with the physical quantity derived by the derivation unit in the reduction information received by the reception unit. The drawing apparatus according to any one of claims 1 to 5, wherein A drawing apparatus according to any one of claims 1 to 6,
An exposure unit configured to expose and draw the drawing pattern on the multilayer wiring board based on the coordinate data corrected by the correction unit of the drawing apparatus;
Exposure drawing apparatus provided with. In the case of drawing by stacking a plurality of drawing patterns on the multilayer wiring board, and controlling the acquisition unit, the derivation unit, the reduction unit, the correction unit, and the exposure unit, each of the plurality of layers The exposure drawing according to claim 7, further comprising a control unit that performs each of acquisition by the acquisition unit, derivation by the derivation unit, reduction by the reduction unit, correction by the correction unit, and exposure by the exposure unit for each. apparatus. A storage unit that stores allowable amount information indicating a maximum allowable amount of the physical amount, which is an upper limit allowable as the magnitude of distortion of the multilayer wiring board,
The exposure drawing apparatus according to claim 8, wherein the control unit prohibits exposure of the multilayer wiring board by the exposure unit when the physical amount derived by the derivation unit is larger than a maximum allowable amount indicated by the allowable amount information. . Computer
Coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on the multilayer wiring board, and a solder resist layer for drawing on the multilayer wiring board defined based on the first position . An acquisition unit that acquires coordinate data indicating a drawing pattern that is a solder resist pattern indicating an opening for component mounting , and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
A physical quantity indicating the magnitude of the distortion of the multilayer wiring board is derived based on the first position and the second position, and the first position and the second position are determined for each of the plurality of reference marks. Derivation unit for deriving a correction amount for correcting the drawing pattern according to the distortion of the multilayer wiring board for the displacement of the position,
A reduction unit configured to reduce a larger amount as the physical amount increases from each of the correction amounts derived by the derivation unit , wherein the opening hole is reduced so as to fit inside a conductor pad for joining with a component. Department and
When drawing the drawing pattern on the multilayer wiring board based on the second position, a correction unit that corrects coordinate data indicating the drawing pattern based on the correction amount reduced by the reduction unit;
Program to function as Coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on the multilayer wiring board, and a solder resist layer for drawing on the multilayer wiring board defined based on the first position . An acquisition step of acquiring coordinate data indicating a drawing pattern that is a solder resist pattern indicating an opening for component mounting , and acquiring coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
A physical quantity indicating the magnitude of the distortion of the multilayer wiring board is derived based on the first position and the second position, and the first position and the second position are determined for each of the plurality of reference marks. A deriving step of deriving a correction amount for correcting the drawing pattern according to the distortion of the multilayer wiring board for the displacement of the position,
A reduction step of reducing, from each of the correction amounts derived in the deriving step, a larger amount as the physical quantity increases, wherein the reduction is such that the opening hole is reduced to fit inside a conductor pad for joining with a component. Steps and
When drawing the drawing pattern on the multilayer wiring board based on the second position, a correction step of correcting coordinate data indicating the drawing pattern based on the correction amount reduced in the reduction step;
Drawing method with.