JPS62274203A - Position recognizing device - Google Patents

Abstract

PURPOSE:To accurately recognize the position of a flat package IC even if a connection pin curves by recognizing specific connection pin position nearby two corners of the flat package IC from image data at the time of image pickup operation and comparing it with a reference position, and judging the position of the IC. CONSTITUTION:The image of the flat package IC 11 is picked up by an image pickup means 10 and image data passed through an A/D converter 14 at this time is stored in an image memory 15. The density level of the storage contents is read out as connection pin picture elements nearby corners of the IC 11 through a mask part 16 according to preset addresses. Then, a connection pin position recognition part 18 recognizes the 3rd pin position from the corner according to the 3rd setting from the corner of the pin position setting part 19. Even if the 1st connection pin curves during transportation, etc., the positions of the 3rd connection pins at two corners where they hardly curve are compared with the contents of a reference pin position storage part 21 and a case position recognition part 20 recognizes the position of the flat package IC accurately even when there is a curving connection pin.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Object of the Invention] (Field of Industrial Application) The present invention is a position recognition device applied to position recognition when a flat package integrated circuit is mounted on a printed circuit board. Regarding.

(Prior Art) There are various types of packages that house integrated circuits, and among them, there is one called a flat package. This has a shape in which, for example, 44 connection pins are arranged around the package 1 as shown in Fig. 7, and the connection pins are printed! (P
C) It is mounted on the board. By the way, when this flat package integrated circuit (hereinafter referred to as flat package IC) is mounted on a printed wiring board, the flat package IC is sucked by a pickup head of a suction device and moved onto the printed circuit board. The positions of the first connecting pins 2a and 2b placed as viewed from the opposing corners 3a and 3b of the package 1 are detected, and the actual position of the flat package IC is recognized and detected from the positions of these connecting pins. The position of each connection pin is compared with the reference pin position to determine the deviation from the position where V7t:W should be applied. Then, the position of the flat package IC with respect to the X-axis direction, Y-axis direction, and rotational direction is corrected according to this amount of deviation, and then the flat package IC is mounted on a printed circuit board.

However, flat package ICs are usually housed in a case 4 as shown in FIG. 8A and transported to a user or the like. For this reason, the connection pins 2c, 2d, etc., which are arranged first when viewed from the corner, collide with the inner wall of the case 4, causing the connection pins 2c, 2d, etc.
It is bent as shown in Fig. 8C. In this case, even if the position of the flat package IC is detected by detecting the position of the connecting pin 2c, even if this position recognition device is not accurate and the position is corrected with high precision, it cannot be mounted accurately at the specified mounting position. It's gone.

(Problems to be Solved by the Invention) As described above, due to the bending of the connection pins, it was not possible to accurately recognize the position of the flat package IC.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a position recognition device that can accurately recognize the position of a flat package IC even if the connection pin is bent.

[Structure of the Invention] (Means for Solving the Problems) The present invention obtains image data of each connection pin arranged near at least two corners of a flat package using an imaging means, and uses this image data to detect the corners. The position of the connecting pin placed at a predetermined position, e.g. This is a position recognition device which attempts to achieve the above object by having a configuration in which recognition is performed by recognition means.

(Function) With this configuration, the position of a predetermined position, for example, the third connection pin, is recognized from the image data of each connection pin placed near at least two corners of the flat package. The determined connection pin position and the reference pin position are compared to recognize the position of the flat package integrated circuit.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is an overall configuration diagram when the position recognition device is applied to a device for mounting a flat package Ic onto a printed wiring board. In the same figure, 101. The tli statue hand throw means,
This has a function of obtaining image data for each connection pin 2 arranged near the flat package corner of the flat package IC 11. Specifically, the entire image of the flat package 1011 is 1ffflte r
A TV camera (industrial television camera) 13 is installed, and the image signal output from this ITV camera 13 is A.
The signal is converted into a digital image signal by a /D (analog/digital) conversion circuit 14 and stored in an image memory 15. Further, the mask section 16 has a function of reading image data of each connection pin corresponding to the vicinity of the flat package corner, for example, the position recognition ranges 17a and 17b, from the image data stored in the image memory 15.

Note that the memory address for obtaining each connection pin image data is set as follows. That is, the ITV camera 13 is fixedly installed, and the flat package IC 11 is attracted and moved to a predetermined position within the field of view of the ITV camera 13 by the pickup head of the mounting II. As a result, if the shape and size of the flat package l011 are the same, the ITV camera 13 in the flat package corner
The position within the field of view is approximately constant. Therefore, the memory address is set according to the shape and size of the flat package IC 11.

By the way, the reason why the connection pin image data is set in the position recognition ranges 17a and 17b near the flat package corners is as follows. That is, the connection pin with the highest probability of being bent by hitting the case during transportation is the first connection pin counted from the flat package corner, as shown in FIG. In addition, in FIG. 2, the average value of the bending of the connecting pin is calculated and shown. On the other hand, if we look at the deviation of the bending amount with respect to the arrangement position of each connection pin from Fig. 3, the deviation of the 1Mth connection pin becomes large, then the second and third connection pins, and the deviation decreases as the distance from the corner increases, and from the third onwards. shows a stable value. Therefore, when determining the position of the flat package IC from the recognized position of the connection pin,
The connection pins are optimally placed after the third from the flat package corner, and image data of the connection pins near the flat package corner is obtained.

Reference numeral 18 denotes a pin position Rm recognition unit, which receives the connection pin image data from the mask unit 16 and sets the position W1 in the pin position setting unit 19 to identify the connection pin to be recognized, for example, placed third from the flat package corner. It has a function to recognize the position of connected pins.

The case position determination unit 20 has a function of determining the actual position of the flat package IC from the recognized connection pin position by the pin position recognition unit 18, and stores the connection pin position and the reference pin position storage unit 21. The position of the flat package IC is recognized from the deviation by comparing it with the reference pin position according to the shape and size of each flat package IC.

The position 1 correction unit 22 creates correction signals for the suction position, that is, correction signals for the X-axis direction, Y-axis direction, and rotational direction, from the 11 differences determined by the case position judgment unit 20, and sends them to the suction device. be.

Next, the operation of the apparatus configured as described above will be explained. When the flat package IC 11 is sucked by the pickup head of the suction device, the flat package IC
- is moved within the field of view of the HITV lamella 13 and stops. At this time, the ITV camera 13 is attached to the flat package I.
C11 is imaged as Ia and its image signal is output. This image signal is converted into a digital image signal by the A/D conversion circuit 14 and stored in the image memory 15. The image data obtained in this way is as shown in FIG. 4, and shows the part of the flat package IC! A pale bell surrounds Il.
It is higher than the i-rubell.

Here, the mask unit 16 selects each pixel D1 near the flat package corner according to a preset memory address.
02 to create each connection pin image data. These connection pin image data are pin positions lft! The information is sent to the recognition unit 18 and the position of the connection pin is recognized. If this connection pin position 1!311 is explained using the connection pin image data D1, the pin position W! First, the recognition unit 18 is at the flat package corner Q! ! practice knowledge. This much! For example, position recognition is performed by Bakun recognition using reference image data of a flat package corner. If the flat package corner position is not Hilled by this position recognition, or if the connection pin image data indicates a position where the connection pin cannot be recognized, the connection pin position recognition is not executed.

By the way, if the flat package corner position is at an appropriate position for position recognition as shown in FIG. 5, the gray level scanning S of each pixel is performed, for example, in the Y-axis direction. As a result of this scanning, the pixel whose first gray level becomes high indicates the arrangement position of the first connection pin, and the next pixel whose m1 gray level becomes high indicates the second arrangement position of the connection pin. Therefore,
If the pin position set in the pin position setting 7119 is the third pin position, the position of the third connection pin is recognized from the memory address of the pixel D3 whose bell has become the third mth lighter.

Note that the pin position rl identification as described above is also performed on the connection pin image data D2, and the position of the connection pin placed third from the flat package corner is recognized. Furthermore, the pin position recognition unit 18 detects the change in the il light level obtained by scanning S of the connection pin image data, that is, 1ilj
The interval between each connecting pin is determined from the number of pitches, and the amount of bending of the connecting pin is calculated from this interval. In other words, if the connecting pin is bent, 118! corresponding to each connecting pin position! a
A light level appears! im pitch is getting better. Therefore, the curved finger of the connection pin is calculated from this pixel pitch. Here, if the bending length of the connection pin is larger than a predetermined amount, the KM of the flat package IC onto the printed wiring board is stopped.

Now, when the positions of the third connecting pins are recognized, these positions of the connecting pins are sent to the case position determining section 20. Here, as shown in FIG. 6, the connection pin position obtained from the connection pin image data D1 is (Pxl-1Py1-
), and the connection pin positions obtained from the connection pin image data D2 are (Px2', Py2N, while the reference pin positions are (Pxl, Pyl) and (Px2, Py2), respectively.
Then, the case position determination unit 20 calculates the respective deviations □□□d×, dy, and dθ of the flat package IC 11 in the X-axis direction, Y-axis direction, and rotational direction from these positions.

In other words, Px = (Px2-+Px1-)/2PV
= <py2- +Py1- ) /2dl= JP
x 2+ py z , each deviation amount is clx=dl-cos Ran −' ((Py2
--PVI-)÷(Px2--Pxl-))) dy=dl-sin (jan' ((Py2-
-pyt-) ÷ (Px2--Pxl-)) ) old = jan ' ((Py2--Pyl-) ÷ (Px
2--Pxl-)) -tan' (Py1/Px2). Therefore, these deviations start from the actual flat package IC1.
1 position is recognized. When the actual position of the flat package IC, that is, the misaligned seedling, is determined in this way, the position correction unit 22 adjusts the position in each X-axis direction based on the amount of deviation from the position where it should be mounted
A correction signal for the Y-axis direction and rotational direction is created and sent to the suction device I\. As a result, the suction device corrects the position according to each correction signal and mounts the flat package IC onto the printed wiring board.

In this way, in the above embodiment, the position of the third connecting pin is recognized from the image data of the connecting pins placed near at least two corners of the flat package, and this recognized connecting pin position and the reference pin are combined. Since the position of the flat package IC is recognized by comparing with the position, there is almost no chance of the flat package IC being bent by hitting the case etc. during transportation, and the position of the flat package IC 11 can be accurately recognized from the third connection pin position, which has extremely high connection pin placement accuracy. can. Therefore, the flat package IC can be mounted on the printed wiring board at an accurate position. Furthermore, since the pin position recognition unit 18 determines the bending of each connection pin, it is possible to prevent mounting of a flat package IC having a connection pin bent beyond a predetermined position in advance to ensure electrical wiring on the printed wiring board.

Note that the present invention is not limited to the above-mentioned -Tora flow side,
Modifications may be made without departing from the spirit thereof. for example,
The ITV camera 13 has a flat package IC1 within its field of view.
1, but if the flat package IC is large, the ITV camera 13 may be moved to image the position recognition ranges 17a and 17b separately to obtain connection pin image data. . Furthermore, the connection pin used for position recognition is not limited to the third, but may be the fourth, fifth, and so on.

[Effects of the Invention] As detailed above, according to the present invention, it is possible to provide a position recognition device that can accurately recognize the position of a flat package IC even if the connection pin is bent.

[Brief explanation of the drawing]

FIG. 1 is an overall configuration diagram when the position recognition device according to the present invention is applied to a mounting device, FIGS. 2 and 3 are diagrams showing the relationship between the bending state and the connection pin arrangement, and FIGS. Figure 5 shows the location of the connection pins in the device of the present invention @vIh
Figure 6 is a diagram to explain how to calculate the displacement of the flat package IC, Figure 7 is an external view of the flat package fc, and Figures 88 to 8C are diagrams showing the connection pins. FIG. 3 is a diagram for explaining bending. 10...vR(!J! Means, 11...Flat package IC113-I TV camera 5.14.=A/
D conversion circuit, 15... image memory, 1G... mask section,] 8... pin position recognition section, 20... case position determination section. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 4 @ Figure 5 b Figure 7 Figure 8A C Figure 8B C ea8C closed

Claims (3)

[Claims] (1) An imaging means for obtaining image data of each connection pin arranged near at least two corners of a flat package in a flat package integrated circuit, and arrangement at a predetermined point from the corner using the image data obtained by this imaging means. pin position recognition means for recognizing the position of the connecting pin that has been detected; and case position recognition that determines the position of the flat package integrated circuit by comparing the connection pin position recognized by the pin position recognition means with a reference pin position. A position recognition device characterized by comprising means. (2) The position recognition device according to claim 1, wherein the pin position recognition means recognizes the position of a connecting pin located at the third or subsequent corner from the corner of the flat package. (3) The position recognition device according to claim (1), wherein the pin position recognition means has a function of recognizing the position of each connection pin and determining the amount of bending with respect to the flat package.