JP2985380B2 - Electronic component position detection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting the position and inclination of an electronic component at a high speed in an electronic component mounting apparatus for mounting an electronic component on a circuit board.

[0002]

2. Description of the Related Art A conventional method for detecting the position of an electronic component will be described with reference to FIGS.

FIG. 9 shows a chip type capacitor 80 having electrodes at both ends of an electronic component (hereinafter simply referred to as a capacitor).
FIG. 4 is an explanatory diagram in the case of performing position detection. In order to perform position detection at high speed, the center of the entire processing area 81 of the digital image is
Two regions 82 and 83 where the electrodes enter are predicted and set in advance.

FIG. 10 shows a state in which a capacitor 80 is being picked up by a suction nozzle 90 for an electronic component and is being imaged by a video camera 91 in the electronic component mounting apparatus. In the electronic component mounting apparatus, the suction nozzle 90 and the video camera 9 are adjusted so that the extension of the central axis of the suction nozzle 90 and the center of the image screen of the video camera 91 coincide.
1 has been determined.

Therefore, the dimensions of the two regions 82 and 83 into which the electrodes enter are based on the dimensions of the capacitor 80 and are received by the suction nozzle 90 when the capacitor 80 is being sucked by the suction nozzle 90 for electronic components. The amount of displacement of the condenser 80 with respect to the suction nozzle 90 due to the impact is predicted and determined with a margin.

FIG. 11 shows two regions 8 where the electrodes have entered.
2 and 83, the positions 101 and 102 of the two electrodes are obtained, and the center position 103 and the inclined axis 104 of the capacitor 80 are detected from the positions 101 and 102 of the two electrodes. .

[0007]

However, in the above-described configuration, the electrodes may not enter the two regions 82 and 83 set in advance, and the center position and the inclination of the electronic component may be detected. Cannot be performed correctly.

FIG. 12A shows that the suction nozzle is a condenser 8.
FIG. 12 (b) is a state diagram when the center of 0 is correctly sucked, and FIG. 12 (b) is a state diagram when the center positions of both are slightly shifted when the suction nozzle sucks the capacitor 80. There is no problem in detecting the position of.

However, FIG. 12C shows a state in which the capacitor 80 is further deviated from the state of FIG.
In the region 82, the electrode of the capacitor protrudes, indicating that the position of the capacitor 80 cannot be correctly detected.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems and to always perform high-accuracy and high-speed positioning of electronic components.

[0011]

In order to achieve the above-mentioned object, a method for detecting the position of an electronic component according to the present invention comprises the steps of: providing a large processing area corresponding to the size of the electronic component; A first step of setting a rough center position and a rough inclination from a large processing area, a second step of detecting a rough center position and a rough inclination, and a second step corresponding to a plurality of electrodes of the electronic component one by one from the rough center position and the rough inclination. A third step of obtaining a second reference position, a fourth step of setting a small processing area surrounding each of the plurality of electrodes of the electronic component one by one based on the second reference position, and a plurality of electronic components from the small processing area. Fifth step of determining the electrode position of the electronic component, and sixth step of detecting the center position and the inclination of the electronic component from the plurality of electrode positions
It comprises a process and performs position detection by resetting a smaller processing area.

[0012]

According to the present invention, a rough center position and a rough inclination of an electronic component are first determined by the above-mentioned structure, and a smaller central position and a rough inclination are used to surround a plurality of electrodes of the electronic component one by one from the rough center position and the rough inclination. A plurality of electrode positions are obtained by resetting the processing area, and the center position and the inclination of the electronic component can be detected at high speed and with high accuracy from the obtained electrode positions.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a flowchart showing an outline of the processing of the electronic component position detecting method according to the present invention, and FIGS. 2 and 3 are FIGS.
FIG. 4 is a detailed explanatory view of each step. First, a processing outline of a method for detecting the position of an electronic component by digital image processing according to the present invention will be described with reference to FIGS.

The coarse search area setting step 1 is a step of setting a large rectangular area 12 such that a predetermined reference position 11 is the center of the rectangular area 12 in the entire digital image processing area 10 shown in FIG. It is. The size of the rectangular area 12 is based on the size of the electronic component 13,
Considering the amount of shift when the electronic component 13 is sucked by the suction nozzle, it is determined as small as possible within a range where the electronic component 13 always fits.

In the rough search step 2, a large rectangular area 12 shown in FIG. 3A is processed to detect a rough center position 14 and a rough inclination 15 of the electronic component 13.

In the fine search reference position setting step 3, FIG.
A rough center position 1 of the electronic component 13 as shown in FIG.
Second reference positions 16 and 17 corresponding to a plurality of electrodes of the electronic component 13 are set from 4 and the rough inclination 15.

In the fine search area setting step 4, FIG.
The small rectangular areas 18 and 19 are set such that the second reference positions 16 and 17 overlap the centers of the smaller rectangular areas 18 and 19 corresponding to the respective electrodes as shown in FIG.

In the fine search step 5, the small rectangular areas 18 and 19 are processed as shown in FIG. 3 (d) to detect the electrode positions 20 and 21 of the electronic component 13.

In the electronic component position detecting step 6, FIG.
As shown in (2), the center position 22 and the inclination 23 of the finally required electronic component 13 are detected from the electrode positions 20 and 21.

Next, the rough search step 2 will be described in detail with reference to FIG. FIG. 4 shows a plurality of grid points (30 points in this embodiment) roughly set at every i pixel in the rough search area 12 surrounding the electronic component 13. A rough center position 14 and a rough slope 15 of the electronic component 13 can be calculated from the luminances INI (x, y) on the 30 grid points 24. By setting the grid points 24 roughly every i pixels, the processing speed can be greatly increased. For example, i
If it is set to 5, the processing data amount becomes 1/25 as compared with the case where the processing of the entire area is performed, and the processing time is shortened accordingly. By formulating the center position and the slope obtained by such a method, the center position coordinates are (Sx / N, Sy / N) and the slope is (1/2) tan ^-1 (S1 / S2). However, S1 = 2 (N · Sxy−Sx · Sy) S2 = (N · Sxx−Sx · Sy) − (N · Syy-S
x ・ Sy)

[0022]

(Equation 1)

[0023]

(Equation 2)

[0024]

(Equation 3)

[0025]

(Equation 4)

[0026]

(Equation 5)

[0027]

(Equation 6)

Ρ (x, y) = max [INT (x, y) −THL, O], where THL is a threshold value for each pixel.

FIG. 5 is a detailed explanatory diagram of the fine search step 5. In FIG. 5A, a small processing area 40 surrounding the electrodes
A scanning line 41 for scanning in a fixed direction is set every j pixels, and the luminance INT (x, y) on the scanning line 41 is read out for each pixel to detect a point where the luminance changes greatly. . The points at which the luminance changes significantly include a rising edge point 42 at which the luminance changes from dark to light and a falling edge point 43 at which the luminance changes from light to dark. FIG.
In (b), for each rising edge point 42 or falling edge point 43, points arranged on a straight line are extracted.
Then, as shown in FIG. 5C, a line segment 44 composed of the rising edge point 42 and the falling edge point 4
A temporary center 46 is determined from both end points of the line segment 45 composed of the three. Microprocessing areas 47 and 48 are set at two locations on a line segment extending from the temporary center 46 in a direction parallel to the line segment 44,
By searching from the outside to the inside of the electronic component 13, two rising edge points 49 and 50 are extracted. The midpoint 51 between the two rising edges 49 and 50 is one of the electronic components 13.
It is the center of one electrode.

Next, the process of detecting the position of an electronic component according to the present invention will be described with reference to the block diagram of FIG. The electronic component 13 is sucked by the suction nozzle 52 and is brightly illuminated by the illumination 53. The imaging means 54 images the electronic component 13 held by the suction nozzle 52 from below. The video signal obtained from the imaging means 54 is digitized by the digitizing means 55 and stored in the image pattern storage means 56 as a digital image pattern. Since the light of the illumination 53 is directly applied to the electronic component 13, the electrode portions at both ends of the image pattern stored in the image pattern storage unit 56 are brighter than the surroundings.

The upper controller 57 transfers data relating to the external dimensions of the electronic component 13 and the positions and numbers of the electrodes to the electronic component information storage means 58. The central processing unit 59 stores the electronic component 13 stored in the electronic component information storage unit 58.
A rough search area is set in the rough search means 60 based on the external dimensions of, and the rough search means 60 performs a rough search. The rough search means 60 processes the rough search area of the image pattern storage means 56 and detects a rough center position and a rough inclination of the electronic component 13. The central processing means 59 includes the coarse search means 6
From the data about the approximate center position and the approximate inclination of the electronic component 13 detected by “0” and the data on the external dimensions and the positions and the number of electrodes of the electronic component 13 stored in the electronic component information storage means 58, one electrode is set to one. A fine search area surrounding each is set in the fine search means 61, and the fine search means 61 performs a fine search. The fine search means 61 processes the fine search area of the image pattern storage means 56 and detects the position of each electrode with high accuracy. The central processing unit 59 detects the center position and inclination of the electronic component 13 from the electrode position data detected by the fine search unit 61, and notifies the host controller 57 via the electronic component position storage unit 62.

FIGS. 7A and 7B show two methods of setting a coarse search area. FIGS. 8A and 8B show fine search areas corresponding to FIG. This shows how to set an area.

7 and 8 are the same as those in FIGS. 2 and 3.

[0034]

As is apparent from the above description, according to the present invention, a large processing area corresponding to the size of an electronic component is set with reference to a first reference position which is determined in advance. Find the center position and approximate tilt,
From the rough center position and the rough inclination, a second reference position corresponding to each of the plurality of electrodes of the electronic component is obtained, and the plurality of electrodes of the electronic component are individually placed on the basis of the second reference position. By determining a plurality of electrode positions of the electronic component by setting a small processing area to surround, it is possible to detect the center position and the inclination of the electronic component from the plurality of electrode positions with high speed and high accuracy, thereby significantly improving productivity. be able to.

[Brief description of the drawings]

FIG. 1 is a flowchart showing an embodiment of an electronic component position detecting method according to the present invention.

FIG. 2 is a plan view showing a positional relationship between an entire area of digital image processing of the same method, a processing area in a first step, and electronic components.

FIG. 3 (a) is an explanatory view of a processing step in a rough search step of the same method. FIG. 3 (b) is an explanatory view of a step of setting a second reference position in a fine search step of the same method. (D) is an explanatory diagram of a process of setting a smaller rectangular area in the fine search step. (D) is an explanatory diagram of a process of detecting each electrode position of the electronic component in the fine search process of the same method. Explanatory diagram of the process of detecting the center and tilt of an electronic component

FIG. 4 is an explanatory diagram of a process of detecting a rough center position and a rough inclination of an electronic component from grid points in a rough search area in a rough search step of the method.

FIG. 5A is an explanatory view of detecting an edge point of an electrode of an electronic component in a fine search step of the same method. FIG. (C) is an explanatory diagram for detecting the center point of the electrode of the electronic component in the fine search step of the method.

FIG. 6 is a block diagram showing an example of a configuration of an apparatus for implementing the method.

FIG. 7A is a diagram illustrating a state in which a coarse search area is set vertically in the same method, and FIG. 7B is a diagram illustrating a state in which a coarse search area is set horizontally in the method.

FIG. 8A is a diagram showing a state in which a fine search area is set so that an electronic component is vertically long in the same method. FIG. 8B is a diagram showing a state in which a fine search area is set so that an electronic component is horizontally long in the same method. State diagram

FIG. 9 is an explanatory view of a conventional electronic component position detection method.

FIG. 10 is a perspective view showing a positional relationship between an electronic component and a video camera.

FIG. 11 is a diagram showing a positional relationship between a conventional fixed processing area and electronic components.

FIG. 12A is a diagram illustrating a conventional electronic component detection method.
The state diagram in which the electronic component is sucked by the suction nozzle in the correct posture for the two processing areas is shown in FIG. 3B. (C) is a state diagram in which the electronic component is displaced and sucked by the suction nozzle until the position of the electronic component cannot be detected in the two processing areas in the same conventional method.

[Explanation of symbols]

 1 coarse search area setting step (first step) 2 coarse search step (second step) 3 fine search reference position setting step (third step) 4 fine search area step (fourth step) 5 fine search step (fifth step) 6) Electronic component position detection step (Sixth step)

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Shimizu 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-118404 (JP, A) JP-A 64-64 69903 (JP, A) JP-A-2-251714 (JP, A) JP-A-63-135849 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01B 11/00-11 / 30

Claims (1)

(57) [Claims] An electronic component is imaged by an imaging means such as a video camera, a video signal of the electronic component obtained from the imaging means is digitized, and a digital image pattern, which is a digitized video signal, is processed to process the electronic component. In digital image processing for obtaining a position and an inclination, a first step of setting a large processing area corresponding to the size of an electronic component based on a predetermined first reference position, and processing the processing area of the first step. A second step of obtaining a rough center position and a rough inclination of the electronic component by using the second step, and a second reference corresponding to a plurality of electrodes of the electronic part one by one from the rough center position and the rough inclination obtained in the second step. A third step of obtaining a position, and a fourth step of setting a small processing area surrounding each of the plurality of electrodes of the electronic component one by one from the second reference position.
A fifth step of processing the plurality of small processing areas of the fourth step to determine the center positions of the plurality of electrodes of the electronic component;
A method for detecting the position of an electronic component, comprising the sixth step of determining the center position and inclination of the electronic component from the center positions of the plurality of electrodes determined in the fifth step, and performing the position detection by resetting a small processing area.