JP4380864B2 - Component detection method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention, parts Shinaken out method and apparatus, more particularly, to a method and apparatus out parts Shinaken for detecting the position and inclination of a predetermined portion of the electronic component before mounting the electronic component in the component mounting machine.
[0002]
[Prior art]
Conventionally, when an electronic component is mounted on a circuit board in a mounting machine, the image recognition unit acquires image data of the component with an imaging device such as a CCD camera immediately before mounting, performs image processing, and positions the electronic component with high accuracy. Was implemented.
[0003]
For example, a connector as shown in FIG. 1 has component external size, the number of leads, lead length, lead pitch, lead width information, etc. registered in advance as component data. Was positioning. For example, the connector 1 as shown in FIG. 1A is first sucked at the center by the suction nozzle of the mounting machine, moves to the image pickup device section, the image of the component is picked up, and the image data is the image processing section. As shown in FIG. 1B, the image data is sequentially scanned from the outer periphery to detect the position where the lead 1a is supposed to exist on all sides, and the external contact 1b of the component is obtained. Is divided into two equal parts both vertically and horizontally, and roughly set as a lead detection area for each side. The center positions of the parts 1 are detected by detecting the center positions of the leads 1a, detecting the center positions of the respective leads, and calculating the centers of the respective sides.
[0004]
[Problems to be solved by the invention]
However, in the conventional lead detection area setting method in component recognition, the lead on each side is registered on the assumption that the number of leads is registered, the lead pitch, lead length, and lead width are the same, and there is nothing other than the lead. Therefore, if there is a metal fitting 2b or a frame 2c other than the lead 2a defined as shown in FIG. 2 such as the connector 2 shown in FIG. If the search is included and the circumscribed tangent is divided into two equal parts in length and width, there is a problem that the lead group to be detected is not included, the inspection region cannot be set normally, and the electrode cannot be recognized correctly.
[0005]
In addition, even if there is no object other than the lead such as metal fittings, as the inclination at the time of imaging is large, the lead group is not included and the inspection area can not be set normally, and the electrode can not be recognized correctly, There was a problem. In addition, there is also a problem that the inspection area cannot be set correctly and the electrodes cannot be recognized correctly even for atypical parts having lead groups with different lead pitch, number of leads, lead width, lead length, etc. .
[0006]
Therefore, the present invention has been made to solve such a problem, and has high reliability even in an electronic component in which extra components other than electrodes exist, and even when the inclination of the electronic component is large during imaging of the component. quickly as its object to provide a method and apparatus out parts Shinaken which can recognize the position and inclination of a predetermined portion of the electronic component.
[0007]
[Means for Solving the Problems]
The present invention provides a method and apparatus out parts Shinaken for detecting the position and inclination of a predetermined portion of the electronic component of the captured image data processing to the electronic component having a lead portion, of the state of the tilting outs 0 ° the lead portion model template, lead pitch lead width, number of leads, lead obtained from the component data length and 1 pixel of pixel values as parameters, one round-life lead pitch, the image density COS function with amplitude created using, the model template template matching the captured image to detect an area of a predetermined unit is located in the electronic component, detecting the inclination of a predetermined portion of the electronic component in the detected region and, if the slope is greater than the predetermined value, a model template of the lead portion which corrects-out inclination, lead pitch, lead width, number of leads, lead obtained from the component data length and 1 The pixel value of the unit as a parameter, one round-life lead pitch, the image density was generated using a COS function with amplitude, by capturing an image with template matching model templates corrected for the inclination, the electronic An area where a predetermined part of the component is located is detected, and the position and inclination of the predetermined part of the electronic component are obtained using the component data within the detected area.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
[0011]
FIG. 3 shows a component position detection apparatus according to an embodiment of the present invention. In the figure, reference numeral 11 denotes an electronic component. The electronic component 11 is supplied from a component supply unit (not shown) and is sucked by the suction nozzle 12. In order to recognize the suction posture of the component, the electronic component 11 is illuminated by an illuminating device 13 having a large number of illumination lamps 13a, 13b, and 13c on four surfaces, and an imaging camera (such as a CCD camera) having a photographing lens 14. 15 is picked up and image input is performed.
[0012]
The image of the electronic component imaged by the imaging camera 15 is converted into a digital signal via the A / D converter 19 under the control of the CPU 18 of the image processing device 17, stored in the image memory 20, and subjected to image processing and the component. The position is recognized, and the deviation between the component center and the suction center, the suction inclination of the component, and the like are calculated. Further, the image processing device 17 is provided with a template memory 21 and stores a template formed based on component data such as a component external size, the number of leads, a lead length, a lead pitch, and lead width information. Furthermore, a monitor 22 is connected to the image processing apparatus 17 so that an input image or a processed image can be displayed.
[0013]
In such a configuration, the flow of detecting the component position will be described along the flow of FIG.
[0014]
First, data of components to be mounted is set in step S1, and the suction nozzle 12 sucks the electronic component 11 from a component supply unit (not shown) of the mounting machine and moves to the component detection unit where the imaging camera 15 is installed. . When the movement of the electronic component 11 to the position of the imaging camera 15 is completed, the image processing device 17 turns on the lamps 13a, 13b, and 13c of the illumination device 13 to input the video of the electronic component 11, and the imaging camera via the lens 14 Imaging is performed at 15 (step S2). The captured image data is stored in the image memory 20 via the A / D converter 19.
[0015]
The component specifications of the electronic component 11 to be recognized here are registered in advance (step S1), and the image processing device 17 is already notified of these data from the mounting machine main system (not shown) when performing recognition. ing. For example, in the case of a connector as shown in FIG. 2, the number of leads on each side of the connector (each 12), the lead pitch (assuming 0.8 mm as an example), and the lead length (assuming 2.0 mm as an example) The lead width (assumed to be 0.3 mm as an example) is known. Therefore, in step S 3, a model lead (model template) 30 as shown in FIG. 5B is generated by the CPU 18 from the data related to the lead of the electronic component 11 already registered, and stored in the template memory 21. . This model template is generated as follows.
[0016]
First, the pixel value, lead pitch, lead width, number of leads, and lead length of one pixel of an image when performing component detection are generated as parameters from the component data. By using these parameters, the number of pixels in one line of the lead portion and the image data when the inclination is 0 degree can be expressed by the following expression. Further, a template having an inclination can be generated by performing affine transformation after the following generation is completed.
[0017]
Lead portion image data = 256-COS (2 * π / (P / Rate) * Pos + 1) * 128 / (Width / 2 * P) (1)
Number of horizontal pixels = (P / Rate) * (Num-1) +1 (2)
here,
P: Lead pitch Rate: Pixel value (length of one side occupied by one pixel)
Pos: writing pixel position Width: read width Num: number of leads.
[0018]
Model lead generation by equation (1) uses the COS function, the lead pitch is one period, the amplitude is considered as the image density, the slope of the COS function occupied by one pixel is calculated from the lead pitch and one pixel value, and from these, Each density between one lead pitch is calculated and normalized to a value from 0 to 255. If the COS function is used as it is, the duty ratio between the lead part and the non-lead part is fixed at 1: 1, so the lead width information is referred to by multiplying the ratio of the lead width information and the 2 × lead pitch as a coefficient. A lead density data table is created. For example, when the lead pitch is 0.8 mm, the lead width is 0.3 mm, the number of leads is 12, and the value of one pixel is 0.1 mm, the number of pixels occupied between the lead pitches is 0.8 / 0.1 = 8 pixels. Therefore, when one period of the COS function is divided into eight and the amplitude is converted as density, the gradient occupied by one pixel value can be expressed as 2 × π / (0.8 / 0.1) = 0.7853 rad. From this angle, in order to normalize the image density to 0 to 255 with the COS function, +1 is added after the COS function calculation and 128 is multiplied. Further, the duty ratio between one pitch is varied by multiplying the ratio of the lead width to the lead pitch / 2. When the above calculation is performed, the calculation results are -85.3, -35.3, 85.3, 206.1, 256.0, 206.1, 85.3, -35.3, and so on. Results are obtained. At this time, by treating the negative number as 0, the read data can be normalized to 0 to 255 as shown in FIG.
[0019]
On the other hand, in the calculation of the number of pixels by equation (2), the number of pixels for one pitch is obtained from the lead pitch / 1 pixel value, and the number of pixels for the total number of leads is obtained by multiplying this by the number of leads-1.
[0020]
As described above, read data for one line is generated from the read parameters, and the number of lines corresponding to the read length is generated in the template memory 21, thereby generating the template data of the lead portion. At this time, the number of lines corresponding to the read length is calculated by the read length / 1 pixel value. In addition, when generating a lead template, a lead model template (model pattern) 30 as shown in FIG. 5B is added to the lead tip by adding a process such as writing a portion outside the lead (background). Is generated.
[0021]
Subsequently, template matching is performed using the image data of the electronic component 11 stored in the memory 20 and the template created in step S3 (step S4). In this template matching, as shown in FIG. 6A, the model template 30 is used to sequentially scan the image data 31 of the target component from the upper left, and the highest similarity is obtained by processing such as normalized correlation calculation. Processing such as calculating the position is performed.
[0022]
As will be described later, when the aspect ratio of the template size is small and does not exceed an experimentally obtained threshold value (for example, 1: 3), the position where the lead portion 31a is surely present in this template is determined. Since it is determined that it can be detected (No in Step S5), the region 32 where the lead portion 31a is located is roughly detected by the template matching in Step S4, and the lead portion can be recognized (Step S9). . In the example shown in FIG. 6A, it is possible to detect the region where the other lead portion 31b is located by performing template matching twice in the determination of step S10.
[0023]
When the rough recognition of the area where all the lead groups are located is finished, the CPU 18 detects the center position for each lead by detecting the edge of the center position corresponding to the number of registered leads from the component data, and so on. The center of each part and the inclination of the part are calculated by calculating the center of each side (step S11). In this manner, the lead portion can be detected even in a component having a metal fitting or the like other than the lead, and the center position of the component can be reliably detected.
[0024]
Further, in the model template created by the algorithm described above, when the number of leads increases, the aspect ratio of the template increases, and when the imaged component has a large inclination, as shown in FIG. A case where the detection is slightly shifted is expected. Therefore, when the aspect ratio of the template size determined from the number of leads and the lead length exceeds the above-described threshold value (Yes in step S5), the number pattern with an angle by referring to the read data in the recognized area Projection data is acquired (step S6), a rough inclination is calculated from the projection data (step S7), and a model template 30 ′ corresponding to this inclination is generated again (step S8). Then, as shown in FIG. 6C, the region where the lead exists can be detected with high reliability even when the inclination of the imaged component is large by performing template matching again.
[0025]
The rough lead inclination performed in step S7 is performed by sequentially reading and adding image data along several different angle lines in the longitudinal direction of the lead in the detected area. The angle is calculated from the projection data (see, for example, Japanese Patent Publication No. 2-46708).
[0026]
In the above-described embodiment, instead of or in addition to the determination in step S5, a step for determining whether or not the calculated angle exceeds a predetermined threshold value is provided after step S7. If the angle is equal to or smaller than the predetermined threshold value, the process may proceed to step S9, and if not, the process may proceed to step S8. Further, when the angle calculated in step S7 exceeds the second threshold value that is larger than the predetermined threshold value, a warning is issued and the component position recognition process or the component mounting process may be interrupted. it can.
[0027]
【The invention's effect】
As described above, according to the present invention, by performing the generated pattern matching model templates read from Li Dodeta components registered (model pattern), there are also lead with parts that metal other than the lead It is possible to quickly and reliably detect the area to be performed. In addition, even if the image inclination of a part is large, it is possible to roughly detect the area where the lead exists. Therefore, by calculating the inclination of the lead in that area, generating a template with the inclination corrected, and performing template matching again to perform the lead It is possible to quickly and reliably detect the area where the noise exists.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a conventional method for detecting the position of an electronic component.
FIG. 2 is a plan view of an electronic component having metal fittings in addition to leads.
FIG. 3 is a configuration diagram showing a configuration of a component position detection apparatus according to the present invention.
FIG. 4 is a flowchart showing a flow of component position detection.
FIG. 5 is an explanatory diagram illustrating generation of a model template.
FIG. 6 is an explanatory diagram showing a state in which the position of a part is detected using a model template.
[Explanation of symbols]
11 Electronic Component 12 Suction Nozzle 15 Imaging Camera 17 Image Processing Device 21 Template Memory 30 Model Template

Claims (2)

A part Shinaken out how the captured image of the electronic component data processing to detect the position and inclination of a predetermined portion of the electronic component having a lead portion,
Tilting the Kiga 0 ° model templates lead portion in a state of the lead pitch lead width, number of leads, lead length and 1 pixel of pixel values obtained from the component data as a parameter, one round-life lead pitch, the image created by using the COS function of the concentration and amplitude,
The model templates by capturing images and template matching, detects a region in which predetermined portions of the electronic components are located,
Detecting an inclination of a predetermined portion of the electronic component within the detected area;
If the slope is greater than the predetermined value, a model template of the lead portion which corrects-out tilting the lead pitch lead width, number of leads, lead obtained from the component data length and 1 pixel of pixel values as parameters , one round-life lead pitch, the image density was generated using a COS function with amplitude,
The model templates correcting the tilt by capturing images and template matching, detects a region in which predetermined portions of the electronic component is positioned,
Obtaining the position and inclination of the predetermined part of the electronic component using the component data in the detected area ;
Part Shinaken out wherein the. A part Shinaken detection apparatus for detecting the position and inclination of a predetermined portion of the electronic component of the captured image of the electronic component data processing to have a lead portion,
Tilting the Kiga 0 ° model templates lead portion in a state of the lead pitch lead width, number of leads, lead length and 1 pixel of pixel values obtained from the component data as a parameter, one round-life lead pitch, the image It means for creating with the COS function which the density and amplitude,
The model templates by capturing images and template matching, and means for detecting an area in which predetermined portions of the electronic components are located,
Means for detecting an inclination of a predetermined portion of the electronic component within the detected region;
If the slope is greater than the predetermined value, a model template of the lead portion which corrects-out tilting the lead pitch lead width, number of leads, lead obtained from the component data length and 1 pixel of pixel values as parameters , one round-life lead pitch, the image density was generated using a COS function with amplitude, a model template correcting the tilt by capturing images and template matching, a predetermined portion of the electronic component is positioned Means for detecting the region;
Means for calculating the position and inclination of a predetermined portion of the electronic component using component data within the detected area;
Part Shinaken out apparatus characterized by comprising a.

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