TW201407294A - Printing device, exposure printing device, printing method and storage medium - Google Patents

Abstract

A coordinate data representing designing first positions of a plurality of reference marks established in an exposed substrate, a coordinate data representing a printing pattern printed to the exposed substrate defined on the basis of the first positions, and a coordinate data representing an actual second position of each of the reference marks are obtained; a strain correction quantity for correcting a deviation of the first position and the second position for each of the reference marks is derived; each derived strain correction quantity is reduced at a rate defined beforehand; the coordinate data representing the printing pattern is corrected based on the reduced strain correction quantity when printing the printing pattern to the exposed substrate based on the coordinate data representing the printing pattern on the basis of the coordinate data representing the second position.

Description

Recording medium for lithography device, exposure lithography device, lithography method, memory program

The present invention relates to a drawing device, an exposure drawing device, a drawing method, and a memory recording medium, and more particularly to a drawing device for drawing a drawing pattern on a substrate, and an exposure drawing for drawing a drawing pattern on the substrate by exposure. A device, a method of drawing a drawing pattern on a substrate, and a recording medium that memorizes a program executed by the drawing device.

In the prior art, a multilayer wiring board which is a prepreg which is impregnated with a glass cloth and dried, or a metal plate excellent in rigidity, is known as a core substrate, and has such a core. A multilayer wiring structure in which a resin layer and a wiring layer are stacked in a plurality of layers on a substrate. Further, in recent years, the multilayer wiring board has been required to be thinner and space-saving, and therefore, a thin multilayer wiring board having no core layer has been proposed.

In the multilayer wiring board, the substrate is warped due to chemical treatment, or the substrate is deformed due to insufficient strength. Therefore, the positional alignment between the layers of the circuit pattern (wiring pattern) drawn on each layer is changed. Difficult. However, by the high density of the circuit pattern, the pad diameter of the circuit pattern (land The diameter and the aperture are miniaturized, so high-precision alignment of the layers is required.

In order to satisfy this requirement, there has been proposed a technique in which a circuit pattern is deformed in response to strain of a substrate caused by warpage and deformation of a substrate, and then drawn on a substrate. According to this technique, although the accuracy of the positional alignment between the layers is improved, strain is accumulated for each overlapping layer, and therefore, there is a case where the shape of the circuit pattern drawn on the upper layer deviates from the shape of the designed circuit pattern on the substrate. The installation of electronic parts has become difficult.

Further, a technique has been proposed in which an image indicating a circuit pattern is divided into a plurality of regions, and for each of the divided regions, the image is rotationally moved in accordance with the strain of the substrate. According to this technique, the amount of deviation of the shape of the design circuit pattern from the shape of the actually drawn circuit pattern is reduced in each divided region. However, in this technique, there is a problem that image processing becomes complicated by dividing an image into a plurality of regions; and a mechanism for forming positioning holes for connecting circuit patterns between the layers must be formed with respect to each divided region.

As a technique for solving such problems, Japanese Patent Laid-Open Publication No. Hei. No. 2005-157326 and Japanese Patent Laid-Open No. 2011-95742 disclose a drawing device in which image processing is not complicated and can be The offset of the depicted circuit pattern from the designed circuit pattern is suppressed.

In the drawing device of Japanese Laid-Open Patent Publication No. 2005-157326, the deformation information of the substrate is obtained in advance, and based on the deformation information, the circuit pattern recorded on the deformed substrate becomes a circuit represented by raster data. Replace the raster data in the same way as the pattern. Next, the circuit pattern is recorded on the substrate before the deformation based on the replaced grating data.

Further, the drawing device of the above-mentioned Japanese Patent Laid-Open Publication No. 2011-95742 The position of the reference point is corrected based on the displacement pattern of the position coordinates of the substrate, wherein the drawing data includes a position coordinate defining a target region to be drawn and a position of a reference point provided in the target region. Next, each coordinate in the target region is corrected in a state in which the shape of the target region is maintained based on the position of the corrected reference point.

Here, when the circuit pattern is drawn on each layer of the multilayer wiring board, the circuit pattern layer may be provided on the upper side and the lower side of the drawing target layer, respectively. In this case, there is a problem that if the deformation of the circuit pattern corresponding to the strain of the substrate is performed, there is a possibility that the pitch of the pad is mounted on the upper or lower side from the electrode of the electronic component. Offset by the pitch, the final mounting of the electronic components on the substrate becomes difficult. Further, when a solder resist pattern for protecting a circuit is drawn on a circuit pattern drawn on a substrate, the same problem as the deformation of the solder resist pattern corresponding to the strain of the substrate is generated.

However, in the technique disclosed in Japanese Laid-Open Patent Publication No. 2005-157326, the circuit pattern is deformed based on the deformation state that is grasped in advance, and therefore, when the circuit pattern is already provided on the lower side layer, the lower side is connected. The accuracy of the alignment of the wiring between the layers is deteriorated. In this case, the mounting of the electronic components existing on the substrate becomes difficult.

Further, in the technique disclosed in Japanese Laid-Open Patent Publication No. 2011-95742, the size of each target region changes from the size of the target region before the correction, and the pitch of the mounting pads is largely changed from the set value. The possibility. In this case, the mounting of the electronic components on the substrate also becomes difficult.

The present invention has been made in view of the above problems, and an object of the invention is to provide a drawing device, an exposure drawing device, a drawing method, and a memory recording medium, which can be accurately performed even when the drawing pattern is deformed in accordance with the strain of the substrate. The electronic components are mounted on the substrate.

In order to achieve the above object, the drawing device of the present invention includes: an acquisition member that acquires coordinate data indicating a first position, coordinate data indicating a drawing pattern, and coordinate data indicating a second position, wherein the first position is provided on the substrate to be exposed a design position of the plurality of fiducial marks, wherein the drawing pattern is drawn on the exposed substrate defined by the first position, wherein the second position is an actual position of each of the plurality of reference marks; and the deriving member is Each of the plurality of reference marks derives an offset correction amount for correcting a deviation between the first position and the second position; and the reducing means reduces the offset correction amount derived by the deriving means by a predetermined ratio And a correction means for correcting and indicating the drawing pattern based on the offset correction amount reduced by the reducing member when the drawing pattern is drawn on the exposed substrate with reference to the coordinate data indicating the second position Coordinate information.

According to the drawing device of the present invention, the coordinate data indicating the first position, the coordinate data indicating the drawing pattern, and the coordinate data indicating the second position are obtained by the acquiring means, wherein the first position is a plurality of substrates provided on the exposed substrate a design position of the fiducial mark, wherein the drawing pattern is drawn on the exposed substrate defined by the first position, wherein the second position is an actual position of each of the plurality of reference marks; and the deriving means is Each of the plurality of reference marks derives an offset correction amount for correcting the offset between the first position and the second position.

Here, in the drawing device of the present invention, by reducing the member, pressing in advance The predetermined ratio reduces the amount of offset correction derived by the above-described deriving means.

Further, in the drawing device of the present invention, when the drawing pattern is drawn on the exposed substrate with reference to the coordinate data indicating the second position, the correction means is reduced by the reducing member. The coordinate data indicating the above-described drawing pattern is corrected by shifting the correction amount.

That is, in the drawing device of the present invention, when the coordinate data indicating the drawing pattern to be drawn is corrected corresponding to the strain of the substrate to be exposed, after the offset correction amount due to the strain of the substrate to be exposed is reduced, based on the deviation The coordinate amount indicating the drawing pattern is corrected by shifting the correction amount. The drawing device of the present invention is in this way to reduce the degree of positional alignment (deformation) with respect to the offset of the fiducial mark generated by the strain of the substrate to be exposed.

As described above, according to the drawing device of the present invention, the degree of alignment with respect to the offset of the reference mark caused by the strain of the substrate to be exposed is lowered, and the shapeability is improved, and thus the present invention is not applied. In contrast, even when the drawing pattern is deformed in accordance with the strain of the substrate, the electronic component can be mounted on the substrate with high precision. Further, by applying the present invention to the formation of a drawing pattern for a multilayer wiring board, each layer is gradually corrected to a shape drawing pattern, and finally, a highly accurate component mounting can be realized.

Further, in the drawing device of the present invention, the reducing means may reduce the derived offset correction amount by a predetermined ratio by performing at least one of the following, that is, multiplying by the offset correction amount The value is less than 1, the value of the offset correction is divided by a value greater than 1, and the predetermined amount is subtracted from the offset correction amount. Thereby, although the degree of positional alignment is deteriorated, pattern distortion can be alleviated.

In addition, in the drawing device of the present invention, the drawing pattern may be represented by The circuit pattern of the electronic wiring has a ratio that is defined in such a manner that a via is accommodated inside the pad of the drawing pattern. Thereby, it is possible to prevent the pad defect (the extension of the via hole to the outside of the pad) which is a cause of the product defect.

Further, in the drawing device of the present invention, the drawing pattern may be a solder resist pattern indicating an opening hole for mounting a component of the solder resist layer, and the ratio is such that the opening hole is received in a conductor pad for bonding with a component. The way the internal way is prescribed. Thereby, it is possible to prevent the offset of the conductor pad and the opening hole which are defective products.

Further, in the drawing device of the present invention, the deriving member may be removed from at least one of an offset due to parallel movement of the exposed substrate, an offset due to rotation, and an offset due to expansion and contraction. The offset is derived while the above offset correction is derived. Thereby, the amount of shift due to the strain of the substrate to be exposed can be more accurately derived.

Further, in the drawing device of the present invention, the drawing pattern may be drawn on each of the plurality of regions of the exposed substrate, and the reference mark may be provided in each of the plurality of regions in which the drawing pattern is drawn, and the reducing member may be The above-described offset correction amount is reduced for each of the plurality of regions. As a result, although the complexity of the function is increased, it is stabilized with respect to strain, and the electronic component can be mounted on the substrate with higher precision.

Furthermore, the drawing device of the present invention may further include a receiving member that receives an input of an adjustment parameter for reducing each offset correction amount derived by the deriving member, the reducing member being received based on the receiving member The above ratio is calculated by adjusting the parameters. Thereby, the convenience of the user can be further improved.

Further, in the drawing device of the present invention, the deriving member may draw a plurality of drawing patterns on the exposed substrate, and may be drawn as described above. When the drawing pattern is drawn on the uppermost layer of the exposure substrate, the offset correction amount is set to zero. Thereby, the electronic component can be mounted on the substrate more reliably.

On the other hand, in order to achieve the above object, the exposure drawing apparatus of the present invention includes the drawing device of the present invention and an exposure member which is based on the coordinate data corrected by the correction member of the drawing device, and is exposed to the substrate to be exposed. The above-described drawing pattern is exposed and drawn.

Therefore, the exposure drawing device according to the present invention functions in the same manner as the drawing device of the present invention. Therefore, even in the case where the drawing pattern is deformed in accordance with the strain of the substrate, it is possible to accurately perform the same as the drawing device. The electronic components are mounted on the substrate.

Further, in order to achieve the above object, the program of the present invention causes a computer to function as a member for acquiring a coordinate data indicating a first position on a design of a plurality of reference marks provided on a substrate to be exposed, and a coordinate data of a drawing pattern of the substrate to be exposed defined by the first position and a coordinate data indicating an actual second position of each of the plurality of reference marks; and a deriving member for each of the plurality of reference marks Deriving an offset correction amount for correcting an offset between the first position and the second position; reducing a component, reducing each offset correction amount derived by the deriving member by a predetermined ratio; and correcting the component When the drawing pattern is drawn on the exposed substrate with reference to the coordinate data indicating the second position, the coordinate data indicating the drawing pattern is corrected based on the offset correction amount reduced by the reducing member.

Therefore, according to the program of the present invention, the computer can be made to function similarly to the drawing device of the present invention. Therefore, even in the case where the drawing pattern is deformed in accordance with the strain of the substrate, the drawing can be made to be high. Electronic parts Mounted on the substrate.

Further, in order to achieve the above object, the drawing method of the present invention includes the obtaining step of acquiring coordinate data indicating a first position of a design of a plurality of reference marks provided on an exposed substrate, and indicating that the drawing is based on the first position. a coordinate data of a predetermined drawing pattern of the exposed substrate and coordinate data indicating an actual second position of each of the plurality of reference marks; and a deriving step of deriving the correction for each of the plurality of reference marks An offset correction amount of the offset between the first position and the second position; a decreasing step of reducing each offset correction amount derived by the deriving step by a predetermined ratio; and a correcting step to indicate the second When the drawing pattern is drawn on the exposed substrate based on the coordinate data of the position, the coordinate data indicating the drawing pattern is corrected based on the offset correction amount reduced by the reducing step.

Therefore, according to the drawing method of the present invention, similarly to the drawing device of the present invention, even in the case where the drawing pattern is deformed in accordance with the strain of the substrate, the drawing can be performed with high precision. The parts are mounted on a substrate.

According to the present invention, even when the drawing pattern is deformed in accordance with the strain of the substrate, the electronic component can be mounted on the substrate with high precision.

10‧‧‧Exposure drawing device

12‧‧‧ platform

14‧‧‧ base

16‧‧‧Abutment

18‧‧‧ rails

20, 32‧‧ ‧ gate

22‧‧‧Exposure Department

22a‧‧‧Exposure head

24‧‧‧Light source unit

26‧‧‧ fiber optic

28‧‧‧Image Processing Unit

30‧‧‧Signal cable

34‧‧‧Photography Department

34a‧‧ Track

40‧‧‧System Control Department

42‧‧‧ Platform Drivers

44‧‧‧Operating device

46‧‧‧ Shooting Drive Department

48‧‧‧External input and output

62‧‧‧ Images

62A, 62B, 62C, 62D‧‧‧ circuit pattern

64‧‧‧Target area

66‧‧‧ pads

68‧‧‧through holes

C‧‧‧ exposed substrate

D‧‧‧ aperture

D‧‧‧ pad diameter

The width of the L‧‧‧ hole ring

M, M1, M2, M3, M4‧‧‧ benchmark marks

P1‧‧‧ image area

P2‧‧‧Complete exposure area

S101~S123, S201~S207, S301, S303, S401, S403‧‧‧ steps

SA0, SA1, SA2, SA3‧‧‧ area

X, Y, Z‧‧ Direction

FIG. 1 is a perspective view showing an appearance of an exposure drawing device according to an embodiment.

FIG. 2 is a perspective view showing a configuration of a main part of an exposure drawing device according to an embodiment.

3 is a perspective view showing a configuration of an exposure head of the exposure drawing device of the embodiment.

4 is a plan view showing a completed exposure region formed on an exposed substrate in the exposure drawing device of the embodiment.

Fig. 5 is a block diagram showing a configuration of an electrical system of an exposure drawing device according to an embodiment.

Fig. 6A is a plan view for explaining the principle of exposure control processing in the exposure drawing device of the embodiment.

Fig. 6B is a plan view for explaining the principle of exposure control processing in the exposure drawing device of the embodiment.

FIG. 7A is a plan view showing a region to be subjected to coordinate conversion corresponding to the strain of the substrate to be exposed in the exposure drawing device according to the first embodiment and the second embodiment.

FIG. 7B is a plan view showing a region to be subjected to coordinate conversion corresponding to the strain of the substrate to be exposed in the exposure drawing device according to the first embodiment and the second embodiment.

FIG. 8 is a flowchart showing a flow of processing of the exposure control processing program of the first embodiment.

9 is a plan view showing the position of the design mark and the position of the measured mark in the exposure control process of the first embodiment.

FIG. 10 is a plan view for explaining a method of coordinate conversion corresponding to strain of an exposed substrate in the exposure control process of the first embodiment. FIG.

11A is a plan view showing an example of an image after coordinate conversion of the exposure drawing device according to the first embodiment, and shows a case where coordinate conversion corresponding to strain of the substrate to be exposed is not performed.

11B is a plan view showing an example of an image after coordinate conversion of the exposure drawing device according to the first embodiment, and shows a case where the strain correction amount is reduced and the coordinate conversion corresponding to the strain of the substrate to be exposed is performed.

11C is a plan view showing an example of an image after the coordinate conversion of the exposure drawing device according to the first embodiment, and shows a case where the coordinate conversion corresponding to the strain of the substrate to be exposed is performed without reducing the strain correction amount.

FIG. 12 is a cross-sectional view showing an example of an exposed substrate in a case where a circuit pattern is drawn in a plurality of layers on an exposed substrate in the exposure drawing device according to the first embodiment.

FIG. 13 is a plan view showing an example of an image drawn on each layer in the case where the circuit pattern is multi-layered on the substrate to be exposed in the exposure drawing device according to the first embodiment.

Figure 14 is a plan view for explaining an annular ring.

Fig. 15 is a flowchart showing the flow of processing of the exposure control processing program of the second embodiment.

16A is a plan view showing an example of an image after coordinate conversion of the exposure drawing device according to the second embodiment, and shows a case where coordinate conversion corresponding to strain of the substrate to be exposed is not performed.

16B is a plan view showing an example of an image after the coordinate conversion of the exposure drawing device according to the second embodiment, and shows a case where coordinate conversion corresponding to the strain of the substrate to be exposed is performed based on the restriction of the hole ring.

Fig. 16C is a diagram showing the coordinate conversion of the exposure drawing device of the second embodiment; A plan view of an example of an image shows a case where the coordinate conversion corresponding to the strain of the substrate to be exposed is performed without providing the above limitation.

17 is a plan view for explaining a method of coordinate conversion corresponding to strain of an exposed substrate in the exposure control process of the second embodiment.

FIG. 18 is a flowchart showing a flow of processing of the exposure control processing program of the third embodiment.

19A is a plan view showing a region to be an object of coordinate conversion corresponding to strain of a substrate to be exposed in the exposure drawing device of the fourth embodiment.

19B is a plan view showing a region to be an object of coordinate conversion corresponding to the strain of the substrate to be exposed in the exposure drawing device of the fourth embodiment.

19C is a plan view showing a region which is an object of coordinate conversion corresponding to the strain of the substrate to be exposed in the exposure drawing device of the fourth embodiment.

FIG. 20A is a plan view showing a region to be an object of coordinate conversion corresponding to strain of an exposed substrate in the exposure drawing device of the fourth embodiment.

FIG. 20B is a plan view showing a region to be an object of coordinate conversion corresponding to the strain of the substrate to be exposed in the exposure drawing device of the fourth embodiment.

FIG. 20C is a plan view showing a region to be an object of coordinate conversion corresponding to the strain of the substrate to be exposed in the exposure drawing device of the fourth embodiment.

21 is a flow chart showing the flow of processing of the exposure control processing program of the fourth embodiment.

[First Embodiment]

Hereinafter, the exposure drawing device of the embodiment will be described in detail with reference to the drawings. Bright. Further, in the present embodiment, a case where the present invention is applied to an exposure drawing device that exposes a light beam to an exposed substrate (the substrate to be exposed C below) and draws a circuit pattern to indicate solder resist is described as an example. A pattern is drawn by a solder resist pattern or the like of the opening hole for the component mounting of the layer. Further, the substrate C to be exposed is a flat substrate such as a printed circuit board or a glass substrate for a flat panel display.

As shown in FIGS. 1 and 2, the exposure drawing device 10 of the present embodiment includes a flat plate stage 12 for fixing the substrate C to be exposed. A plurality of suction holes for taking in air are provided on the upper surface of the platform 12. Thereby, when the exposed substrate C is placed on the upper surface of the stage 12, the exposed substrate C is vacuum-adsorbed to the stage 12 by sucking air between the exposed substrate C and the stage 12.

Further, hereinafter, the direction in which the stage 12 is moved is defined as the Y direction, the direction orthogonal to the horizontal direction in the horizontal direction is defined as the X direction, and the direction orthogonal to the Y direction in the vertical plane is defined as Z. direction.

Further, the platform 12 is supported by a flat base 16 which is arranged to be movable on the upper surface of the table-like base 14. That is, one or a plurality of (two in the present embodiment) guide rails 18 are provided on the upper surface of the base 14. The base 16 is supported so as to be freely movable in the Y direction along the guide rail 18, and is driven by a drive mechanism (such as the following stage drive unit 42) including a motor or the like to move. The platform 12 moves in the Y direction along the guide rail 18 in conjunction with the movement of the base 16.

A shutter 20 that is erected across the two rails 18 is provided on the upper surface of the base 14. The exposed substrate C placed on the stage 12 moves in such a manner that the guard rail 18 enters and exits the opening of the shutter 20. An exposure portion 22 that exposes a light beam toward the opening is attached to an upper portion of the opening of the shutter 20. By the exposure unit 22, on the platform When the guide rail 18 moves along the guide portion 18, the light beam is exposed to the upper surface of the substrate C to be exposed placed on the stage 12.

The exposure unit 22 of the present embodiment is configured by including a plurality of (ten in the present embodiment) exposure heads 22a. Further, an optical fiber 26 and a signal cable 30 are connected to the exposure unit 22, and the optical fiber 26 is taken out from the light source unit 24, which is extracted from the image processing unit 28 described below.

Each of the exposure heads 22a has a digital micro-mirror device (DMD) as a reflective spatial light modulation element. The exposure head 22a modulates the light beam from the light source unit 24 by controlling the DMD based on the image information input from the image processing unit 28. The exposure drawing device 10 exposes the substrate C to be exposed by irradiating the modulated light beam to the substrate C to be exposed. Further, the spatial light modulation element is not limited to the reflection type, and may be a transmissive spatial light modulation element such as a liquid crystal.

On the upper surface of the base 14, a shutter 32 that is erected across the two guide rails 18 is further provided. The exposed substrate C placed on the stage 12 moves in such a manner that the guard rail 18 enters and exits the opening of the shutter 32.

One or a plurality of (two in the present embodiment) imaging units 34 for imaging the opening are attached to the upper portion of the opening of the shutter 32. The imaging unit 34 is a charge coupled device (CCD) camera or the like in which a single-stroke flashlight is provided. Further, in the upper portion of the opening portion of the shutter 32, a rail 34a is provided in a horizontal direction (X direction) perpendicular to the moving direction (Y direction) of the stage 12 in the horizontal plane, and each of the photographing portions 34 is guided by the rail 34a to be movable. Ground setting. By the imaging unit 34, when the stage 12 moves along the guide rail 18 and is located at the opening, the image is placed on the exposed substrate C placed on the stage 12. surface.

Next, the exposure processing by the exposure head 22a of the present embodiment will be described.

As shown in FIG. 3, the region exposed by the exposure head 22a, that is, the image region P1, is a rectangular shape in which one side is inclined at a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 12. Further, if the stage 12 exposes the light beam by the exposure head 22a while moving in the opening portion of the shutter 20, the strip-shaped finish exposure is formed with respect to each of the exposure heads 22a with respect to the substrate C to be exposed as the stage 12 moves. Area P2.

Further, as shown in FIG. 4, each of the exposure heads 22a arranged in a matrix shape is one by one in the X direction with a natural multiple of the length of the long side of the image region P1 (one time in the present embodiment). Offset configuration. Further, each of the completed exposure regions P2 is formed to partially overlap the adjacent completed exposure region P2.

Next, the configuration of the electric system of the exposure drawing device 10 of the present embodiment will be described.

As shown in FIG. 5, the exposure drawing device 10 is provided with a system control unit 40 that is electrically connected to each unit of the apparatus, and the system control unit 40 collectively controls the respective units of the exposure drawing apparatus 10. Further, the exposure drawing device 10 includes a stage driving unit 42, an operation device 44, an imaging driving unit 46, and an external input/output unit 48.

The system control unit 40 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), and a hard disk drive (Hard Disk Drive, HDD). Further, the system control unit 40 causes the light beam to be emitted from the light source unit 24 by the CPU, and the timing of the movement of the corresponding stage 12 (timing) The corresponding image information is output by the image processing unit 28, thereby controlling exposure of the light beam to the substrate C to be exposed.

The platform drive unit 42 has a drive mechanism including a motor or a hydraulic pump, and the platform 12 is driven by the control of the system control unit 40.

The operation device 44 includes a display unit that displays various kinds of information under the control of the system control unit 40, and an input unit that inputs various kinds of information by a user operation.

The imaging drive unit 46 includes a drive mechanism including a motor or a hydraulic pump, and the imaging unit 34 is driven by the control of the system control unit 40.

The external input/output unit 48 inputs and outputs various kinds of information to and from an information processing device such as a personal computer connected to the exposure drawing device 10.

Here, the exposure drawing device 10 of the present embodiment draws an image such as a drawing pattern indicated by image information on the substrate C to be exposed as described above. On the other hand, as shown in FIG. 2, an alignment mark (hereinafter referred to as "reference mark") M as a reference for positioning when an image is drawn is provided on the substrate C to be exposed. The exposure drawing device 10 captures the reference mark M by the imaging unit 34 before exposing the light beam to the substrate C to be exposed, and measures the position of the reference mark M based on the captured image. Next, the exposure drawing device 10 determines the region in which the image is drawn based on the measured position.

That is, as shown in FIG. 6A, the above-described four reference marks M1 to M4 are provided in the substrate C to be exposed of the present embodiment (hereinafter, four reference marks are also collectively referred to as reference marks M). Further, on the substrate C to be exposed, the image 62 is usually drawn at a predetermined relative position with respect to the reference marks M1 to M4. Further, in the present embodiment, the reference mark M1 is provided at the position on the upper left side in the front view of FIG. 6A and FIG. 6B, the reference mark M2 is provided on the upper right position, and the base is provided at the lower left position. The reference mark M3 and the position mark M4 are provided at the lower right position. The exposure drawing device 10 estimates the strain of the substrate C to be exposed based on the offset amount of each of the measured reference marks M1 to M4 from the positions of the design reference marks M1 to M4. Further, the exposure drawing device 10 corresponds to the estimated strain of the substrate C to be exposed, and as an example, the image 62 is deformed as shown in FIG. 6B, and the deformed image 62 is drawn on the substrate C to be exposed.

Further, in the exposure drawing device 10 of the present embodiment, when the image is deformed in accordance with the strain of the substrate C to be exposed, as an example, as shown in FIG. 7A, the entire region to be drawn can be set as a coordinate transformation. The object, that is, the object area (the area indicated by the dot pattern in FIGS. 7A and 7B) 64. However, the target region 64 is not limited thereto, and may be any size and shape if the relative positions with respect to the reference marks M1 to M4 are known in advance. For example, as shown in FIG. 7B, a rectangular region surrounded by four reference marks M1 to M4 may be referred to as a target region 64.

In addition, when an image other than the circuit pattern such as the identification number of the exposed substrate C is drawn at the end portion of the substrate C to be exposed, or the like, the drawing region of the image is not subjected to coordinate conversion but only the drawing region of the circuit pattern. Perform coordinate transformation. This is because, for example, in the case of performing exposure drawing on an image indicating the identification number of the substrate C to be exposed, it is easier to confirm the drawing content in accordance with the strain of the substrate C to be exposed without deforming the image.

Next, the operation of the exposure drawing device 10 of the present embodiment will be described with reference to Fig. 8 . In addition, FIG. 8 is a flowchart showing a flow of processing of an exposure control processing program executed by the system control unit 40 of the exposure drawing device 10 when an execution instruction is input via the operation device 44. This program is stored in advance in a predetermined area of the ROM provided in the system control unit 40.

First, in step S101, coordinate data indicating that the image is drawn on the substrate C to be exposed (in the present embodiment, an image showing a drawing pattern having a rectangular outer shape) is acquired (in this embodiment, vector data) ), that is, image information. At this time, the system control unit 40 reads the image information stored in the HDD or acquires the image information by externally inputting the image information via the external input/output unit 48. In the present embodiment, the outline of the image represented by the image information is rectangular, but the shape is not limited thereto, and may be any shape. Further, in the present embodiment, the image information is vector data indicating a drawing pattern or the like, but is not limited thereto, and may be raster data.

In the next step S103, position information indicating the position (first position) of the design reference marks M1 to M4 of the substrate C to be exposed is acquired as coordinate data. At this time, the system control unit 40 reads the position information previously stored in the HDD, or acquires the position information by externally inputting the position information via the external input/output unit 48.

Alternatively, the correspondence table may be pre-memorized in the HDD, and the correspondence table associates the identification information of the exposed substrate C with the position information indicating the position of the design reference marks M1 to M4, and derives the design based on the correspondence table. The position of the reference marks M1 to M4. More specifically, the exposed substrate C can be identified based on the positions of the reference marks M1 to M4 obtained by the mark measurement of the following step S107, and the identification of the exposed substrate C obtained by the recognition can be obtained. The information establishes associated location information.

In the next step S105, the stage 12 is moved until the substrate C to be exposed is positioned at the bottom position, that is, the respective reference marks M1 to M4 are included in the position of the imaging region of the imaging unit 34.

In the next step S107, the positions (second positions) of the actual reference marks M1 to M4 are measured. At this time, the system control unit 40 extracts the regions corresponding to the reference marks M1 to M4 from the image captured by the imaging unit 34, and derives the position coordinates of the reference mark M. In the present embodiment, the coordinates of the center of gravity of the region of the reference mark M in the above-described captured image are used as the position coordinates of the reference marks M1 to M4. Further, in the present embodiment, the position coordinates of the reference mark M are derived from the captured image. However, the present invention is not limited thereto, and information indicating the position coordinates of the reference mark M obtained by the measurement may be input from the outside.

As an example, as shown in FIG. 9, the positions of the measured reference marks M1 to M4 are shifted from the positions of the design reference marks M1 to M4, respectively. Further, in Fig. 9, the positions of the measured reference marks M1 to M4 are indicated by solid lines, and the positions of the design reference marks M1 to M4 are indicated by broken lines. In the following, as shown in FIG. 9 , the front and rear directions of the substrate C to be exposed are referred to as the x direction, and the vertical direction is referred to as the y direction.

In the next step S109, the rotation of the exposed substrate C is derived based on the offset of the position of the design reference marks M1 to M4 obtained in step S103 and the positions of the reference marks M1 to M4 measured in step S107. At least one of a quantity, an offset amount, and a telescopic magnification. In addition, the above-mentioned amount of rotation means a predetermined orthogonal coordinate system (in the present embodiment, as an example, the xy coordinate system shown in FIG. 9), from the position of the design reference mark M to The rotation angle of the position of the corresponding actual reference mark M. Here, the above-described offset amount refers to a parallel movement amount from the position of the design reference mark M to the position of the corresponding actual reference mark M in the orthogonal coordinate system. Further, the above-described expansion ratio refers to a self-design basis in the above-described orthogonal coordinate system. The enlargement or reduction magnification of the position of the quasi-marker M to the position of the corresponding actual fiducial mark M. In the present embodiment, the amount of rotation, the amount of deflection, and the expansion/contraction ratio of all the substrates C to be exposed are derived. At this time, by using the least square method of each of the four reference marks M1 to M4, the amount of deviation of the x in the x direction of the substrate C to be exposed, the amount of deviation of the y direction of the sound, and the expansion and contraction magnification kx in the x direction are derived. Each parameter such as the expansion/contraction ratio ky and the rotation amount θ in the y direction.

That is, when the above parameters are derived, the positions of the design reference marks M1 to M4 and the positions of the reference marks M1 to M4 measured by the processing of step S107 include the above-described respective parameters and have a clear relationship. In this case, the above-described respective parameters are determined such that the average deviation of the above-described parameters is the smallest (for example, refer to JP-A-61-44429, etc.). The method of determining each of the above parameters is a known method used in affine transformation or the like, and thus the description thereof is omitted here.

In the next step S111, the strain correction amount (dx, dy) for correcting the strain of the substrate C to be exposed is derived. Further, the amount of strain of the substrate C to be exposed is represented by the respective offset amounts of the four reference marks M1 to M4. Therefore, the strain correction amount for correcting the strain of the exposed substrate C is expressed as (dx0, dy0) to (dx3, dy3) with respect to the respective reference marks M1 to M4, respectively. In the present embodiment, the strain correction amount of each of the reference marks M1 to M4 is the following residual (offset amount), that is, the design based on the amount of deviation, the expansion and contraction magnification, and the amount of rotation derived in step S109. The residual (offset) of the position of the upper reference marks M1 to M4 and the positions of the measured reference marks M1 to M4.

In the next step S113, the adjustment parameter corresponding to the coordinate correction amount of the substrate C to be exposed is corrected while the coordinates in the image information are corrected. Information of (Mx, My) (0 < Mx < 1, 0 < My < 1) is read from the above HDD. In addition, Mx is an adjustment parameter in the x direction, and My is an adjustment parameter in the y direction. The degree of alignment with respect to the offset of the reference marks M1 to M4 caused by the strain of the substrate C to be exposed is determined by the adjustment parameters (Mx, My) in the present embodiment. In the present embodiment, the adjustment parameter is a ratio at which the strain correction amount is reduced (hereinafter also referred to as "correction ratio"). That is, in the case where the adjustment parameter (Mx, My) = (0, 0), the correction corresponding to the strain of the substrate C to be exposed is not performed, and the adjustment parameter is (Mx, My) = (1, 1). Next, the correction corresponding to the strain of the substrate C to be exposed is performed without reducing the correction amount. Further, in the case where the adjustment parameter is greater than 0 and less than 1, the strain correction amount is reduced according to the adjustment parameter, and the correction corresponding to the strain of the substrate C to be exposed is reduced.

In the present embodiment, the information indicating the adjustment parameter is input by the user via the operation device 44 in advance, and is stored in the HDD. Further, in this step S113, an input indicating information indicating an adjustment parameter via the operation device 44 may be received. Further, in the present embodiment, it is assumed that 0 < Mx < 1, and 0 < My < 1. However, the present invention is not limited thereto, and may include a case where correction of the strain corresponding to the substrate C to be exposed is not performed, and a case where the correction is performed without reducing the correction amount, and is set to 0≦Mx≦1, 0≦My≦. 1.

In the next step S115, the strain correction amount (dx, dy) of the substrate C to be exposed is reduced based on the adjustment parameters (Mx, My) read in step S113. Further, in the present embodiment, the strain correction amount (dx', dy') of the reduced strain correction amount (dx, dy) is calculated by the following formula (1).

[Number 1] ( dx , dy )={( dx 0, dy 0), ( dx 1, dy 1), ( dx 2, dy 2), ( dx 3, dy 3)} dx '= Mx × dx dy '= Mx × dy ...(1)

In the next step S117, the coordinates (x1, y1) of the object of the coordinate transformation in the image information are converted into corresponding values using the strain correction amount (dx', dy') obtained by the processing of step S115. A coordinate (xm, ym) corrected for the strain of the substrate C to be exposed.

At this time, in the present embodiment, as shown in FIG. 10, the system control unit 40 divides the image represented by the image information into a plurality of pieces based on the coordinates of the coordinate conversion target (this embodiment). In the middle of the four regions, the areas SA0 to SA3 of each divided region are derived. Here, when the division is performed, as shown in FIG. 10, in the image represented by the image information, by drawing a line parallel to each side of the image and passing through the coordinates of the transformation target, the division is performed. Into the above four areas. In the present embodiment, the area of the upper left area of the front view of FIG. 10 is represented by SA0, the area of the upper right area is represented by SA1, the area of the lower left area is represented by SA2, and the area of the lower right area is represented by SA3.

Further, the system control unit 40 substitutes the areas SA0 to SA3 of the divided regions obtained in this way and the strain correction amount (dx', dy') obtained by the processing of step S115 into the following formula (2). Thereby, the obtained value is the strain correction amount (ddx, ddy) of each coordinate (x1, y1) which is the object of the coordinate transformation in the above image information.

For example, as shown in FIG. 10, in the case of dx0'=1, dx1'=2, dx2'=5, dx3'=10, SA0=1, SA1=3, SA2=3, SA3=9, SS=16 Next, ddx = (10 × 9 + 5 × 3 + 2 × 3 + 1 × 1) / 16 = 7.

Further, the method of deriving the strain correction amount (ddx, ddy) is not limited to this. In other words, when the position coordinates in the coordinate data of the image to be drawn are P(x, y), the internal division ratio with respect to each side of the reference rectangle is obtained. The position P' corresponding to the internal division ratio may be defined for the corrected image, and the offset amount of the position P and the position P' may be set as the strain correction amount (ddx, ddy).

Further, the system control unit 40 sets the strain correction amount (ddx, ddy) of each coordinate in the image information, the offset amount ofsx in the x direction, the offset amount ofsy in the y direction, and the expansion and contraction magnification kx and y directions in the x direction. The expansion ratio ky and the rotation amount θ are substituted into the following formula (3). Thereby, the obtained value becomes a coordinate (xm, ym) obtained by correcting each coordinate (x1, y1) based on the strain correction amount of the substrate C to be exposed.

[Number 3] xm = (kx × x 1+ ddx) × cos θ - (ky × y 1+ ddy) × sin θ + ofsx ym = (kx × x 1+ ddx) × sin θ + (ky × y 1 + ddy )×cos θ + ofsy ...(3)

In the next step S119, the stage driving portion 42 is controlled to move the stage 12 to a position where the position of the upper surface of the exposed substrate C is exposed by the light beam emitted from the exposure portion 22.

In the next step S121, the image represented by the image information is drawn on the substrate C to be exposed by using the coordinates (xm, ym) obtained by the process of the above step S117, via the light source unit 24 and The image processing unit 28 controls the exposure head 22a. At this time, the system control unit 40 controls the stage driving unit 42 so that the stage 12 moves at a predetermined speed to expose the substrate to be exposed. When C moves, the exposure head 22a is controlled such that the image is drawn on the substrate C to be exposed.

In the next step S123, the mobile platform 12 is moved to the position where the exposed substrate C can be removed from the platform 12, thereby ending the execution of the exposure control processing program.

For example, in the case where the adjustment parameter read in step S113 of the exposure control processing program is 0% (Mx=0, My=0), that is, if the correction corresponding to the strain of the substrate C to be exposed is not performed, As shown in FIG. 11A, a rectangular drawing pattern is drawn regardless of the strain of the substrate C to be exposed.

In the case where the adjustment parameter is 50% (half), as an example, as shown in FIG. 11B, after the strain correction amount of the reference mark M is 50%, the drawing pattern is deformed based on the strain correction amount. Depiction.

Further, when the adjustment parameter is 100% (Mx=1, My=1), as an example, as shown in FIG. 11C, the image is deformed and drawn using the strain correction amount itself of the reference mark M. In this case, since the image is deformed by the position corresponding to the reference marks M1 to M4, the drawing pattern is deformed into a shape corresponding to the strain of the substrate C to be exposed.

Further, for example, as shown in FIG. 12, when the substrate C to be exposed is sequentially formed by stacking a plurality of (for example, four) circuit patterns 62A to 62D from the lower side, development is performed every time the drawing of each layer is completed. Chemical treatment such as etching and peeling. Further, in order to laminate the layers, lamination of the prepreg layer, processing of via holes, filled via plating, roughening treatment, lamination of dry film photoresist (DFR), etc. are performed. . Therefore, as shown in FIG. 13, it is assumed that for each of the first layer circuit pattern 62A, the second layer circuit pattern 62B, the third layer circuit pattern 62C, and the fourth layer circuit pattern 62D, the strain of the exposed substrate C increases. .

In addition, in FIG. 11A to FIG. 11C, in order to make the positional relationship of the pad 66 and the via hole 68 easy to understand, the position of the reference mark M of the layer to be drawn is provided in the circuit pattern to be drawn. The disk 66 is provided with a via hole 68 at a position of the reference mark M of the other layer. In the present embodiment, when the circuit pattern is drawn, the correction amount corresponding to the strain of the substrate C to be exposed is corrected so that the via hole 68 is housed inside the pad 66 of the substrate C to be exposed. cut back. Thereby, even when the circuit pattern is deformed in accordance with the strain of the substrate C to be exposed, the electronic component can be mounted on the substrate with high precision.

Further, in the present embodiment, the strain correction amount is reduced by multiplying the strain correction amount of each of the reference marks M1 to M4 by a value smaller than 1 (adjustment parameter (Mx, My)), but the present invention is not limited thereto. . In other words, the strain correction amount may be reduced by dividing the strain correction amount by a value exceeding 1 or by subtracting a predetermined amount from the strain correction amount. Alternatively, the plurality of multiplications, divisions, and subtractions may be combined to reduce the strain correction amount.

Further, when a plurality of circuit patterns are stacked on the exposed substrate C and the circuit pattern is drawn on the uppermost layer of the exposed substrate C, the strain correction amount (dx', dy') may be set to The calculation of the above formula (2) is performed at (0, 0). In other words, when an electronic component having a predetermined shape (for example, a rectangular shape) is stacked on the uppermost layer of the multilayer wiring board, if the strain correction amount of the circuit pattern drawn at the highest position is large, the circuit pattern to be drawn is large. The possibility of deformation that could not install the electronic part. However, since the strain is not corrected in the uppermost layer, the deformation of the circuit pattern of the uppermost layer can be avoided, and the electronic component can be surely mounted on the substrate C to be exposed.

Moreover, in the present embodiment, the present invention is applied to the substrate to be exposed Although the case where the exposure light drawing device 10 which draws a circuit pattern is exposed by C light beam was demonstrated, it is not limited to this. That is, the present invention can be applied to an arbitrary drawing device for drawing an image to be drawn based on the position of the reference mark provided on the object to be drawn. Further, the present invention can also be applied to a laser processing apparatus and a drilling processing apparatus for forming a via hole or the like, and the via hole is electrically connected between layers of each layer in which a circuit pattern is drawn. Further, it can also be applied to an exposure apparatus and a processing apparatus for forming a component mounting hole in a solder resist layer for protecting a circuit pattern of a substrate. Thereby, the electronic component can be mounted on the substrate more reliably.

[Second Embodiment]

Hereinafter, the exposure drawing device 10 according to the second embodiment of the present invention will be described.

The exposure drawing device 10 of the second embodiment is configured as shown in FIGS. 1 to 6B in the same manner as the exposure drawing device 10 of the first embodiment.

In the exposure drawing device 10 of the second embodiment, when the correction is performed in accordance with the strain of the substrate C to be exposed, the amount of change corresponding to the amount of correction (dx, dy) is set in accordance with the value of the annular ring. As shown in FIG. 14, the hole ring is an annular region surrounding the entire circumference of the via hole 68 in the case where the via hole 68 is left inside the pad 66, and the pad is formed. The width of the annular region in the case where the diameter is D and the aperture is d, that is, the width L of the orifice ring is represented by L = (Dd)/2.

Next, the operation of the exposure drawing device 10 of the present embodiment will be described with reference to Fig. 15 . In addition, FIG. 15 is a flowchart showing a flow of a process of the exposure control processing program executed by the system control unit 40 of the exposure drawing device 10 of the second embodiment when an execution instruction is input via the operation device 44. The program is pre-memorized in the system The control unit 40 is in a predetermined area of the ROM. Incidentally, the steps in FIG. 15 that are the same as those in FIG. 8 are denoted by the same step numbers as those in FIG. 8, and the description thereof is omitted in principle.

First, in steps S101 to S111, the same processing as step S101 to step S111 of the first embodiment is performed.

In the next step S201, the width L of the aperture ring is derived. In the present embodiment, information indicating the pad diameter D of the pad 66 and the aperture d of the via hole 68 is obtained, and the pad diameter D and the aperture d are substituted into the following equation (4), thereby obtaining the width L of the aperture ring.

Further, the pad diameter D and the aperture d may be input by the user via the operating device 44 based on the design value of the circuit pattern. Further, the method of deriving the width L of the eyelet is not limited thereto. For example, the information processing device connected to the outside may be input via the external input/output unit 48, or may be stored in advance in a memory member such as a RAM or an HDD. Further, the width L of the eyelet ring may be set smaller than the actual value in consideration of the drawing error, and the margin may be set so that the via hole 68 does not protrude from the pad 66.

In the next step S203, it is determined whether or not the arbitrary offset amount dE of the reference marks M1 to M4 caused by the strain of the substrate C to be exposed as shown in the following formula (5) is larger than the width L of the eyelet.

In the case where it is determined in step S203 that the offset amount dE of the reference marks M1 to M4 is larger than the width L of the eyelet, the process proceeds to step S205, the via hole 68 is housed to the pad 66, and the shape is maintained as much as possible. The amount of strain correction (dx, dy) limits the amount of strain correction (dx, dy). The purpose of such processing is to avoid the positional deviation of the pads 66 and the via holes 68 between the layers when the circuit pattern is drawn in multiple layers on the substrate C to be exposed, and to maintain the shape as much as possible. In the present embodiment, the strain correction amount (dx) derived from the processing of step S111 is substituted by shifting the offset dE, the width L of the orifice ring, and the strain correction amount (dx, dy) into the following equation (6). , dy) is corrected to the strain correction amount (dx', dy'). Thereby, the strain correction amount (dx, dy) is corrected to the maximum strain correction amount (dx', dy') in the range in which the via hole 68 is housed inside the pad 66. Further, when the solder resist pattern indicating the component mounting opening hole of the solder resist layer is drawn as the drawing pattern, the strain correction may be restricted so that the opening hole is housed inside the conductor pad for bonding to the component. Quantity (dx, dy).

On the other hand, if it is determined in step S203 that the offset amount dE of the reference marks M1 to M4 is less than or equal to the width L of the aperture ring, the process proceeds to step S207, and the strain correction amount (dx, for correction) is performed. Dy) does not set a limit. That is, the strain correction amount (dx, dy) derived in step S111 is directly replaced with the strain correction amount (dx', dy') using the following formula (7).

[Number 7] dx '= dx dy '= dy ...(7)

In the next steps S117 to S123, the same processing as that of step S117 to step S123 of the first embodiment is performed, and the execution of the exposure control processing program is ended.

For example, in the case where the correction corresponding to the strain of the substrate C to be exposed is not performed, as shown in FIG. 16A, a rectangular image is drawn regardless of the strain of the substrate C to be exposed. In this case, even if the strain of the substrate C to be exposed occurs, the image to be drawn is not deformed, so that the via hole 68 is not necessarily accommodated inside the pad 66. In addition, as shown in FIG. 11A to FIG. 11C, in the circuit pattern to be drawn, the positional relationship between the pad 66 and the via hole 68 is easily understood, and is used as a drawing target. The pad 66 is provided at the position of the reference mark M of the layer, and the via 68 is provided at the position of the reference mark M of the other layer.

Further, in the case where the width L of the aperture ring derived in step S207 is a predetermined value (for example, 20 μm) and the offset amount is larger than the width L of the aperture ring, as an example, as shown in FIG. 16B, the reference mark M is reduced. After the strain correction amount, the image is deformed based on the strain correction amount and rendered. At this time, as shown in FIG. 17, the correction amount with respect to the strain correction amount (dx, dy) is restricted so that the inside of the pad 66 accommodates the via hole 68, and the strain corresponding to the substrate C to be exposed is caused. Like deformation. Thereby, the via hole 68 can be housed inside the pad 66, and the electronic component can be surely mounted on the exposed substrate C.

Further, when the width L of the hole ring is a predetermined value (for example, 20 μm) and the offset amount is less than or equal to the width L of the eyelet ring, as an example, strain correction using the reference mark M is performed as shown in FIG. 16C. The amount itself causes the image to be deformed Depiction. In this case, the image to be drawn is deformed in accordance with the strain of the substrate C to be exposed. Therefore, the via hole 68 can be surely accommodated in the inside of the pad 66. However, when the strain is large, the borrowing is performed. It is not always possible to mount the electronic component on the substrate C to be exposed by deforming the mounting region of the electronic component.

[Third embodiment]

Hereinafter, the exposure drawing device 10 according to the third embodiment of the present invention will be described.

The exposure drawing device 10 of the third embodiment is configured as shown in FIGS. 1 to 6B in the same manner as the exposure drawing device 10 of the first embodiment and the second embodiment.

The exposure drawing device 10 of the third embodiment reduces the strain correction amount (dx, dy) according to the adjustment parameter (Mx, My) when the strain is corrected corresponding to the strain of the substrate C to be exposed, and changes according to the width L of the aperture ring. The correction amount (dx, dy) sets the limit.

Next, the operation of the exposure drawing device 10 of the present embodiment will be described with reference to Fig. 18 . In addition, FIG. 18 is a flowchart showing a flow of a process of an exposure control processing program executed by the system control unit 40 of the exposure drawing device 10 when an execution instruction is input via the operation device 44. This program is stored in advance in a predetermined area of the ROM of the system control unit 40.

Incidentally, the steps of the same processing as those of FIG. 8 or FIG. 15 in FIG. 18 are denoted by the same step numbers as those in FIG. 8 or FIG. 15, and the description thereof will be omitted in principle.

First, in steps S101 to S113, the same processing as step S101 to step S113 of the first embodiment is performed. In the next step S201 and step S203, the same as step S201 and step S203 of the second embodiment. Kind of processing.

In the case where it is determined in step S203 that the offset amount dE of the reference marks M1 to M4 is larger than the width L of the eyelet, the process proceeds to step S301, the via hole 68 is housed to the pad 66, and the shape is maintained as much as possible. The amount of strain correction (dx, dy) limits the amount of strain correction (dx, dy). In the present embodiment, the strain correction amount (dx, dy), the offset amount dE, the width L of the orifice ring, and the adjustment parameter (Mx, My) read in the step S113 are substituted into the following formula (8). The strain correction amount (dx, dy) derived in step S111 is corrected to the strain correction amount (dx', dy'). Thereby, the strain correction amount (dx, dy) is corrected to the shape-adjusted strain correction amount (dx', dy') in which the via hole 68 is housed inside the pad 66.

On the other hand, if it is determined in step S203 that the offset amount dE of the reference marks M1 to M4 is less than or equal to the width L of the aperture ring, the process proceeds to step S303, and the strain correction amount (dx, for correction) is performed. Dy) does not set a limit. That is, the adjustment parameter (Mx, My) read in step S113 is substituted into the following formula (9), and the strain correction amount (dx, dy) derived in step S111 is corrected to the strain correction amount (dx', Dy').

[Number 9] dx '= Mx × dx dy '= My × dy ...(9)

In the next step S117 to step S123, respectively, and the first The same processing as step S117 to step S123 of the embodiment ends the execution of the exposure control processing program.

[Fourth embodiment]

Hereinafter, the exposure drawing device 10 of the fourth embodiment of the present invention will be described.

The exposure drawing device 10 of the fourth embodiment is configured as shown in FIGS. 1 to 6B in the same manner as the exposure drawing device 10 of the first to third embodiments.

The exposure drawing device 10 of the first embodiment to the third embodiment performs coordinate conversion corresponding to the strain of the substrate C to be exposed based on the four reference marks M1 to M4 in one target region 64. On the other hand, the exposure drawing device 10 of the fourth embodiment performs coordinate conversion on the strain corresponding to the substrate C to be exposed based on the different reference marks M for the plurality of target regions 64.

For example, as shown in FIG. 19A, the plurality of target regions 64 may be used as each region in which an image represented by image information is divided into a plurality of (for example, four) regions. Further, when dividing the image, the division is performed in such a manner that four reference marks M arranged in two rows and two rows in the reference mark M provided in a lattice pattern are included in each divided region.

Alternatively, as shown in FIG. 19B, after the outer peripheral portion of the image is set as a non-target region, the region obtained by removing the non-target region from the image may be divided into a plurality of (for example, four) regions. The area is set to the object area 64. Further, when dividing the image, the division is performed by dividing the area surrounded by the four reference marks M arranged in two rows and two rows in the reference mark M arranged in a matrix form as each division. region.

Alternatively, as shown in FIG. 19C, a part of the plurality of images (for example, four) may be extracted, and each of the extracted regions may be the target region 64. Further, each of the partial regions may be extracted in such a manner that the corner portions of the respective target regions 64 are located, respectively, in each of the four reference marks M arranged in two rows and two rows in the fiducial mark M arranged in a matrix. One nearby.

Alternatively, as shown in FIG. 20A, the plurality of target regions 64 may be formed as a region in which an image represented by image information is divided into a plurality of (for example, four) regions. Further, each of the plurality of target regions 64 is divided so as to include four reference marks M arranged in two rows and two rows.

Alternatively, as shown in FIG. 20B, after the outer peripheral portion of the image is set as a non-target region, the region obtained by removing the non-target region from the image may be divided into a plurality of (for example, four) regions. The area is set as the object area 64. Further, each of the plurality of target regions 64 is divided so as to include four reference marks M arranged in two rows and two rows.

Alternatively, as shown in FIG. 20C, a part of the plurality of images (for example, four) may be extracted, and each of the extracted regions may be the target region 64. Further, four reference marks M arranged in two rows and two rows are formed in the interior of each of the target regions 64 or in the vicinity of the outer periphery of each of the target regions 64 in accordance with the shape or size of each of the target regions 64.

Next, the operation of the exposure drawing device 10 of the present embodiment will be described with reference to Fig. 21 . In addition, FIG. 21 is a flowchart showing a flow of a process of an exposure control processing program executed by the system control unit 40 of the exposure drawing device 10 when an execution instruction is input via the operation device 44. This program is stored in advance in a predetermined area of the ROM of the system control unit 40.

Incidentally, the steps of the same processing as those of FIG. 8 in FIG. 21 are denoted by the same step numbers as those in FIG. 8, and the description thereof will be omitted in principle.

First, in steps S101 to S107, the same processing as steps S101 to S107 of the first embodiment is performed.

In the next step S401, the reference mark M corresponding to one of the plurality of target regions 64 is used to derive the amount of rotation, the amount of deviation, and the expansion ratio of the substrate C to be exposed in the same manner as in step S109. .

In the next step S111 to step S117, the same processing as step S111 to step S117 of the first embodiment is performed.

In the next step S403, it is determined whether or not the coordinate conversion in step S117 is performed on the reference mark M corresponding to all the target regions 64 in the plurality of target regions 64. If the determination is negative in step S117, the process returns to step S401.

On the other hand, in the case of affirmative determination in step S403, the process proceeds to step S119. In steps S119 to S123, the same processes as steps S119 to S123 of the first embodiment are performed, and the execution of the exposure control processing program is ended.

Further, when the circuit pattern of each of the plurality of regions drawn on the substrate C to be exposed is deformed, the circuit patterns drawn between the adjacent regions may be overlapped or rotated by the parallel or rotational movement. Adjust the drawing area of the circuit pattern.

Further, the fourth embodiment is a configuration in which the following configuration is applied to each of the plurality of regions in the substrate C to be exposed, and the strain correction is reduced for each of the plurality of regions. Quantitative composition, but applied The embodiment of the configuration is not limited to this. That is, the configuration of the fourth embodiment can be applied to the second embodiment or the third embodiment.

The disclosure of Japanese Patent Application No. 2012-1779935 is incorporated herein by reference in its entirety.

All documents, patent applications, and technical standards described in the specification are incorporated in the specification as the

S101~S123‧‧‧Steps

Claims (11)

A drawing device includes: an acquisition member that acquires coordinate data indicating a first position, coordinate data indicating a drawing pattern, and coordinate data indicating a second position, wherein the first position is a plurality of reference marks provided on the substrate to be exposed In the design position, the drawing pattern is drawn on the exposed substrate defined by the first position, the second position is an actual position of each of the plurality of reference marks, and the deriving means is for each of the plurality of references Marking, deriving an offset correction amount for correcting an offset between the first position and the second position; reducing a component, reducing each offset correction amount derived by the deriving member by a predetermined ratio; and correcting the component, When the drawing pattern is drawn on the exposed substrate with reference to the coordinate data indicating the second position, the coordinate data indicating the drawing pattern is corrected based on the offset correction amount reduced by the reducing member. The drawing device according to claim 1, wherein the reducing member reduces each of the derived offset correction amounts by a predetermined ratio by performing at least one of the following, that is, by the above The offset correction amount is multiplied by a value smaller than 1, the offset correction amount is divided by a value larger than 1, and a predetermined amount is subtracted from the offset correction amount. The drawing device according to the first or second aspect of the invention, wherein the drawing pattern is a circuit pattern indicating an electronic wiring, and the ratio is a ratio defined by a method of accommodating a via hole in a pad of the drawing pattern. . A drawing device as described in claim 1 or 2, wherein The drawing pattern is a solder resist pattern indicating an opening hole for mounting a component of the solder resist layer, and the ratio is a ratio defined by accommodating the opening hole in the inside of the conductor pad to be bonded to the component. The drawing device according to claim 1 or 2, wherein the deriving member is an offset caused by parallel movement of the exposed substrate, a shift due to rotation, and a bias caused by expansion and contraction. At least one of the shifts removes the resulting offset and derives the offset correction. The drawing device according to claim 1 or 2, wherein the drawing pattern is each of a plurality of regions drawn on the substrate to be exposed, and the reference mark is provided on the plurality of the drawing patterns. Each of the plurality of regions, the reducing member is configured to reduce each of the offset correction amounts for each of the plurality of regions. The drawing device according to claim 1 or 2, further comprising: a receiving member that receives an input of an adjustment parameter, wherein the adjustment parameter is used to reduce each of the offset correction amounts derived by the deriving member, And the reducing member calculates the ratio based on the adjustment parameter received by the receiving member. The drawing device according to claim 1 or 2, wherein the deriving member draws a plurality of drawing patterns on the exposed substrate, and draws and draws on an uppermost layer of the exposed substrate. In the case of a pattern, the offset correction amount described above is set to zero. An exposure drawing device comprising: The drawing device according to the first or second aspect of the invention, wherein the exposure member exposes the drawing pattern on the exposed substrate based on the coordinate data corrected by the correction member of the drawing device. A drawing method includes: (a) acquiring coordinate data indicating a first position, coordinate data indicating a drawing pattern, and coordinate data indicating a second position, wherein the first position is a plurality of reference marks provided on the substrate to be exposed In the design position, the drawing pattern is drawn on the exposed substrate defined by the first position, wherein the second position is an actual position of each of the plurality of reference marks; and (b) for each of the plurality of references Marking, deriving an offset correction amount for correcting an offset of the first position and the second position; (c) reducing each offset correction amount derived by the above (b) by a predetermined ratio; (d) When the drawing pattern is drawn on the exposed substrate with reference to the coordinate data indicating the second position, the coordinate data indicating the drawing pattern is corrected based on the offset correction amount reduced by the reducing step. A recording medium, which is a computer readable recording medium for storing a program for causing a computer to execute a drawing program, and the drawing program includes: (a) acquiring coordinate data indicating a first position, coordinate data indicating a drawing pattern, and expressing The coordinate data of the second position, wherein the first position is a design position of the plurality of reference marks provided on the substrate to be exposed, and the drawing pattern is drawn on the exposed substrate defined by the first position, wherein The second position is an actual position of each of the plurality of reference marks; (b) deriving an offset correction amount for correcting the offset of the first position and the second position for each of the plurality of reference marks; (c) reducing the amount derived from the above (b) by a predetermined ratio (d) in the case where the drawing pattern is drawn on the exposed substrate with reference to the coordinate data indicating the second position, based on the offset correction amount reduced by the reducing member The above-mentioned coordinate data of the pattern is drawn.