KR102090015B1 - 슬러리 및/또는 화학적 배합물 공급 장치들 - Google Patents

슬러리 및/또는 화학적 배합물 공급 장치들 Download PDF

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Publication number
KR102090015B1
KR102090015B1 KR1020177011248A KR20177011248A KR102090015B1 KR 102090015 B1 KR102090015 B1 KR 102090015B1 KR 1020177011248 A KR1020177011248 A KR 1020177011248A KR 20177011248 A KR20177011248 A KR 20177011248A KR 102090015 B1 KR102090015 B1 KR 102090015B1
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South Korea
Prior art keywords
slurry
delete delete
module
chemical
pump
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Korean (ko)
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KR20170049625A (ko
Inventor
개리 알렌 바이어스
베라 데렉스케이
벤자민 패트릭 바이엘
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버슘머트리얼즈 유에스, 엘엘씨
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00Control of flow ratio
    • G05D11/02Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/131Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
    • G05D11/132Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
    • B01F15/0022
    • B01F15/0408
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40Mixing liquids with liquids; Emulsifying
    • B01F23/45Mixing liquids with liquids; Emulsifying using flow mixing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40Mixing liquids with liquids; Emulsifying
    • B01F23/49Mixing systems, i.e. flow charts or diagrams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/20Jet mixers, i.e. mixers using high-speed fluid streams
    • B01F25/21Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers
    • B01F25/211Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers the injectors being surrounded by guiding tubes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/50Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/60Pump mixers, i.e. mixing within a pump
    • B01F3/088
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20Measuring; Control or regulation
    • B01F35/21Measuring
    • B01F35/2132Concentration, pH, pOH, p(ION) or oxygen-demand
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80Forming a predetermined ratio of the substances to be mixed
    • B01F35/82Forming a predetermined ratio of the substances to be mixed by adding a material to be mixed to a mixture in response to a detected feature, e.g. density, radioactivity, consumed power or colour
    • B01F5/0212
    • B01F5/10
    • B01F5/12
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Accessories For Mixers (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020177011248A 2012-11-13 2013-11-13 슬러리 및/또는 화학적 배합물 공급 장치들 Active KR102090015B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201261725863P 2012-11-13 2012-11-13
US61/725,863 2012-11-13
US201361802950P 2013-03-18 2013-03-18
US61/802,950 2013-03-18
US201361861739P 2013-08-02 2013-08-02
US61/861,739 2013-08-02
US201361899560P 2013-11-04 2013-11-04
US61/899,560 2013-11-04
PCT/US2013/069868 WO2014078398A1 (en) 2012-11-13 2013-11-13 Slurry and/or chemical blend supply apparatuses

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157015652A Division KR101732092B1 (ko) 2012-11-13 2013-11-13 슬러리 및/또는 화학적 배합물 공급 장치들

Publications (2)

Publication Number Publication Date
KR20170049625A KR20170049625A (ko) 2017-05-10
KR102090015B1 true KR102090015B1 (ko) 2020-03-17

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KR1020177011248A Active KR102090015B1 (ko) 2012-11-13 2013-11-13 슬러리 및/또는 화학적 배합물 공급 장치들
KR1020157015652A Active KR101732092B1 (ko) 2012-11-13 2013-11-13 슬러리 및/또는 화학적 배합물 공급 장치들

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Country Status (8)

Country Link
EP (3) EP4166226B1 (enExample)
JP (1) JP6588337B2 (enExample)
KR (2) KR102090015B1 (enExample)
CN (1) CN104956278B (enExample)
IL (1) IL238770B (enExample)
SG (2) SG11201503698RA (enExample)
TW (2) TWI641936B (enExample)
WO (1) WO2014078398A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12272544B2 (en) 2021-12-24 2025-04-08 Semes Co., Ltd. Apparatus for treating substrate and method for treating substrate

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX338885B (es) * 2012-10-15 2016-05-04 Resverlogix Corp Compuestos utiles en la sintesis de compuestos de benzamida.
DE102015103484A1 (de) * 2015-03-10 2016-09-15 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG In-Line-Messeinrichtung
JP6540120B2 (ja) * 2015-03-16 2019-07-10 住友ベークライト株式会社 混合装置
US10768641B2 (en) * 2015-08-26 2020-09-08 Fujikin Incorporated Flow dividing system
JP7306608B2 (ja) * 2016-03-11 2023-07-11 フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド 高度な流体処理方法およびシステム
US10081036B2 (en) 2016-09-19 2018-09-25 Applied Materials, Inc. Methods and systems for liquid particle prequalification
CA3041841A1 (en) 2016-11-01 2018-05-11 Cms Technology, Inc. Systems and methods for improved blending of agents in chemical applications
JP6602334B2 (ja) * 2017-03-30 2019-11-06 栗田工業株式会社 規定濃度水の供給方法及び装置
CN107050700A (zh) * 2017-05-12 2017-08-18 广州三业科技有限公司 数字定比大流量混合装置及其测试系统和调试方法
CN107300488B (zh) * 2017-07-25 2023-11-24 广西糖业集团红河制糖有限公司 一种半自动间歇式蜜料采样装置
CN109551960A (zh) * 2017-09-27 2019-04-02 河北科技大学 一种艺术绘画专用二十四位自动调色板
CA2992255A1 (en) * 2018-01-18 2019-07-18 Nova Chemicals Corporation Odh complex with on-line mixer unit and feed line cleaning
KR101944309B1 (ko) * 2018-03-09 2019-02-01 (주)한국에이티아이 반도체 cmp 공정 연마제의 측정을 통한 품질 예측 및 조정 통합 시스템
JP7064979B2 (ja) * 2018-06-25 2022-05-11 株式会社荏原製作所 流体の漏洩を確認する方法、および研磨装置
CN109164837B (zh) * 2018-08-13 2021-08-03 力合科技(湖南)股份有限公司 流量恒定装置及其使用方法、快速分析仪器及其检测方法
TWI699237B (zh) * 2019-02-22 2020-07-21 亞泰半導體設備股份有限公司 研磨液混料供應系統
JP6835126B2 (ja) * 2019-03-28 2021-02-24 栗田工業株式会社 希薄薬液製造装置
US20200338688A1 (en) * 2019-04-25 2020-10-29 Lth Co., Ltd. Method for automatically verifying and cleaning large-sized particle counter for analyzing cmp slurry and verification system suitable for same
KR102277512B1 (ko) * 2019-07-29 2021-07-15 솔리스 주식회사 대용량 슬러리 공급 장치
DE202019104349U1 (de) * 2019-08-07 2020-11-10 Eversys Ag Vorrichtung zum Erhitzen und Aufschäumen einer Flüssigkeit, insbesondere eines Getränks
CN110561275B (zh) * 2019-10-17 2023-09-05 群福电子科技(上海)有限公司 研磨液供应方法
US11465110B2 (en) * 2019-12-26 2022-10-11 Asahi Kasei Bioprocess America, Inc. Scaleable inline buffer dilution scheme
CN112255051B (zh) * 2020-11-17 2022-07-08 攀钢集团攀枝花钢铁研究院有限公司 一种开放式管道的矿浆取样装置
US11828696B2 (en) 2020-12-16 2023-11-28 Caterpillar Inc. System and method for processing data from a particle monitoring sensor
IT202100001856A1 (it) * 2021-01-29 2022-07-29 D B N Tubetti S R L Sistema di alimentazione in continuo per un impianto di spruzzatura interna di vernice all’interno di un tubetto
US20220362902A1 (en) * 2021-05-14 2022-11-17 Taiwan Semiconductor Manufacturing Company Ltd. Method and system for slurry quality monitoring
KR102712625B1 (ko) * 2021-11-18 2024-10-02 삼성이앤에이 주식회사 수지 충진 장치 및 방법
KR102431849B1 (ko) * 2022-01-21 2022-08-12 웨스글로벌 주식회사 씨엠피 슬러리 혼합 및 공급 제어 시스템
CN114699941A (zh) * 2022-03-14 2022-07-05 长鑫存储技术有限公司 一种液体混合装置、供给系统及供给方法
EP4245406A1 (en) * 2022-03-17 2023-09-20 Saravanos Process++ SRL Systems and methods for feeding inlet materials to a process system
CN115041044B (zh) * 2022-04-25 2024-04-02 安徽广信农化股份有限公司 一种多菌灵可湿性粉剂加工用上料装置及其上料方法
TWI830579B (zh) * 2023-01-12 2024-01-21 全營科技有限公司 研磨液混合槽的製造方法
TWI882529B (zh) * 2023-01-12 2025-05-01 全營科技有限公司 研磨液混合槽的結構
CN117839408A (zh) * 2023-02-16 2024-04-09 李佳辉 一种湿法脱硫脱硝装置
CN116808906A (zh) * 2023-07-11 2023-09-29 湖南经源科技有限公司 一种正极材料制备用管道连续式粉体混合装置

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB798983A (en) * 1957-02-08 1958-07-30 Courtaulds Ltd Improvements in and relating to mixing materials
GB835975A (en) * 1957-07-15 1960-06-01 Walter Jordan Surge absorber for pressure fluid lines
US3166020A (en) * 1961-09-20 1965-01-19 Hypro Engineering Inc Venturi mixer nozzle
DE1275512B (de) * 1962-01-08 1968-08-22 Willi Walbersdorf Sondermaschb Mischvorrichtung
US3946994A (en) * 1974-04-10 1976-03-30 Petrolite Corporation System for producing emulsions
US4045004A (en) * 1976-10-01 1977-08-30 Berger Henry F Chemical mixing and pumping apparatus
US4538222A (en) * 1983-04-06 1985-08-27 Halliburton Company Apparatus and method for mixing a plurality of substances
AU1781592A (en) * 1992-05-21 1993-12-13 Eastman Kodak Company A system for producing a photographic dispersion
US5823670A (en) * 1993-11-17 1998-10-20 Calgon Corporation Chemical delivery and on-site blending system for producing multiple products
DE19723802C2 (de) * 1997-06-06 1999-08-12 Kuesters Eduard Maschf Vorrichtung zum Auftragen eines fluiden Behandlungsmittels auf eine Bahn
JP3382138B2 (ja) * 1997-08-21 2003-03-04 富士通株式会社 薬液供給装置及び薬液供給方法
US5887974A (en) * 1997-11-26 1999-03-30 The Boc Group, Inc. Slurry mixing apparatus and method
KR20010072569A (ko) * 1998-04-09 2001-07-31 추후제출 자동화 화학공정 제어 시스템
US6224252B1 (en) * 1998-07-07 2001-05-01 Air Products And Chemicals, Inc. Chemical generator with controlled mixing and concentration feedback and adjustment
JP2000071172A (ja) * 1998-08-28 2000-03-07 Nec Corp 化学機械研磨用スラリーの再生装置及び再生方法
KR100268417B1 (ko) * 1998-09-18 2000-10-16 윤종용 반도체 씨엠피설비의 슬러리공급시스템
JP2000117635A (ja) * 1998-10-15 2000-04-25 Sumitomo Metal Ind Ltd 研磨方法及び研磨システム
JP2000218107A (ja) * 1998-11-25 2000-08-08 Ebara Corp フィルタ装置及び砥液供給装置
US6280300B1 (en) * 1998-11-25 2001-08-28 Ebara Corporation Filter apparatus
JP3464929B2 (ja) * 1999-02-12 2003-11-10 東京エレクトロン株式会社 スラリー供給システム及びこれを備えた研磨システム
JP3748731B2 (ja) * 1999-03-26 2006-02-22 株式会社荏原製作所 砥液供給装置
US6048256A (en) * 1999-04-06 2000-04-11 Lucent Technologies Inc. Apparatus and method for continuous delivery and conditioning of a polishing slurry
US20020117559A1 (en) * 2000-02-11 2002-08-29 Kaligian Raymond A. Continuous slurry dispenser apparatus
JP2002016029A (ja) * 2000-06-27 2002-01-18 Mitsubishi Chemical Engineering Corp 研磨液の調製方法および調製装置
WO2002001618A1 (en) * 2000-06-27 2002-01-03 Nymtech Co., Ltd. Slurry recycling system and method for cmp apparatus
CN101274230A (zh) * 2000-07-31 2008-10-01 迅捷公司 用来混合加工材料的方法和装置
JP3677203B2 (ja) * 2000-10-06 2005-07-27 株式会社荏原製作所 砥液供給装置、研磨装置及び砥液供給装置の運転方法
TW583355B (en) * 2001-06-21 2004-04-11 M Fsi Ltd Slurry mixing feeder and slurry mixing and feeding method
JP3774681B2 (ja) * 2001-06-21 2006-05-17 エム・エフエスアイ株式会社 スラリー混合供給装置及びスラリー混合供給方法
US6903138B2 (en) * 2002-06-03 2005-06-07 Intevep, S.A. Manufacture of stable bimodal emulsions using dynamic mixing
KR20050035865A (ko) * 2002-07-19 2005-04-19 키네틱 시스템즈, 인코포레이티드 공정 재료를 혼합하기 위한 방법 및 장치
JP2004207422A (ja) * 2002-12-25 2004-07-22 Matsushita Electric Ind Co Ltd 半導体装置の研磨方法、半導体装置の製造方法および研磨装置
JP4362473B2 (ja) * 2003-06-20 2009-11-11 富士通マイクロエレクトロニクス株式会社 薬液供給装置及び供給装置
JP4645056B2 (ja) * 2004-03-31 2011-03-09 パナソニック株式会社 研磨液供給装置
US7524383B2 (en) * 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
JP4915897B2 (ja) * 2005-07-19 2012-04-11 東京エレクトロン株式会社 脈動軽減装置及び検査装置
US7726870B1 (en) * 2007-04-19 2010-06-01 Vortex Systems (International) Ci Method for mixing fluids with an eductor
US8052127B2 (en) * 2007-10-19 2011-11-08 Philip Morris Usa Inc. Respiratory humidification system
JP2011506110A (ja) * 2007-12-06 2011-03-03 フォアサイト プロセッシング,エルエルシー 流体を含む加工材料混合物を搬送するシステムおよび方法
WO2009103038A1 (en) * 2008-02-14 2009-08-20 David Randolph Smith Method and apparatus to treat well stimulation fluids in-situ
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Sumco Techxiv株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
JP5340760B2 (ja) * 2009-02-12 2013-11-13 倉敷紡績株式会社 流体制御方法及び流体制御装置
US20100258196A1 (en) * 2009-04-14 2010-10-14 Mega Fluid Systems, Inc. Arrangement of multiple pumps for delivery of process materials
US8746960B2 (en) * 2009-04-20 2014-06-10 Mega Fluid Systems, Inc. Method and apparatus for blending process materials
KR101041450B1 (ko) * 2009-04-22 2011-06-15 세메스 주식회사 기판 세정 장치 및 방법
EP2336093A1 (en) * 2009-12-14 2011-06-22 Arkema Vlissingen B.V. Process for scratch masking of glass containers
US20120042575A1 (en) * 2010-08-18 2012-02-23 Cabot Microelectronics Corporation Cmp slurry recycling system and methods
TWI403662B (zh) * 2010-11-19 2013-08-01 循環系統及方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12272544B2 (en) 2021-12-24 2025-04-08 Semes Co., Ltd. Apparatus for treating substrate and method for treating substrate

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TW201422376A (zh) 2014-06-16
EP2920662B1 (en) 2019-05-29
IL238770B (en) 2021-06-30
TWI641936B (zh) 2018-11-21
SG11201503698RA (en) 2015-06-29
IL238770A0 (en) 2015-06-30
EP4166226B1 (en) 2024-11-06
CN104956278B (zh) 2018-05-29
TWI574789B (zh) 2017-03-21
JP2015536239A (ja) 2015-12-21
EP2920662A4 (en) 2017-01-25
EP3564771A3 (en) 2020-03-18
WO2014078398A1 (en) 2014-05-22
KR20170049625A (ko) 2017-05-10
TW201721322A (zh) 2017-06-16
EP2920662A1 (en) 2015-09-23
EP3564771A2 (en) 2019-11-06
JP6588337B2 (ja) 2019-10-09
SG10201800355QA (en) 2018-02-27
KR20150085013A (ko) 2015-07-22
EP4166226A1 (en) 2023-04-19
CN104956278A (zh) 2015-09-30
KR101732092B1 (ko) 2017-05-04

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