KR102089098B1 - 절단 장치 및 절단 방법 - Google Patents

절단 장치 및 절단 방법 Download PDF

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KR102089098B1
KR102089098B1 KR1020177024358A KR20177024358A KR102089098B1 KR 102089098 B1 KR102089098 B1 KR 102089098B1 KR 1020177024358 A KR1020177024358 A KR 1020177024358A KR 20177024358 A KR20177024358 A KR 20177024358A KR 102089098 B1 KR102089098 B1 KR 102089098B1
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cutting
cut
jig
sealed substrate
mark
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KR20170110651A (ko
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카츠노리 츠타후지
칸지 이시바시
카츠마사 시라이
히로토 모치즈키
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H01L21/67092—
    • H01L21/67242—
    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

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KR1020177024358A 2015-02-05 2016-01-06 절단 장치 및 절단 방법 Active KR102089098B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015021259A JP6212507B2 (ja) 2015-02-05 2015-02-05 切断装置及び切断方法
JPJP-P-2015-021259 2015-02-05
PCT/JP2016/050202 WO2016125518A1 (ja) 2015-02-05 2016-01-06 切断装置及び切断方法

Publications (2)

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KR20170110651A KR20170110651A (ko) 2017-10-11
KR102089098B1 true KR102089098B1 (ko) 2020-03-13

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KR1020177024358A Active KR102089098B1 (ko) 2015-02-05 2016-01-06 절단 장치 및 절단 방법

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JP (1) JP6212507B2 (https=)
KR (1) KR102089098B1 (https=)
CN (1) CN107210206B (https=)
TW (1) TWI622090B (https=)
WO (1) WO2016125518A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6483541B2 (ja) * 2015-06-16 2019-03-13 株式会社ディスコ パッケージ基板の加工方法
JP2018133432A (ja) * 2017-02-15 2018-08-23 株式会社ディスコ 切削装置
WO2019220499A1 (ja) * 2018-05-14 2019-11-21 株式会社Ｆｕｊｉ リード線切断ユニットおよびそれを備える実装機
EP3702831A1 (de) 2019-03-01 2020-09-02 Carl Zeiss Vision International GmbH Datensatz zur verwendung in einem verfahren zur herstellung eines brillenglases
JP6912745B1 (ja) * 2019-09-27 2021-08-04 株式会社東京精密 ダイシング装置及び方法
KR102411860B1 (ko) 2019-09-27 2022-06-23 가부시키가이샤 도교 세이미쓰 다이싱 장치 및 방법
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
JP7613849B2 (ja) * 2020-06-26 2025-01-15 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7446169B2 (ja) * 2020-06-26 2024-03-08 キヤノントッキ株式会社 基板搬送装置、基板処理システム、基板搬送方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7440355B2 (ja) * 2020-06-26 2024-02-28 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7440356B2 (ja) * 2020-06-26 2024-02-28 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7438865B2 (ja) * 2020-06-26 2024-02-27 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7423161B2 (ja) * 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
KR102799609B1 (ko) * 2021-03-16 2025-04-29 한미반도체 주식회사 반도체 자재 절단장치의 절단 셋팅방법
JP7564747B2 (ja) * 2021-03-29 2024-10-09 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
KR102633129B1 (ko) * 2021-09-29 2024-02-06 한국생산기술연구원 다이 웨이퍼 간 본딩 시 정렬방법
CN114609711B (zh) * 2022-03-09 2023-07-18 业成科技（成都）有限公司 光学元件的制造方法、夹持装置、显示模组及电子设备
JP7813201B2 (ja) * 2022-08-09 2026-02-12 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法
CN115815474B (zh) * 2022-12-01 2023-09-15 广东新亚光电缆股份有限公司 一种低压电线及其智能加工系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156025A (ja) 1999-11-29 2001-06-08 Disco Abrasive Syst Ltd ペレットの分離方法
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
KR101123613B1 (ko) 2008-03-17 2012-03-20 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 장치 및 스크라이브 방법
JP2012114126A (ja) * 2010-11-19 2012-06-14 Sharp Corp 基板分割装置および電子部品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4733929B2 (ja) * 2004-04-20 2011-07-27 株式会社ディスコ 半導体ウエーハの切断方法
JP2005353723A (ja) 2004-06-09 2005-12-22 Apic Yamada Corp 切断装置、及び切断方法
JP6232667B2 (ja) * 2013-06-25 2017-11-22 ボンドテック株式会社 基板接合方法
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6143668B2 (ja) * 2013-12-28 2017-06-07 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156025A (ja) 1999-11-29 2001-06-08 Disco Abrasive Syst Ltd ペレットの分離方法
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
KR101123613B1 (ko) 2008-03-17 2012-03-20 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 장치 및 스크라이브 방법
JP2012114126A (ja) * 2010-11-19 2012-06-14 Sharp Corp 基板分割装置および電子部品の製造方法

Also Published As

Publication number Publication date
JP6212507B2 (ja) 2017-10-11
JP2016143861A (ja) 2016-08-08
CN107210206A (zh) 2017-09-26
WO2016125518A1 (ja) 2016-08-11
TWI622090B (zh) 2018-04-21
CN107210206B (zh) 2020-09-22
TW201643951A (zh) 2016-12-16
KR20170110651A (ko) 2017-10-11

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