KR102082271B1 - 캐리어기판 분리 시스템 및 분리 방법 - Google Patents

캐리어기판 분리 시스템 및 분리 방법 Download PDF

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KR102082271B1
KR102082271B1 KR1020130058733A KR20130058733A KR102082271B1 KR 102082271 B1 KR102082271 B1 KR 102082271B1 KR 1020130058733 A KR1020130058733 A KR 1020130058733A KR 20130058733 A KR20130058733 A KR 20130058733A KR 102082271 B1 KR102082271 B1 KR 102082271B1
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South Korea
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substrate
carrier substrate
stage
carrier
manufacturing
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KR1020130058733A
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English (en)
Korean (ko)
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KR20140138452A (ko
Inventor
강기복
김흥선
이승후
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엘지디스플레이 주식회사
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Application filed by 엘지디스플레이 주식회사 filed Critical 엘지디스플레이 주식회사
Priority to KR1020130058733A priority Critical patent/KR102082271B1/ko
Priority to TW103118180A priority patent/TWI509723B/zh
Priority to JP2014107216A priority patent/JP5844847B2/ja
Priority to CN201410225354.6A priority patent/CN104183468B/zh
Publication of KR20140138452A publication Critical patent/KR20140138452A/ko
Application granted granted Critical
Publication of KR102082271B1 publication Critical patent/KR102082271B1/ko

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020130058733A 2013-05-24 2013-05-24 캐리어기판 분리 시스템 및 분리 방법 KR102082271B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020130058733A KR102082271B1 (ko) 2013-05-24 2013-05-24 캐리어기판 분리 시스템 및 분리 방법
TW103118180A TWI509723B (zh) 2013-05-24 2014-05-23 載體基板分離系統及方法
JP2014107216A JP5844847B2 (ja) 2013-05-24 2014-05-23 キャリア基板分離システム及び分離方法
CN201410225354.6A CN104183468B (zh) 2013-05-24 2014-05-26 载体衬底分离系统及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130058733A KR102082271B1 (ko) 2013-05-24 2013-05-24 캐리어기판 분리 시스템 및 분리 방법

Publications (2)

Publication Number Publication Date
KR20140138452A KR20140138452A (ko) 2014-12-04
KR102082271B1 true KR102082271B1 (ko) 2020-04-16

Family

ID=51964430

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130058733A KR102082271B1 (ko) 2013-05-24 2013-05-24 캐리어기판 분리 시스템 및 분리 방법

Country Status (4)

Country Link
JP (1) JP5844847B2 (zh)
KR (1) KR102082271B1 (zh)
CN (1) CN104183468B (zh)
TW (1) TWI509723B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102300081B1 (ko) * 2015-04-27 2021-09-08 삼성디스플레이 주식회사 합착 장치 및 이를 이용한 곡면 표시 장치의 제조 방법
CN104900564B (zh) * 2015-05-12 2017-10-17 京东方科技集团股份有限公司 剥离设备
JP6515789B2 (ja) * 2015-11-17 2019-05-22 富士通株式会社 表示装置の分離方法及び分離装置
JP6499109B2 (ja) * 2016-03-29 2019-04-10 日本特殊陶業株式会社 保持装置の分離方法および製造方法
TWI663115B (zh) * 2016-12-23 2019-06-21 盟立自動化股份有限公司 用於剝離兩基板的裝置及方法
JP6765761B2 (ja) * 2016-12-27 2020-10-07 株式会社ディスコ 静電チャック装置及び静電吸着方法
KR20180124198A (ko) * 2017-05-10 2018-11-21 코닝 인코포레이티드 기판 처리 방법들
KR102572801B1 (ko) * 2018-03-20 2023-08-29 코닝 인코포레이티드 디본딩 서포트 장치 및 이를 이용한 디본딩 방법
KR102560167B1 (ko) * 2018-10-04 2023-07-25 코닝 인코포레이티드 디본딩 서포트 장치 및 이를 이용한 디본딩 방법
CN112478783B (zh) * 2020-12-09 2022-03-29 河北光兴半导体技术有限公司 基板玻璃分离机及分离方法

Citations (4)

* Cited by examiner, † Cited by third party
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WO2008041293A1 (fr) 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
WO2010090147A1 (ja) 2009-02-06 2010-08-12 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置
JP2012044086A (ja) * 2010-08-23 2012-03-01 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013052998A (ja) * 2011-09-06 2013-03-21 Asahi Glass Co Ltd 剥離装置、及び電子デバイスの製造方法

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JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
CN1243327A (zh) * 1998-07-27 2000-02-02 佳能株式会社 样品加工装置和方法
KR20000012011A (ko) * 1998-07-27 2000-02-25 미다라이 후지오 시료처리장치 및 시료처리방법
JP4809600B2 (ja) * 2003-10-28 2011-11-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
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KR101395821B1 (ko) * 2006-11-29 2014-05-16 엘아이지에이디피 주식회사 기판 합착기
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041293A1 (fr) 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
WO2010090147A1 (ja) 2009-02-06 2010-08-12 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置
JP2012044086A (ja) * 2010-08-23 2012-03-01 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013052998A (ja) * 2011-09-06 2013-03-21 Asahi Glass Co Ltd 剥離装置、及び電子デバイスの製造方法

Also Published As

Publication number Publication date
JP5844847B2 (ja) 2016-01-20
TW201448092A (zh) 2014-12-16
TWI509723B (zh) 2015-11-21
JP2014228871A (ja) 2014-12-08
KR20140138452A (ko) 2014-12-04
CN104183468B (zh) 2018-03-16
CN104183468A (zh) 2014-12-03

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