WO2008041293A1 - Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte - Google Patents

Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte Download PDF

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Publication number
WO2008041293A1
WO2008041293A1 PCT/JP2006/319540 JP2006319540W WO2008041293A1 WO 2008041293 A1 WO2008041293 A1 WO 2008041293A1 JP 2006319540 W JP2006319540 W JP 2006319540W WO 2008041293 A1 WO2008041293 A1 WO 2008041293A1
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WO
WIPO (PCT)
Prior art keywords
electrostatic chuck
workpiece
holding plate
substrate
electrostatic
Prior art date
Application number
PCT/JP2006/319540
Other languages
English (en)
Japanese (ja)
Inventor
Yoshikazu Ohtani
Original Assignee
Shin-Etsu Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Engineering Co., Ltd. filed Critical Shin-Etsu Engineering Co., Ltd.
Priority to JP2006549203A priority Critical patent/JP4043506B1/ja
Priority to CN2006800007517A priority patent/CN101316777B/zh
Priority to PCT/JP2006/319540 priority patent/WO2008041293A1/fr
Priority to TW096101276A priority patent/TWI412480B/zh
Publication of WO2008041293A1 publication Critical patent/WO2008041293A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Definitions

  • the present invention can be applied to a process for producing a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP), a flexible display, and a glass substrate such as CF glass or TFT glass.
  • Substrate assembling equipment including a substrate laminating machine, which detachably holds and attaches synthetic resin substrates such as PES (Poly-Ether-Sulphone) plastic films, and insulation of such substrates
  • the present invention relates to a workpiece transfer method and an electrostatic chuck device used in a substrate transfer device for transferring a workpiece (object to be processed) such as a body, a conductor or a semiconductor wafer, and a substrate bonding method using the same.
  • the method includes a workpiece transfer method in which a workpiece is attracted and held by an electrostatic chuck of a holding plate, the held workpiece is released and placed at a predetermined position, and a holding plate and an electrostatic chuck that holds the workpiece by suction.
  • the present invention relates to an electrostatic chuck device and a substrate bonding method using the same.
  • a pressure plate is an electrostatic chuck composed of an insulating member having an electrode plate built therein, and a glass substrate is held as a workpiece on the electrostatic chuck.
  • the vacuum chamber is depressurized, and when the vacuum chamber reaches a desired degree of vacuum, the electrostatic adsorption function of the pressure plate is released.
  • the upper substrate is dropped onto the lower substrate, the upper and lower substrates are overlapped, and then the pressure plate is lowered to pressurize the upper and lower substrates so that the distance between them is bonded to a predetermined gap (for example, Patent Document 1).
  • the back side force gas of the upper substrate is ejected, and this gas is ejected from the electrostatic chuck surface of the upper holding plate.
  • the electrostatic adsorption force between them is forcibly attenuated and disappears.
  • the drop force on the lower substrate (lower substrate) that is, the acceleration of the drop, is forcibly acted on by the pressure of the injected gas.
  • the upper substrate moves onto the lower substrate without being changed in posture while being held by the electroadsorption means, is crimped, and the upper and lower substrates are sealed and overlapped (for example, see Patent Document 2).
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-166272 (Page 6, FIG. 8)
  • Patent Document 2 Japanese Patent No. 3721378 (Page 8, Figure 1)
  • the workpiece (upper substrate) is free to fall while rotating around the last peeled point, causing an error in the alignment between the upper and lower substrates, and sealing with free fall pressure.
  • air was easily mixed due to incompleteness.
  • the workpiece (upper substrate) partly drops due to gravity at the point where it first begins to peel off against the electrostatic chucking surface, and tilting occurs, and the tilting force tends to change depending on the situation.
  • the force of the display and plasma display substrates that are starting to be manufactured up to over 1000mm on a side tends to be large. Even if the substrate is enlarged, the same degree of parallelism as a small substrate is required. In particular, if one side of the substrate exceeds 1000 mm, the Z-direction interval is extremely small compared to the size in the XY direction, so it is ideal to move these upper and lower substrates closer together, but in reality, Very difficult to It is.
  • liquid crystal sealing material annular adhesive
  • the back side of the workpiece (upper substrate) is also peeled off by injecting gas between the workpiece and the workpiece 0.7-7.
  • the electrostatic chucking force could be reliably peeled off by the gas in which the peeling gas is easily transmitted uniformly in the surface direction.
  • the glass thickness of the workpiece is very thin, about 0.5 mm or less.
  • the workpieces used for flexible displays become plastic films such as PES (Poly-Ether Sulphone) with a thickness of several hundreds of um.
  • Such workpieces such as glass substrates and plastic films of about 0.5 mm or less have also been used with conventional forces. Since the rigidity is extremely low compared to glass substrates of 0.7 to 1.1 mm, gas for peeling is used. Even if the spray is sprayed, the workpiece is partially extruded and deformed, and the flow path of the peeling gas concentrates on the deformed portion, and the workpiece may not be reliably peeled off due to the residual adsorption force.
  • the inventions according to claims 1 and 4 are intended to open and mount even a thin and low-rigid workpiece without causing deformation or misalignment during movement.
  • the invention described in claim 2 is intended to securely hold and transfer the workpiece.
  • the invention described in claim 3 is intended to improve the peelability of the workpiece in addition to the object of the invention described in claim 1 or 2.
  • the invention described in claim 5 adheres at a fixed position and reliably peels off even if the substrate has low rigidity, regardless of unevenness in releasing the electrostatic adsorption force. It is for the purpose.
  • the invention according to claim 1 of the present invention is configured such that the electrostatic chuck is formed in a thin plate shape or a film shape and is movably supported, and is opposed to the electrostatic chuck.
  • the surface of the workpiece is electrostatically attracted, and this attracting position force moves the electrostatic chuck to the open position while the workpiece is electrostatically attracted, and stops the electrostatic chuck function of the electrostatic chuck, thereby releasing the electrostatic chuck.
  • the force only the electrostatic chuck is reversely moved toward the suction position, and the surface force of the workpiece moved to the open position is also characterized by peeling off the electrostatic chuck.
  • the invention according to claim 2 is a configuration in which the electrostatic chuck is formed in a thin plate shape or a film shape in the configuration of the invention according to claim 1 and intersects with a smooth base surface of the holding plate having a rigid body force. It is characterized by the addition of a structure that is movably supported.
  • the invention described in claim 3 is the configuration of the invention described in claim 1 or 2, wherein the electrostatic chucking portion of the electrostatic chuck is also partially deformed at the part force facing the outer peripheral end portion of the workpiece. It is characterized by the addition of a structure in which a separation gap is partially formed between the outer peripheral edge of the hook.
  • the invention according to claim 4 is a state in which the electrostatic chuck is movably supported in a direction crossing the workpiece side surface of the holding plate, and the electrostatic chuck is placed along the workpiece side surface.
  • the surface of the workpiece is electrostatically attracted, and this attracting position force also moves the electrostatic chuck to the open position while the workpiece is electrostatically attracted, and stops the electrostatic chuck function of the electrostatic chuck,
  • the electrostatic chuck device according to claim 4 is provided in either one or both of the pair of holding plates, and the two substrates as the workpiece are opposed to each other and held detachably between the holding plates. From either side of the plate The electrostatic chuck of the chuck device is separated while one substrate is electrostatically attracted, the one substrate is moved toward the other substrate, and both substrates are bonded together with an annular adhesive. Is. The invention's effect
  • the invention described in claim 1 of the present invention is that the electrostatic chuck is attached to the holding plate by the attaching means, and the work is attracted and held by the attached electrostatic chuck.
  • the workpiece does not become free, so it is transferred to the open position without being affected by gravity, etc., and the electrostatic chuck function of this electrostatic chuck is stopped.
  • the surface of the work moved to the open position is peeled off from the electrostatic chuck, and the work is left on the open position.
  • the separation gas flow path does not concentrate on a specific part even in the case of a low-rigidity workpiece, as compared to the conventional type in which the workpiece is peeled off by the gas injection pressure. It is excellent in workability.
  • the invention of claim 2 forms an electrostatic chuck in a thin plate shape or a film shape, and intersects with the smooth base surface of the holding plate having a rigid body force.
  • the base plate and the base plate are electrostatically adsorbed by flattening at least the electrostatic chuck part of the electrostatic chuck along the smooth base surface with rigid body force by the support means. Since the workpiece does not become free by separating the base surface force electrostatic chuck while the workpiece is electrostatically attracted by the operation of the separation means, the workpiece does not become free. Thereafter, the surface force of the moved workpiece is peeled off by the operation of the adhering means, and the electrostatic chuck is peeled off and returned to the initial state along the base surface.
  • the workpiece can be reliably held and transferred.
  • the electrostatic chucking portion of the electrostatic chuck in response to the effect of the invention of claim 1 or 2, is partially deformed at a position facing the outer peripheral end of the workpiece. , Outside the workpiece By partially forming a separation gap between the peripheral edge and the peripheral edge, the separation gap widens between the electrostatic chuck portion of the electrostatic chuck and the surface of the workpiece, and the residual suction force is reduced. Forced to decay and disappear.
  • the electrostatic chuck is movably supported in a direction crossing the workpiece side surface of the holding plate, and the electrostatic chuck is placed along the workpiece side surface.
  • the surface of the cake is electrostatically attracted, and this attracting position force is also affected by gravity, etc. because the workpiece does not become free by moving the electrostatic chuck while the workpiece is electrostatically attracted.
  • the electrostatic chuck function of the electrostatic chuck is stopped and the electrostatic force of the electrostatic chuck is moved back to the suction position.
  • the electrostatic chuck also peels off the surface force.
  • the separation gas flow path does not concentrate on a specific part even in the case of a low-rigidity workpiece, as compared to the conventional type in which the workpiece is peeled off by the gas injection pressure. It is excellent in workability.
  • the invention of claim 5 pulls the electrostatic chuck from one of the two holding plates while the one substrate is electrostatically attracted to the other substrate.
  • the two substrates are bonded to each other with an annular adhesive, so that one of the substrates does not become free, so it is transported and bonded accurately without being affected by gravity, etc.
  • the electrostatic chuck is easily peeled off from one of the substrates held by the adhesive force. Therefore, even if the substrate has low rigidity, it can be securely bonded and peeled off at a fixed position regardless of the unevenness in releasing the electrostatic adsorption force.
  • the substrate has low rigidity compared to the conventional substrate bonding machine that directly peels only the substrate with the gas injection pressure, the gas flow for peeling does not concentrate on a specific part, and the substrate has high rigidity. As with, it can be peeled off reliably and has excellent workability.
  • the electrostatic chuck device of the present invention is used in a production line such as a liquid crystal display, the operation of the entire line can be resumed in a short time. Occupancy rate does not decrease and stable production can be expected.
  • D force Workpieces A and B can be detachably attached to a glass substrate or a plastic film substrate used for a liquid crystal display (LCD), plasma display (PDP), or flexible display panel. This shows the case where it is installed in a substrate bonding machine that holds and bonds to the substrate.
  • LCD liquid crystal display
  • PDP plasma display
  • This substrate laminating machine is a fixed plate formed into a flat plate having a thickness that does not deform (stagnate) with a rigid body such as metal or ceramics as shown in Figs. 5 (a) to 5 (c).
  • a pair of upper and lower holding plates 1, 1 ′ which is a board force, is arranged, and the two substrates A and B are detachably held on the parallel opposing surfaces of these upper and lower holding plates 1, 1 ′.
  • the upper and lower holding plates 1, ⁇ ' are relatively adjusted and moved in the ⁇ ⁇ direction (horizontal direction in the drawing) to obtain substrates A and B.
  • the substrates A and B After aligning each other, at least one of the substrates A and B is peeled off and overlapped by the smooth surface force of the upper and lower holding plates 1, ⁇ ', and then the vacuum break in the vacuum chamber S is performed.
  • the pressure difference between the substrates A and B is pressurized to a predetermined gap by the pressure difference generated between the substrates A and B.
  • the upper and lower holding plates 1, ⁇ 'as shown by the solid line in FIG. (Not shown) is supported so as to be relatively movable in the z direction (vertical direction in the drawing).
  • the upper and lower holding plates 1 are separated from each other in the vertical direction,
  • the substrates A and B transferred by the transfer robot (not shown) are set and held respectively.
  • the horizontal holding means (not shown) is operated to operate the upper and lower holding plates 1. , 1 'is adjusted and moved in the XY 0 direction relative to the other, so that rough alignment and fine alignment are sequentially performed as alignment between the substrates A and B held by them.
  • the electrostatic chuck device D of the present invention is configured by the above-described upper and lower holding plates 1, ⁇ 'also having rigid body force and the electrostatic chuck 2 that holds the substrates A and B by suction.
  • the electrostatic chuck 2 is supported so as to be movable in the Z direction (vertical direction in the drawing) intersecting with the smooth surface of the upper holding plate 1, and the upper holding plate 1 further includes the electrostatic chuck.
  • attachment means 3 for pulling 2 toward each smooth surface and detachably adhering to each smooth surface
  • isolation means 4 for separating the electrostatic chuck 2 from each smooth surface.
  • the attachment means 3 attaches the electrostatic chuck 2 to the smooth surface of the upper holding plate 1, and the attached electrostatic chuck 2 electrostatically adsorbs the upper substrate A.
  • the upper substrate A is integrated and separated from the upper holding plate 1 toward the open position by the separating means 4 and moved in parallel. Then, the electrostatic chucking function of the electrostatic chuck 2 was stopped, and then the electrostatic chuck 2 alone was moved back to the upper holding plate 1 by the attachment means 3 and moved to the open position.
  • Upper Surface force of substrate A By peeling off the electrostatic chuck 2, the above-described bonding operation of the substrates A and B is performed.
  • the electrostatic chuck 2 is made of a dielectric thin film or a thin film made of an insulating organic material such as polyimide, polyetheretherketone (PEEK), or polyethylene naphthalate (PEN).
  • an electrode portion 2c which also becomes a conductive paste or a conductive foil pattern patterned by screen printing or the like is integrally laminated.
  • the electrode portion 2c is formed insulated from the surroundings, and is connected to a power source (not shown) for applying a voltage thereto.
  • a bipolar electrostatic chuck in which two or more electrode portions 2c are embedded in, for example, a comb tooth shape.
  • the electrode part 2c of the electrostatic chuck 2 that is supported so as to be able to reciprocate in the vertical direction is controlled so that the power supply connection is cut immediately after the operation of the separating means 4 to be described later is terminated and its electrostatic adsorption function is stopped. Has been.
  • the attaching means 3 includes, for example, a magnet 3a such as a permanent magnet or an electromagnet over one or both of the smooth surfaces of the upper and lower holding plates 1, ⁇ 'and the surface of the electrostatic chuck 2 facing the upper surface.
  • a magnet 3a such as a permanent magnet or an electromagnet over one or both of the smooth surfaces of the upper and lower holding plates 1, ⁇ 'and the surface of the electrostatic chuck 2 facing the upper surface.
  • a magnet attracted by the magnet and a magnetic material 3b such as a metal formed in a film shape by sputtering, for example, or a structure other than an adhesive other than a magnetic force such as a mechanical one-touch connection mechanism
  • the electrostatic chuck 2 is detachably bonded to the smooth surface by their magnetic force and adhesive force.
  • the isolating means 4 injects a gas such as nitrogen gas or air or other fluid from one or both of the smooth surfaces of the upper and lower holding plates 1, 1 'toward the opposite surface of the electrostatic chuck 2.
  • a gas such as nitrogen gas or air or other fluid from one or both of the smooth surfaces of the upper and lower holding plates 1, 1 'toward the opposite surface of the electrostatic chuck 2.
  • a driving body that reciprocates up and down, such as an air cylinder, or the magnets 3a and 3b that are provided oppositely as the attachment means 3
  • the electrostatic chuck 2 is also separated in parallel.
  • This embodiment 1 is a pedestal (base) made of a rigid body in which the magnet 3a of the attachment means 3 is embedded in the smooth surface of the holding plate 1 as shown in FIGS. 1 (a) and 1 (b). And a thin plate-like or thin-film electrostatic chuck 2 in which the magnet 3b of the attachment means 3 is laminated on a smooth base surface la on the tip surface thereof, as guide means (not shown), etc.
  • the separation means 4 is supported by the above-mentioned separating plate 4 and the force for injecting a gas or fluid toward the electrostatic chuck 2 from the holding plate 1 and the vent hole 4a provided in the base.
  • the holding plate 1 and the pedestal are provided with suction suction means 5 for sucking and holding in the atmosphere, and a plurality of suction paths formed as the suction suction means 5 are sucked by, for example, a vacuum pump.
  • a pipe is connected to a source (not shown), and this suction path is used as a vent hole 4a of the isolation means 4.
  • the rigidity of the workpiece A of about 0.5 mm or less is extremely low by supporting the electrostatic chuck 2 so as to reciprocate in the vertical direction with respect to the smooth surface of the upper holding plate 1.
  • the lower substrate is supported by supporting the electrostatic chuck 2 in a reciprocating manner in the vertical direction with respect to the smooth surface of the lower holding plate. The same applies when moving while holding the surface of B by suction.
  • the magnet 3a fixedly arranged on the pedestal of the holding plate 1 a permanent magnet or an electromagnet is used, and as the magnet 3b fixedly arranged on the opposite surface of the electrostatic chuck 2, a thin plate or a thin film is used. If the magnet formed in the shape is used, the cushioning property of the electrostatic chuck 2 is preferable because the peelability of both the magnets 3a and 3b is maintained.
  • a magnet 3 a fixedly arranged on the pedestal of the holding plate 1 and a magnet 3 b fixedly arranged on the opposing surface of the electrostatic chuck 2.
  • the electrostatic chuck 2 in the form of a thin plate or thin film is attracted toward the base surface la of the holding plate 1 made of a rigid body as shown in FIG.
  • the electrostatic chucking portion 2a is smoothened and force-bonded along the base surface la, and the workpiece A is electrostatically chucked to the electrostatic chuck 2.
  • the electrostatic chuck 2 is pulled away from the base surface 1a of the holding plate 1 as shown in FIG.
  • the work A is moved in parallel toward the other work (lower substrate) B, the work A does not become free, so it is transferred without being affected by gravity, etc. Temporarily fixed to the other workpiece B.
  • the attachment means 3 and the suction suction means 5 are operated, and the temporarily fixed workpiece A force is also forcibly separated from the thin plate-like or film-like electrostatic chuck 2. Since the residual attracting force of the workpiece is weakened, there is a separation gap S1 between the workpiece A and the electrostatic chucking part 2a of the electrostatic chuck 2, and this partial force of the gap S1 is also electrostatic chuck 2 The electrostatic attracting part 2a peels off without difficulty.
  • the electrostatic chuck 2 in the form of a thin plate or thin film is XY 0 with respect to the base surface la of the holding plate 1 by magnets 3a and 3b in which electrodes of opposite magnetic poles are alternately arranged. It automatically attaches to the original position without any slight displacement in the direction and returns to the initial state. [0034] Thereby, even the workpiece A having extremely low rigidity can be transferred to a fixed position and reliably peeled regardless of the residual adsorption force of the electrostatic chuck 2 or the uneven release of the electrostatic adsorption force.
  • the electrostatic chucking part 2a of the electrostatic chuck 2 is smoothed along the base surface la of the holding plate 1 which also has a rigid body force, the electrostatic chucking part 2a and the surface of the workpiece A are in contact with each other without any gap. It is electrostatically attracted and workpiece A can be held securely.
  • the electrostatic chuck 2 is also partially deformed at the part force facing the outer peripheral end A1 of the workpiece A, and a separation gap S1 is partially formed between the electrostatic chuck 2 and the outer peripheral end A1 of the workpiece A. If formed, the separation gap S 1 spreads between the electrostatic chucking part 2a of the electrostatic chuck 2 and the surface of the workpiece A, and the residual suction force is forcibly attenuated. Since it disappears, the peelability of work A can be improved.
  • Example 2 the electrostatic chuck 2 as shown in FIGS. 4 (a) and 4 (b) is formed larger than the base surface la of the holding plate 1 and the workpiece A, and the outer ends thereof are formed.
  • the portion 2d is detachably fixed to the holding plate 1 by the stator 2e, or a part or the entire circumference of the outer end 2d is folded back and fixed to the holding plate 1 by the stator 2e.
  • it is connected to the current supply part 2f to supply current to the electrode part 2c, and an elastically deformable stagnation part 2g is defined between the outer end part 2d and the electrostatic adsorption part 2a.
  • the other configurations are the same as those shown in FIGS. 1 to 3. Same as Example 1.
  • the outer end 2d of the electrostatic chuck 2 is fixed in a frame shape over the entire circumference, or at appropriate intervals over the entire circumference of the outer end 2d. It is fixed in a dot shape.
  • the set of outer end portions 2d arranged in parallel of the electrostatic chuck 2 is fixed in parallel, or the set of parallel outer end portions 2d is fixed in a dot shape at appropriate intervals. It is also possible.
  • the electrostatic chuck 2 can be supported so as to reciprocate in the vertical direction without a guide means (not shown), and the above-described holding means can be operated by the operation of the separating means 4.
  • the electrostatic chuck 2 is pulled away from the base surface la of the holding plate 1, it returns to its original position without being displaced in the ⁇ ⁇ direction.
  • the attaching means 3 a magnet 3a fixedly arranged on the base of the holding plate 1 as shown in FIGS. 2 and 3, and a magnet 3b fixedly arranged on the opposing surface of the electrostatic chuck 2 are respectively provided.
  • a magnetic material such as a metal formed in a film shape by sputtering or the like is disposed and fixed.
  • it can be reciprocated in the ⁇ direction without displacement, and the structure of the attachment means 3 can be simplified and the cost can be reduced compared to the first embodiment shown in FIGS. There is a point.
  • Example 3 is an example of a substrate bonding machine using the above-described electrostatic chuck device D as shown in FIGS. 5 (a) to 5 (c).
  • a thin plate or thin film electrostatic chuck 2 is disposed on each of the surfaces la and la ', the upper and lower substrates A are supported on these electrostatic chucks 2 by reciprocating in the vertical direction only on the upper base surface la.
  • B are electrostatically attracted, and after the alignment of the substrates A, B described above, the upper chuck A is electrostatically attracted to the upper electrostatic chuck 2 from the upper base surface la by the operation of the separating means 4.
  • the lower holding plate Between the lower base surface 1 and the electrostatic chuck 2, for example, an adhesive, mechanical one-touch coupling mechanism, or adhesive can be placed, and both can be attached and detached.
  • the lower holding plate The electrostatic chuck 2 does not reciprocate vertically.
  • this lower holding plate as shown in Fig. 6 (a) and (b)!
  • a plurality of through holes 6 are penetrated and opened in a straight line in the Z (vertical) direction, respectively.
  • separating means 7 for separating the completed upper and lower substrates A and B from the surface of the electrostatic chuck 2 a force for disposing a lift pin whose tip is formed of an insulating material movably in the Z (vertical) direction, or for example By controlling the operation so that a gas such as nitrogen gas or air and other fluids are jetted upward, the upper and lower substrates A and B, which have been bonded together, are pushed up by the surface force of the lower electrostatic chuck 2 as well.
  • Back side of board B It is preferable to form a slight static elimination gap S2 of about 2 to 3 mm, for example, with the surface Bl.
  • the lower electrostatic chuck 2 is formed in the atmosphere or in a predetermined low vacuum in which the gap S2 is formed between the surface of the lower electrostatic chuck 2 and the rear surface B1 of the lower substrate B by the separating means 7.
  • a high voltage is applied from a high voltage power source (not shown) between two or more electrode parts 2c embedded in the substrate, and is applied when the lower substrate B is electrostatically attracted.
  • the electric field that neutralizes the charge remaining on the upper and lower substrates A and B is induced by changing the voltage of these two or more electrode portions 2c by repeatedly inverting the polarity.
  • Example 1 shown in FIGS. 1 to 3 was used as the electrostatic chuck device D described above, but the example shown in FIG. 4 is not shown as another example.
  • Example 2 can also be used.
  • a thin plate or thin film electrostatic chuck 2 is bowed toward the upper base surface la by the operation of the adhering means 3 and the suction suction means 5.
  • the upper and lower substrates A and B transferred by the transfer robot in this state along the upper base surface la, and the upper electrostatic chuck 2 attached to the upper holding surface la;
  • the lower electrostatic chuck 2 mounted on the lower base surface la ' is electrostatically attracted and held.
  • the upper and lower holding plates 1, 1 ′ are moved closer to each other by the operation of the lifting means as shown by the two-dot chain line in FIG. 5A to form a vacuum chamber S, and the inside of the vacuum chamber S is predetermined.
  • the upper and lower holding plates 1, ⁇ ' are adjusted and moved relative to each other in the ⁇ direction, and the upper and lower substrates A and B are aligned.
  • the upper substrate A is electrostatically connected to the electrostatic chuck 2 above the upper base surface la by the operation of the separating means 4 as shown in FIG. 5 (b).
  • the upper substrate A is moved toward the lower substrate B by being separated while being adsorbed.
  • the upper and lower substrates A and B are instantaneously pressed with the annular adhesive C interposed therebetween, and the two are sealed and overlapped.
  • the inside of the vacuum chamber S is returned to the atmospheric pressure, and the pressure is evenly applied by the pressure difference generated inside and outside of both the substrates A and B.
  • the pressure difference generated inside and outside the both substrates A and B reaches the predetermined gap.
  • the bonding process is completed by crushing.
  • the upper substrate A bonded to the lower substrate B through the annular adhesive C as shown in FIG. 5 (c) is moved upward by the operation of the adhering means 3 and the suction adsorbing means 5.
  • the electrostatic chuck 2 is pulled toward the upper base surface la, and separation of both of them starts.
  • the residual attracting force of the upper electrostatic chuck 2 is extremely reduced by passing through the Paschen discharge region where the degree of vacuum in the vacuum chamber S is about several tens of Pa to several thousand Pa. .
  • the upper substrate A held by the adhesive force of the annular adhesive C and the upper electrostatic chuck 2 may come in contact with each other, and may be difficult to peel off.
  • the entire surface of the upper electrostatic chuck 2 from the surface of the upper substrate A is not separated at the same time, but partially from the portion facing the outer peripheral end A1 of the bonded upper substrate A. If it is deformed and a gap for peeling is partially formed between the outer peripheral edge A1 of the upper substrate A, the electrostatic chucking portion 2a of the electrostatic chuck 2 and the surface of the upper substrate A are separated. Since the residual gap is forcibly attenuated and disappears, the electrostatic force on the electrostatic chuck 2 of the upper electrostatic chuck 2 is peeled off smoothly from the surface of the substrate A.
  • the upper electrostatic chuck 2 peeled from the surface of the upper substrate A adheres to the upper base surface la, and thereafter, the upper and lower holding plates 1, 1 'are separated from each other by the operation of the elevating means. Move in the direction to return to the initial state.
  • the surroundings of the upper and lower substrates A and B that have been bonded together in this situation are in the atmosphere or 100 It is in a low vacuum of Pa or more.
  • the lower holding plate as shown in Fig. 6 (a) and (b):
  • the lift pin is raised from the base surface la ′ and the plurality of through holes 6 opened in the lower electrostatic chuck 2, or a gas such as nitrogen gas or air or other fluid is moved upward.
  • the upper and lower substrates A and B that have been bonded together are also pushed up by the surface force of the lower electrostatic chuck 2 to the lower surface B 1 of the lower substrate B.
  • a static elimination gap S2 is formed.
  • the upper and lower substrates A and B are transferred by the transfer robot described above, and the upper electrostatic chuck 2 attached to the upper base surface la and the lower substrate attached to the lower base surface la '.
  • glass cullet shards
  • the surface of the electrostatic chuck 2 such as the dielectric 2a is obtained by interposing the cullet between the electrostatic chucks 2 along with the electrostatic adsorption between the upper and lower substrates A and B. May break down and break down.
  • the electrostatic chuck 2 in the form of a thin plate or thin film is detachably provided on the upper and lower base surfaces la and W, so that these electrostatic chucks 2 can be easily replaced. There is also an advantage in that maintenance is excellent.
  • the electrostatic chuck apparatus D force work A and B of the present invention detachably holds a glass substrate or a plastic film substrate used for a liquid crystal display (LCD), a plasma display (PDP) or a flexible display panel as workpieces A and B.
  • LCD liquid crystal display
  • PDP plasma display
  • the present invention is not limited to this.
  • the present invention is not limited to this, and it is provided in a board assembly apparatus other than this board bonding machine, a board transfer apparatus that transfers boards, For LCD panel It is possible to hold a substrate other than the glass substrate.
  • the present invention is not limited to this, and a substrate bonding machine for bonding substrates A and B in the atmosphere can be used. The same effects as the above-described vacuum bonding machine can be obtained.
  • the force that supports the electrostatic chuck 2 so as to reciprocate in the vertical direction only with respect to the upper base surface la of the upper holding plate 1 is not limited to this.
  • the electrostatic chuck 2 is supported so as to be movable in the Z direction with respect to the lower base surface la ′, and the lower holding plate is further provided with an adhesion means 3 and an isolation means 4, and the adhesion means 3
  • the electrostatic chuck 2 is attached to the lower base surface 1 and the lower substrate B is electrostatically adsorbed by the attached electrostatic chuck 2, and the electrostatic chuck 2 and the lower substrate B are integrated with each other as described above.
  • the lower holding plate 1 is separated to 1 'force release position in 4 and moved in parallel.At the same time, the electrostatic chucking function of this electrostatic chuck 2 is stopped.
  • the substrate A and B may be bonded together by peeling back the surface force electrostatic chuck 2 of the lower substrate B that has been moved backward to the lower holding plate. .
  • FIG. 1 is a longitudinal front view showing Embodiment 1 of a workpiece transfer method and an electrostatic chuck device of the present invention, and (a) and (b) show in order of operation steps.
  • FIG. 2 is a reduced bottom view taken along line (2)-(2) in FIG. 1 (a).
  • FIG. 3 is a reduced and enlarged plan view taken along line (3)-(3) in FIG. 1 (a).
  • FIG. 4 is a longitudinal sectional front view showing Embodiment 2 of the workpiece transfer method and electrostatic chuck apparatus of the present invention, and (a) and (b) show in order of operation steps.
  • FIG. 5 is a reduced longitudinal front view showing Example 3 of a bonding machine using the workpiece transfer method and the electrostatic chuck device of the present invention, and (a) to (c) show the substrate bonding method in the order of steps. It is shown.
  • FIG. 6 A reduced longitudinal front view showing the state of static elimination, (a) and (b) are shown in order of operation steps. Explanation of symbols

Abstract

La présente invention concerne un dispositif à mandrin électrostatique qui permet de positionner de façon amovible même une pièce mince de faible rigidité, sans causer ni déformation, ni déplacement lors du mouvement. Un mandrin électrostatique (2) est relié à une plaque de support (1) par un moyen de liaison (3). Une pièce (A) est montée sur mandrin et maintenue par le mandrin électrostatique relié (2). Le mandrin électrostatique (2) et la pièce (A) sont intégralement séparés de la plaque de support (1) par un moyen de séparation (4). La pièce n'étant pas présentée dans un état libre, elle peut être transférée en position de libération sans être touchée par la gravité. Seulement lorsque le mandrin électrostatique (2) est à nouveau relié à la plaque de support (1) par le moyen de liaison (3) après arrêt du fonctionnement d'attraction électrostatique du mandrin électrostatique (2), ce dernier est séparé de la surface de la pièce (A) déplacée en position de libération, puis la pièce (A) est laissée en position de libération et positionnée.
PCT/JP2006/319540 2006-09-29 2006-09-29 Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte WO2008041293A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006549203A JP4043506B1 (ja) 2006-09-29 ワーク移送方法及び静電チャック装置並びに基板貼り合わせ方法
CN2006800007517A CN101316777B (zh) 2006-09-29 2006-09-29 工件移送方法和静电吸盘装置以及基板粘贴方法
PCT/JP2006/319540 WO2008041293A1 (fr) 2006-09-29 2006-09-29 Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
TW096101276A TWI412480B (zh) 2006-09-29 2007-01-12 Workpiece transfer method, electrostatic chuck device and substrate bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319540 WO2008041293A1 (fr) 2006-09-29 2006-09-29 Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte

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WO2008041293A1 true WO2008041293A1 (fr) 2008-04-10

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Country Status (3)

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CN (1) CN101316777B (fr)
TW (1) TWI412480B (fr)
WO (1) WO2008041293A1 (fr)

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JP2012168386A (ja) * 2011-02-15 2012-09-06 Joyo Kogaku Kk 封止方法およびその装置
JP5523646B1 (ja) * 2013-12-04 2014-06-18 信越エンジニアリング株式会社 貼合デバイスの製造装置
KR20140138452A (ko) * 2013-05-24 2014-12-04 엘지디스플레이 주식회사 캐리어기판 분리 시스템 및 분리 방법
JP2014232772A (ja) * 2013-05-28 2014-12-11 リンテック株式会社 静電保持装置および静電保持装置からの保持対象物の離脱方法
JP2015053360A (ja) * 2013-09-06 2015-03-19 リンテック株式会社 シート貼付装置及び貼付方法
CN114193901A (zh) * 2020-09-18 2022-03-18 日机装株式会社 真空层叠装置及层叠体的制造方法

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CN103094167B (zh) * 2011-10-28 2016-03-30 无锡华润安盛科技有限公司 半导体器件拾取装置
JP6765751B2 (ja) * 2016-06-21 2020-10-07 株式会社ディスコ 被加工物の保持機構及び加工装置
CN106927258A (zh) * 2017-01-26 2017-07-07 江苏东旭亿泰智能装备有限公司 一种用于玻璃基板的传送装置及其传送方法
CN111052313A (zh) * 2017-08-10 2020-04-21 东京毅力科创株式会社 基板处理方法
KR20190100980A (ko) * 2017-12-27 2019-08-30 캐논 톡키 가부시키가이샤 정전척, 성막장치, 기판흡착방법, 성막방법, 및 전자 디바이스의 제조방법
KR102421610B1 (ko) * 2018-07-31 2022-07-14 캐논 톡키 가부시키가이샤 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법
KR102430361B1 (ko) * 2018-09-21 2022-08-05 캐논 톡키 가부시키가이샤 흡착장치, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
KR102550586B1 (ko) * 2018-10-31 2023-06-30 캐논 톡키 가부시키가이샤 흡착 및 얼라인먼트 방법, 흡착 시스템, 성막 방법, 성막 장치 및 전자 디바이스의 제조 방법

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Publication number Priority date Publication date Assignee Title
JP2012168386A (ja) * 2011-02-15 2012-09-06 Joyo Kogaku Kk 封止方法およびその装置
KR20140138452A (ko) * 2013-05-24 2014-12-04 엘지디스플레이 주식회사 캐리어기판 분리 시스템 및 분리 방법
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JP2014232772A (ja) * 2013-05-28 2014-12-11 リンテック株式会社 静電保持装置および静電保持装置からの保持対象物の離脱方法
JP2015053360A (ja) * 2013-09-06 2015-03-19 リンテック株式会社 シート貼付装置及び貼付方法
JP5523646B1 (ja) * 2013-12-04 2014-06-18 信越エンジニアリング株式会社 貼合デバイスの製造装置
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CN114193901A (zh) * 2020-09-18 2022-03-18 日机装株式会社 真空层叠装置及层叠体的制造方法

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JPWO2008041293A1 (ja) 2010-01-28
TWI412480B (zh) 2013-10-21
CN101316777A (zh) 2008-12-03
TW200815268A (en) 2008-04-01
CN101316777B (zh) 2012-01-18

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