WO2015083257A1 - Procédé de fabrication d'un dispositif collé - Google Patents

Procédé de fabrication d'un dispositif collé Download PDF

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Publication number
WO2015083257A1
WO2015083257A1 PCT/JP2013/082620 JP2013082620W WO2015083257A1 WO 2015083257 A1 WO2015083257 A1 WO 2015083257A1 JP 2013082620 W JP2013082620 W JP 2013082620W WO 2015083257 A1 WO2015083257 A1 WO 2015083257A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
chamber
hole
holding member
pressure chamber
Prior art date
Application number
PCT/JP2013/082620
Other languages
English (en)
Japanese (ja)
Inventor
義和 大谷
Original Assignee
信越エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越エンジニアリング株式会社 filed Critical 信越エンジニアリング株式会社
Priority to KR1020157018877A priority Critical patent/KR20160093539A/ko
Priority to PCT/JP2013/082620 priority patent/WO2015083257A1/fr
Priority to JP2014509968A priority patent/JP5523646B1/ja
Priority to CN201380070869.7A priority patent/CN104937652A/zh
Priority to TW103140669A priority patent/TWI576246B/zh
Publication of WO2015083257A1 publication Critical patent/WO2015083257A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Abstract

L'invention concerne une structure d'étanchéité caractérisée en ce qu'aucun élément d'étanchéité n'est utilisé entre une chambre à pression ou des trous débouchants et un élément de distribution, et en ce que l'élément de distribution peut être déplacé sans contact de manière illimitée. Lorsqu'une pièce est amenée dans une chambre (1) à pression, une unité (7) de commande ouvre un élément (6) de fermeture de façon à ouvrir des trous débouchants (12) dans la chambre (1) à pression, rendant ainsi mobile un élément (5) de distribution. Une première pièce (W1) et/ou une deuxième pièce (W2) sont reçues par l'élément (5) de distribution et amenées de l'élément (5) de distribution à un premier élément (2) de maintien et/ou à un deuxième élément (3) de maintien. Ensuite, l'unité de commande retire l'élément (5) de distribution des trous débouchants (12) de la chambre (1) à pression, puis ferme l'élément (6) de fermeture de façon à fermer les trous débouchants (12) de manière étanche à l'air. Ainsi, la pression peut être réduite dans la chambre (1) à pression jusqu'à un état de vide poussé, et la première pièce (W1) et la deuxième pièce (W2) sont collées.
PCT/JP2013/082620 2013-12-04 2013-12-04 Procédé de fabrication d'un dispositif collé WO2015083257A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020157018877A KR20160093539A (ko) 2013-12-04 2013-12-04 첩합 디바이스의 제조 장치
PCT/JP2013/082620 WO2015083257A1 (fr) 2013-12-04 2013-12-04 Procédé de fabrication d'un dispositif collé
JP2014509968A JP5523646B1 (ja) 2013-12-04 2013-12-04 貼合デバイスの製造装置
CN201380070869.7A CN104937652A (zh) 2013-12-04 2013-12-04 贴合器件的制造装置
TW103140669A TWI576246B (zh) 2013-12-04 2014-11-24 A device for manufacturing a bonded device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/082620 WO2015083257A1 (fr) 2013-12-04 2013-12-04 Procédé de fabrication d'un dispositif collé

Publications (1)

Publication Number Publication Date
WO2015083257A1 true WO2015083257A1 (fr) 2015-06-11

Family

ID=51175681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/082620 WO2015083257A1 (fr) 2013-12-04 2013-12-04 Procédé de fabrication d'un dispositif collé

Country Status (5)

Country Link
JP (1) JP5523646B1 (fr)
KR (1) KR20160093539A (fr)
CN (1) CN104937652A (fr)
TW (1) TWI576246B (fr)
WO (1) WO2015083257A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021007154A (ja) * 2020-09-09 2021-01-21 東京エレクトロン株式会社 接合装置
JP2021007155A (ja) * 2016-07-12 2021-01-21 東京エレクトロン株式会社 接合装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5797863B1 (ja) * 2015-05-29 2015-10-21 オリジン電気株式会社 接合部材製造装置及び接合部材の製造方法
JP6049820B1 (ja) * 2015-07-24 2016-12-21 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
JP7057336B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板保持部材、基板保持装置、基板処理装置、基板保持方法、成膜方法、及び電子デバイスの製造方法
KR102154686B1 (ko) * 2020-05-19 2020-09-10 ㈜ 엘에이티 정전척 방식의 폴더블 디스플레이 제조용 라미네이터
KR102154685B1 (ko) * 2020-05-19 2020-09-10 ㈜ 엘에이티 정전력을 이용한 폴더블 디스플레이 제조용 라미네이터

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040398A (ja) * 2000-07-19 2002-02-06 Nec Corp 液晶表示装置の製造装置及びその製造方法
JP2006178476A (ja) * 2005-12-26 2006-07-06 Fujitsu Ltd 貼合せ基板製造装置
JP2007234965A (ja) * 2006-03-02 2007-09-13 Toto Ltd 静電吸着方法
WO2008041293A1 (fr) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
JP2009237287A (ja) * 2008-03-27 2009-10-15 Toshiba Mobile Display Co Ltd 平面表示装置の製造方法及び製造装置
JP2010262271A (ja) * 2009-04-08 2010-11-18 Shibaura Mechatronics Corp 基板貼り合わせ装置及び基板貼り合わせ方法
JP2012247507A (ja) * 2011-05-25 2012-12-13 Shibaura Mechatronics Corp 基板の貼り合せ装置
JP2013117713A (ja) * 2011-12-02 2013-06-13 Lg Display Co Ltd 基板の貼り合わせ方法及び基板の貼り合わせシステム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4690572B2 (ja) 2000-11-30 2011-06-01 キヤノンアネルバ株式会社 基板重ね合わせ装置
JP2006119286A (ja) * 2004-10-20 2006-05-11 Ran Technical Service Kk 基板の貼り合わせ装置及び貼り合わせ方法
WO2008114337A1 (fr) 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. Procédé de collage sous vide et dispositif de collage sous vide

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040398A (ja) * 2000-07-19 2002-02-06 Nec Corp 液晶表示装置の製造装置及びその製造方法
JP2006178476A (ja) * 2005-12-26 2006-07-06 Fujitsu Ltd 貼合せ基板製造装置
JP2007234965A (ja) * 2006-03-02 2007-09-13 Toto Ltd 静電吸着方法
WO2008041293A1 (fr) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
JP2009237287A (ja) * 2008-03-27 2009-10-15 Toshiba Mobile Display Co Ltd 平面表示装置の製造方法及び製造装置
JP2010262271A (ja) * 2009-04-08 2010-11-18 Shibaura Mechatronics Corp 基板貼り合わせ装置及び基板貼り合わせ方法
JP2012247507A (ja) * 2011-05-25 2012-12-13 Shibaura Mechatronics Corp 基板の貼り合せ装置
JP2013117713A (ja) * 2011-12-02 2013-06-13 Lg Display Co Ltd 基板の貼り合わせ方法及び基板の貼り合わせシステム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021007155A (ja) * 2016-07-12 2021-01-21 東京エレクトロン株式会社 接合装置
JP2021007154A (ja) * 2020-09-09 2021-01-21 東京エレクトロン株式会社 接合装置
JP7012798B2 (ja) 2020-09-09 2022-01-28 東京エレクトロン株式会社 接合装置

Also Published As

Publication number Publication date
TWI576246B (zh) 2017-04-01
KR20160093539A (ko) 2016-08-08
JP5523646B1 (ja) 2014-06-18
CN104937652A (zh) 2015-09-23
JPWO2015083257A1 (ja) 2017-03-16
TW201529326A (zh) 2015-08-01

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