KR102069550B1 - 대칭적 피드 구조를 갖는 기판 지지체 - Google Patents

대칭적 피드 구조를 갖는 기판 지지체 Download PDF

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KR102069550B1
KR102069550B1 KR1020197004123A KR20197004123A KR102069550B1 KR 102069550 B1 KR102069550 B1 KR 102069550B1 KR 1020197004123 A KR1020197004123 A KR 1020197004123A KR 20197004123 A KR20197004123 A KR 20197004123A KR 102069550 B1 KR102069550 B1 KR 102069550B1
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conductor
disposed
electrode
conductors
dielectric layer
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KR20190021472A (ko
Inventor
싱 린
더글라스 에이. 주니어. 버크버거
샤오핑 저우
앤드류 뉴옌
안첼 쉐이너
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020197004123A 2010-10-22 2011-10-20 대칭적 피드 구조를 갖는 기판 지지체 Active KR102069550B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/910,547 US9123762B2 (en) 2010-10-22 2010-10-22 Substrate support with symmetrical feed structure
US12/910,547 2010-10-22
PCT/US2011/057024 WO2012054689A2 (en) 2010-10-22 2011-10-20 Substrate support with symmetrical feed structure

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137002166A Division KR101950330B1 (ko) 2010-10-22 2011-10-20 대칭적 피드 구조를 갖는 기판 지지체

Publications (2)

Publication Number Publication Date
KR20190021472A KR20190021472A (ko) 2019-03-05
KR102069550B1 true KR102069550B1 (ko) 2020-02-11

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KR1020197004123A Active KR102069550B1 (ko) 2010-10-22 2011-10-20 대칭적 피드 구조를 갖는 기판 지지체
KR1020137002166A Active KR101950330B1 (ko) 2010-10-22 2011-10-20 대칭적 피드 구조를 갖는 기판 지지체

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Country Status (6)

Country Link
US (3) US9123762B2 (enExample)
JP (2) JP6226746B2 (enExample)
KR (2) KR102069550B1 (enExample)
CN (1) CN103081086B (enExample)
TW (2) TWI590373B (enExample)
WO (1) WO2012054689A2 (enExample)

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Also Published As

Publication number Publication date
CN103081086B (zh) 2016-08-03
WO2012054689A2 (en) 2012-04-26
CN103081086A (zh) 2013-05-01
TW201628122A (zh) 2016-08-01
US10096494B2 (en) 2018-10-09
TWI590373B (zh) 2017-07-01
TW201227870A (en) 2012-07-01
US20120097332A1 (en) 2012-04-26
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