KR102055630B1 - 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 - Google Patents

연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 Download PDF

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Publication number
KR102055630B1
KR102055630B1 KR1020170182060A KR20170182060A KR102055630B1 KR 102055630 B1 KR102055630 B1 KR 102055630B1 KR 1020170182060 A KR1020170182060 A KR 1020170182060A KR 20170182060 A KR20170182060 A KR 20170182060A KR 102055630 B1 KR102055630 B1 KR 102055630B1
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KR
South Korea
Prior art keywords
monomer
polyimide film
dianhydride
mol
diamine
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Application number
KR1020170182060A
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English (en)
Korean (ko)
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KR20190079944A (ko
Inventor
백승열
이길남
임현재
Original Assignee
에스케이씨코오롱피아이 주식회사
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Application filed by 에스케이씨코오롱피아이 주식회사 filed Critical 에스케이씨코오롱피아이 주식회사
Priority to KR1020170182060A priority Critical patent/KR102055630B1/ko
Priority to CN201880081644.4A priority patent/CN111491988B/zh
Priority to PCT/KR2018/011398 priority patent/WO2019132184A1/ko
Priority to TW107147486A priority patent/TWI705092B/zh
Publication of KR20190079944A publication Critical patent/KR20190079944A/ko
Application granted granted Critical
Publication of KR102055630B1 publication Critical patent/KR102055630B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
KR1020170182060A 2017-12-28 2017-12-28 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 KR102055630B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020170182060A KR102055630B1 (ko) 2017-12-28 2017-12-28 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판
CN201880081644.4A CN111491988B (zh) 2017-12-28 2018-09-27 用于制备柔性铜箔层压板的聚酰亚胺薄膜及包含其的柔性铜箔层压板
PCT/KR2018/011398 WO2019132184A1 (ko) 2017-12-28 2018-09-27 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판
TW107147486A TWI705092B (zh) 2017-12-28 2018-12-27 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170182060A KR102055630B1 (ko) 2017-12-28 2017-12-28 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190142542A Division KR102141891B1 (ko) 2019-11-08 2019-11-08 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판

Publications (2)

Publication Number Publication Date
KR20190079944A KR20190079944A (ko) 2019-07-08
KR102055630B1 true KR102055630B1 (ko) 2019-12-16

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Family Applications (1)

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KR1020170182060A KR102055630B1 (ko) 2017-12-28 2017-12-28 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판

Country Status (4)

Country Link
KR (1) KR102055630B1 (zh)
CN (1) CN111491988B (zh)
TW (1) TWI705092B (zh)
WO (1) WO2019132184A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102362385B1 (ko) * 2019-11-13 2022-02-15 피아이첨단소재 주식회사 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법
KR102346587B1 (ko) * 2019-11-13 2022-01-05 피아이첨단소재 주식회사 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법
CN111154125B (zh) * 2020-01-16 2022-09-27 东莞东阳光科研发有限公司 一种黑色聚酰亚胺薄膜及其制备方法
KR102652586B1 (ko) * 2021-09-30 2024-04-01 피아이첨단소재 주식회사 기계적 강도 및 내열성이 향상된 폴리이미드 필름 및 이의 제조방법
KR102689315B1 (ko) * 2021-12-20 2024-07-29 에스케이마이크로웍스 주식회사 필름, 다층전자장비 및 필름의 제조방법
CN114573811B (zh) * 2021-12-29 2023-12-22 宁波博雅聚力新材料科技有限公司 一种酰亚胺浆料、其合成方法以及含有该酰亚胺浆料的组合物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261822A (ja) 2000-03-17 2001-09-26 Hitachi Cable Ltd ポリイミドおよびその製造方法
JP2008531334A (ja) 2005-07-27 2008-08-14 エルジー・ケム・リミテッド 金属積層板およびその製造方法

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Publication number Priority date Publication date Assignee Title
JPH1149856A (ja) * 1997-08-04 1999-02-23 Mitsui Chem Inc ポリイミド共重合体
KR20070090425A (ko) * 2006-03-02 2007-09-06 주식회사 엘지화학 금속적층판 및 그의 제조방법
JP2009528933A (ja) * 2006-03-06 2009-08-13 エルジー・ケム・リミテッド 金属積層板およびその製造方法
KR101558621B1 (ko) * 2010-12-16 2015-10-08 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
FR2980201B1 (fr) * 2011-09-20 2014-10-24 Rhodia Operations Polyimides thermoplastiques
TWI535760B (zh) * 2014-06-30 2016-06-01 可隆股份有限公司 高耐熱聚醯胺酸溶液及聚醯亞胺薄膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261822A (ja) 2000-03-17 2001-09-26 Hitachi Cable Ltd ポリイミドおよびその製造方法
JP2008531334A (ja) 2005-07-27 2008-08-14 エルジー・ケム・リミテッド 金属積層板およびその製造方法

Also Published As

Publication number Publication date
KR20190079944A (ko) 2019-07-08
TWI705092B (zh) 2020-09-21
CN111491988B (zh) 2023-02-17
TW201930403A (zh) 2019-08-01
CN111491988A (zh) 2020-08-04
WO2019132184A1 (ko) 2019-07-04

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