KR101949722B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDF

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KR101949722B1
KR101949722B1 KR1020130140481A KR20130140481A KR101949722B1 KR 101949722 B1 KR101949722 B1 KR 101949722B1 KR 1020130140481 A KR1020130140481 A KR 1020130140481A KR 20130140481 A KR20130140481 A KR 20130140481A KR 101949722 B1 KR101949722 B1 KR 101949722B1
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South Korea
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flow rate
housing
substrate
cup
gas
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Korean (ko)
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KR20140064666A (ko
Inventor
타카히사 오츠카
노부히로 오가타
히로시 마루모토
테루후미 와키야마
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020130140481A 2012-11-20 2013-11-19 기판 처리 장치, 기판 처리 방법 및 기억 매체 Ceased KR101949722B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012254424A JP6026241B2 (ja) 2012-11-20 2012-11-20 基板処理装置、基板処理方法及び記憶媒体
JPJP-P-2012-254424 2012-11-20

Publications (2)

Publication Number Publication Date
KR20140064666A KR20140064666A (ko) 2014-05-28
KR101949722B1 true KR101949722B1 (ko) 2019-02-19

Family

ID=50726750

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130140481A Ceased KR101949722B1 (ko) 2012-11-20 2013-11-19 기판 처리 장치, 기판 처리 방법 및 기억 매체

Country Status (4)

Country Link
US (1) US20140137893A1 (https=)
JP (1) JP6026241B2 (https=)
KR (1) KR101949722B1 (https=)
TW (1) TWI547986B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150098211A (ko) * 2014-02-19 2015-08-27 램 리서치 아게 웨이퍼-형상 물체를 프로세싱하는 방법 및 장치

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102232664B1 (ko) * 2014-05-28 2021-03-30 세메스 주식회사 기판 처리 장치 및 기판 처리 시스템
JP6306459B2 (ja) * 2014-07-15 2018-04-04 東京エレクトロン株式会社 基板処理装置および基板処理方法
US10203604B2 (en) * 2015-11-30 2019-02-12 Applied Materials, Inc. Method and apparatus for post exposure processing of photoresist wafers
KR102387542B1 (ko) * 2017-05-11 2022-04-19 주식회사 케이씨텍 에어공급부 및 기판 처리 장치
JP6887912B2 (ja) * 2017-08-07 2021-06-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6990602B2 (ja) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
JP7015219B2 (ja) * 2018-06-29 2022-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102201879B1 (ko) * 2018-09-07 2021-01-12 세메스 주식회사 기판 처리 장치 및 방법
JP7307575B2 (ja) 2019-03-28 2023-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7314634B2 (ja) 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
KR102351341B1 (ko) * 2019-12-09 2022-01-18 무진전자 주식회사 팬 필터 유닛 및 이를 포함하는 기판 처리 장치
JP7356896B2 (ja) * 2019-12-24 2023-10-05 東京エレクトロン株式会社 液処理装置、液処理方法及びコンピュータ読み取り可能な記録媒体
US12512342B2 (en) * 2020-02-26 2025-12-30 SCREEN Holdings Co., Ltd. Substrate treating apparatus
KR102835069B1 (ko) * 2020-04-16 2025-07-17 주식회사 제우스 기판 처리장치 및 기판 처리방법
KR102388473B1 (ko) * 2020-08-11 2022-04-20 (주)마스 클린 건조 공기 셔터 팬 필터 유닛
TWI770753B (zh) * 2021-01-04 2022-07-11 南亞科技股份有限公司 清洗裝置及清洗方法
KR20220131680A (ko) * 2021-03-22 2022-09-29 세메스 주식회사 기판 처리 장치
JP7719651B2 (ja) * 2021-07-15 2025-08-06 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板洗浄システム、基板処理システム、基板洗浄方法および基板処理方法
KR102571523B1 (ko) 2021-09-10 2023-08-29 (주)디바이스이엔지 배기구조를 포함하는 기판 처리장치
JP2023165156A (ja) * 2022-05-02 2023-11-15 東京エレクトロン株式会社 気流形成装置
KR102646155B1 (ko) * 2022-10-05 2024-03-12 엘에스이 주식회사 기판 세정 장치
KR102844261B1 (ko) * 2024-01-04 2025-08-11 엘에스이 주식회사 기판 세정 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080078426A1 (en) 2006-09-28 2008-04-03 Katsuhiko Miya Substrate processing apparatus and substrate processing method
US20080093340A1 (en) 2006-10-06 2008-04-24 Mitsunori Nakamori Substrate processing method, substrate processing apparatus, and storage medium
JP2009224514A (ja) * 2008-03-14 2009-10-01 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20100078129A1 (en) 2008-09-26 2010-04-01 Tokyo Electron Limited Mounting table for plasma processing apparatus
US20120234356A1 (en) 2011-03-16 2012-09-20 Tokyo Electron Limited Liquid processing apparatus, liquid processing method and storage medium
JP2012204719A (ja) * 2011-03-28 2012-10-22 Dainippon Screen Mfg Co Ltd 基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148231A (ja) * 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP3380663B2 (ja) * 1995-11-27 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
JP2003347186A (ja) * 2002-05-23 2003-12-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4381909B2 (ja) * 2004-07-06 2009-12-09 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4516141B2 (ja) 2008-06-02 2010-08-04 東京エレクトロン株式会社 基板処理方法，記録媒体及び基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080078426A1 (en) 2006-09-28 2008-04-03 Katsuhiko Miya Substrate processing apparatus and substrate processing method
US20080093340A1 (en) 2006-10-06 2008-04-24 Mitsunori Nakamori Substrate processing method, substrate processing apparatus, and storage medium
JP2009224514A (ja) * 2008-03-14 2009-10-01 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20100078129A1 (en) 2008-09-26 2010-04-01 Tokyo Electron Limited Mounting table for plasma processing apparatus
US20120234356A1 (en) 2011-03-16 2012-09-20 Tokyo Electron Limited Liquid processing apparatus, liquid processing method and storage medium
JP2012204719A (ja) * 2011-03-28 2012-10-22 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150098211A (ko) * 2014-02-19 2015-08-27 램 리서치 아게 웨이퍼-형상 물체를 프로세싱하는 방법 및 장치
KR102360260B1 (ko) 2014-02-19 2022-02-07 램 리서치 아게 웨이퍼-형상 물체를 프로세싱하는 방법 및 장치

Also Published As

Publication number Publication date
JP6026241B2 (ja) 2016-11-16
KR20140064666A (ko) 2014-05-28
JP2014103263A (ja) 2014-06-05
TWI547986B (zh) 2016-09-01
TW201440133A (zh) 2014-10-16
US20140137893A1 (en) 2014-05-22

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