KR101941050B1 - 금속 피복 수지 입자 및 이것을 사용한 도전성 접착제 - Google Patents
금속 피복 수지 입자 및 이것을 사용한 도전성 접착제 Download PDFInfo
- Publication number
- KR101941050B1 KR101941050B1 KR1020167024105A KR20167024105A KR101941050B1 KR 101941050 B1 KR101941050 B1 KR 101941050B1 KR 1020167024105 A KR1020167024105 A KR 1020167024105A KR 20167024105 A KR20167024105 A KR 20167024105A KR 101941050 B1 KR101941050 B1 KR 101941050B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal
- resin
- resin particles
- particles
- urethane
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2014-090474 | 2014-04-24 | ||
JP2014090474A JP6429228B2 (ja) | 2014-04-24 | 2014-04-24 | 金属被覆樹脂粒子及びそれを用いた導電性接着剤 |
PCT/JP2015/002210 WO2015162931A1 (ja) | 2014-04-24 | 2015-04-23 | 金属被覆樹脂粒子及びそれを用いた導電性接着剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160148515A KR20160148515A (ko) | 2016-12-26 |
KR101941050B1 true KR101941050B1 (ko) | 2019-01-22 |
Family
ID=54332105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167024105A KR101941050B1 (ko) | 2014-04-24 | 2015-04-23 | 금속 피복 수지 입자 및 이것을 사용한 도전성 접착제 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6429228B2 (ja) |
KR (1) | KR101941050B1 (ja) |
CN (1) | CN106233397B (ja) |
TW (1) | TWI611002B (ja) |
WO (1) | WO2015162931A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11490846B2 (en) | 2016-06-30 | 2022-11-08 | Tatsuta Electric Wire & Cable Co., Ltd. | Bioelectrode and method for producing bioelectrode |
JP6653843B2 (ja) | 2016-06-30 | 2020-02-26 | タツタ電線株式会社 | 電極材料 |
JP6612984B2 (ja) | 2016-06-30 | 2019-11-27 | タツタ電線株式会社 | 塩化銀ペースト |
JP6810452B2 (ja) * | 2016-11-14 | 2021-01-06 | ナミックス株式会社 | 金属被覆粒子及び樹脂組成物 |
JP2018120929A (ja) * | 2017-01-24 | 2018-08-02 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP2018175127A (ja) * | 2017-04-07 | 2018-11-15 | 東海電気株式会社 | 体内管導入物用マーカー及び体内管導入物,並びにそれらの製造方法 |
JP2019179647A (ja) * | 2018-03-30 | 2019-10-17 | デクセリアルズ株式会社 | 導電材料、及び接続体の製造方法 |
KR102660389B1 (ko) * | 2021-07-16 | 2024-04-24 | 엑시노 주식회사 | 저밀도 판상형 도전성 분말의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008156610A (ja) * | 2006-11-29 | 2008-07-10 | Sanyo Chem Ind Ltd | 弾性樹脂粒子 |
JP2010033911A (ja) * | 2008-07-29 | 2010-02-12 | Hiroshima Industrial Promotion Organization | 導電性粒子及び導電材料 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2948038B2 (ja) * | 1992-12-18 | 1999-09-13 | 住友ベークライト株式会社 | 異方導電フィルム |
US5565143A (en) * | 1995-05-05 | 1996-10-15 | E. I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
JP3436327B2 (ja) | 1995-05-16 | 2003-08-11 | 日本化学工業株式会社 | 導電性無電解めっき粉体 |
JP3241276B2 (ja) | 1995-10-30 | 2001-12-25 | 積水化学工業株式会社 | 導電性微球体及び液晶表示素子 |
JP3294146B2 (ja) | 1997-03-21 | 2002-06-24 | 早川ゴム株式会社 | 金属被覆微粒子及び導電性材料 |
JPH11339558A (ja) * | 1998-05-26 | 1999-12-10 | Sekisui Chem Co Ltd | 異方性導電接着剤及び導電接続構造体 |
JP4347974B2 (ja) | 2000-01-05 | 2009-10-21 | 積水化学工業株式会社 | 導電性微粒子の製造方法、異方性導電接着剤及び導電接続構造体 |
JP2004164874A (ja) * | 2002-11-08 | 2004-06-10 | Osugi Kk | 異方性導電接着剤用導電微粒子 |
JP2005036265A (ja) * | 2003-07-18 | 2005-02-10 | Natoko Kk | 導電性粒子、導電性材料および異方性導電膜 |
JP2006012709A (ja) * | 2004-06-29 | 2006-01-12 | Sanyo Chem Ind Ltd | 導電性微粒子 |
JP2008285631A (ja) * | 2007-05-21 | 2008-11-27 | Sanyo Chem Ind Ltd | 樹脂粒子分散体 |
WO2010013668A1 (ja) * | 2008-07-31 | 2010-02-04 | 積水化学工業株式会社 | 重合体粒子、導電性粒子、異方性導電材料及び接続構造体 |
JP5535507B2 (ja) * | 2009-03-30 | 2014-07-02 | 国立大学法人京都大学 | 導電性粒子、及びその製造方法 |
WO2011001910A1 (ja) * | 2009-06-30 | 2011-01-06 | 東海ゴム工業株式会社 | 柔軟導電材料およびトランスデューサ |
WO2011115105A1 (ja) * | 2010-03-17 | 2011-09-22 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体 |
JP2011238433A (ja) * | 2010-05-10 | 2011-11-24 | Sumitomo Electric Ind Ltd | フィルム状導電性接着剤並びにこれを用いた接続構造体及び回路基板接続方法 |
EP2607520B1 (en) * | 2010-08-20 | 2019-10-30 | Mitsubishi Materials Electronic Chemicals Co., Ltd. | Silver-coated spherical resin, method for producing same, anisotropically conductive adhesive containing silver-coated spherical resin, anisotropically conductive film containing silver-coated spherical resin, and conductive spacer containing silver-coated spherical resin |
JP5410387B2 (ja) * | 2010-08-31 | 2014-02-05 | デクセリアルズ株式会社 | 導電性粒子及びその製造方法、並びに異方性導電フィルム、接合体、及び接続方法 |
JP2012164454A (ja) * | 2011-02-04 | 2012-08-30 | Sony Chemical & Information Device Corp | 導電性粒子及びこれを用いた異方性導電材料 |
JP5583613B2 (ja) * | 2011-02-04 | 2014-09-03 | 株式会社日本触媒 | 導電性微粒子 |
JP5936882B2 (ja) * | 2012-03-02 | 2016-06-22 | デクセリアルズ株式会社 | 回路接続材料、及びそれを用いた実装体の製造方法 |
JP5988512B2 (ja) * | 2014-10-15 | 2016-09-07 | 京楽産業.株式会社 | 遊技機 |
JP6187834B2 (ja) * | 2016-02-05 | 2017-08-30 | 株式会社サンセイアールアンドディ | 遊技機 |
-
2014
- 2014-04-24 JP JP2014090474A patent/JP6429228B2/ja active Active
-
2015
- 2015-04-23 TW TW104113068A patent/TWI611002B/zh active
- 2015-04-23 WO PCT/JP2015/002210 patent/WO2015162931A1/ja active Application Filing
- 2015-04-23 KR KR1020167024105A patent/KR101941050B1/ko active IP Right Grant
- 2015-04-23 CN CN201580021076.5A patent/CN106233397B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008156610A (ja) * | 2006-11-29 | 2008-07-10 | Sanyo Chem Ind Ltd | 弾性樹脂粒子 |
JP2010033911A (ja) * | 2008-07-29 | 2010-02-12 | Hiroshima Industrial Promotion Organization | 導電性粒子及び導電材料 |
Also Published As
Publication number | Publication date |
---|---|
KR20160148515A (ko) | 2016-12-26 |
TWI611002B (zh) | 2018-01-11 |
CN106233397B (zh) | 2019-04-09 |
WO2015162931A1 (ja) | 2015-10-29 |
JP6429228B2 (ja) | 2018-11-28 |
CN106233397A (zh) | 2016-12-14 |
JP2015210883A (ja) | 2015-11-24 |
TW201606042A (zh) | 2016-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101941050B1 (ko) | 금속 피복 수지 입자 및 이것을 사용한 도전성 접착제 | |
KR101612564B1 (ko) | 중합체 입자, 도전성 입자, 이방성 도전 재료 및 접속 구조체 | |
JP7100088B2 (ja) | 導電材料 | |
CN102120920B (zh) | 各向异性导电粘性复合物和膜,及电路连接结构 | |
TWI601159B (zh) | Conductive particles, resin particles, a conductive material, and a connecting structure | |
JP4950451B2 (ja) | 導電性微粒子、異方性導電材料、及び、接続構造体 | |
TWI550640B (zh) | 以含有導電微球之各向異性導電膜連接的半導體元件 | |
CN101689410A (zh) | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 | |
JP2009076431A (ja) | 異方性導電膜およびその製造方法 | |
US20150047878A1 (en) | Electroconductive particle, circuit connecting material, mounting body, and method for manufacturing mounting body | |
JP2011040189A (ja) | 導電性粒子、異方性導電材料及び接続構造体 | |
KR20100080628A (ko) | 회로 접속 재료, 및 회로 부재의 접속 구조 | |
KR20230043820A (ko) | 도전성 접착제 | |
JP2008210908A (ja) | 電子部品の実装方法 | |
JP7289993B2 (ja) | 導電性接着剤層 | |
KR20200080337A (ko) | 접속 재료 | |
KR101534841B1 (ko) | 돌기형 도전성 미립자 및 이를 포함하는 이방 도전성 필름 | |
JP2020109739A (ja) | 導電粒子、導電材料およびそれを用いた接続構造体 | |
JP2001214149A (ja) | 異方導電接着剤 | |
TW201903786A (zh) | 樹脂組合物及導通檢查用構件 | |
JP2018133331A (ja) | 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト | |
JP2018110120A (ja) | 異方性導電フィルム、並びに、接合体の製造方法及び接合体 | |
JP5421982B2 (ja) | 導電性微粒子、異方性導電材料、及び、接続構造体 | |
JP6280017B2 (ja) | 異方性導電フィルム、並びに、接続方法及び接合体 | |
WO2016068165A1 (ja) | 導電材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant |