JP6429228B2 - 金属被覆樹脂粒子及びそれを用いた導電性接着剤 - Google Patents
金属被覆樹脂粒子及びそれを用いた導電性接着剤 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Description
1.金属被覆樹脂粒子の調整及び評価
表1に示した樹脂粒子をそれぞれ用いて金属被覆樹脂粒子を形成した。樹脂粒子の30%圧縮変形後の回復率は、微小圧縮試験機((株)島津製作所製、MCT−510)を用いて、以下の要領で測定した。
圧縮率(%)=(a/R)×100
2.導電性接着剤の調整及び評価
上記により得られた金属被覆粒子を、熱可塑性樹脂成分に配合して導電性接着剤を調製した。使用した樹脂成分の詳細は次の通りであり、得られた導電性接着剤中1.5質量%とした。得られた導電性接着剤につき、次の方法で導電性を調べた。結果を表1に示す。
導電性(初期):図4に示すように、フレキシブルプリント基板(FPC)11とガラスエポキシ基板12とを導電性接着剤で接着したFPC/PTF試験用サンプルを作成し、低抵抗計(日置電機(株)製、直流方式3227ミリオームハイテスタ)を用いてフレキシブルプリント基板11の端末端子間(a−b、b−c、及びc−d間)の接続抵抗をそれぞれ測定し、平均値を求めた。
2 ……ステージ
3 ……圧子
4 ……低抵抗計
11……フレキシブルプリント基板
12……ガラスエポキシ基板
Claims (5)
- 樹脂粒子と、この樹脂粒子の少なくとも一部を被覆する金属被覆層とからなる金属被覆樹脂粒子であって、
前記樹脂粒子は、ポリエステルポリオール、ポリエーテルポリオール、ポリエーテルエステルポリオール、及びポリカーボネートポリオールからなる群より選ばれる少なくとも1種の高分子ポリオール(a)とジイソシアネート(b)とを必須成分としてなり、炭素−炭素2重結合を有するウレタン樹脂(A1)と、ウレタン結合を有さず数平均分子量が100〜1000であって炭素−炭素2重結合を2個以上有する化合物(B)との架橋共重合体を含有することを特徴とする弾性樹脂粒子、又は、ジイソシアネート3量体(h)を必須成分としてなり、炭素−炭素2重結合を有するウレタン樹脂(A2)と、ウレタン結合を有さず数平均分子量が100〜1000であって炭素−炭素2重結合を2個以上有する化合物(B)との架橋共重合体を含有することを特徴とする弾性樹脂粒子であり、平均粒径が1〜100μmであり、30%圧縮変形後の回復率が90%以上であり、
前記金属被覆層は、ビッカース硬度が100以下の金属からなり、平均厚みが20〜150nmである
ことを特徴とする金属被覆樹脂粒子。 - 30%変位に必要な力が20mN以下であることを特徴とする、請求項1に記載の金属被覆樹脂粒子。
- 前記金属被覆層が、金、銀、パラジウム、白金、及び銅からなる群から選択された1種又は2種以上の金属からなることを特徴とする、請求項1又は2に記載の金属被覆樹脂粒子。
- 請求項1〜3の何れか1項に記載の金属被覆樹脂粒子を樹脂成分100質量部に対して1〜100質量部の割合で配合したことを特徴とする導電性接着剤。
- 請求項4に記載の導電性接着剤を用いて、電極を接続したことを特徴とするプリント配線板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014090474A JP6429228B2 (ja) | 2014-04-24 | 2014-04-24 | 金属被覆樹脂粒子及びそれを用いた導電性接着剤 |
PCT/JP2015/002210 WO2015162931A1 (ja) | 2014-04-24 | 2015-04-23 | 金属被覆樹脂粒子及びそれを用いた導電性接着剤 |
KR1020167024105A KR101941050B1 (ko) | 2014-04-24 | 2015-04-23 | 금속 피복 수지 입자 및 이것을 사용한 도전성 접착제 |
TW104113068A TWI611002B (zh) | 2014-04-24 | 2015-04-23 | 金屬被覆樹脂粒子及使用其之導電性接著劑 |
CN201580021076.5A CN106233397B (zh) | 2014-04-24 | 2015-04-23 | 金属覆盖树脂颗粒及使用其的导电性粘接剂 |
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JP2014090474A JP6429228B2 (ja) | 2014-04-24 | 2014-04-24 | 金属被覆樹脂粒子及びそれを用いた導電性接着剤 |
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JP2015210883A JP2015210883A (ja) | 2015-11-24 |
JP6429228B2 true JP6429228B2 (ja) | 2018-11-28 |
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JP (1) | JP6429228B2 (ja) |
KR (1) | KR101941050B1 (ja) |
CN (1) | CN106233397B (ja) |
TW (1) | TWI611002B (ja) |
WO (1) | WO2015162931A1 (ja) |
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US11490846B2 (en) | 2016-06-30 | 2022-11-08 | Tatsuta Electric Wire & Cable Co., Ltd. | Bioelectrode and method for producing bioelectrode |
JP6653843B2 (ja) | 2016-06-30 | 2020-02-26 | タツタ電線株式会社 | 電極材料 |
JP6612984B2 (ja) | 2016-06-30 | 2019-11-27 | タツタ電線株式会社 | 塩化銀ペースト |
JP6810452B2 (ja) * | 2016-11-14 | 2021-01-06 | ナミックス株式会社 | 金属被覆粒子及び樹脂組成物 |
JP2018120929A (ja) * | 2017-01-24 | 2018-08-02 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP2018175127A (ja) * | 2017-04-07 | 2018-11-15 | 東海電気株式会社 | 体内管導入物用マーカー及び体内管導入物,並びにそれらの製造方法 |
JP2019179647A (ja) * | 2018-03-30 | 2019-10-17 | デクセリアルズ株式会社 | 導電材料、及び接続体の製造方法 |
WO2023287222A1 (ko) * | 2021-07-16 | 2023-01-19 | 엑시노 주식회사 | 저밀도 판상형 도전성 분말의 제조방법 |
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