KR101922791B1 - 신속 반응형, 형상 기억 열경화성 폴리이미드 및 이의 제조 방법 - Google Patents

신속 반응형, 형상 기억 열경화성 폴리이미드 및 이의 제조 방법 Download PDF

Info

Publication number
KR101922791B1
KR101922791B1 KR1020167035960A KR20167035960A KR101922791B1 KR 101922791 B1 KR101922791 B1 KR 101922791B1 KR 1020167035960 A KR1020167035960 A KR 1020167035960A KR 20167035960 A KR20167035960 A KR 20167035960A KR 101922791 B1 KR101922791 B1 KR 101922791B1
Authority
KR
South Korea
Prior art keywords
temperature
shape memory
hours
product
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020167035960A
Other languages
English (en)
Korean (ko)
Other versions
KR20170012379A (ko
Inventor
징송 렁
신리 시아오
옌쥐 리우
더옌 콩
Original Assignee
하얼빈 인스티튜트 오브 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하얼빈 인스티튜트 오브 테크놀로지 filed Critical 하얼빈 인스티튜트 오브 테크놀로지
Publication of KR20170012379A publication Critical patent/KR20170012379A/ko
Application granted granted Critical
Publication of KR101922791B1 publication Critical patent/KR101922791B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • C08G73/026Wholly aromatic polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • C08G73/0273Polyamines containing heterocyclic moieties in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075Partially aromatic polyimides
    • C08G73/1078Partially aromatic polyimides wholly aromatic in the diamino moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075Partially aromatic polyimides
    • C08G73/1082Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/02Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/03Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
    • C08J3/075Macromolecular gels
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2280/00Compositions for creating shape memory

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020167035960A 2014-05-23 2015-01-07 신속 반응형, 형상 기억 열경화성 폴리이미드 및 이의 제조 방법 Active KR101922791B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201410221959.8 2014-05-23
CN201410221959.8A CN103980491B (zh) 2014-05-23 2014-05-23 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法
PCT/CN2015/070280 WO2015176544A1 (zh) 2014-05-23 2015-01-07 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法

Publications (2)

Publication Number Publication Date
KR20170012379A KR20170012379A (ko) 2017-02-02
KR101922791B1 true KR101922791B1 (ko) 2018-11-27

Family

ID=51272675

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167035960A Active KR101922791B1 (ko) 2014-05-23 2015-01-07 신속 반응형, 형상 기억 열경화성 폴리이미드 및 이의 제조 방법

Country Status (6)

Country Link
US (2) US10155850B2 (https=)
EP (1) EP3147306B1 (https=)
JP (1) JP6418562B2 (https=)
KR (1) KR101922791B1 (https=)
CN (1) CN103980491B (https=)
WO (1) WO2015176544A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230151372A (ko) 2022-04-25 2023-11-01 가톨릭대학교 산학협력단 4d 프린팅 공정을 이용한 열자극 반응성 형상 기억 고분자 및 이의 제조방법

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103980491B (zh) 2014-05-23 2016-04-06 哈尔滨工业大学 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法
CN104788675B (zh) * 2015-04-22 2017-04-26 哈尔滨工业大学 一种光学透明的浅色耐高温形状记忆聚合物及其制备方法
US10239254B1 (en) * 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
CN106478949A (zh) * 2015-08-28 2017-03-08 深圳市比克动力电池有限公司 聚醚酰亚胺热缩膜基体材料及其制备方法
CN105254888B (zh) * 2015-11-23 2019-01-22 厦门理工学院 聚酰亚胺离聚物及其制备方法
CN105399951B (zh) * 2015-12-29 2018-03-30 哈尔滨工业大学 一种玻璃化转变温度可调节的形状记忆无规共聚聚酰亚胺及其制备方法
CN105778092B (zh) * 2016-03-09 2018-03-16 哈尔滨工业大学 一种聚醚酰亚胺高温热缩管及其制备方法
WO2018194936A1 (en) * 2017-04-21 2018-10-25 Ares Materials Inc. Polymer substrate design parameters for electronic microfabrication
US10749368B2 (en) * 2017-06-01 2020-08-18 Logitech Europe S.A. Computer mouse clock tuning to reduce electromagnetic induced noise in a wireless charging system
CN107500732B (zh) * 2017-08-10 2019-11-19 浙江大学 一种制备三维无机陶瓷的方法
CN109679103B (zh) * 2017-10-18 2021-03-23 天津大学 一种动态热可逆可重塑的聚硅氧烷弹性体材料及其制备方法
CN109679102B (zh) * 2017-10-18 2021-03-23 天津大学 一种动态热可逆可重塑的石墨烯/聚硅氧烷纳米复合材料及其制备方法
CN107698760A (zh) * 2017-10-21 2018-02-16 芮志行 一种耐老化型形状记忆聚酰亚胺的制备方法
CN108257783B (zh) * 2017-12-30 2019-12-03 山东众鑫电子材料有限公司 一种自动还原型电容器金属化薄膜的制备方法
CN108456309B (zh) * 2018-01-17 2020-08-21 中国科学院兰州化学物理研究所 一种可层压及焊接的高性能热固性形状记忆聚酰亚胺
CN109651611A (zh) * 2018-12-29 2019-04-19 哈尔滨工业大学 一种形状记忆聚酰亚胺预浸料、复合材料及制备方法
RU2738712C1 (ru) * 2019-06-25 2020-12-15 Общество с ограниченной ответственностью "Научно-исследовательский институт космических и авиационных материалов" Цианат-эфирные полимерные смолы для изготовления высокопрочных композиционных изделий космического назначения с эффектом памяти формы
US11840607B1 (en) 2019-09-30 2023-12-12 United States Of America As Represented By The Secretary Of The Air Force Cross-linkable thermoplastics, and processes of making and using same
US11577448B1 (en) 2019-09-30 2023-02-14 United States Of America As Represented By The Secretary Of The Air Force Method for fabricating multiphenylethynyl-containing and lightly crosslinked polyimides capable of memorizing shapes and augmenting thermomechanical stability
US11504899B1 (en) 2019-09-30 2022-11-22 United States Of America As Represented By The Secretary Of The Air Force Method for fabricating lightly crosslinked polyimides with phenylethynyl pendants for shape-memory effect and programmed enhancement in Tg and modulus
US11613051B1 (en) 2019-09-30 2023-03-28 United States Of America As Represented By The Secretary Of The Air Force Shape-memory polyimide nanocomposites and fabrication of same
MX2022013519A (es) 2020-04-30 2022-11-16 GAF Energy LLC Hoja frontal y hoja trasera de modulo fotovoltaico.
TWI876067B (zh) * 2020-06-29 2025-03-11 日商日本化藥股份有限公司 異氰酸酯改質聚醯亞胺樹脂、樹脂組成物及其硬化物
CN115536816B (zh) * 2022-10-28 2024-02-20 中国科学院兰州化学物理研究所 一种热固性环氧树脂形状记忆聚合物及其制备方法
CN115850703B (zh) * 2022-11-04 2024-05-17 齐鲁工业大学 一种生物基本征型光敏形状记忆聚酰亚胺及三维智能聚酰亚胺的制备方法
CN115873246B (zh) * 2022-11-30 2024-06-07 中国科学院兰州化学物理研究所 一种耐高温热固性超分子形状记忆聚酰亚胺及其制备方法
CN115850701B (zh) * 2022-12-06 2024-07-02 西安工业大学 一种低开启电压的阻变活性材料及其存储元件的制备方法
CN116041702B (zh) * 2023-01-04 2025-08-08 中国科学院兰州化学物理研究所 一种形状记忆聚酰亚胺模塑粉及其制备方法和应用、形状记忆聚酰亚胺三维块体材料
CN116640303B (zh) * 2023-06-21 2026-03-13 齐鲁工业大学(山东省科学院) 一种交联聚酰亚胺大分子链结构互穿型多刺激响应形状记忆聚酰亚胺多孔材料及其制备方法
CN120310011A (zh) * 2025-04-19 2025-07-15 哈尔滨工业大学 一种基于聚酰亚胺凝胶动态网络重构成膜的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010024389A (ja) 2008-07-23 2010-02-04 Toyobo Co Ltd ポリイミド構造体、その製造方法および積層フィルム、デバイス構造体
US20100063241A1 (en) 2008-09-09 2010-03-11 Spirit Aerosystems, Inc. High performance polyaspartimide resin
JP2012224697A (ja) * 2011-04-18 2012-11-15 Sumitomo Electric Wintec Inc ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001081453A1 (en) * 2000-04-27 2001-11-01 Virginia Tech Intellectual Properties, Inc. Method for making polyimide
US7147906B2 (en) * 2003-06-24 2006-12-12 General Electric Company Data storage medium comprising polyimides
JP2005042091A (ja) * 2003-07-04 2005-02-17 Nitto Denko Corp 電気絶縁材料用ポリイミド樹脂
JP2007099842A (ja) * 2005-09-30 2007-04-19 Kaneka Corp 新規なポリイミド樹脂
JP2007106891A (ja) * 2005-10-13 2007-04-26 Kaneka Corp 新規なポリイミド樹脂
JP5119781B2 (ja) * 2006-07-25 2013-01-16 宇部興産株式会社 無電解めっき促進用多分岐ポリイミド、金属被覆多分岐ポリイミド及びこれらの製造方法
KR100831155B1 (ko) * 2006-11-08 2008-05-20 주식회사 엘지화학 액정배향용 조성물, 이로 제조된 액정배향막, 및 이를포함하는 액정디스플레이
CN100441652C (zh) * 2007-01-19 2008-12-10 东华大学 一种含酚羟基聚酰亚胺粘合剂的制备方法
WO2008114798A1 (ja) * 2007-03-19 2008-09-25 Ibiden Co., Ltd. 多孔性ポリイミド
CN101139501B (zh) * 2007-10-11 2011-05-25 同济大学 一种聚酰亚胺耐高温水性分散体涂料及其制备方法和应用
KR101197161B1 (ko) * 2007-12-21 2012-11-12 주식회사 엘지화학 비선형 폴리아믹산 및 이를 포함하는 감광성 수지조성물.
JP2009203414A (ja) * 2008-02-29 2009-09-10 Toray Ind Inc 熱硬化性樹脂組成物
CN101289537B (zh) * 2008-05-19 2010-09-08 东华大学 1,4-双(2,4-二氨基苯氧基)苯型自增韧性不饱和聚酰亚胺粉末的制备方法
JP5329849B2 (ja) * 2008-06-19 2013-10-30 富士フイルム株式会社 液晶性有機半導体材料および有機電子デバイス
TWI405667B (zh) * 2010-12-15 2013-08-21 Ind Tech Res Inst 聚醯亞胺薄膜層合物及包含其之金屬積層板
JP6325791B2 (ja) * 2013-10-04 2018-05-16 旭化成株式会社 樹脂組成物、積層体、プリント配線板、及びその製造方法
CN103980491B (zh) * 2014-05-23 2016-04-06 哈尔滨工业大学 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010024389A (ja) 2008-07-23 2010-02-04 Toyobo Co Ltd ポリイミド構造体、その製造方法および積層フィルム、デバイス構造体
US20100063241A1 (en) 2008-09-09 2010-03-11 Spirit Aerosystems, Inc. High performance polyaspartimide resin
JP2012224697A (ja) * 2011-04-18 2012-11-15 Sumitomo Electric Wintec Inc ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230151372A (ko) 2022-04-25 2023-11-01 가톨릭대학교 산학협력단 4d 프린팅 공정을 이용한 열자극 반응성 형상 기억 고분자 및 이의 제조방법

Also Published As

Publication number Publication date
US20160369055A1 (en) 2016-12-22
EP3147306A1 (en) 2017-03-29
US10738163B2 (en) 2020-08-11
CN103980491B (zh) 2016-04-06
US20190085133A1 (en) 2019-03-21
JP6418562B2 (ja) 2018-11-07
EP3147306A4 (en) 2018-03-14
JP2017516900A (ja) 2017-06-22
WO2015176544A1 (zh) 2015-11-26
CN103980491A (zh) 2014-08-13
EP3147306B1 (en) 2024-12-18
US10155850B2 (en) 2018-12-18
KR20170012379A (ko) 2017-02-02

Similar Documents

Publication Publication Date Title
KR101922791B1 (ko) 신속 반응형, 형상 기억 열경화성 폴리이미드 및 이의 제조 방법
CN108219133B (zh) 一种含呋喃环的聚酰亚胺树脂及其制备方法
JP2017516900A5 (https=)
CN108484910B (zh) 基于双马来酰亚胺的热固性形状记忆树脂及其制备方法
WO2015176545A1 (zh) 一种耐高温热塑性形状记忆聚酰亚胺及其制备方法
US20230242707A1 (en) Biomass benzoxazine-based shape memory resin, preparation method therefor, and application thereof
WO2012088759A1 (zh) 一种可熔性聚酰亚胺模塑料及其制备方法
JP6293457B2 (ja) ポリイミドおよび耐熱性フィルム
CN108752928A (zh) 一种含呋喃环的交联型聚酰亚胺树脂及其制备方法
CN113717384A (zh) 一种改性聚酰胺酰亚胺材料及其制备方法
CN108586743A (zh) 热固性形状记忆双马来酰亚胺树脂及其制备方法
CN108102094A (zh) 利用六氟二酐制备聚酰亚胺薄膜的方法
CN103965824A (zh) 一种乙炔基聚酰亚胺改性氰酸酯胶粘剂及其制备方法
CN106748963B (zh) 含茚满结构的聚酰胺-酰亚胺及其制备方法
CN111154101A (zh) 一种耐高温乙炔基封端聚酰亚胺材料及其制备方法
CN109928907B (zh) 一种具有优异加工性和耐高温的活性稀释剂及其制备方法
Yu et al. Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties
CN110483763B (zh) 一种含苯酰基结构支化型邻苯二甲腈树脂及其制备方法
CN108117644A (zh) 一种制备萘基自催化型聚苯腈树脂的方法
CN116041702B (zh) 一种形状记忆聚酰亚胺模塑粉及其制备方法和应用、形状记忆聚酰亚胺三维块体材料
CN105968350A (zh) 一种高韧性聚醚脲型苯并噁嗪树脂及其制备方法
CN117164854A (zh) 一种交联型聚酰亚胺及其制备方法
CN111574513B (zh) 生物质苯并噁嗪形状记忆树脂用单体及其制备方法与应用
Chen et al. Synthesis and properties of novel meltable fluorinated aromatic oligoimides endcapped with 4-phenylethynylphthalic anhydride
JP6765093B2 (ja) ポリイミド

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20161222

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20171101

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20180404

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20180901

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20181121

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20181121

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20210913

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20210913

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20221020

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20221020

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20241024

Start annual number: 7

End annual number: 7