KR101905535B1 - 발광 소자 패키지 및 이를 구비한 조명 장치 - Google Patents
발광 소자 패키지 및 이를 구비한 조명 장치 Download PDFInfo
- Publication number
- KR101905535B1 KR101905535B1 KR1020110119822A KR20110119822A KR101905535B1 KR 101905535 B1 KR101905535 B1 KR 101905535B1 KR 1020110119822 A KR1020110119822 A KR 1020110119822A KR 20110119822 A KR20110119822 A KR 20110119822A KR 101905535 B1 KR101905535 B1 KR 101905535B1
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- KR
- South Korea
- Prior art keywords
- light emitting
- lead frames
- emitting device
- device package
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110119822A KR101905535B1 (ko) | 2011-11-16 | 2011-11-16 | 발광 소자 패키지 및 이를 구비한 조명 장치 |
| US13/673,478 US9231166B2 (en) | 2011-11-16 | 2012-11-09 | Light emitting device and lighting apparatus having the same |
| JP2012249943A JP6104570B2 (ja) | 2011-11-16 | 2012-11-14 | 発光素子及びこれを備えた照明装置 |
| EP12192726.3A EP2595205B1 (en) | 2011-11-16 | 2012-11-15 | Light emitting diode device |
| CN201210465088.5A CN103117348B (zh) | 2011-11-16 | 2012-11-16 | 发光器件以及具有发光器件的照明装置 |
| US14/953,081 US10128423B2 (en) | 2011-11-16 | 2015-11-27 | Light emitting device and lighting apparatus having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110119822A KR101905535B1 (ko) | 2011-11-16 | 2011-11-16 | 발광 소자 패키지 및 이를 구비한 조명 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130054040A KR20130054040A (ko) | 2013-05-24 |
| KR101905535B1 true KR101905535B1 (ko) | 2018-10-10 |
Family
ID=47427206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110119822A Expired - Fee Related KR101905535B1 (ko) | 2011-11-16 | 2011-11-16 | 발광 소자 패키지 및 이를 구비한 조명 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9231166B2 (https=) |
| EP (1) | EP2595205B1 (https=) |
| JP (1) | JP6104570B2 (https=) |
| KR (1) | KR101905535B1 (https=) |
| CN (1) | CN103117348B (https=) |
Families Citing this family (78)
| Publication number | Priority date | Publication date | Assignee | Title |
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| GB2484713A (en) | 2010-10-21 | 2012-04-25 | Optovate Ltd | Illumination apparatus |
| TWI489657B (zh) * | 2012-04-12 | 2015-06-21 | 隆達電子股份有限公司 | 發光二極體封裝件 |
| CN104508364B (zh) * | 2012-05-31 | 2020-03-06 | Lg伊诺特有限公司 | 用于控制光通量的构件及其制造方法、显示装置以及发光装置 |
| CN103682028A (zh) * | 2012-08-30 | 2014-03-26 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
| JP6131664B2 (ja) * | 2013-03-25 | 2017-05-24 | 日亜化学工業株式会社 | 発光装置の製造方法および発光装置 |
| TWI559053B (zh) * | 2013-05-28 | 2016-11-21 | 潘宇翔 | 適用於直下式背光模組之光源裝置及其顯示器 |
| DE102013213073A1 (de) * | 2013-07-04 | 2015-01-08 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelementes |
| US9515241B2 (en) * | 2013-07-12 | 2016-12-06 | Lite-On Opto Technology (Changzhou) Co., Ltd. | LED structure, metallic frame of LED structure, and carrier module |
| JP6221456B2 (ja) * | 2013-07-23 | 2017-11-01 | 日亜化学工業株式会社 | 発光装置及び照明装置 |
| CN104456428A (zh) * | 2013-09-12 | 2015-03-25 | 欧司朗有限公司 | 发光结构的光学单元和发光结构和具有该发光结构的灯箱 |
| KR102098870B1 (ko) * | 2013-10-30 | 2020-04-08 | 엘지이노텍 주식회사 | 발광 장치 |
| KR102110477B1 (ko) * | 2013-11-26 | 2020-05-13 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 조명시스템 |
| DE102013224581A1 (de) * | 2013-11-29 | 2015-06-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| KR20150081089A (ko) * | 2014-01-03 | 2015-07-13 | 삼성디스플레이 주식회사 | Led 패키지 |
| DE102014101557A1 (de) * | 2014-02-07 | 2015-08-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| KR102203683B1 (ko) * | 2014-04-10 | 2021-01-15 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이를 포함하는 발광장치 |
| US9997676B2 (en) | 2014-05-14 | 2018-06-12 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
| US10439111B2 (en) | 2014-05-14 | 2019-10-08 | Genesis Photonics Inc. | Light emitting device and manufacturing method thereof |
| US9748165B2 (en) * | 2014-05-30 | 2017-08-29 | Delta Electronics, Inc. | Packaging structure |
| TWI557952B (zh) | 2014-06-12 | 2016-11-11 | 新世紀光電股份有限公司 | 發光元件 |
| KR102218401B1 (ko) * | 2014-06-27 | 2021-02-23 | 엘지디스플레이 주식회사 | 광원 패키지 및 이를 장착한 백라이트 유닛 |
| JP6515716B2 (ja) | 2014-07-18 | 2019-05-22 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| KR101572495B1 (ko) | 2014-08-20 | 2015-12-02 | 주식회사 루멘스 | 발광 소자 패키지의 제조 방법과, 발광 소자 패키지용 정렬 지그와, 발광 소자 패키지용 리드 프레임 스트립 및 발광 소자 패키지용 렌즈 스트립 |
| EP2988341B1 (en) * | 2014-08-22 | 2017-04-05 | LG Innotek Co., Ltd. | Light emitting device package |
| KR20160054666A (ko) * | 2014-11-06 | 2016-05-17 | 삼성전자주식회사 | 광원 모듈 및 조명 장치 |
| DE102014117435A1 (de) * | 2014-11-27 | 2016-06-02 | Osram Opto Semiconductors Gmbh | Bauteil mit Leiterrahmenabschnitt |
| KR102294163B1 (ko) | 2014-12-05 | 2021-08-27 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 모듈 |
| KR102606852B1 (ko) | 2015-01-19 | 2023-11-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 |
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| KR20160112116A (ko) * | 2015-03-18 | 2016-09-28 | 엘지이노텍 주식회사 | 발광소자 어레이와 이를 포함하는 조명시스템 |
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2012
- 2012-11-09 US US13/673,478 patent/US9231166B2/en not_active Expired - Fee Related
- 2012-11-14 JP JP2012249943A patent/JP6104570B2/ja not_active Expired - Fee Related
- 2012-11-15 EP EP12192726.3A patent/EP2595205B1/en active Active
- 2012-11-16 CN CN201210465088.5A patent/CN103117348B/zh active Active
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2015
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103117348B (zh) | 2017-08-18 |
| US9231166B2 (en) | 2016-01-05 |
| JP2013106047A (ja) | 2013-05-30 |
| US20130121000A1 (en) | 2013-05-16 |
| JP6104570B2 (ja) | 2017-03-29 |
| EP2595205A3 (en) | 2015-12-02 |
| US20160079507A1 (en) | 2016-03-17 |
| US10128423B2 (en) | 2018-11-13 |
| EP2595205B1 (en) | 2020-04-15 |
| CN103117348A (zh) | 2013-05-22 |
| KR20130054040A (ko) | 2013-05-24 |
| EP2595205A2 (en) | 2013-05-22 |
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