KR101870117B1 - 반사 및 난연 특성이 탁월한 용품의 형성을 위한 조성물 및 이로부터 형성된 용품 - Google Patents

반사 및 난연 특성이 탁월한 용품의 형성을 위한 조성물 및 이로부터 형성된 용품 Download PDF

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KR101870117B1
KR101870117B1 KR1020157017280A KR20157017280A KR101870117B1 KR 101870117 B1 KR101870117 B1 KR 101870117B1 KR 1020157017280 A KR1020157017280 A KR 1020157017280A KR 20157017280 A KR20157017280 A KR 20157017280A KR 101870117 B1 KR101870117 B1 KR 101870117B1
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KR20150102031A (ko
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스탠턴 제임스 덴트
제이콥 윌리엄 스테인브레처
마이클 레이먼드 스트롱
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다우 실리콘즈 코포레이션
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016Flame-proofing or flame-retarding additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/5403Silicon-containing compounds containing no other elements than carbon or hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224Magnesium hydroxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020157017280A 2012-12-27 2013-12-19 반사 및 난연 특성이 탁월한 용품의 형성을 위한 조성물 및 이로부터 형성된 용품 Active KR101870117B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261746262P 2012-12-27 2012-12-27
US61/746,262 2012-12-27
PCT/US2013/076648 WO2014105645A1 (en) 2012-12-27 2013-12-19 Composition for forming an article having excellent reflectance and flame retardant properties and article formed therefrom

Publications (2)

Publication Number Publication Date
KR20150102031A KR20150102031A (ko) 2015-09-04
KR101870117B1 true KR101870117B1 (ko) 2018-06-25

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Country Link
US (1) US9507054B2 (https=)
EP (1) EP2938678B1 (https=)
JP (1) JP6363618B2 (https=)
KR (1) KR101870117B1 (https=)
CN (1) CN104884534B (https=)
TW (1) TWI630235B (https=)
WO (1) WO2014105645A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104955905B (zh) 2013-02-27 2017-11-28 株式会社朝日橡胶 白色反射膜用油墨、粉体涂料、白色反射膜及其制造方法、光源支架及照明器具遮光罩
CN105368064B (zh) * 2014-08-27 2018-01-23 广州慧谷化学有限公司 有机聚硅氧烷组合物及其制备方法及半导体器件
WO2016065505A1 (en) * 2014-10-27 2016-05-06 Ablestik (Shanghai) Ltd. A method for manufacturing an optical semiconductor device and a silicone resin composition therefor
FR3029924B1 (fr) * 2014-12-15 2016-12-09 Univ Claude Bernard Lyon Materiaux anisotropes obtenus par hydrosilylation, leur procede de preparation et leur utilisation
KR102591068B1 (ko) 2015-12-15 2023-10-18 마테리온 코포레이션 향상된 파장 변환 장치
KR20180034937A (ko) * 2016-09-28 2018-04-05 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
CN108219472B (zh) * 2016-12-13 2021-02-02 北京科化新材料科技有限公司 一种液态硅树脂组合物及其制备方法和应用
CN112048180A (zh) * 2019-06-06 2020-12-08 富士能电子(昆山)有限公司 防延烧阻燃材料
JP2021042332A (ja) * 2019-09-12 2021-03-18 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、光反射材、及び、光半導体装置
WO2022207119A1 (de) * 2021-04-01 2022-10-06 Wacker Chemie Ag Keramifizierende aluminiumhydroxid enthaltende siliconzusammensetzung
FR3135086B1 (fr) * 2022-04-28 2025-07-04 Elkem Silicones France Sas Composition silicone réticulable par irradiation comprenant du Pt(octane-2,4-dione)2 comme catalyseur
KR20250073364A (ko) 2022-10-26 2025-05-27 와커 헤미 아게 배터리 모듈용 실리콘 기반 단열재
JP7793276B2 (ja) * 2022-12-22 2026-01-05 信越化学工業株式会社 フォトカプラ封止剤及びフォトカプラ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189594A (ja) * 2009-02-20 2010-09-02 Shin-Etsu Chemical Co Ltd 高電圧電気絶縁体用シリコーンゴム組成物

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131800C (https=) 1965-05-17
US4087585A (en) 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
JPS5952798B2 (ja) * 1977-11-15 1984-12-21 松下電器産業株式会社 X線遮蔽能を有する難燃性シリコン組成物
FR2577233B1 (fr) * 1985-02-08 1987-02-27 Rhone Poulenc Spec Chim Compositions organopolysiloxaniques transformables en mousses ayant une resistance amelioree a la combustion
JPS6243435A (ja) * 1985-08-20 1987-02-25 Shin Etsu Chem Co Ltd 耐火性シリコ−ン発泡体組成物
US4766176A (en) 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3029680B2 (ja) 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
US5260372A (en) * 1991-11-18 1993-11-09 Wacker Silicones Corporation Flame retardant elastomeric composition
US5298536A (en) 1992-02-21 1994-03-29 Hercules Incorporated Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
JPH0644320U (ja) * 1992-11-04 1994-06-10 株式会社岡部マイカ工業所 耐火形バスダクト
EP0699717A3 (en) 1994-08-30 1997-01-02 Dow Corning Organopolysiloxane compositions curable into products having good adhesiveness and reduced flammability
DE19740631A1 (de) * 1997-09-16 1999-03-18 Ge Bayer Silicones Gmbh & Co Additionsvernetzende Siliconkautschukmischungen, ein Verfahren zu deren Herstellung und deren Verwendung
CA2314264A1 (en) * 1998-10-12 2000-04-20 Ge Bayer Silicones Gmbh & Co. Kg Addition-crosslinking silicone rubber blends, a process for their preparation and their use
US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP3931968B2 (ja) * 2002-02-28 2007-06-20 信越化学工業株式会社 固体高分子型燃料電池セパレータシール用ゴム組成物及びこれを用いたシール材並びに固体高分子型燃料電池セパレータ
US7595113B2 (en) 2002-11-29 2009-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
JP4733933B2 (ja) * 2004-06-18 2011-07-27 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
DE112005002224T5 (de) 2004-09-15 2007-08-09 Idemitsu Kosan Co. Ltd. Lichtreflektierende Folie und daraus geformter Gegenstand
DE102004050129A1 (de) * 2004-10-14 2006-04-20 Wacker Chemie Ag Siliconkautschuk Zusammensetzung enthaltend unbehandeltes Aluminiumhydroxid als Füllstoff
EP1882718B1 (en) 2005-05-19 2011-03-16 Teijin Chemicals, Ltd. Polycarbonate resin composition
ATE410483T1 (de) 2005-05-26 2008-10-15 Dow Corning Verfahren und silikonverkapselungszusammensetzung zur formung kleiner formen
KR100782265B1 (ko) 2005-12-30 2007-12-04 제일모직주식회사 광반사성 및 난연성이 우수한 폴리카보네이트 수지 조성물
PL2032655T3 (pl) * 2006-06-26 2012-09-28 Dow Corning Wytwarzanie silikonowych elastomerów kauczukowych
KR100826396B1 (ko) 2007-01-18 2008-05-02 삼성전기주식회사 Led 칩 패키지
JP4623322B2 (ja) 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP2009256400A (ja) 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5340653B2 (ja) 2008-06-25 2013-11-13 スタンレー電気株式会社 色変換発光装置
JP5471180B2 (ja) 2008-09-11 2014-04-16 信越化学工業株式会社 シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置
KR101271584B1 (ko) 2008-09-11 2013-06-11 주식회사 엘지화학 발광 다이오드 소자의 봉지재 또는 렌즈용 실록산 고분자 및 이를 포함하는 고분자 조성물
JP2010106243A (ja) 2008-09-30 2010-05-13 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
JP2010263165A (ja) 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Led用反射基板及び発光装置
KR20120123242A (ko) 2009-06-26 2012-11-08 가부시키가이샤 아사히 러버 백색 반사재 및 그 제조방법
TWI422638B (zh) 2009-08-25 2014-01-11 臺灣永光化學工業股份有限公司 含矽樹脂封裝組成物
JP2011052115A (ja) 2009-09-02 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2011054902A (ja) 2009-09-04 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
CN101735619B (zh) 2009-12-28 2011-11-09 华南理工大学 一种无卤阻燃导热有机硅电子灌封胶及其制备方法
JP2011140550A (ja) 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
JP6157118B2 (ja) 2010-03-23 2017-07-05 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物
CN102339936B (zh) 2010-07-27 2015-04-29 展晶科技(深圳)有限公司 发光装置封装结构及其制造方法
JP5684511B2 (ja) 2010-08-11 2015-03-11 三菱樹脂株式会社 金属箔積層体、led搭載用基板及び光源装置
WO2012078617A1 (en) 2010-12-08 2012-06-14 Dow Corning Corporation Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants
JP2012149131A (ja) * 2011-01-17 2012-08-09 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5522116B2 (ja) * 2011-04-28 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物及びそれを用いた光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189594A (ja) * 2009-02-20 2010-09-02 Shin-Etsu Chemical Co Ltd 高電圧電気絶縁体用シリコーンゴム組成物

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KR20150102031A (ko) 2015-09-04
JP2016505691A (ja) 2016-02-25
EP2938678B1 (en) 2018-12-19
TWI630235B (zh) 2018-07-21
CN104884534A (zh) 2015-09-02
US20150362628A1 (en) 2015-12-17
WO2014105645A1 (en) 2014-07-03
EP2938678A1 (en) 2015-11-04
JP6363618B2 (ja) 2018-07-25
US9507054B2 (en) 2016-11-29
TW201428059A (zh) 2014-07-16
CN104884534B (zh) 2018-03-30

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