KR101765373B1 - 임프린트 장치 및 물품의 제조 방법 - Google Patents

임프린트 장치 및 물품의 제조 방법 Download PDF

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KR101765373B1
KR101765373B1 KR1020140170606A KR20140170606A KR101765373B1 KR 101765373 B1 KR101765373 B1 KR 101765373B1 KR 1020140170606 A KR1020140170606 A KR 1020140170606A KR 20140170606 A KR20140170606 A KR 20140170606A KR 101765373 B1 KR101765373 B1 KR 101765373B1
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South Korea
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mold
substrate
discharge port
imprint
soft
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Korean (ko)
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KR20150067724A (ko
Inventor
츠요시 아라이
유타카 미타
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/021—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020140170606A 2013-12-10 2014-12-02 임프린트 장치 및 물품의 제조 방법 Active KR101765373B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-255372 2013-12-10
JP2013255372A JP5865340B2 (ja) 2013-12-10 2013-12-10 インプリント装置及び物品の製造方法

Publications (2)

Publication Number Publication Date
KR20150067724A KR20150067724A (ko) 2015-06-18
KR101765373B1 true KR101765373B1 (ko) 2017-08-07

Family

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KR1020140170606A Active KR101765373B1 (ko) 2013-12-10 2014-12-02 임프린트 장치 및 물품의 제조 방법

Country Status (5)

Country Link
US (1) US10067420B2 (https=)
JP (1) JP5865340B2 (https=)
KR (1) KR101765373B1 (https=)
CN (1) CN104698743B (https=)
TW (1) TWI600058B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6021365B2 (ja) * 2012-03-12 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6400090B2 (ja) * 2014-05-29 2018-10-03 キヤノン株式会社 塗布装置、インプリント装置および物品の製造方法
KR20160039957A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 이온 발생기를 갖는 기판 이송 시스템
FR3031751B1 (fr) * 2015-01-21 2018-10-05 Arkema France Procede de reduction des defauts dans un film ordonne de copolymere a blocs
FR3031750B1 (fr) * 2015-01-21 2018-09-28 Arkema France Procede d'obtention de films ordonnes epais et de periodes elevees comprenant un copolymere a blocs
JP6807045B2 (ja) * 2015-09-07 2021-01-06 大日本印刷株式会社 インプリント装置及びインプリント方法
JP6603678B2 (ja) * 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP2018077952A (ja) * 2016-11-07 2018-05-17 日産自動車株式会社 電池用セパレータの除電装置
JP6735656B2 (ja) * 2016-11-18 2020-08-05 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
US11040482B2 (en) * 2017-02-28 2021-06-22 Toshiba Kikai Kabushiki Kaisha Transfer method, transfer apparatus, and mold
CN106842825B (zh) * 2017-03-21 2021-01-12 京东方科技集团股份有限公司 母模及其制造方法
JP6948924B2 (ja) * 2017-11-21 2021-10-13 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP7119385B2 (ja) * 2018-01-24 2022-08-17 株式会社リコー 積層体の製造装置及び積層体の製造方法
CN110193991B (zh) * 2019-05-15 2021-01-05 郑州工程技术学院 一种美术立体转印系统及其方法
KR20260050369A (ko) * 2024-10-07 2026-04-15 주식회사 라파스 몰드장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010052288A (ja) * 2008-08-28 2010-03-11 Hitachi Industrial Equipment Systems Co Ltd 微細構造転写モールド及び微細構造転写装置
JP2012238672A (ja) 2011-05-10 2012-12-06 Canon Inc インプリント装置、インプリント方法及び物品の製造方法
JP2013065813A (ja) * 2011-08-29 2013-04-11 Fujifilm Corp インプリントシステムおよびインプリントシステムのメンテナンス方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
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JP2002353096A (ja) * 2001-05-22 2002-12-06 Nikon Corp 基板搬送方法、露光装置及び露光方法
JP2007088262A (ja) 2005-09-22 2007-04-05 Matsushita Electric Ind Co Ltd 電子デバイスの洗浄装置及び電子デバイスの洗浄方法
JP5137635B2 (ja) 2007-03-16 2013-02-06 キヤノン株式会社 インプリント方法、チップの製造方法及びインプリント装置
JP5235506B2 (ja) 2008-06-02 2013-07-10 キヤノン株式会社 パターン転写装置及びデバイス製造方法
WO2010067691A1 (ja) 2008-12-11 2010-06-17 昭和電工株式会社 造形方法
JP5828626B2 (ja) 2010-10-04 2015-12-09 キヤノン株式会社 インプリント方法
JP2013021231A (ja) * 2011-07-13 2013-01-31 Kyocera Corp 半導体層の製造方法および光電変換装置の製造方法
JP2013021229A (ja) * 2011-07-13 2013-01-31 Fujitsu Ltd 電子部品とその製造方法
JP6028602B2 (ja) * 2013-02-06 2016-11-16 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6123321B2 (ja) * 2013-02-06 2017-05-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6032036B2 (ja) * 2013-02-06 2016-11-24 大日本印刷株式会社 インプリント方法およびインプリント装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010052288A (ja) * 2008-08-28 2010-03-11 Hitachi Industrial Equipment Systems Co Ltd 微細構造転写モールド及び微細構造転写装置
JP2012238672A (ja) 2011-05-10 2012-12-06 Canon Inc インプリント装置、インプリント方法及び物品の製造方法
JP2013065813A (ja) * 2011-08-29 2013-04-11 Fujifilm Corp インプリントシステムおよびインプリントシステムのメンテナンス方法

Also Published As

Publication number Publication date
US10067420B2 (en) 2018-09-04
JP2015115413A (ja) 2015-06-22
CN104698743B (zh) 2019-08-16
US20150158243A1 (en) 2015-06-11
CN104698743A (zh) 2015-06-10
JP5865340B2 (ja) 2016-02-17
TWI600058B (zh) 2017-09-21
KR20150067724A (ko) 2015-06-18
TW201530614A (zh) 2015-08-01

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