KR101763458B1 - 접착재 릴 - Google Patents

접착재 릴 Download PDF

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Publication number
KR101763458B1
KR101763458B1 KR1020147009593A KR20147009593A KR101763458B1 KR 101763458 B1 KR101763458 B1 KR 101763458B1 KR 1020147009593 A KR1020147009593 A KR 1020147009593A KR 20147009593 A KR20147009593 A KR 20147009593A KR 101763458 B1 KR101763458 B1 KR 101763458B1
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KR
South Korea
Prior art keywords
adhesive
adhesive layer
tape
mass
winding core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020147009593A
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English (en)
Korean (ko)
Other versions
KR20140054438A (ko
Inventor
가즈야 마쯔다
다까시 세끼
도오루 후지나와
다다야스 후지에다
Original Assignee
히타치가세이가부시끼가이샤
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Publication of KR20140054438A publication Critical patent/KR20140054438A/ko
Application granted granted Critical
Publication of KR101763458B1 publication Critical patent/KR101763458B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
KR1020147009593A 2010-03-12 2011-03-10 접착재 릴 Active KR101763458B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010056270 2010-03-12
JPJP-P-2010-056270 2010-03-12
JPJP-P-2010-086330 2010-04-02
JP2010086330 2010-04-02
PCT/JP2011/055671 WO2011111784A1 (ja) 2010-03-12 2011-03-10 接着材リール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127022602A Division KR20120113803A (ko) 2010-03-12 2011-03-10 접착재 릴

Publications (2)

Publication Number Publication Date
KR20140054438A KR20140054438A (ko) 2014-05-08
KR101763458B1 true KR101763458B1 (ko) 2017-07-31

Family

ID=44563582

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147009593A Active KR101763458B1 (ko) 2010-03-12 2011-03-10 접착재 릴
KR1020127022602A Ceased KR20120113803A (ko) 2010-03-12 2011-03-10 접착재 릴

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127022602A Ceased KR20120113803A (ko) 2010-03-12 2011-03-10 접착재 릴

Country Status (5)

Country Link
JP (3) JPWO2011111784A1 (enExample)
KR (2) KR101763458B1 (enExample)
CN (2) CN104403589B (enExample)
TW (1) TWI435841B (enExample)
WO (1) WO2011111784A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046896B2 (ja) * 2012-01-30 2016-12-21 デクセリアルズ株式会社 フィルム巻装体、及びフィルム巻装体の製造方法
JP5997306B2 (ja) * 2015-02-18 2016-09-28 株式会社ホンマ コーナー部用粘着テープ
CN118291047A (zh) * 2015-11-25 2024-07-05 株式会社力森诺科 电路连接用粘接剂组合物和结构体
DE102016200810A1 (de) 2016-01-21 2017-07-27 Tesa Se Abroller, Verwendung eines Abrollers, Klebeband zur Verklebung von Bauteilen und Verklebung von zwei Bauteilen
WO2017130789A1 (ja) * 2016-01-29 2017-08-03 日立化成株式会社 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール
TWI770371B (zh) * 2018-03-23 2022-07-11 日商琳得科股份有限公司 晶粒接合薄膜、切割晶粒接合片及半導體晶片的製造方法
JP2020073404A (ja) * 2019-09-30 2020-05-14 日立化成株式会社 異方導電フィルム用リール及び異方導電フィルム巻
JP7446095B2 (ja) * 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法
JP2022048793A (ja) * 2020-09-15 2022-03-28 昭和電工マテリアルズ株式会社 接着材リール、及び、回路接続構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2009238676A (ja) * 2008-03-28 2009-10-15 Sony Chemical & Information Device Corp 異方性導電膜転写具及び接続方法

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JP3045427B2 (ja) * 1992-06-22 2000-05-29 ソニー株式会社 異方性導電膜の貼付け方法および装置
JPH0749504A (ja) * 1993-08-06 1995-02-21 Hitachi Electron Eng Co Ltd 異方性導電テープのカット目検出装置
JP3223780B2 (ja) * 1996-01-19 2001-10-29 松下電器産業株式会社 チップの実装装置
JPH1051115A (ja) * 1996-07-29 1998-02-20 Sony Corp 異方性導電膜貼付け装置及び異方性導電膜分割方法
JP4151083B2 (ja) * 1997-05-12 2008-09-17 日立化成工業株式会社 異方導電性接着テープの貼付け方法および装置
JP3648933B2 (ja) * 1997-08-06 2005-05-18 松下電器産業株式会社 異方性導電材の貼着方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP3680669B2 (ja) * 1999-12-17 2005-08-10 ソニーケミカル株式会社 多層異方性導電膜積層体
JP4648521B2 (ja) * 2000-07-17 2011-03-09 スタンレー電気株式会社 液晶装置の製造方法
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP4654566B2 (ja) * 2003-04-23 2011-03-23 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
JP4333140B2 (ja) * 2003-01-08 2009-09-16 日立化成工業株式会社 接着剤テープの製造方法
CN100548840C (zh) * 2002-07-30 2009-10-14 日立化成工业株式会社 粘接材料带连接体及粘接材料带的连接方法
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
KR20100009561A (ko) * 2004-06-09 2010-01-27 히다치 가세고교 가부시끼가이샤 필름상 접착제, 필름상 회로접속재, 회로부재의 접속구조 및 반도체 장치
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JP2009004354A (ja) * 2007-05-23 2009-01-08 Hitachi Chem Co Ltd 接着材リール及びこれを用いた回路接続体の製造方法
WO2009031472A1 (ja) * 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 接着剤及びそれを用いた接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2009238676A (ja) * 2008-03-28 2009-10-15 Sony Chemical & Information Device Corp 異方性導電膜転写具及び接続方法

Also Published As

Publication number Publication date
JP2014037544A (ja) 2014-02-27
JP2015083691A (ja) 2015-04-30
WO2011111784A1 (ja) 2011-09-15
JPWO2011111784A1 (ja) 2013-06-27
CN104403589B (zh) 2017-01-11
CN102712834A (zh) 2012-10-03
CN102712834B (zh) 2014-11-26
TWI435841B (zh) 2014-05-01
JP5928567B2 (ja) 2016-06-01
TW201139259A (en) 2011-11-16
CN104403589A (zh) 2015-03-11
KR20140054438A (ko) 2014-05-08
KR20120113803A (ko) 2012-10-15

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