KR101722277B1 - 광전 소자를 위한 박막 봉지부와 그 제조 방법 및 광전 소자 - Google Patents
광전 소자를 위한 박막 봉지부와 그 제조 방법 및 광전 소자 Download PDFInfo
- Publication number
- KR101722277B1 KR101722277B1 KR1020117025037A KR20117025037A KR101722277B1 KR 101722277 B1 KR101722277 B1 KR 101722277B1 KR 1020117025037 A KR1020117025037 A KR 1020117025037A KR 20117025037 A KR20117025037 A KR 20117025037A KR 101722277 B1 KR101722277 B1 KR 101722277B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- ald
- thin film
- film encapsulation
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/10—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising heterojunctions between organic semiconductors and inorganic semiconductors
- H10K30/15—Sensitised wide-bandgap semiconductor devices, e.g. dye-sensitised TiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009014543.5 | 2009-03-24 | ||
| DE102009014543 | 2009-03-24 | ||
| DE102009024411.5 | 2009-06-09 | ||
| DE102009024411A DE102009024411A1 (de) | 2009-03-24 | 2009-06-09 | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
| PCT/EP2010/053717 WO2010108894A1 (de) | 2009-03-24 | 2010-03-22 | Dünnschichtverkapselung für ein optoelektronisches bauelement, verfahren zu dessen herstellung und optoelektronisches bauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120001778A KR20120001778A (ko) | 2012-01-04 |
| KR101722277B1 true KR101722277B1 (ko) | 2017-03-31 |
Family
ID=42664172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117025037A Expired - Fee Related KR101722277B1 (ko) | 2009-03-24 | 2010-03-22 | 광전 소자를 위한 박막 봉지부와 그 제조 방법 및 광전 소자 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9444062B2 (enExample) |
| EP (2) | EP2412040B1 (enExample) |
| JP (1) | JP6073130B2 (enExample) |
| KR (1) | KR101722277B1 (enExample) |
| CN (1) | CN102362369B (enExample) |
| DE (1) | DE102009024411A1 (enExample) |
| WO (1) | WO2010108894A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11777048B2 (en) | 2020-04-29 | 2023-10-03 | Samsung Electronics Co., Ltd. | Sensors and electronic devices |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009024411A1 (de) | 2009-03-24 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
| FR2949776B1 (fr) | 2009-09-10 | 2013-05-17 | Saint Gobain Performance Plast | Element en couches pour l'encapsulation d'un element sensible |
| FR2949775B1 (fr) | 2009-09-10 | 2013-08-09 | Saint Gobain Performance Plast | Substrat de protection pour dispositif collecteur ou emetteur de rayonnement |
| FR2973939A1 (fr) | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
| FR2973940A1 (fr) * | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
| DE102011079004A1 (de) | 2011-07-12 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes bauelement und verfahren zum herstellen eines organischen lichtemittierenden bauelements |
| DE102011079048B4 (de) | 2011-07-13 | 2025-09-11 | Pictiva Displays International Limited | Lichtemittierende bauelemente und verfahren zum herstellen eines lichtemittierenden bauelements |
| CN103718324B (zh) | 2011-07-14 | 2016-10-19 | 欧司朗Oled股份有限公司 | 用于光电子器件的封装结构和用于封装光电子器件的方法 |
| DE102011113428A1 (de) | 2011-09-14 | 2013-03-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102011084276B4 (de) | 2011-10-11 | 2019-10-10 | Osram Oled Gmbh | Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung |
| DE102012203212B4 (de) | 2012-03-01 | 2025-02-27 | Osram Oled Gmbh | Beschichtungsanlage und verfahren zur durchführung eines aufwachsprozesses |
| DE102012208142B4 (de) | 2012-05-15 | 2021-05-12 | Pictiva Displays International Limited | Organisches licht emittierendes bauelement und verfahren zur herstellung eines organischen licht emittierenden bauelements |
| DE102012211869A1 (de) | 2012-07-06 | 2014-01-09 | Osram Opto Semiconductors Gmbh | Organisches Licht emittierendes Bauelement |
| DE102012214216A1 (de) | 2012-08-09 | 2014-02-13 | Osram Opto Semiconductors Gmbh | Organisches Leuchtdiodenmodul und Verfahren zu dessen Herstellung |
| DE102012214325B4 (de) | 2012-08-10 | 2017-06-08 | Osram Oled Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelementes und Verfahren zum Strukturieren eines organischen, optoelektronischen Bauelementes |
| KR101970361B1 (ko) | 2012-08-20 | 2019-04-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조방법 |
| CN102864417A (zh) * | 2012-08-22 | 2013-01-09 | 吉林大学 | 电子束蒸发结合原子层沉积钝化层实现有机器件封装的方法 |
| DE102012215708A1 (de) | 2012-09-05 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Vorratsbehälter für eine beschichtungsanlage und beschichtungsanlage |
| DE102012221080A1 (de) * | 2012-11-19 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
| EP2927346A4 (en) * | 2012-11-29 | 2016-07-20 | Lg Chemical Ltd | COATING METHOD FOR REDUCING DAMAGE TO A SHOCK LAYER |
| JP6036279B2 (ja) * | 2012-12-26 | 2016-11-30 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子製造方法 |
| CN106486601A (zh) | 2013-04-30 | 2017-03-08 | 成均馆大学校产学协力团 | 多层封装薄膜 |
| KR101465212B1 (ko) * | 2013-04-30 | 2014-11-25 | 성균관대학교산학협력단 | 초극유연성 봉지 박막 |
| DE102013105128A1 (de) | 2013-05-17 | 2014-11-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| KR20150018964A (ko) | 2013-08-12 | 2015-02-25 | 삼성디스플레이 주식회사 | 유기전계발광 표시장치 및 그의 제조방법 |
| DE102013108871A1 (de) | 2013-08-16 | 2015-03-12 | Osram Opto Semiconductors Gmbh | Organisches Licht emittierendes Bauelement |
| DE102013109646B4 (de) | 2013-09-04 | 2021-12-02 | Pictiva Displays International Limited | Organisches optoelektronisches Bauelement |
| EP3016162B1 (en) * | 2013-09-30 | 2020-07-22 | LG Chem, Ltd. | Substrate for organic electronic devices and production method therefor |
| KR101928598B1 (ko) * | 2013-09-30 | 2018-12-12 | 주식회사 엘지화학 | 폴리이미드 필름 및 그 제조방법 |
| FR3020179B1 (fr) * | 2014-04-22 | 2017-10-06 | Saint Gobain | Electrode supportee transparente pour oled |
| DE102014106549B4 (de) | 2014-05-09 | 2023-10-19 | Pictiva Displays International Limited | Organisches Licht emittierendes Bauelement |
| DE102014108282A1 (de) | 2014-06-12 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement, Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements sowie Lichtquelle mit einem optoelektronischen Halbleiterbauelement |
| EP2960315A1 (de) | 2014-06-27 | 2015-12-30 | cynora GmbH | Organische Elektrolumineszenzvorrichtung |
| DE102014110969A1 (de) | 2014-08-01 | 2016-02-04 | Osram Oled Gmbh | Organisches Bauteil sowie Verfahren zur Herstellung eines organischen Bauteils |
| DE102014118354A1 (de) | 2014-09-12 | 2016-03-17 | Osram Oled Gmbh | Organisches Bauelement |
| KR102251715B1 (ko) | 2014-09-17 | 2021-05-12 | 시노라 게엠베하 | 이미터로서 사용하기 위한 유기 분자 |
| DE102014116141B4 (de) | 2014-11-05 | 2022-07-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterchips, optoelektronischer Halbleiterchip sowie optoelektronisches Halbleiterbauelement |
| DE102014223507A1 (de) | 2014-11-18 | 2016-05-19 | Osram Oled Gmbh | Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen Licht emittierenden Bauelements |
| JP2016100315A (ja) * | 2014-11-26 | 2016-05-30 | パイオニア株式会社 | 発光装置 |
| JP2016103443A (ja) * | 2014-11-28 | 2016-06-02 | パイオニア株式会社 | 発光装置 |
| KR102382025B1 (ko) * | 2015-03-04 | 2022-04-04 | 삼성디스플레이 주식회사 | 표시 장치 |
| DE102015105766A1 (de) | 2015-04-15 | 2016-10-20 | Osram Oled Gmbh | Haltevorrichtung für eine organische Leuchtdiode und OLED-Modul |
| DE102015107471A1 (de) | 2015-05-12 | 2016-11-17 | Osram Oled Gmbh | Organisches Licht emittierendes Bauelement |
| US9847511B2 (en) * | 2015-05-14 | 2017-12-19 | Applied Materials, Inc. | Encapsulating film stacks for OLED applications |
| DE102015110241A1 (de) | 2015-06-25 | 2016-12-29 | Osram Oled Gmbh | Verfahren zur Steuerung eines organischen Licht emittierenden Bauelements, Licht emittierende Vorrichtung mit einem organischen Licht emittierenden Bauelement und Scheinwerfer mit einer Licht emittierenden Vorrichtung |
| DE102015118417A1 (de) | 2015-10-28 | 2017-05-04 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| CN105449123B (zh) * | 2015-11-18 | 2018-03-06 | 上海大学 | 水氧阻隔层的制备方法 |
| KR102228408B1 (ko) * | 2016-10-06 | 2021-03-17 | 주식회사 원익아이피에스 | 하드 마스크 제조방법 |
| KR102228412B1 (ko) * | 2016-11-03 | 2021-03-17 | 주식회사 원익아이피에스 | 하드 마스크 제조방법 |
| KR102268492B1 (ko) * | 2017-09-22 | 2021-06-25 | 주식회사 원익아이피에스 | 복합막 제조방법 |
| TWI661076B (zh) * | 2016-10-06 | 2019-06-01 | 南韓商圓益Ips股份有限公司 | 複合膜製造方法 |
| KR102517378B1 (ko) * | 2016-11-07 | 2023-04-04 | 더 리젠츠 오브 더 유니버시티 오브 콜로라도, 어 바디 코포레이트 | 테크니컬 세라믹의 개선된 성능 |
| JP6924023B2 (ja) * | 2016-12-16 | 2021-08-25 | パイオニア株式会社 | 発光装置 |
| JP6815901B2 (ja) * | 2017-03-06 | 2021-01-20 | 株式会社日本製鋼所 | 表示装置およびその製造方法 |
| CN108666438A (zh) * | 2017-04-01 | 2018-10-16 | 上海和辉光电有限公司 | 显示面板以及显示装置 |
| CN107819075A (zh) * | 2017-11-02 | 2018-03-20 | 长沙新材料产业研究院有限公司 | 一种在浮空器囊体上集成柔性钙钛矿太阳能电池的方法 |
| CN108598198A (zh) * | 2018-04-26 | 2018-09-28 | 上海空间电源研究所 | 一种耐原子氧柔性高透明导电封装材料 |
| JP2019195001A (ja) * | 2019-08-20 | 2019-11-07 | パイオニア株式会社 | 発光装置 |
| KR20220097462A (ko) * | 2019-11-07 | 2022-07-07 | 외를리콘 서피스 솔루션즈 아게, 페피콘 | 코팅의 제조 방법 |
| JP2020053411A (ja) * | 2019-12-26 | 2020-04-02 | パイオニア株式会社 | 発光装置 |
| US12016241B2 (en) | 2020-02-13 | 2024-06-18 | Samsung Electronics Co., Ltd. | Quantum dot device, method of manufacturing the same, and electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165537A (ja) * | 2004-11-19 | 2006-06-22 | Asm Internatl Nv | 低温での金属酸化物膜の製造方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507393A (en) * | 1983-08-11 | 1985-03-26 | Schott Glass Technologies, Inc. | Highly prefractive, low dispersion optical glass suitable for multifocal corrective lenses |
| ATE266745T1 (de) | 1999-04-03 | 2004-05-15 | Leibniz Inst Fuer Festkoerper | Metallischer werkstoff auf nickelbasis und verfahren zu dessen herstellung |
| US7198832B2 (en) * | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
| JP4556282B2 (ja) | 2000-03-31 | 2010-10-06 | 株式会社デンソー | 有機el素子およびその製造方法 |
| FI118014B (fi) | 2000-10-23 | 2007-05-31 | Asm Int | Menetelmä alumiinioksidiohutkalvojen valmistamiseksi matalissa lämpötiloissa |
| JP3687582B2 (ja) * | 2001-09-12 | 2005-08-24 | ウシオ電機株式会社 | 放電ランプ |
| JP3724454B2 (ja) * | 2002-05-31 | 2005-12-07 | 株式会社デンソー | 薄膜の形成方法 |
| DE10307095A1 (de) * | 2003-02-19 | 2004-09-02 | Merck Patent Gmbh | Aufdampfmaterial zur Herstellung hochbrechender optischer Schichten |
| JP4186688B2 (ja) | 2003-04-17 | 2008-11-26 | 三菱化学株式会社 | エレクトロルミネッセンス素子 |
| US7212485B2 (en) * | 2003-04-14 | 2007-05-01 | Hoya Corporation | Objective lens and method for manufacture thereof |
| US20070275181A1 (en) | 2003-05-16 | 2007-11-29 | Carcia Peter F | Barrier films for plastic substrates fabricated by atomic layer deposition |
| CN1657976A (zh) * | 2004-02-16 | 2005-08-24 | 柯尼卡美能达精密光学株式会社 | 光学元件和光接收装置 |
| US20050181535A1 (en) * | 2004-02-17 | 2005-08-18 | Yun Sun J. | Method of fabricating passivation layer for organic devices |
| WO2006014591A2 (en) * | 2004-07-08 | 2006-02-09 | Itn Energy Systems, Inc. | Permeation barriers for flexible electronics |
| JP4363365B2 (ja) | 2004-07-20 | 2009-11-11 | 株式会社デンソー | カラー有機elディスプレイおよびその製造方法 |
| US20060063015A1 (en) * | 2004-09-23 | 2006-03-23 | 3M Innovative Properties Company | Protected polymeric film |
| WO2006095632A1 (ja) | 2005-03-11 | 2006-09-14 | Mitsubishi Chemical Corporation | エレクトロルミネッセンス素子及び照明装置 |
| JP5066814B2 (ja) * | 2005-03-11 | 2012-11-07 | 三菱化学株式会社 | エレクトロルミネッセンス素子及び照明装置 |
| JP2007052100A (ja) * | 2005-08-16 | 2007-03-01 | Konica Minolta Opto Inc | 光学反射部材 |
| KR100792139B1 (ko) * | 2006-02-06 | 2008-01-04 | 주식회사 엘지화학 | 전자주입층으로서 무기절연층을 이용한 유기발광소자 및이의 제조 방법 |
| US20070295388A1 (en) * | 2006-05-05 | 2007-12-27 | Nanosolar, Inc. | Solar assembly with a multi-ply barrier layer and individually encapsulated solar cells or solar cell strings |
| US20070295390A1 (en) * | 2006-05-05 | 2007-12-27 | Nanosolar, Inc. | Individually encapsulated solar cells and solar cell strings having a substantially inorganic protective layer |
| US7781031B2 (en) * | 2006-12-06 | 2010-08-24 | General Electric Company | Barrier layer, composite article comprising the same, electroactive device, and method |
| US8174187B2 (en) * | 2007-01-15 | 2012-05-08 | Global Oled Technology Llc | Light-emitting device having improved light output |
| US8241713B2 (en) | 2007-02-21 | 2012-08-14 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
| JP2008235760A (ja) * | 2007-03-23 | 2008-10-02 | Denso Corp | 絶縁膜の製造方法 |
| DE102007024152A1 (de) * | 2007-04-18 | 2008-10-23 | Osram Opto Semiconductors Gmbh | Organisches optoelektronisches Bauelement |
| US20090081356A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Process for forming thin film encapsulation layers |
| US20090079328A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Thin film encapsulation containing zinc oxide |
| TWI420722B (zh) | 2008-01-30 | 2013-12-21 | 歐斯朗奧托半導體股份有限公司 | 具有封裝單元之裝置 |
| DE102008019900A1 (de) | 2008-01-30 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement |
| DE102008048472A1 (de) | 2008-09-23 | 2010-03-25 | Osram Opto Semiconductors Gmbh | Vorrichtung mit Verkapselungsanordnung |
| DE102008031405A1 (de) | 2008-07-02 | 2010-01-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement |
| US20090278454A1 (en) * | 2008-05-12 | 2009-11-12 | Fedorovskaya Elena A | Oled display encapsulated with a filter |
| KR101084267B1 (ko) | 2009-02-26 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| DE102009024411A1 (de) | 2009-03-24 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
-
2009
- 2009-06-09 DE DE102009024411A patent/DE102009024411A1/de not_active Withdrawn
-
2010
- 2010-03-22 KR KR1020117025037A patent/KR101722277B1/ko not_active Expired - Fee Related
- 2010-03-22 JP JP2012501272A patent/JP6073130B2/ja not_active Expired - Fee Related
- 2010-03-22 WO PCT/EP2010/053717 patent/WO2010108894A1/de not_active Ceased
- 2010-03-22 US US13/260,560 patent/US9444062B2/en active Active
- 2010-03-22 EP EP10710030.7A patent/EP2412040B1/de active Active
- 2010-03-22 EP EP12161502A patent/EP2472629A1/de not_active Withdrawn
- 2010-03-22 CN CN201080013287.1A patent/CN102362369B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165537A (ja) * | 2004-11-19 | 2006-06-22 | Asm Internatl Nv | 低温での金属酸化物膜の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11777048B2 (en) | 2020-04-29 | 2023-10-03 | Samsung Electronics Co., Ltd. | Sensors and electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102362369A (zh) | 2012-02-22 |
| JP6073130B2 (ja) | 2017-02-01 |
| KR20120001778A (ko) | 2012-01-04 |
| EP2412040B1 (de) | 2018-07-18 |
| JP2012521623A (ja) | 2012-09-13 |
| EP2472629A1 (de) | 2012-07-04 |
| WO2010108894A1 (de) | 2010-09-30 |
| US9444062B2 (en) | 2016-09-13 |
| DE102009024411A1 (de) | 2010-09-30 |
| CN102362369B (zh) | 2016-10-26 |
| US20120132953A1 (en) | 2012-05-31 |
| EP2412040A1 (de) | 2012-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101722277B1 (ko) | 광전 소자를 위한 박막 봉지부와 그 제조 방법 및 광전 소자 | |
| JP5455929B2 (ja) | 電子構成素子を作製する方法および電子構成素子 | |
| US7816676B2 (en) | Hermetically sealed package and methods of making the same | |
| TWI590503B (zh) | 電子裝置的邊緣阻隔薄膜 | |
| US11569479B2 (en) | Multilayer encapsulation, method for encapsulating and optoelectronic component | |
| JP5837191B2 (ja) | オプトエレクトロニクス素子のためのカプセル化構造及びオプトエレクトロニクス素子をカプセル化するための方法 | |
| JP2012521623A5 (enExample) | ||
| JP2012504304A (ja) | 有機光電子装置及び前記装置をカプセル化する方法 | |
| JP6038295B2 (ja) | 有機発光素子および有機発光素子の製造方法 | |
| WO2015061657A1 (en) | Permeation barrier system for substrates and devices and method of making the same | |
| US10411220B2 (en) | OLED display with an encapsulation with a plurality of inorganic layers | |
| KR20100108335A (ko) | 수분 반응성 물질을 갖는 캡슐화 층 및 유기 컴포넌트를 포함하는 디바이스 | |
| CN103718324A (zh) | 用于光电子器件的封装结构和用于封装光电子器件的方法 | |
| JP2009054444A5 (enExample) | ||
| KR20150059667A (ko) | 유기 전자소자 및 유기 전자소자의 제조방법 | |
| US10043988B2 (en) | Element for stabilizing an optoelectronic device method for producing an element and optoelectronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R11-asn-PN2301 St.27 status event code: A-3-3-R10-R13-asn-PN2301 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E90F | Notification of reason for final refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| X091 | Application refused [patent] | ||
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PX0901 | Re-examination |
St.27 status event code: A-2-3-E10-E12-rex-PX0901 |
|
| PX0701 | Decision of registration after re-examination |
St.27 status event code: A-3-4-F10-F13-rex-PX0701 |
|
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
Fee payment year number: 1 St.27 status event code: A-2-2-U10-U12-oth-PR1002 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 4 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 5 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 6 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 7 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PC1903 | Unpaid annual fee |
Not in force date: 20240328 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE St.27 status event code: A-4-4-U10-U13-oth-PC1903 |
|
| PC1903 | Unpaid annual fee |
Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20240328 St.27 status event code: N-4-6-H10-H13-oth-PC1903 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |