JP2012521623A5 - - Google Patents
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- Publication number
- JP2012521623A5 JP2012521623A5 JP2012501272A JP2012501272A JP2012521623A5 JP 2012521623 A5 JP2012521623 A5 JP 2012521623A5 JP 2012501272 A JP2012501272 A JP 2012501272A JP 2012501272 A JP2012501272 A JP 2012501272A JP 2012521623 A5 JP2012521623 A5 JP 2012521623A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- layer
- film encapsulation
- oxide
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 15
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 238000000231 atomic layer deposition Methods 0.000 claims 15
- 238000000034 method Methods 0.000 claims 8
- 230000005693 optoelectronics Effects 0.000 claims 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 6
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- 239000011787 zinc oxide Substances 0.000 claims 3
- 229910000449 hafnium oxide Inorganic materials 0.000 claims 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 2
- 238000004544 sputter deposition Methods 0.000 claims 2
- 238000002207 thermal evaporation Methods 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000013086 organic photovoltaic Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009014543.5 | 2009-03-24 | ||
| DE102009014543 | 2009-03-24 | ||
| DE102009024411.5 | 2009-06-09 | ||
| DE102009024411A DE102009024411A1 (de) | 2009-03-24 | 2009-06-09 | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
| PCT/EP2010/053717 WO2010108894A1 (de) | 2009-03-24 | 2010-03-22 | Dünnschichtverkapselung für ein optoelektronisches bauelement, verfahren zu dessen herstellung und optoelektronisches bauelement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012521623A JP2012521623A (ja) | 2012-09-13 |
| JP2012521623A5 true JP2012521623A5 (enExample) | 2014-04-24 |
| JP6073130B2 JP6073130B2 (ja) | 2017-02-01 |
Family
ID=42664172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012501272A Expired - Fee Related JP6073130B2 (ja) | 2009-03-24 | 2010-03-22 | オプトエレクトロニクス素子のための薄膜カプセル封入並びにその製造方法、及びオプトエレクトロニクス素子 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9444062B2 (enExample) |
| EP (2) | EP2412040B1 (enExample) |
| JP (1) | JP6073130B2 (enExample) |
| KR (1) | KR101722277B1 (enExample) |
| CN (1) | CN102362369B (enExample) |
| DE (1) | DE102009024411A1 (enExample) |
| WO (1) | WO2010108894A1 (enExample) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009024411A1 (de) | 2009-03-24 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
| FR2949776B1 (fr) | 2009-09-10 | 2013-05-17 | Saint Gobain Performance Plast | Element en couches pour l'encapsulation d'un element sensible |
| FR2949775B1 (fr) | 2009-09-10 | 2013-08-09 | Saint Gobain Performance Plast | Substrat de protection pour dispositif collecteur ou emetteur de rayonnement |
| FR2973939A1 (fr) | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
| FR2973940A1 (fr) * | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
| DE102011079004A1 (de) | 2011-07-12 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes bauelement und verfahren zum herstellen eines organischen lichtemittierenden bauelements |
| DE102011079048B4 (de) | 2011-07-13 | 2025-09-11 | Pictiva Displays International Limited | Lichtemittierende bauelemente und verfahren zum herstellen eines lichtemittierenden bauelements |
| CN103718324B (zh) | 2011-07-14 | 2016-10-19 | 欧司朗Oled股份有限公司 | 用于光电子器件的封装结构和用于封装光电子器件的方法 |
| DE102011113428A1 (de) | 2011-09-14 | 2013-03-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102011084276B4 (de) | 2011-10-11 | 2019-10-10 | Osram Oled Gmbh | Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung |
| DE102012203212B4 (de) | 2012-03-01 | 2025-02-27 | Osram Oled Gmbh | Beschichtungsanlage und verfahren zur durchführung eines aufwachsprozesses |
| DE102012208142B4 (de) | 2012-05-15 | 2021-05-12 | Pictiva Displays International Limited | Organisches licht emittierendes bauelement und verfahren zur herstellung eines organischen licht emittierenden bauelements |
| DE102012211869A1 (de) | 2012-07-06 | 2014-01-09 | Osram Opto Semiconductors Gmbh | Organisches Licht emittierendes Bauelement |
| DE102012214216A1 (de) | 2012-08-09 | 2014-02-13 | Osram Opto Semiconductors Gmbh | Organisches Leuchtdiodenmodul und Verfahren zu dessen Herstellung |
| DE102012214325B4 (de) | 2012-08-10 | 2017-06-08 | Osram Oled Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelementes und Verfahren zum Strukturieren eines organischen, optoelektronischen Bauelementes |
| KR101970361B1 (ko) | 2012-08-20 | 2019-04-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조방법 |
| CN102864417A (zh) * | 2012-08-22 | 2013-01-09 | 吉林大学 | 电子束蒸发结合原子层沉积钝化层实现有机器件封装的方法 |
| DE102012215708A1 (de) | 2012-09-05 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Vorratsbehälter für eine beschichtungsanlage und beschichtungsanlage |
| DE102012221080A1 (de) * | 2012-11-19 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
| EP2927346A4 (en) * | 2012-11-29 | 2016-07-20 | Lg Chemical Ltd | COATING METHOD FOR REDUCING DAMAGE TO A SHOCK LAYER |
| JP6036279B2 (ja) * | 2012-12-26 | 2016-11-30 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子製造方法 |
| CN106486601A (zh) | 2013-04-30 | 2017-03-08 | 成均馆大学校产学协力团 | 多层封装薄膜 |
| KR101465212B1 (ko) * | 2013-04-30 | 2014-11-25 | 성균관대학교산학협력단 | 초극유연성 봉지 박막 |
| DE102013105128A1 (de) | 2013-05-17 | 2014-11-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| KR20150018964A (ko) | 2013-08-12 | 2015-02-25 | 삼성디스플레이 주식회사 | 유기전계발광 표시장치 및 그의 제조방법 |
| DE102013108871A1 (de) | 2013-08-16 | 2015-03-12 | Osram Opto Semiconductors Gmbh | Organisches Licht emittierendes Bauelement |
| DE102013109646B4 (de) | 2013-09-04 | 2021-12-02 | Pictiva Displays International Limited | Organisches optoelektronisches Bauelement |
| EP3016162B1 (en) * | 2013-09-30 | 2020-07-22 | LG Chem, Ltd. | Substrate for organic electronic devices and production method therefor |
| KR101928598B1 (ko) * | 2013-09-30 | 2018-12-12 | 주식회사 엘지화학 | 폴리이미드 필름 및 그 제조방법 |
| FR3020179B1 (fr) * | 2014-04-22 | 2017-10-06 | Saint Gobain | Electrode supportee transparente pour oled |
| DE102014106549B4 (de) | 2014-05-09 | 2023-10-19 | Pictiva Displays International Limited | Organisches Licht emittierendes Bauelement |
| DE102014108282A1 (de) | 2014-06-12 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement, Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements sowie Lichtquelle mit einem optoelektronischen Halbleiterbauelement |
| EP2960315A1 (de) | 2014-06-27 | 2015-12-30 | cynora GmbH | Organische Elektrolumineszenzvorrichtung |
| DE102014110969A1 (de) | 2014-08-01 | 2016-02-04 | Osram Oled Gmbh | Organisches Bauteil sowie Verfahren zur Herstellung eines organischen Bauteils |
| DE102014118354A1 (de) | 2014-09-12 | 2016-03-17 | Osram Oled Gmbh | Organisches Bauelement |
| KR102251715B1 (ko) | 2014-09-17 | 2021-05-12 | 시노라 게엠베하 | 이미터로서 사용하기 위한 유기 분자 |
| DE102014116141B4 (de) | 2014-11-05 | 2022-07-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterchips, optoelektronischer Halbleiterchip sowie optoelektronisches Halbleiterbauelement |
| DE102014223507A1 (de) | 2014-11-18 | 2016-05-19 | Osram Oled Gmbh | Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen Licht emittierenden Bauelements |
| JP2016100315A (ja) * | 2014-11-26 | 2016-05-30 | パイオニア株式会社 | 発光装置 |
| JP2016103443A (ja) * | 2014-11-28 | 2016-06-02 | パイオニア株式会社 | 発光装置 |
| KR102382025B1 (ko) * | 2015-03-04 | 2022-04-04 | 삼성디스플레이 주식회사 | 표시 장치 |
| DE102015105766A1 (de) | 2015-04-15 | 2016-10-20 | Osram Oled Gmbh | Haltevorrichtung für eine organische Leuchtdiode und OLED-Modul |
| DE102015107471A1 (de) | 2015-05-12 | 2016-11-17 | Osram Oled Gmbh | Organisches Licht emittierendes Bauelement |
| US9847511B2 (en) * | 2015-05-14 | 2017-12-19 | Applied Materials, Inc. | Encapsulating film stacks for OLED applications |
| DE102015110241A1 (de) | 2015-06-25 | 2016-12-29 | Osram Oled Gmbh | Verfahren zur Steuerung eines organischen Licht emittierenden Bauelements, Licht emittierende Vorrichtung mit einem organischen Licht emittierenden Bauelement und Scheinwerfer mit einer Licht emittierenden Vorrichtung |
| DE102015118417A1 (de) | 2015-10-28 | 2017-05-04 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| CN105449123B (zh) * | 2015-11-18 | 2018-03-06 | 上海大学 | 水氧阻隔层的制备方法 |
| KR102228408B1 (ko) * | 2016-10-06 | 2021-03-17 | 주식회사 원익아이피에스 | 하드 마스크 제조방법 |
| KR102228412B1 (ko) * | 2016-11-03 | 2021-03-17 | 주식회사 원익아이피에스 | 하드 마스크 제조방법 |
| KR102268492B1 (ko) * | 2017-09-22 | 2021-06-25 | 주식회사 원익아이피에스 | 복합막 제조방법 |
| TWI661076B (zh) * | 2016-10-06 | 2019-06-01 | 南韓商圓益Ｉｐｓ股份有限公司 | 複合膜製造方法 |
| KR102517378B1 (ko) * | 2016-11-07 | 2023-04-04 | 더 리젠츠 오브 더 유니버시티 오브 콜로라도, 어 바디 코포레이트 | 테크니컬 세라믹의 개선된 성능 |
| JP6924023B2 (ja) * | 2016-12-16 | 2021-08-25 | パイオニア株式会社 | 発光装置 |
| JP6815901B2 (ja) * | 2017-03-06 | 2021-01-20 | 株式会社日本製鋼所 | 表示装置およびその製造方法 |
| CN108666438A (zh) * | 2017-04-01 | 2018-10-16 | 上海和辉光电有限公司 | 显示面板以及显示装置 |
| CN107819075A (zh) * | 2017-11-02 | 2018-03-20 | 长沙新材料产业研究院有限公司 | 一种在浮空器囊体上集成柔性钙钛矿太阳能电池的方法 |
| CN108598198A (zh) * | 2018-04-26 | 2018-09-28 | 上海空间电源研究所 | 一种耐原子氧柔性高透明导电封装材料 |
| JP2019195001A (ja) * | 2019-08-20 | 2019-11-07 | パイオニア株式会社 | 発光装置 |
| KR20220097462A (ko) * | 2019-11-07 | 2022-07-07 | 외를리콘 서피스 솔루션즈 아게, 페피콘 | 코팅의 제조 방법 |
| JP2020053411A (ja) * | 2019-12-26 | 2020-04-02 | パイオニア株式会社 | 発光装置 |
| US12016241B2 (en) | 2020-02-13 | 2024-06-18 | Samsung Electronics Co., Ltd. | Quantum dot device, method of manufacturing the same, and electronic device |
| KR102764010B1 (ko) | 2020-04-29 | 2025-02-05 | 삼성전자주식회사 | 센서 및 전자 장치 |
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| US20090079328A1 (en) * | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Thin film encapsulation containing zinc oxide |
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| DE102008019900A1 (de) | 2008-01-30 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement |
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| US20090278454A1 (en) * | 2008-05-12 | 2009-11-12 | Fedorovskaya Elena A | Oled display encapsulated with a filter |
| KR101084267B1 (ko) | 2009-02-26 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| DE102009024411A1 (de) | 2009-03-24 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
-
2009
- 2009-06-09 DE DE102009024411A patent/DE102009024411A1/de not_active Withdrawn
-
2010
- 2010-03-22 KR KR1020117025037A patent/KR101722277B1/ko not_active Expired - Fee Related
- 2010-03-22 JP JP2012501272A patent/JP6073130B2/ja not_active Expired - Fee Related
- 2010-03-22 WO PCT/EP2010/053717 patent/WO2010108894A1/de not_active Ceased
- 2010-03-22 US US13/260,560 patent/US9444062B2/en active Active
- 2010-03-22 EP EP10710030.7A patent/EP2412040B1/de active Active
- 2010-03-22 EP EP12161502A patent/EP2472629A1/de not_active Withdrawn
- 2010-03-22 CN CN201080013287.1A patent/CN102362369B/zh active Active
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