KR101710862B1 - 인쇄된 전자장치를 위한 인쇄-적합 디자인 및 레이아웃 - Google Patents

인쇄된 전자장치를 위한 인쇄-적합 디자인 및 레이아웃 Download PDF

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KR101710862B1
KR101710862B1 KR1020127002943A KR20127002943A KR101710862B1 KR 101710862 B1 KR101710862 B1 KR 101710862B1 KR 1020127002943 A KR1020127002943 A KR 1020127002943A KR 20127002943 A KR20127002943 A KR 20127002943A KR 101710862 B1 KR101710862 B1 KR 101710862B1
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KR20120052273A (ko
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치강 왕
비벡 서브라마니안
리 클리버랜드
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씬 필름 일렉트로닉스 에이에스에이
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C14/00—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down
    • G11C14/0054—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down in which the volatile element is a SRAM cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4473—Conductive organic materials, e.g. conductive adhesives or conductive inks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/18—Auxiliary circuits, e.g. for writing into memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09245—Crossing layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)
KR1020127002943A 2009-08-05 2010-08-05 인쇄된 전자장치를 위한 인쇄-적합 디자인 및 레이아웃 Active KR101710862B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23164309P 2009-08-05 2009-08-05
US61/231,643 2009-08-05
US25580409P 2009-10-28 2009-10-28
US61/255,804 2009-10-28
PCT/US2010/044598 WO2011017552A1 (en) 2009-08-05 2010-08-05 Print compatible designs and layout schemes for printed electronics

Publications (2)

Publication Number Publication Date
KR20120052273A KR20120052273A (ko) 2012-05-23
KR101710862B1 true KR101710862B1 (ko) 2017-02-28

Family

ID=43544671

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127002943A Active KR101710862B1 (ko) 2009-08-05 2010-08-05 인쇄된 전자장치를 위한 인쇄-적합 디자인 및 레이아웃

Country Status (6)

Country Link
US (2) US8383952B2 (https=)
JP (1) JP2013501383A (https=)
KR (1) KR101710862B1 (https=)
CN (1) CN102474254A (https=)
TW (1) TWI573496B (https=)
WO (1) WO2011017552A1 (https=)

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WO2015075310A1 (en) * 2013-11-19 2015-05-28 Teknologian Tutkimuskeskus Vtt Oy A method for the fabrication and use of electronic circuits and an electronics circuit structure
GB2543528B (en) 2015-10-20 2020-01-15 Advanced Risc Mach Ltd Memory circuit
WO2019036304A1 (en) * 2017-08-18 2019-02-21 Thin Film Electronics Asa SPRAY-COATED DETECTION LINES, SAFETY AND / OR IDENTIFICATION LABELS AND DEVICES COMPRISING THE SAME, AND METHODS OF MAKING
US20210189165A1 (en) * 2017-10-19 2021-06-24 Hewlett-Packard Development Company, L.P. Printable ammonium-based chalcogenometalate fluids
US10306749B1 (en) * 2018-02-19 2019-05-28 Dell Products L.P. System and method of utilizing serpentine regions
CN113486621B (zh) * 2021-06-28 2024-03-01 深圳市华星光电半导体显示技术有限公司 像素电路的设计方法、装置、控制器及存储介质

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Also Published As

Publication number Publication date
TWI573496B (zh) 2017-03-01
US9155202B2 (en) 2015-10-06
WO2011017552A1 (en) 2011-02-10
CN102474254A (zh) 2012-05-23
JP2013501383A (ja) 2013-01-10
US20110186333A1 (en) 2011-08-04
US20130146334A1 (en) 2013-06-13
US8383952B2 (en) 2013-02-26
KR20120052273A (ko) 2012-05-23
TW201125445A (en) 2011-07-16

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