KR101682887B1 - 금속막 부착 필름 - Google Patents

금속막 부착 필름 Download PDF

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Publication number
KR101682887B1
KR101682887B1 KR1020117007116A KR20117007116A KR101682887B1 KR 101682887 B1 KR101682887 B1 KR 101682887B1 KR 1020117007116 A KR1020117007116 A KR 1020117007116A KR 20117007116 A KR20117007116 A KR 20117007116A KR 101682887 B1 KR101682887 B1 KR 101682887B1
Authority
KR
South Korea
Prior art keywords
layer
metal film
film
water
metal
Prior art date
Application number
KR1020117007116A
Other languages
English (en)
Korean (ko)
Other versions
KR20110046572A (ko
Inventor
히로히사 나라하시
아야미 야스다
시게오 나카무라
에이이치 하야시
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20110046572A publication Critical patent/KR20110046572A/ko
Application granted granted Critical
Publication of KR101682887B1 publication Critical patent/KR101682887B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
KR1020117007116A 2008-08-29 2009-08-28 금속막 부착 필름 KR101682887B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2008-222731 2008-08-29
JP2008222731 2008-08-29
PCT/JP2009/065031 WO2010024370A1 (ja) 2008-08-29 2009-08-28 金属膜付きフィルム

Publications (2)

Publication Number Publication Date
KR20110046572A KR20110046572A (ko) 2011-05-04
KR101682887B1 true KR101682887B1 (ko) 2016-12-06

Family

ID=41721533

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117007116A KR101682887B1 (ko) 2008-08-29 2009-08-28 금속막 부착 필름

Country Status (4)

Country Link
JP (1) JP5500074B2 (ja)
KR (1) KR101682887B1 (ja)
TW (1) TWI495561B (ja)
WO (1) WO2010024370A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5993666B2 (ja) * 2012-09-03 2016-09-14 国立大学法人埼玉大学 積層体の製造方法
JP6648800B1 (ja) * 2018-10-23 2020-02-14 住友金属鉱山株式会社 金属膜付き樹脂フィルムの製造装置と製造方法
JP2021072324A (ja) * 2019-10-29 2021-05-06 昭和電工マテリアルズ株式会社 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板
WO2021187135A1 (ja) * 2020-03-16 2021-09-23 日東電工株式会社 粘着フィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030054190A1 (en) 1997-05-14 2003-03-20 Smith Gordon C. Very ultra thin conductor layers for printed wiring boards
JP2004235194A (ja) 2003-01-28 2004-08-19 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザーによる孔あけ用補助シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09296156A (ja) 1996-05-01 1997-11-18 Ajinomoto Co Inc 金属薄層付き多層プリント配線板用層間接着フィルム、及びこれを用いた多層プリント配線板とその製造法
JP3200052B2 (ja) * 1999-08-12 2001-08-20 株式会社麗光 プリント配線板用転写フイルムとそれを使用して得るプリント配線板及びその製造方法
JP2002301790A (ja) * 2001-02-01 2002-10-15 Toray Ind Inc 離型フィルム
JP3734758B2 (ja) 2001-02-21 2006-01-11 パナック株式会社 金属層転写フィルム及び金属層の転写方法
JP2003234240A (ja) * 2002-02-06 2003-08-22 Toyo Metallizing Co Ltd 電子部品用金属膜転写フィルム
JP2004082511A (ja) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd 離型用フィルムを用いたプリント基板のプレス加工方法
JP2004230729A (ja) 2003-01-30 2004-08-19 Mitsubishi Plastics Ind Ltd 金属薄膜転写用フィルム
JP2005183599A (ja) * 2003-12-18 2005-07-07 Mitsubishi Gas Chem Co Inc Ｂステージ樹脂組成物シートおよびこれを用いたフリップチップ搭載用プリント配線板の製造方法。
JP2008001034A (ja) * 2006-06-23 2008-01-10 Panac Co Ltd 金属蒸着層転写フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030054190A1 (en) 1997-05-14 2003-03-20 Smith Gordon C. Very ultra thin conductor layers for printed wiring boards
JP2004235194A (ja) 2003-01-28 2004-08-19 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザーによる孔あけ用補助シート

Also Published As

Publication number Publication date
KR20110046572A (ko) 2011-05-04
TW201026493A (en) 2010-07-16
JP5500074B2 (ja) 2014-05-21
WO2010024370A1 (ja) 2010-03-04
JPWO2010024370A1 (ja) 2012-01-26
TWI495561B (zh) 2015-08-11

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A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
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Payment date: 20191118

Year of fee payment: 4