KR101672076B1 - 웨이퍼의 면취 가공 방법, 웨이퍼의 면취 가공 장치 및 숫돌 각도 조정용 지그 - Google Patents

웨이퍼의 면취 가공 방법, 웨이퍼의 면취 가공 장치 및 숫돌 각도 조정용 지그 Download PDF

Info

Publication number
KR101672076B1
KR101672076B1 KR1020130094874A KR20130094874A KR101672076B1 KR 101672076 B1 KR101672076 B1 KR 101672076B1 KR 1020130094874 A KR1020130094874 A KR 1020130094874A KR 20130094874 A KR20130094874 A KR 20130094874A KR 101672076 B1 KR101672076 B1 KR 101672076B1
Authority
KR
South Korea
Prior art keywords
wafer
grindstones
disk
cup
grooved
Prior art date
Application number
KR1020130094874A
Other languages
English (en)
Korean (ko)
Other versions
KR20140021975A (ko
Inventor
이치로 가타야마
Original Assignee
다이토 일렉트론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이토 일렉트론 가부시키가이샤 filed Critical 다이토 일렉트론 가부시키가이샤
Publication of KR20140021975A publication Critical patent/KR20140021975A/ko
Application granted granted Critical
Publication of KR101672076B1 publication Critical patent/KR101672076B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020130094874A 2012-08-13 2013-08-09 웨이퍼의 면취 가공 방법, 웨이퍼의 면취 가공 장치 및 숫돌 각도 조정용 지그 KR101672076B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-179315 2012-08-13
JP2012179315A JP5988765B2 (ja) 2012-08-13 2012-08-13 ウェーハの面取り加工方法、ウェーハの面取り加工装置および砥石角度調整用治具

Publications (2)

Publication Number Publication Date
KR20140021975A KR20140021975A (ko) 2014-02-21
KR101672076B1 true KR101672076B1 (ko) 2016-11-02

Family

ID=50077180

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130094874A KR101672076B1 (ko) 2012-08-13 2013-08-09 웨이퍼의 면취 가공 방법, 웨이퍼의 면취 가공 장치 및 숫돌 각도 조정용 지그

Country Status (4)

Country Link
JP (1) JP5988765B2 (ja)
KR (1) KR101672076B1 (ja)
CN (1) CN103586751B (ja)
TW (1) TWI600496B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6045542B2 (ja) * 2014-09-11 2016-12-14 信越半導体株式会社 半導体ウェーハの加工方法、貼り合わせウェーハの製造方法、及びエピタキシャルウェーハの製造方法
CN105881136A (zh) * 2016-05-26 2016-08-24 浙江新工机械制造有限公司 一种小型倒角抛光机
CN106181681A (zh) * 2016-08-31 2016-12-07 天通银厦新材料有限公司 一种蓝宝石加工用精确打磨装置
JP6825518B2 (ja) * 2017-08-24 2021-02-03 三菱マテリアル株式会社 プラズマ処理装置用炭化珪素電極板及びその製造方法
CN111347061B (zh) * 2018-12-24 2021-03-30 有研半导体材料有限公司 一种硅环加工的工艺方法
CN110026889B (zh) * 2019-04-28 2021-04-20 上海新昇半导体科技有限公司 固定连接部件、研磨头组件及抛光设备
CN110265192B (zh) * 2019-07-29 2024-04-05 湖州师范学院 厚度可调双套滚轮漆包扁线导体成形装置
CN111618707A (zh) * 2020-05-20 2020-09-04 清华大学 晶圆磨削方法及晶圆磨削系统
KR102358687B1 (ko) * 2020-10-13 2022-02-08 (주)미래컴퍼니 웨이퍼 가공 방법 및 시스템
JP7093875B2 (ja) 2021-06-24 2022-06-30 一郎 片山 ワーク加工装置、砥石、およびワーク加工方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006021291A (ja) * 2004-07-09 2006-01-26 Tokyo Seimitsu Co Ltd 研削砥石、研削装置、及び研削方法
JP2007030119A (ja) * 2005-07-28 2007-02-08 Tokyo Seimitsu Co Ltd ウェーハ面取り装置及びウェーハ面取り方法
JP2008177348A (ja) * 2007-01-18 2008-07-31 M Tec Kk ウェーハ面取り加工方法およびその装置
JP2012051098A (ja) 2010-02-26 2012-03-15 Nakamura Tome Precision Ind Co Ltd 円板状ワークの外周加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06262505A (ja) 1993-03-11 1994-09-20 Daito Shoji Kk 面取り砥石車及びそれを用いた面取り加工装置
JPH11207584A (ja) 1998-01-27 1999-08-03 M Tec Kk ワーク外周面の研削方法及び装置
JP4008586B2 (ja) 1998-08-09 2007-11-14 エムテック株式会社 ワークのエッジの研摩装置
JP2000218482A (ja) * 1999-01-28 2000-08-08 Daido Steel Co Ltd 枚葉式端面研磨機
CN2803621Y (zh) * 2005-05-27 2006-08-09 戚道易 旋转磨头的角度调整装置
WO2008106221A1 (en) * 2007-02-28 2008-09-04 Applied Materials, Inc. Methods and apparatus for cleaning a substrate edge using chemical and mechanical polishing
JP2011194561A (ja) * 2010-02-26 2011-10-06 Nakamura Tome Precision Ind Co Ltd 円盤状ワークの面取装置
KR101089480B1 (ko) * 2010-06-01 2011-12-07 주식회사 엘지실트론 웨이퍼 연마장치
CN102198637B (zh) * 2011-04-25 2012-12-26 广州市敏嘉制造技术有限公司 数控磨床砂轮角度调整机构
JP5991728B2 (ja) * 2011-09-30 2016-09-14 Hoya株式会社 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
JP5524995B2 (ja) * 2012-03-27 2014-06-18 ダイトエレクトロン株式会社 ウェーハのエッジの加工方法および加工装置
CN102601691B (zh) * 2012-04-06 2013-12-25 大连理工大学 一种圆锥面磨削方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006021291A (ja) * 2004-07-09 2006-01-26 Tokyo Seimitsu Co Ltd 研削砥石、研削装置、及び研削方法
JP2007030119A (ja) * 2005-07-28 2007-02-08 Tokyo Seimitsu Co Ltd ウェーハ面取り装置及びウェーハ面取り方法
JP2008177348A (ja) * 2007-01-18 2008-07-31 M Tec Kk ウェーハ面取り加工方法およびその装置
JP2012051098A (ja) 2010-02-26 2012-03-15 Nakamura Tome Precision Ind Co Ltd 円板状ワークの外周加工装置

Also Published As

Publication number Publication date
CN103586751A (zh) 2014-02-19
CN103586751B (zh) 2017-08-25
JP2014037014A (ja) 2014-02-27
TW201406495A (zh) 2014-02-16
JP5988765B2 (ja) 2016-09-07
KR20140021975A (ko) 2014-02-21
TWI600496B (zh) 2017-10-01

Similar Documents

Publication Publication Date Title
KR101672076B1 (ko) 웨이퍼의 면취 가공 방법, 웨이퍼의 면취 가공 장치 및 숫돌 각도 조정용 지그
KR101707252B1 (ko) 웨이퍼의 면취 가공방법
KR101143290B1 (ko) 판상체의 연마 방법 및 그 장치
US11141830B2 (en) Method for setting processing device
KR101908359B1 (ko) 양두 연삭 장치 및 워크의 양두 연삭 방법
JP7234317B2 (ja) ツルーイング方法及び面取り装置
JP7136953B2 (ja) 加工装置
JP5112703B2 (ja) ウェーハ面取り加工方法およびその装置
CN110605629B (zh) 一种研磨装置
US6537139B2 (en) Apparatus and method for ELID grinding a large-diameter workpiece to produce a mirror surface finish
JP3459058B2 (ja) ウェーハ面取り方法
JPH09168953A (ja) 半導体ウェーハのエッジ研摩方法及び装置
JP2004050345A (ja) 薄板状ワーク外周部加工装置
JP6725831B2 (ja) ワーク加工装置
JP2004243422A (ja) 外周研削合体ホイル
JP7278584B2 (ja) 研削装置
JP2000158306A (ja) 両面研削装置
KR20170106861A (ko) 웨이퍼 가공 장치
JP2024031191A (ja) 研削装置
JP2021133428A (ja) 平面研削装置
JP2001038588A (ja) ワークの研削方法及び研削装置
JP2002079446A (ja) 薄板の周縁研磨装置
JPH10217081A (ja) ウェハの両面加工方法及び装置
JPH10277894A (ja) ウエハの加工方法及び平面研削盤及び研削工具

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190917

Year of fee payment: 4