KR101670940B1 - 기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체 - Google Patents

기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체 Download PDF

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KR101670940B1
KR101670940B1 KR1020110106852A KR20110106852A KR101670940B1 KR 101670940 B1 KR101670940 B1 KR 101670940B1 KR 1020110106852 A KR1020110106852 A KR 1020110106852A KR 20110106852 A KR20110106852 A KR 20110106852A KR 101670940 B1 KR101670940 B1 KR 101670940B1
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defect
processing
substrate
cause
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KR20120049803A (ko
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마코토 하야카와
히로시 도미타
타츠헤이 요시다
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/9563—Inspecting patterns on the surface of objects and suppressing pattern images

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
KR1020110106852A 2010-11-09 2011-10-19 기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체 Active KR101670940B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-250909 2010-11-09
JP2010250909A JP5566265B2 (ja) 2010-11-09 2010-11-09 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法

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KR20120049803A KR20120049803A (ko) 2012-05-17
KR101670940B1 true KR101670940B1 (ko) 2016-10-31

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US (1) US9026240B2 (https=)
JP (1) JP5566265B2 (https=)
KR (1) KR101670940B1 (https=)
CN (1) CN102664158B (https=)
TW (1) TWI503534B (https=)

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JP6221461B2 (ja) * 2013-07-25 2017-11-01 大日本印刷株式会社 欠陥解析方法、凹凸パターン構造体の製造方法及びインプリントシステム
JP6244329B2 (ja) 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
DE102018106751B4 (de) 2017-07-31 2025-02-27 Taiwan Semiconductor Manufacturing Co. Ltd. Automatisiertes inspektionswerkzeug
US10490463B2 (en) * 2017-07-31 2019-11-26 Taiwan Semiconductor Manufacturing Co., Ltd. Automated inspection tool
CN109685756A (zh) * 2017-10-16 2019-04-26 乐达创意科技有限公司 影像特征自动辨识装置、系统及方法
JP7087397B2 (ja) * 2018-01-17 2022-06-21 東京エレクトロン株式会社 基板の欠陥検査装置、基板の欠陥検査方法及び記憶媒体
WO2020005001A1 (ko) * 2018-06-28 2020-01-02 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
KR102267919B1 (ko) 2018-06-28 2021-06-23 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
JP7308337B2 (ja) * 2018-08-17 2023-07-13 東京エレクトロン株式会社 異常判定方法及び基板処理システム
JP7105135B2 (ja) * 2018-08-17 2022-07-22 東京エレクトロン株式会社 処理条件補正方法及び基板処理システム
JP7133424B2 (ja) * 2018-10-05 2022-09-08 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体
WO2020111756A1 (ko) 2018-11-27 2020-06-04 주식회사 고영테크놀러지 기판에 대한 검사 결과를 표시하는 전자 장치 및 방법
JP7450358B2 (ja) * 2019-09-25 2024-03-15 東京エレクトロン株式会社 基板処理制御方法、基板処理装置、及び記憶媒体

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Also Published As

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TW201229498A (en) 2012-07-16
JP5566265B2 (ja) 2014-08-06
KR20120049803A (ko) 2012-05-17
TWI503534B (zh) 2015-10-11
CN102664158A (zh) 2012-09-12
CN102664158B (zh) 2015-12-16
JP2012104593A (ja) 2012-05-31
US20120116567A1 (en) 2012-05-10
US9026240B2 (en) 2015-05-05

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