JP5566265B2 - 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法 - Google Patents

基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法 Download PDF

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Publication number
JP5566265B2
JP5566265B2 JP2010250909A JP2010250909A JP5566265B2 JP 5566265 B2 JP5566265 B2 JP 5566265B2 JP 2010250909 A JP2010250909 A JP 2010250909A JP 2010250909 A JP2010250909 A JP 2010250909A JP 5566265 B2 JP5566265 B2 JP 5566265B2
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Prior art keywords
defect
substrate
processing
unit
cause
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Japanese (ja)
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JP2012104593A (ja
JP2012104593A5 (https=
Inventor
誠 早川
浩 富田
達平 吉田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2010250909A priority Critical patent/JP5566265B2/ja
Priority to TW100133779A priority patent/TWI503534B/zh
Priority to KR1020110106852A priority patent/KR101670940B1/ko
Priority to US13/281,535 priority patent/US9026240B2/en
Priority to CN201110351996.7A priority patent/CN102664158B/zh
Publication of JP2012104593A publication Critical patent/JP2012104593A/ja
Publication of JP2012104593A5 publication Critical patent/JP2012104593A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/9563—Inspecting patterns on the surface of objects and suppressing pattern images

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
JP2010250909A 2010-11-09 2010-11-09 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法 Active JP5566265B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010250909A JP5566265B2 (ja) 2010-11-09 2010-11-09 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法
TW100133779A TWI503534B (zh) 2010-11-09 2011-09-20 A substrate processing device, a computer-readable memory medium, and a substrate handling method
KR1020110106852A KR101670940B1 (ko) 2010-11-09 2011-10-19 기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체
US13/281,535 US9026240B2 (en) 2010-11-09 2011-10-26 Substrate treatment apparatus, method of transferring substrate, and non-transitory computer storage medium
CN201110351996.7A CN102664158B (zh) 2010-11-09 2011-11-09 基板处理装置、程序、计算机存储介质和基板的输送方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010250909A JP5566265B2 (ja) 2010-11-09 2010-11-09 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法

Related Child Applications (1)

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JP2014124124A Division JP5837649B2 (ja) 2014-06-17 2014-06-17 基板処理装置、異常処理部判定方法、プログラム及びコンピュータ記憶媒体

Publications (3)

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JP2012104593A JP2012104593A (ja) 2012-05-31
JP2012104593A5 JP2012104593A5 (https=) 2012-11-22
JP5566265B2 true JP5566265B2 (ja) 2014-08-06

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Country Status (5)

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US (1) US9026240B2 (https=)
JP (1) JP5566265B2 (https=)
KR (1) KR101670940B1 (https=)
CN (1) CN102664158B (https=)
TW (1) TWI503534B (https=)

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JP6244329B2 (ja) 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
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JP7087397B2 (ja) * 2018-01-17 2022-06-21 東京エレクトロン株式会社 基板の欠陥検査装置、基板の欠陥検査方法及び記憶媒体
WO2020005001A1 (ko) * 2018-06-28 2020-01-02 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
KR102267919B1 (ko) 2018-06-28 2021-06-23 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
JP7308337B2 (ja) * 2018-08-17 2023-07-13 東京エレクトロン株式会社 異常判定方法及び基板処理システム
JP7105135B2 (ja) * 2018-08-17 2022-07-22 東京エレクトロン株式会社 処理条件補正方法及び基板処理システム
JP7133424B2 (ja) * 2018-10-05 2022-09-08 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体
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JP7450358B2 (ja) * 2019-09-25 2024-03-15 東京エレクトロン株式会社 基板処理制御方法、基板処理装置、及び記憶媒体

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Also Published As

Publication number Publication date
TW201229498A (en) 2012-07-16
KR20120049803A (ko) 2012-05-17
TWI503534B (zh) 2015-10-11
CN102664158A (zh) 2012-09-12
KR101670940B1 (ko) 2016-10-31
CN102664158B (zh) 2015-12-16
JP2012104593A (ja) 2012-05-31
US20120116567A1 (en) 2012-05-10
US9026240B2 (en) 2015-05-05

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