KR101655926B1 - 반도체장치 및 반도체장치의 제조방법 - Google Patents

반도체장치 및 반도체장치의 제조방법 Download PDF

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KR101655926B1
KR101655926B1 KR1020110021213A KR20110021213A KR101655926B1 KR 101655926 B1 KR101655926 B1 KR 101655926B1 KR 1020110021213 A KR1020110021213 A KR 1020110021213A KR 20110021213 A KR20110021213 A KR 20110021213A KR 101655926 B1 KR101655926 B1 KR 101655926B1
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South Korea
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solder
electrode
circuit board
particles
solder particles
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KR20110109848A (ko
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다이스케 사쿠라이
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파나소닉 아이피 매니지먼트 가부시키가이샤
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    • H—ELECTRICITY
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    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01215—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps forming coatings
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    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01257—Changing the shapes of bumps by reflowing
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    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01261—Chemical or physical modification, e.g. by sintering or anodisation
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
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    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
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    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
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    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
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    • H10W72/221—Structures or relative sizes
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    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
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    • H10W72/231—Shapes
    • H10W72/235—Shapes of outermost layers of multilayered bumps, e.g. bump coating not being conformal on a bump core
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    • H10W72/231—Shapes
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    • H10W72/245—Dispositions, e.g. layouts of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core
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    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
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    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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    • H10W72/251—Materials
    • H10W72/255—Materials of outermost layers of multilayered bumps, e.g. material of a coating
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    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
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    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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KR1020110021213A 2010-03-29 2011-03-10 반도체장치 및 반도체장치의 제조방법 Active KR101655926B1 (ko)

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JPJP-P-2010-074492 2010-03-29
JP2010074492A JP5375708B2 (ja) 2010-03-29 2010-03-29 半導体装置の製造方法

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KR20110109848A KR20110109848A (ko) 2011-10-06
KR101655926B1 true KR101655926B1 (ko) 2016-09-08

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US (1) US8367539B2 (https=)
JP (1) JP5375708B2 (https=)
KR (1) KR101655926B1 (https=)
CN (1) CN102208388B (https=)
TW (1) TWI518808B (https=)

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KR101607790B1 (ko) * 2012-01-17 2016-03-30 파나소닉 아이피 매니지먼트 가부시키가이샤 반도체 장치 제조 방법 및 반도체 장치
JP2013183094A (ja) * 2012-03-02 2013-09-12 Nec Corp 電子部品の実装方法及び半導体装置
JP2013214557A (ja) * 2012-03-30 2013-10-17 Olympus Corp 電極形成体、配線基板、および半導体装置
JP5923725B2 (ja) * 2012-05-15 2016-05-25 パナソニックＩｐマネジメント株式会社 電子部品の実装構造体
EP2747132B1 (en) * 2012-12-18 2018-11-21 IMEC vzw A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
JP6089732B2 (ja) * 2013-01-30 2017-03-08 日立金属株式会社 導電性部材の接続構造、導電性部材の接続方法、及び光モジュール
US8969191B2 (en) * 2013-07-16 2015-03-03 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for forming package structure
US9583470B2 (en) * 2013-12-19 2017-02-28 Intel Corporation Electronic device with solder pads including projections
US20150318259A1 (en) * 2014-05-02 2015-11-05 KyungOe Kim Integrated circuit packaging system with no-reflow connection and method of manufacture thereof
JP6430843B2 (ja) * 2015-01-30 2018-11-28 株式会社ジェイデバイス 半導体装置
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
FR3070550B1 (fr) * 2017-08-24 2020-07-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede d'assemblage de connecteurs electriques
JP2019176056A (ja) * 2018-03-29 2019-10-10 富士通株式会社 電子装置
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